The use of Optimization in Signal Integrity …Page 1 The use of Optimization in Signal Integrity...

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Page 1 Page 1 The use of Optimization in Signal Integrity Performance Centric High Speed Digital Design Flow Asian IBIS Summit, Shanghai China November 4, 2009 Brahim Bensalem, Intel Corporation Lihua Wang, Agilent Technologies, EEsof Division Sanjeev Gupta, Agilent Technologies, EEsof Division Xuliang Yuan, Agilent Technologies, EEsof Division Email contact: [email protected]

Transcript of The use of Optimization in Signal Integrity …Page 1 The use of Optimization in Signal Integrity...

Page 1: The use of Optimization in Signal Integrity …Page 1 The use of Optimization in Signal Integrity Performance Centric High Speed Digital Design Flow Asian IBIS Summit, Shanghai China

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The use of Optimization in Signal Integrity Performance Centric High Speed Digital Design Flow

Asian IBIS Summit, Shanghai ChinaNovember 4, 2009

Brahim Bensalem, Intel Corporation Lihua Wang, Agilent Technologies, EEsof Division Sanjeev Gupta, Agilent Technologies, EEsof Division Xuliang Yuan, Agilent Technologies, EEsof Division

Email contact: [email protected]

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Agenda

• Channel Complexity and Gaps in Current Design Flow

• Advantage of End to End Eye Centric Design Flow

• Why an Eye Diagram ? And Eye Diagram Measurements

• Optimization of DDR2 Channel.

• Introduction to Batch Mode Simulation

• DDR Compliance

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Gap in Channel Design Flow

Design TargetEye Mask, TJ, SU/HD Margin, etc.

Chanel ParametersImpedance, Signal spacing,

total length, Rtt, et.

Solution Space ExplorationDOE, Corner Ana., Monte Carlo

TD and/or FD

Post Process/Convertto Design Target

Target Met?

End

YES

No

Design TargetEye Mask, TJ, SU/HD Margin, etc.

Chanel ParametersImpedance, Signal spacing,

total length, Rtt, et.

Optimize Param. for Max. Eye Performance

Conventional Flow Desired Flow

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Advantage of Eye Centric Design Flow

• Substantial gain in Channel Design Time (More than 3 weeks in our DDR2 case)

• Design is more robust since channel is optimized toward end to end channel performance

• Reduces risk of marginal design or opportunity loss due to over design

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Different Eye Diagrams Functions

Why Eye Diagram is Important?

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Characterizing an Eye DiagramMost commonly used eye diagram measurements

• Eye level 1 & level 0

• Eye rise/ fall time

• Eye opening

• Eye width

• Eye height

• Eye amplitude

• Peak to peak & RMS jitter

Delay Effect

Most of the measurements are statistical in nature

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Slice and DiceEye Binning

Binning DataEye Diagram

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Histogram PlotsHistogram can be created for any portion of eye diagram

Histogram across amplitude axis provide distribution around level one and zero

Histogram across timing axis provide peak to peak jitter

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Eye DelayWhy delay calculation is required

• Delay calculation is required for automated eye parameter measurements

• Binning the eye diagram makes this calculation easy

Calculated Delay

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Automated Eye Crossing Detection

• Mean value of horizontal histogram provide crossing time value

• Mean value of amplitude histogram provides crossing amplitude value

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Measurements of Eye Level One/Zero

0% 40%60%Measurement boundaries

100%

Eye

Am

plitu

de

3 σ

3 σ

Eye

H

eigh

t

1 σ

1 σ Eye Amplitude = Level One – Level ZeroEye Height = (Eye level one- 3σ)- (Eye level zero+3σEye S/N= (Eye level one-Eye level zero)

1σ level one+1σ level zero

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Eye Measurements

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Simplified Eye Measurements

Concept of Eye Probe Measurements which needs to be performed

Any number of Eye probes could be used in a design

Fast and Easy

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DDR2 Simulation

IBIS drivers and triggers Memory Module & Eye Probe

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Memory Bus Simulation Details

• X8 Un-buffered Memory Down Channel• 8 SDRAM Devices per signal• Signal Group : CMD/ADD

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Memory Performance at DRAM

How to improve channel performance?

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• Introduction to Optimization• Time domain Optimization and why it is difficult• Optimization of DDR2 Channel

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Introduction to OptimizationModify your Designs Automatically to Achieve Required Performance

Why Optimization?• Parameter sweep often doesn’t lead to an optimized designs• Parameter sweeps requires usually large number of simulation when

number of variables are large

The use of Optimizers in a design process• Automatically change design parameter to meet design goals• Categorized by their error function formulation• Coarse design stages: Random optimizer, Random Minimax optimizer and Simulated

Annealing optimizer • Fine design stages: Gradient optimizer, Gradient Minimax optimizer, Quasi-Newton optimizer

and Minimax optimizer

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Issues with Time Domain Optimization

– Time domain optimization goals are often difficult to define

– Changes in any reactive component during optimization will effect channel delay and optimization goals may no longer be applicable

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DDR2 Channel Design

X8 Un-buffered Memory Down Channel

8 SDRAM Devices

Signal Group to Optimize: CMD/ADD

Design Parameters:

Leadin Escape W leadin S Breakout Trace Spacing

Rtt L Brkout

3-5 mils 0.3-0.8in20-100 Ω8-15 mils3.5-5.5 mils0.3-0.8 in2-4 in

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Eye Diagram Optimization

– Which all eye measurements can be optimized

– How many nodes can be optimized simultaneously

– Can optimization be performed easily

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Optimization Cockpit

What are the benefits of such a cockpit?

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Optimized Eye Diagram Performance

Eye Diagram after Channel Optimization

Optimizer Type : RandomNumber of iteration : 20Optimization time : 25 minutes

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Performance Comparison

Before After

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Sweeping Corner Case

Batch simulation is used to sweep corner cases

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Simulation Results

Here only Rx corner cases was swept.

Batch mode allows simulation of any combination of Tx/Rx corner cases and IBIS models

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Time Domain Optimization Discussed

• Works well even if the flight time delay is changed due to changein the reactive element value.

• Automatically calculates delay required for eye positioning

• Automatically detects eye crossing point and 40-60% region

• Optimize eye diagram performance

• Corner case simulation performance was determined

Any eye diagram parameter such as eye opening factor, eye height, peak to peak jitter, rise time … can be used as an optimization goal.

Will make your design work without running 1000’s of parameter sweep

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DDR Mesurements

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Memory Compliance Toolkits

vdd

DRAM_1

vdd

DRAM_0

vdd

vdd

aw

DQS_DRAM_1N

DQS_DRAM_1Pvdd

DQS_DRAM_0N

DQS_DRAM_0Pvdd

vdd

ML1CTL_Cdq_TL2_2

Layer=1W=W milLength=2.9 mmSubst="DIMMSUB"

ML1CTL_Cdq_TL2_1

Layer=1W=W milLength=2.9 mmSubst="DIMMSUB"

RR1R=R_dq Ohm

ML1CTL_Cdq_TL1

Layer=1W=W milLength=14.3 mmSubst="DIMMSUB"

ML1CTL_Cdq_TL0

Layer=1W=W milLength=3 mmSubst="DIMMSUB"

IBIS_IOIBIS26

UsePkg=yesDataTypeSelector=TypSetAllData=yesModelName="DQ_FULL_800"PinName="K8"ComponentName="MT47H32M16BN_CLP_3_neg25"IbisFile="u37y_800.ibs"

DigO

IO

PD

PU

E

TPCGC

IBIS_IOIBIS11

UsePkg=yesDataTypeSelector=TypSetAllData=yesModelName="DQ_FULL_800"PinName="K8"ComponentName="MT47H32M16BN_CLP_3_neg25"IbisFile="u37y_800.ibs"

DigO

IO

PD

PU

E

TPC

GCVARVAR3W=5.0

EqnVar

VtPRBSVPRBS4

Delay=0 psecFallTime=10 psecRiseTime=10 psecBitRate=0.75 GHzEdgeShape=Linear TransitionVhigh=2 VVlow=0.0 VRegisterLength=17

- -

++

VtPRBSVPRBS3

Delay=0 psecFallTime=10 psecRiseTime=10 psecBitRate=0.75 GHzEdgeShape=Linear TransitionVhigh=2 VVlow=0.0 VRegisterLength=17

- -

++

ML1CTL_Cdq_TL0A1

Layer=1W=W milLength=3 inSubst="DIMMSUB"

V_DCSRC18Vdc=VDD/2

RR6R=R_Ref Ohm

IBIS_IOIBIS21

UsePkg=yesDataTypeSelector=TypSetAllData=yesModelName="SSTL18_I"PinName="12"ComponentName="VIRTEX-5_FF1136"IbisFile="v irtex5.ibs"

Di gO

IO

PD

PU

E

TPC

GC

IBIS_IOIBIS17

UsePkg=yesDataTypeSelector=TypSetAllData=yesModelName="SSTL18_I"PinName="12"ComponentName="VIRTEX-5_FF1136"IbisFile="v irtex5.ibs"

Di gO

IO

PD

PU

E

TPC

GC

IBIS_DIOIBIS8

UsePkg=yesDataTypeSelector=TypSetAllData=yesModelName="DQ_FULL_800"PinName="E7"ComponentName="MT47H32M16BN_CLP_3_neg25"IbisFile="u37y_800.ibs"

DigO

IO_I

PU

PD E

T

GC

PC

IO_NI

ML2CTL_Cdqs_TL0

ReuseRLGC=noRLGC_File=Layer=1S=6 milW=W milLength=3 mmSubst="DIMMSUB"

ML2CTL_Cdqs_TL1

ReuseRLGC=noRLGC_File=Layer=1S=6 milW=W milLength=3 mmSubst="DIMMSUB"

RR8R=R_dqs Ohm

RR7R=R_dqs Ohm

IBIS_DIOIBIS27

UsePkg=yesDataTypeSelector=TypSetAllData=yesModelName="DQ_FULL_800"PinName="E7"ComponentName="MT47H32M16BN_CLP_3_neg25"IbisFile="u37y_800.ibs"

DigO

IO_I

PU

PD

E

T

GCPC

IO_NI

ML2CTL_Cdqs_TL2_1

ReuseRLGC=noRLGC_File=Layer=1S=6.0 milW=W milLength=2.9 mmSubst="DIMMSUB"

ML2CTL_Cdqs_TL2_2

ReuseRLGC=noRLGC_File=Layer=1S=6.0 milW=W milLength=2.9 mmSubst="DIMMSUB"

VtPRBSVPRBS5

Delay=0 psecFallTime=10 psecRiseTime=10 psecBitRate=0.75 GHzEdgeShape=Linear TransitionVhigh=2 VVlow=0.0 VBitSequence="10101010"

- -

++

ML2CTL_Cdqs_TL0A1

ReuseRLGC=noRLGC_File=Layer=1S=6.0 milW=W milLength=3 inSubst="DIMMSUB"

IBIS_DIOIBIS24

UsePkg=yesDataTypeSelector=TypSetAllData=yesModelName="SSTL18_I"PinName="20P"ComponentName="VIRTEX-5_FF1136"IbisFile="v irtex5.ibs"

Di gO

IO_ I

PU

PD E

T

GCPC

IO_NI

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Memory Compliance Toolkits-Features

2 4 6 8 10 12 14 16 18 200 22

1.95

2.00

2.05

2.10

1.90

2.15

Index

Sle

wR

Set

upFa

ll

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Conclusion

• Time Domain optimization of eye diagram provides a powerful methodology to improve high speed memory design and to extract even fraction of the psec of timing margin buried in interconnects

• Substantial reduction in time needed to design and optimize of memory platform design is made (from weeks to hours)

• Guaranteed maximal channel robustness

• Minimize Over/Under design risks

Opportunities for future developmentNeed to demonstrate IBIS model optimization such as driver strength, ODT etc.