The Challenges in Making NIL Master Templates · eBeam Initiative Luncheon at SPIE 2014 © 2011 Dai...

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© 2011 Dai Nippon Printing Co.,Ltd. All Rights Reserved. The Challenges in Making NIL Master Templates Naoya Hayashi Dai Nippon Printing Co., Ltd. A Member of the eBeam Initiative

Transcript of The Challenges in Making NIL Master Templates · eBeam Initiative Luncheon at SPIE 2014 © 2011 Dai...

© 2011 Dai Nippon Printing Co.,Ltd. All Rights Reserved.

The Challenges in Making NIL

Master Templates

Naoya Hayashi

Dai Nippon Printing Co., Ltd.

A Member of the eBeam Initiative

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OUTLINE

Recent Progress in Nanoimprint for CMOS

Challenges in NIL master templates

Patterning challenges

Summary

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NIL template strategy

EB writing

Imprint

Wafer imprint

High quality

master template

Multiple replica

templates

Multiple replica templates will be duplicated from high

quality EB written master template.

Replica templates

used as stamps for

wafer lithographyMaster

Replica

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Template fabrication process

EB writing

Imprint

Master

Develop Etching Repair

Replica

Etching

Resolution

IP control

CDU

Uniformity Inspection

Fine repair

Defect

IP control

CDU

Uniformity

Defect

Inspection

Zero defect

master

Replica

Master Wafer imprint

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Comparison between Optical masks

and NIL templates

NIL template Optical/EUV mask

Lithography Near field lithography Far field lithography

Magnification X1 X4

Field size 26mmx33mm 112mmx132mm

Substrate 6025 Quartz 6025 Quartz

Mask fabrication Master: EB / Replica: NIL EB lithography

EB process High resolution / low sensitivity

/ Non-CAR

High sensitivity / CAR

Difficulties in NIL template fabrication Master template resolution and throughput are the most critical

issues for X1 lithography Defect control becomes difficult due to near field (contact)

lithography Duplication from master to replica template degrades master

template performance

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General performance status at

hp3x nm generation

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CD map of the current template

Replica Template CD uniformity

CDU(3σ) = 1.5nm

○ : -● : +

Error sources:

Master uniformity,

RLT uniformity,

Etching uniformity,

need to be optimized.

RLT

(Residual film

thickness)

Master

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IP : Master & Replica

10nm 10nmMaster Replica

Replica residual

x=2.00nm, y=2.48nm

Image placement has been reached to less than 2.5nm.

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Master residual

x=1.13nm, y=1.82nm

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1

10

100

1000

10000

100000

1000000

Q3 Q4 Q1 Q2 Q3 Q4 H1 H2

2011 2012 2013

DD:0.6pcs/cm2

Non-fills

Process defects

History of replica template defect improvement

2014

Master damages

Plugs

Defect density (DD) has been reduced to 0.6 pcs./cm2 by defect

source analysis and process optimization.

Defe

ct

density (

pic

s/s

q.c

m)

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Defect density of replica

Defect density of replica template is now less than 5 pieces/cm2

0

1

2

3

4

5

6

7

8

9

10

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Defe

ct

densi

ty (

pics/

sq.c

m)

Number of replica

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NIL Template Readiness

Templates are ready for use!

Target Status

Defectivity (pcs/cm2) 1.0 0.6

CD Uniformity (3σ, nm) 2.2 1.5

Image Placement (3σ, nm) 2.5 2.5

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* Status of hp2x and 1x nm generation were updated at the morning

sessions of today.

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Patterning Challenges

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1x nm template

HP22nm HP20nm HP19nm HP18nm HP17nm

Master

Replica

1x nm replica fabrication is confirmed down to 18nm LS.

Master resolution is a key to extend NIL.

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HP22nm HP20nm HP19nm HP18nm HP17nm

Master

Replica

Multi-beam Mask Writer:10nm beam resolution

EB with Non-CAR

MBMW with Non-CAR

15nm L&S

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Resist images

hp14nmhp16nm hp15nm hp13nm

Resolution with 100kV EB Writer

100KeV EB

with Non-CAR

MBMW with Non-CAR

15nm L&S

Multi-beam Mask Writer:10nm beam resolution

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Summary

マスター

NIL template progresses in CMOS application CD uniformity of 1.5nm has been obtained. Image placement of within 2.5nm residual distortion has

been obtained. Defect density on templates has been improved to zero

defect on master template, and <1 defect/cm2 on

replicated template at hp3x nm generation. We have

been working on further improvement on hp2x/1x nm.

Patterning challenges in master templates Resolution down to 1x nm and beyond Throughput

Promising solution Multi e-beam mask writer will provide the solution!

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