Surface Microstructure and Fracture Group: Fracture & Shock · 2019-07-24 · D M Williamson &...
Transcript of Surface Microstructure and Fracture Group: Fracture & Shock · 2019-07-24 · D M Williamson &...
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D M Williamson & Daniel [email protected]
Surface Microstructure and Fracture Group:Fracture & Shock
From static to dynamic(and in-between)
- the response of polymer bonded explosives
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IntroductionShort introduction to PBXs
Methods for thermal characterisation
Methods for mechanical characterisation
Methods for introducing controlled damage
Evaluation of damaged materials
PBX MICROSTRUCTURE
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Polymer Bonded Explosives
THERMAL PROPERTIES SECTION
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Thermal properties
EQUATIONS
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Thermal properties
PCD
ρκ
=
Thermal diffusivity D, Conductivity κ, and Specific Heat CP are all related by:
We independently measured all three and used (1) to cross-check our result. Perform on PBXs and binder systems.
, (1)
MEASUREMENT METHODS
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IntroductionThermal conductivity via Lee’s disc method:
Temperature gradient across a sample analysed using Fourier’s 1D heat flow equation.
Thermal diffusivity via Ångström’s method:
Measure phase and amplitude evolution of a thermal wave propagating in a sample rod.
Specific heat via DSC method:
Power required to ramp temperature of sample a known amount is measured.
Conductivity & diffusivity by transient hot-strip method:
Due to Gustafsson et al. (1979) – solves heat equation for a heat source embedded in an ‘infinite’ body.
LEES DISC
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Thermal conductivity
Heatingelement
Sample
Copperplates
Embeddedthermocouples
( ){ }AAABS
TaTTA
edk−
=
Ångström METHOD
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Thermal diffusivity
Water assisted copperheat exchanger
Water
Peltier cell
Embeddedthermocouples
Thermal imaging camera (FLIR SC300)
)/ln(2 21 TTLvD =
DIFFUSIVITY TRACES
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Thermal diffusivity
HEAT CAPACITY
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Specific heat
Empty reference pan Sample pan
Q Q
∆Q
Measure additional power required to keep both pans at same temperature during a temperature ramp:
Temp TTemp T
dtdTmC
dtdQ
P=CONDUCTIVITY RESULTS
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Thermal conductivity AWE PBX
HMX data from: Hanson-Parr D.M., and Parr T.P. (1999)
From Palmer et al. (2007)DIFFUSIVITY RESULTS
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Thermal diffusivity AWE PBX
From Palmer et al. (2007)SPECIFIC HEAT RESULTS
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Specific heat capacity AWE PBX
Large ‘error’ on temperature due to diffusivity data at 20˚C and conductivity data at 40˚C
From Palmer et al. (2007)MECH PROPS SECTION
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Mechanical Properties
STRAIN RATES OF INTEREST
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Strain rates of interest
100 102 104 106 10810-210-410-610-8
Creep and stress
relaxation
Quasi-static Dynamic Impact
Taylor impact
Plate impact
Hopkinson bar
Com
pression, tension, torsionConventional cross
head devices
1D stress impossible
Inertia importantInertia negligible
Strain rate /s-1
PBX COMPRESSION CURVES
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Rate dependence of AWE PBX
From Williamson et al. (2008)COMP ENVELOPE
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Rate dependence of AWE PBX
From Williamson et al. (2008)TEMP ENVELOPE
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Temperature dependence of AWE PBX
From Williamson et al. (2008)TEMP AND RATE
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Temperature-Rate dependence of AWE PBX
From Williamson et al. (2008)SHIFT FACTORS
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Temperature-Rate dependence of AWE PBX
From Williamson et al. (2008)REMAPPED DATA
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Temperature-Rate dependence of AWE PBX
From Williamson et al. (2008)BRAZ TEST
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Brazilian test
Brazilian test
−=
2
12Rb
DTP
F πσ
From Williamson et al. (2009a)TEMP ENVELOPE
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Failure mode AWE PBX
All transgranular
Mostly transgranular
Mostly intergranular
From Williamson et al. (2009a)RATE ENVELOPE
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Failure mode AWE PBX
All transgranular
Mostly transgranular
Mostly intergranular
From Williamson et al. (2009a)FAILURE MICRO
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A different response?
From Williamson et al. (2009a)
THERMO ADHESION
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Thermodynamic Work of Adhesion
Constant due to liquid tension
Buoyancy term dependant on immersion depthReference liquid
Microbalance
ILL AgpForce ∆−= )(cos ρθγThe Wilhelmy plate method was used; Rosano et al. (1971). Binder coated microscope slides were immersed in reference liquids. The resultant push/pull due to surface buoyancy/tension was measured.
Work of adhesion Wa between liquid of surface tension γL which forms a perimeter p of contact angle θ against the binder is related to the measured force f by
Wa = γL + f/p = γL + γLcosθ
In analysis due to Kaelble (1970) the interactions of a non-fully-wetting liquid on a solid surface is described by:
( ) ( )PS
PL
dS
dLaW γγγγ 22 +=
Simultaneous equations using liquid pairs: solve for binder surface energy components
From Williamson et al. (2009b)COMB W HMX
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Thermodynamic Work of AdhesionFrom these data and analyses the surface energy of the coating can be inferred (42.5 ± 2.8 mJ/m2), and when combined with HMX data (Yee et al. 1980), the TWA calculated.
79.7 ± 8.348.0{110}78.8 ± 7.946.0{010}81.5 ± 6.545.0{011}
HMX – binderTWA /mJ/m2
HMX surfaceenergy /mJ/m2
Crystal Face
From Williamson et al. (2009b)CRYSTAL GROWTH
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Measured Work of Adhesion: crystals
5020
Growth by evaporation Controlled growth rate for ‘best’ crystals
From Palmer et al. (2005)HMX CRYSTAL
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Experimental procedure: crystal
Single crystals ~ 1 cm3
Dural stub
EpoxyPTFE layer
HMX
From Palmer et al. (2005)Schem. Pull-off
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Measured Work of Adhesion : loadcell
Instron logs extension data
HMX
HMXBinder
Temperature compensated bending beam 3 N loadcell
To ‘scope
From Palmer et al. (2005)Stress-strain
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Measured Work of Adhesion
From Palmer et al. (2005)MWA V TWA
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Work of Adhesion
From Williamson et al. (2009b)Gen. PBX stress-strain
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A description of failure
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0 0.1 0.2 0.3 0.4 0.5 0.6
Simple model of adhesion
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Based on a simple model
Debond Energy = Aγ
Strain Energy = ½M0ε2
εa2 = 2Aγ / M0V
Local Volume: VGlobal Strain: εLocal Modulus: M0Particle Surface Area: ASurface Energy: γ
Inducing damage section
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Inducing controlled damage
3 QRXs
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QRXs QinetiQ Research eXplosives
Monomodalcoarse
Bimodal ↔
Monomodalfine
Particle sizedistribution
1.4261.5171.455Density g/cm3
0.300.200.15HTPB basedbinder
0.700.800.75RDXQRX 217QRX 221QRX 214
Material and mass fractionsConstituent
Restricted stroke
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Inducing controlled damage
A restricted stroke SHPB or drop-weight is used to dynamically compress a pre-determined amount.
Density change
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Evaluating damaged samples
Degraded Thermal
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Degradation of thermal conductivity
VIRGIN DMA
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Virgin DMA Spectra
DAM FREQ SWEEP
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Degradation of DMA Spectra
DEGRADED MODULUS PREDICTION
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Predicted degradation of modulus
QRX 221
DEGRADED INSTRON
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Degradation of strength
Low-rate response of QRX214 (monomodal fine)
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Degradation of strength
Low-rate response of QRX217 (monomodal coarse)
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Degradation of strength
Low-rate response of QRX221 (bimodal-fill)Summary
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Summary
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SummaryTogether with our sponsors, we at the Cavendish Laboratory are interested in understanding the full thermo-mechanical responses PBX and related materials, specifically by conducting insightful experiments.
The philosophy behind research is to get at the physical causes behind the experimental observations at the most fundamental level possible. Our colleagues in industry are approaching this from the direction of modeling.
Clearly understanding damage is very important, and here at the Cavendish, with the support of our sponsors, we feel we are making significant progress towards our goals.
A key attribute of the approach is the transferability of the techniques and understanding to be able to rapidly characterise new materials of all types.
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AcknowledgementsISP for opportunity to present
AWE for funding, samples and scientific input(Steve Wortley & Rebecca Govier)
QinetiQ for funding, samples and scientific input†
(Ian Cullis, Peter Gould and Phillip Church)
EPSRC for funding and equipment
PCS members past and present
† This research was carried out as part of the Defence Technology Innovation Centre Weapons Research Programme: UK-E: Hazard
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ReferencesGustafsson et al. (1979) Transient hot-strip method for simultaneously measuring thermal
conductivity and thermal diffusivity of solids and fluids. J. Phys. D: Appl. Phys. 12 1411-1421
Hanson-Parr D.M., and Parr T.P. (1999) Thermal property measurements of solid rocket propellant oxidizers and binder materials as a function of temperature. J. Energetic Materials 17 001-047.
Kaelble D.H. (1970) Dispersion-polar surface tension properties of organic solids. J. Adhesion 2 66-81.
Palmer S.J.P., Williamson D.M., Proud W.G. (2006) Adhesion studies between HMX and PBX binder system. in 2005 APS SCCM pp. 917-920.
Palmer S.J.P., Williamson D.M., Proud W.G. and Bauer C. (2007) Thermal properties of a UK PBX and binder system. in 2007 APS SCCM pp. 849-852.
Rosano H.L., Gerbacia W., Feinstein M.E., and Swaine J.W. (1971) Determination of the critical surface tension using an automated wetting balance. J. of Colloid and Interface Science36 298-307.
Williamson D.M., Siviour S.R., Proud W.G., Palmer S.J.P., Govier R., Ellis K., Blackwell P., Leppard C. (2008) Temperature–time response of a polymer bonded explosive in compression. J. Phys. D: Appl. Phys. 41 085404.
Williamson D.M., Palmer S.J.P., Proud W.G., and Govier R. (2009a) Brazilian disc testing of a UK PBX approaching the glass transition condition. in 2009 APS SCCM pp. 494-497.
Williamson D.M., Palmer S.J.P., Proud W.G., and Govier R. (2009b) Thermodynamic work of adhesion between HMX and a UK PBX binder system. in 2009 APS SCCM pp. 478-481.
Yee R.Y., Adicoff A., and Dibble, E.J. (1980) Surface properties of HMX crystal. In 17th Combustion meetings: papers JANNAF.