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![Page 1: Summary of CMS 3D pixel sensors R&D Enver Alagoz 1 On behalf of CMS 3D collaboration 1 Physics Department, Purdue University, West Lafayette, IN 47907-2036.](https://reader035.fdocuments.in/reader035/viewer/2022062717/56649e455503460f94b39fbc/html5/thumbnails/1.jpg)
Summary of CMS 3D pixel sensors R&D
Enver Alagoz1
On behalf of CMS 3D collaboration1Physics Department, Purdue University, West Lafayette, IN 47907-2036 US
US CMS Meeting, Colorado-Boulder, 18 May 2012
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• 3D vs planar• 3D sensor layouts• 3D assembly• 3D pixel sensors tests
– Lab test results– Beam test results
• Irradiation• Post-irradiation tests
– Lab test results– Beam test results
• Summary & outlook
Outline
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3D vs planar
ionizing particle
300µm
n+
p+
e
h
depletion
p-type
p+ n+
50µm
p-type
depletion
PLANAR: 3D:
• p+ and n+ electrodes are arrays of columns that penetrate into
the bulk
• Lateral depletion
• Charge collection is sideways
• Superior radiation hardness due to smaller electrode spacing: - smaller carrier drift distance - faster charge collection - less carrier trapping - lower depletion voltage
• Higher noise
• Complex, non-standard processing
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3D layouts (200 µm substrate thickness)4E Configurationn+ (readout) p+ (bias)
100
μm
150 μm
2E Configuration
1E Configuration
SIN
TEF
3D
(20
0 μ
m th
ick)
CNM
3D
(20
0 μ
m th
ick)
FBK
3D (2
00 μ
m th
ick)
Sin
gle-
side
etc
hing
Dou
ble-
side
etc
hing
Dou
ble-
side
etc
hing
4
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Lab test setups• Sensors bump bonded to PSI46v2 ROC in SELEX/IZM (In/PbSn bumps)• Wire bonded and assembled on FPIX plaquettes/testboards• PSI test setup is used to fully calibrate FBK sensors in lab
• ROC calibration• Noise• Charge collection with Sr-90 source
Purdue lab warm test setup Purdue cold test setup
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3D Plaquettes/testboards
SensorROC
Bump bonds
VHDIBase
plateAdhesive
Wire
bond
Bias wire SIN
TEF
3D FBK
3D
CNM
3D
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IV measurements @ 21 °C SINTEF 3D
FBK 3DCNM 3D
Breakdown voltages:
CNM > 100V
SINTEF > 100
FBK < 40V
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Noise scans @ 21 °C
Unable to measure noise at Vbias < 40V for 4E sensors from SINTEF 3D
4E2E
1E
SINTEF 3D
FBK 3D
• Planar FPIX/BPIX noise
~ 100-150 electrons• 3D sensors are
noisier 8
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Charge collection @ 21 °C • Sr-90 source: 1 mCi, Eβ = 0.546 ΜeV• Random trigger used
Landau convoluted Gaussian fit
1 Vcal = 65 e- MP = 14 ke-
SINTEF 3D
FBK 3D
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FBK (200 μm thick)
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BEAM
CONTROL ROOM
DUT
PIXEL DETECTORS
SCINTILLATORS
3.7V POWER SUPPLY
ACELLERATOR CLOCK
CLOCK AND TRIGGER
DISTRIBUTION
FNAL testbeam• 120 GeV protons• No B field
Meson Area
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Beam test results
Telescope alignment with the Monicelli software developed by Milano Uni. collaboration
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Beam test results
Beam spot 93.4% efficiency
Unirradiated sensors
Beam spot 98.5% efficiency
CN
M 3
DV
bias
= -
15V
: 0
o til
t
FB
K 3
DV
bias
= -
15V
: 0
o til
t
12
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• Irradiation at the Los Alamos Neutron Science Center (LANSCE) with 800 MeV protons/cm2
– Fluences: 3.5E14, 0.7E15, and 3.5E15 neq/cm2 (FBK)
– Fluences: 0.7E15, and 3.5E15 neq/cm2 (SINTEF)
– Fluences: 1E14, 3E14, 5E14, and 0.7E15 neq/cm2 (CNM)• Post-irradiation lab (@ Purdue) and beam tests (@ FNAL)
performed for SINTEF and FBK 3D sensors– CNM sensors only tested in testbeams
• All readout chips work after irradiation– Except SINTEF case: 1 out of 6 ROCs worked
• Post-irradiation lab measurements carried out in the thermal chamber running at -20 °C – sensor temp estimated by an IR camera to be -7 °C
Irradiation
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Irradiation: IV tests @ -20 °C SINTEF 3D
FBK 3D
• SINTEF 3D breakdown improved by 15V
• FBK 3D breakdown improved by less than 10V
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Irradiation: Noise tests @ -20 °C SINTEF 3D
FBK 3D
• SINTEF 3D noise degraded by less than 50 electrons
• FBK 3D noise degraded by less than 50 electrons
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Irradiation: Charge collection @ -20 °C
Signal LOSS in FBK 3D (@ -30V):
1E 43% after 1E15 p/cm2 (0.7E15 neq/cm2)1E 50% after 5E15 p/cm2 (3.5E15 neq/cm2)
2E 14% after 1E15 p/cm2 (0.7E15 neq/cm2)4E 14% after 1E15 p/cm2 (0.7E15 neq/cm2)SINTEF (200 μm thick)
FBK (200 μm thick)
• Sr-90 source: 1 mCi, Eβ = 0.546 ΜeV• Random trigger used
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Irradiation: Beam test resultsC
NM
(@
-80
V)
FB
K (
@ -
30V
)S
INT
EF
(@
-80
V)
p+
n+
1E
2Ep+
n+
4E p+
n+
• electrodes are less sensitive: observed lower efficiency on electrode regions
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Summary & outlook
• 3D sensors have several features outperform planar sensors• Sensors received from SINTEF (Norway), FBK (Ital), and CNM (Spain)-Lab characterization tests done at Purdue• Breakdown voltage: SINTEF > 100V, CNM > 100V, and FBK < 40V• 3D sensors have higher noises vs CMS planar sensorsTestbeams carried at FNAL • All efficiencies are higher than 90%Irradiation performed at Los Alamos (800 MeV protons/cm2)• Irradiated fluences are between 1E14 and 3.5x1015 neq/cm2
• Signal loss in FBK 3Ds is lower (14%) for sensors with more than 1 electrodes
Next:• Expecting 3Ds from SINTEF without support wafer• Expecting 3Ds with 1E,2E, and 4E configurations from CNM• Next irradiation fluences will go up to 1E16 neq/cm2
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Czech Technical University, Fermilab, Purdue University, INFN Turin, SINTEF, SLAC, University of Hawaii, University of Manchester
3DC
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BACKUP SLIDES
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Noise tests @ 21 °C Single pixel SCurve
2D noise map
Noise distributionError function fit
Gaussian fit
Higher noise due to long pixel on the sensor edges
Noise measurement of FBK 1E type 3D sensor
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