SQEQ Electrical Characterization...I-Trac Connector: Electrical Characterization Report Signal...
Transcript of SQEQ Electrical Characterization...I-Trac Connector: Electrical Characterization Report Signal...
I-Trac™ Connector: Electrical Characterization Report
Electrical Characterization
Report
Date: April 15, 2008 Revision: 7
By David Dunham Molex Inc.
[email protected]: (630) 718-5817 fax: (630) 813-5817
Disclaimer: Molex does not guarantee the performance of the final product to the information provided in this document. All information in this report is considered Molex proprietary and confidential.
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I-Trac™ Connector: Electrical Characterization Report
Table of Contents I-Trac™ Connector: Electrical Characterization Report ............................................................................ 1 Connector Overview ................................................................................................................................. 3
I-Trac Test Fixture .................................................................................................................................. 3 PCB Description ................................................................................................................................. 4 Trace Routing...................................................................................................................................... 5 Signal Mapping................................................................................................................................... 8 I-Trac Pin Layers ................................................................................................................................ 8 Calibration Traces............................................................................................................................... 9
Test Set-Up and Description .................................................................................................................. 10 Time Domain Analysis............................................................................................................................ 12
Diff TDR Impedance (6-Pair Pattern)................................................................................................... 12 Diff CM Impedance (6-Pair Pattern) .................................................................................................... 14 Propagation Delay................................................................................................................................. 17 Pair-to-Pair Skew.................................................................................................................................. 18 Crosstalk ............................................................................................................................................... 19
Eye Pattern Data ..................................................................................................................................... 22 6.25 Gb/s Diff Eye Patterns .................................................................................................................. 22 12.5 Gb/s Diff Eye Patterns .................................................................................................................. 26 Eye Patterns using Tx/Rx grouping ...................................................................................................... 29
TX/Rx Grouping Summary Chart..................................................................................................... 30 6.25 Gb/s Eye Patterns with Pattern 1: K2 RX/TX grouping ........................................................... 31 12.5 Gb/s Eye Patterns with Pattern 1: K2 RX/TX grouping ........................................................... 32 6.25 Gb/s Eye Patterns with Pattern 2: H2 RX/TX grouping ........................................................... 33 12.5 Gb/s Eye Patterns with Pattern 2: H2 RX/TX grouping ........................................................... 34
Frequency Domain Analysis .................................................................................................................. 35 Overview:.............................................................................................................................................. 35 Differential Insertion Loss (6-pair Pattern)........................................................................................... 35 Differential Return Loss (6-pair Pattern).............................................................................................. 38 Isolation (6-pair Pattern) ....................................................................................................................... 41
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I-Trac™ Connector: Electrical Characterization Report
Connector Overview
I-Trac pin out and routing features Daughter Card: 2.5mm x 1.50mm Pitch Backplane: 2.5mm x 1.35mm/2.10mm
Routability Can route along rows Can route along columns
Plated Thru-Hole Size 0.46mm (18mils) finished
Reparability
Single pin replacement on backplane, single wafer Daughtercard
I-Trac Test Fixture
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I-Trac™ Connector: Electrical Characterization Report
PCB Description General - 8 Layers - Material: Rogers 4350B (and associated pre-preg) and FR4 - Transmission line structure: guarded stripline with the “guards” being at least 12 mils away (preferably 15 mils) -2 Connector footprints on the PCB -Thickness: 92 mils ± 10% -Connector footprint: 11 rows tall, 6 wafers wide
- Signals are on the first three wafers - The fourth wafer has signal lines terminated in 50 ohm resistors - Signal lines in wafers 5 and 6 are floating
-Trace width: 7.2 mils -Trace lengths are on the order of 3.5 inches long
PCB Stack Construction
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I-Trac™ Connector: Electrical Characterization Report
Trace Routing Note: Images below are not on the same scale.
PCB Layout
6-pair Panel
8-pair Panel
Daughter Card Backplane
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I-Trac 6-pair Backplane Signal Layer 1 I-Trac 6-pair Backplane Signal Layer 2
I-Trac 6-pair Backplane Signal Layer 3
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I-Trac 8-pair Backplane Signal Layer 1 I-Trac 8-pair Backplane Signal Layer 2
I-Trac 8-pair Backplane Signal Layer 3
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Signal Mapping
I-Trac Pin Layers
(6-pair pattern)
Wafer Wafer Wafer Row 1A 1B 2A 2B 3A 3B
L S1 S1 S1 S1 S3 S3 KG G G G G G G J S1 S1 S3 S3 S3 S3
HG G G G G G G G S2 S2 S1 S1 S2 S2
FG G G G G G G E Term Term Term Term Term Term
DG G G G G G G C S3 S3 S3 S3 S1 S1
BG G G G G G G A S3 S3 S2 S2 S1 S1
where S1 is signal layer #1, S2 is signal layer #2 , S3 is signal layer #3 and G is ground. Row L is the longest path and row A is the shortest. The differential pair consists of both the “A” and “B” columns. For example, C1A, row C and C1B, row C make up one differential pair.
I-Trac Pin Layers (8-pair pattern)
Wafer 1 Wafer 2 Wafer 3
Row 1A 1B 2A 2B 3A 3B L S1 S1 S1 S1 S3 S3 K S1 S1 S3 S3 S3 S3
JG G G G G G G H S2 S2 S1 S1 S2 S2 G Term Term Term Term Term Term
FG G G G G G G E Term Term Term Term Term Term D Term Term Term Term Term Term
CG G G G G G G B S3 S3 S3 S3 S1 S1 A S3 S3 S2 S2 S1 S1
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Calibration Traces
- Signal Layer #1 o 1x thru cal trace (approx 3.5” in length) o 2x thru cal trace: length is 7” o 1L open cal trace: length is 2.7” o 1L short cal trace: length is 2.7 o 1L terminated (50 ohm resistor) cal trace: length is 2.7” o 5 TRL traces (see above for lengths)
- Signal Layer #2 o 1x thru cal trace o 2x thru cal trace o 1L open cal trace: length is 2.953” (75.0mm) o 1L short cal trace: length is 2.953” (75.0mm) o 1L terminated (50 ohm resistor) cal trace: length is 2.953” (75.0mm) o 5 TRL traces (See above for lengths)
- Signal Layer #3 o 2x thru cal trace
TRL Traces:
- The frequency span and length for the three TRL traces is: o 0.16-0.80GHz: length is 9.203” (233.76mm) o 0.80-4.0GHz: length is 6.565” (166.75mm) o 4.0-20.0GHz: length is 6.037” (153.35mm)
- Two additional traces for overlap have been added o 0.48-2.4GHz: length is 7.005” (177.92mm) o 2.4-12.0GHz: length is 6.125” (155.58mm)
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Test Set-Up and Description
Equipment List: Agilent PNA E8364B/X4421B Vector Network Analyzer
Agilent PLTS version 2.5 software Tektronix TDS8000 Digital Sampling Oscilloscope Rhode & Schwarz SMP02 Signal Generator Advantest D3186 Pulse Pattern Generator TDA Systems IConnect version 3.5 software
Tests Performed: TDR Impedance: trise = 50ps (10%-90% ) Near-end and Far-end Crosstalk trise = 50ps (10%-90% ) Eye Pattern (6.25Gbps and 12 Gbps) Insertion Loss (from 50 MHz to 20 GHz) Return Loss (from 50 MHz to 20 GHz) Isolation (from 50 MHz to 20 GHz)
TDR Impedance: The daughter card side is driven. All immediate neighbors are terminated with 50Ω loads.
Crosstalk: All signals are driven from the daughter card side. Listening on the daughter card side is NEXT. Listening on the backplane side is FEXT. All immediate neighbors are terminated with 50Ω loads.
Total crosstalk is reported as the square root of sum of squares of the maximum value of all the individual contributions. (see detailed description below, page 15)
Eye Pattern: All signals are driven from the daughter card side. All immediate neighbors are terminated with 50Ω loads.
Insertion Loss/Return Loss/ Isolation: All immediate neighbors are terminated with 50Ω loads.
Port 1 is on the daughter card. Port 2 is on the backplane and corresponds to Port 1. Port 3 is on the daughter card. Port 4 is on the backplane and corresponds to Port 3. Ports 1 and 3 are the inputs of the differential pair. Ports 2 and 4 are the outputs of the differential pair.
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I-Trac™ Connector: Electrical Characterization Report
Convention for defining risetime: Measurement risetime is defined as risetime of the signal at the end of the PCB trace going into the connector
3dB BW is calculated as follows: Measured 2X 3 dB cal trace bandwidth = 3.2 GHz Calculated 1X 6 dB Cal trace bandwidth = 10 GHz Risetime Degradation = .35/10 GHz = 35 ps Risetime to the Connector = [ (System Risetime)2 + (Risetime Degradation)2] ½ = [ (35 ps)2 + (35 ps)2] ½ = 49 ps (10-90%)= 30ps (20-80%)
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Time Domain Analysis
Diff TDR Impedance (6-Pair Pattern)
Trise = 30 ps (20-80%) Diff Pair Min Max Delta
L1 93 97 +/- 2.0 L2 93 97 +/- 2.0 L3 93 99 +/- 3.0 J1 93 99 +/- 3.0 J3 94 99 +/- 2.5 J3 93 99 +/- 3.0 G1 93 99 +/- 2.5 G2 91 97 +/- 3.0 G3 90 98 +/- 4.0 C1 94 99 +/- 2.5 C2 94 99 +/- 2.5 C3 92 96 +/- 2.0 A1 94 101 +/- 3.5 A2 94 97 +/- 1.5 A3 91 96 +/- 2.5
Impedance measurements are reported in Ohms.
Impedance min/max values do not include the connector via’s
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I-Trac™ Connector: Electrical Characterization Report
Pairs A1, C1 – Short via stub Pairs A2, C3 – Long via stub
Tr = 30 ps 20/80
Short via stubs
Long via stubs
Pairs J3, L3 – Short via stub Pairs G1, L2 – Long via stub
Tr = 30 ps 20/80
Short via stubs Long via stubs
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I-Trac™ Connector: Electrical Characterization Report
Diff CM Impedance (6-Pair Pattern)
Trise = 30 ps (20-80%) CM Pair CM Imp
L1 77 L2 73 L3 73 J1 54 J2 54 J3 54 G1 55 G2 55 G3 55 C1 56 C2 55 C3 52 A1 76 A2 68 A3 68
Impedance measurements are reported in Ohms.
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I-Trac™ Connector: Electrical Characterization Report
Pairs C1, C2, C3
Diff CM Conn Imp
Diff CM PCB Imp
Tr = 30 ps 20/80
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I-Trac™ Connector: Electrical Characterization Report
Diff CM Conn Imp
Pairs J1, J2, J3
Diff CM PCB Imp
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Propagation Delay
Note1: Propagation delay is measured with reference to a 2X cal trace at 10% voltage level.
Propagation Delay
MOLEX INCORPORATED
These propagation times are based on a 6 pair signal/gnd pattern
Trise = 30 ps (20/80%) Diff Pair Pd (ps) @ 10%
L3 223 J3 202 G1 181 E1 166 C2 152 A1 137
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Pair-to-Pair Skew Note1: Skew is measured at 10% voltage level of the TDT step.
6-Pair Pattern
Trise = 30 ps (20/80)
Diff Pair Pd (ps) L-L 0 L-J 21
L-G 42 L-C 71 L-A 86
8-Pair Pattern
Trise = 30 ps (20/80) Diff Pair PD (ps)
L-K 1.9 L-J 4.7 L-B 77.3 L-A 80.1
Terminal Lengths
Terminal Length mm (in) L 44.19 (1.74”) K 42.01 (1.65”) J 39.79 (1.57”) H 37.57 (1.48”) G 35.35 (1.39”) F 33.13 (1.30”) E 30.91 (1.22”) D 28.69 (1.13”) C 26.48 (1.04”) B 24.26 (.95”) A 22.07 (.86”)
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I-Trac™ Connector: Electrical Characterization Report
Crosstalk Note1: For this report, the Near End is the Daughter Card side and the Far End is
the Backplane side. Note2: Total crosstalk in each table is reported in three different formats: RSS, Sum Peak and Sum Synchronous.
NEXT Victim: J2 Trise = 30 ps (20-80%)
-2.0-1.8-1.6-1.4-1.2-1.0-0.8-0.6-0.4-0.20.00.20.40.60.81.0
3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0
Time (ns)
% C
ross
talk
L1
L2
L3
J1
J3
G1
G2
G3Aggressor J3
Aggressor J1
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I-Trac™ Connector: Electrical Characterization Report
Percent Crosstalk for Longest 6-pair Lines Victim (J2)
NEXT FEXT
MOLEX INCORPORATED
Percent Crosstalk for Shortest 6-pair Lines
Victim (C2)
Aggressor L1 0 0 L2 .5% .5% L3 0 0 J1 1% .2% J3 1.2% 0 G1 0 0 G2 .5% .5% G3 0 0
RSS Total 1.7% 0.7% Sum Sync 2.1% 0.8% Sum Peak 3.2% 1.2%
L K J H G F E D C B A
NEXT FEXT
Aggressor E1 0 .0 E2 0 .3% E3 0 0 C1 1.1% .25% C3 1.2% 0 A1 0 0 A2 0 .3% A3 0 0
RSS Total 1.6% .5% Sum Sync 2.3% .6% Sum Peak 2.3% 0.85%
L K J H G F E D C B A
1 2 3
1 2 3
Terminated
Terminated
Column Column Column
Rows
Column Column Column
Rows
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I-Trac™ Connector: Electrical Characterization Report
Percent Crosstalk for Tx/Rx Grouped Longest 8-pair Pattern
Victim (K2)
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Percent Crosstalk for Tx/Rx Grouped Shortest 8-pair Pattern
Terminated
Rx/Tx FEXT
Rx/Tx NEXT
Rx/Tx NEXT (Terminated)
Rx/Tx FEXT
1 2 3
Column Column Column
1 2 3
Column Column Column NEXT FEXT
Victim (B2)
*Assumes Symmetry by using Jpair to Hpair dat
Aggressor L1 NA 0 L2 NA 2.6% L3 NA 0 K1 NA 0 K3 NA 0 H1 0 NA H2 .4% NA H3 0 NA
Sum Peak .4% 2.6%
L K J H G F E D C B A
Rows
NEXT FEXT
Aggressor D1* 0 NA D2* .4% NA D3* 0 NA B1 NA 0% B3 NA 0% A1 NA 0% A2 NA 1.1% A3 NA 0%
Sum Peak .4% 1.1%
L K J H G F E D C B A
Rows
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Eye Pattern Data 6.25 Gb/s Diff Eye Patterns 6.25 Gb/s Inputs: Data rate = 29-1 PRBS Tr = 40ps 10/90% Vin = 0 to 400mv
6.25 Gb/s Performance Summary Signal Pair Eye Width (ps) Eye Height (mv) Jitter (ps)
2x Cal 153 304 7.4 Pair A1 153 (0%) 299 (1.6%) 7.4 (0 ps) Pair L2 148 (3.3%) 266 (12.5%) 11.6 (4.2 ps)
Note: () values are % connector contribution referenced from fixture burden
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I-Trac™ Connector: Electrical Characterization Report
Simulated eye for 2X calibration trace @ 6.25 Gb/s (Fixture Burden)
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I-Trac™ Connector: Electrical Characterization Report
Simulated eye for Pair A1: Shortest connector pair, shortest PCB via stub @ 6.25 Gb/s
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I-Trac™ Connector: Electrical Characterization Report
Simulated eye for Pair L1: Longest connector pair, longest PCB via stub @ 6.25 Gb/s
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12.5 Gb/s Diff Eye Patterns
12.5 Gb/s Inputs: Data rate = 29-1 PRBS, Tr = 32ps 10/90%, Vin = 0 to 400mv
12.5 Gb/s Performance Summary Signal Pair Eye Width (ps) Eye Height (mv) Jitter (ps)
2x Cal 71.45 212 8.5 Pair A1 70.2 (1.74%) 190 (8.9%) 10 (1.5 ps) Pair L2 64.5 (9.7%) 131 (38%) 15.4 (6.9ps)
Note: () values are % connector contribution referenced from fixture burden
Simulated eye for 2X calibration trace @ 12.5 Gb/s (Fixture Burden)
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I-Trac™ Connector: Electrical Characterization Report
Simulated eye for Pair A1: Shortest connector pair, shortest PCB via stub @ 12.5 Gb/s
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I-Trac™ Connector: Electrical Characterization Report
Simulated eye for Pair L1: Longest connector pair, longest PCB via stub @ 12.5 Gb/s
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I-Trac™ Connector: Electrical Characterization Report
Eye Patterns using Tx/Rx grouping In order to estimate real channel noise , using TX/RX assignments, Molex has developed a methodology to estimate Jitter and eye height/width closure when applying adjacent channel noise to a near quiet line. This is done by measuring the Sparameters of the quiet line, and all the isolation, or noise coupling Sparameters from the quiet line to the nearest neighbors of interest. The Agilent ADS Ptolemy model allows Sparameters to be coupled into the quiet channel, using pulse adders Input signal conditions: PRBS: 211-1 Voltage: +/- 200 mv Pre/Post Emphasis = none Column Column Column Worst case Tx/Rx 8 pair grouping
Rows 1 2 3 Tx Tx Tx
Tx Tx Rx L K
JG H G
FGE D
CGB A
Pattern 1: K2 quiet
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1 2 3
Column Column Column Rows
Best Case Tx/Rx 8 pair grouping Tx Tx Tx L K
JG H G
FGE D
CGB A
Pattern 2: H2 quiet
Rx TX/Rx Grouping Summary Chart The table below tabulates eye height and width for 6.25/12.5 Gb/s and both patterns
6.25 Gb/s 12.5 Gb/s Pattern 1 Eye Height Eye Width Eye Height Eye Width K2 Quiet, no aggressors 267 mv 150 ps 184 mv 67 ps K2 Quiet, NEXT aggressors 230 mv 140 ps 153 mv 60ps
Delta 37 mv 10 ps 31 mv 7 ps Pattern 2 H2 Quiet, no aggressors 254 mv 147 ps 146 mv 62 ps H2 Quiet, NEXT aggressors 247 mv 146 ps 137 mv 59 ps
Delta 7 mv 1 ps 9 mv 2 ps Column Column Column
1 2 3 1 2 3
Column Column Column
Tx Tx
Rx Tx Tx
Tx Tx Tx Tx
Rx Pattern 1 Pattern 2
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I-Trac™ Connector: Electrical Characterization Report
6.25 Gb/s Eye Patterns with Pattern 1: K2 RX/TX grouping K2 without NEXT Aggressors (6.25Gbps)
Column Column Column
1 2 3
Tx Tx
Rx Tx Tx
Tx
Eye Height: 267mVp-p Eye Width: 150ps (160ps UI) K2 with NEXT Aggressors (6.25Gbps)
1 2 3
Column Column Column
Tx Tx
Rx Tx Tx
Tx
Eye Height: 230mVp-p Eye Width: 140ps (160ps UI)
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I-Trac™ Connector: Electrical Characterization Report
12.5 Gb/s Eye Patterns with Pattern 1: K2 RX/TX grouping K2 without NEXT Aggressors (12.5Gbps)
Column Column Column
1 2 3
Tx Tx
Rx Tx Tx
Tx
Eye Height: 184mVp-p Eye Width: 67ps (80ps UI) K2 with NEXT Aggressors (12.5Gbps)
1 2 3
Column Column Column
Tx Tx
Rx Tx Tx
Tx
Eye Height: 153mVp-p Eye Width: 60ps (80ps UI)
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I-Trac™ Connector: Electrical Characterization Report
6.25 Gb/s Eye Patterns with Pattern 2: H2 RX/TX grouping H2 without NEXT Aggressors (6.25Gbps)
Column Column Column
1 2 3
Rx
Tx Tx Tx
Eye Height: 254mVp-p Eye Width: 147ps (160ps UI) H2 with NEXT Aggressors (6.25Gbps)
Column Column Column
1 2 3
Rx
Tx Tx Tx
Eye Height: 247mVp-p Eye Width: 146ps (160ps UI)
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I-Trac™ Connector: Electrical Characterization Report
12.5 Gb/s Eye Patterns with Pattern 2: H2 RX/TX grouping H2 without NEXT Aggressors (12.5Gbps)
Column Column Column
1 2 3
Rx
Tx Tx Tx
Eye Height: 146mVp-p Eye Width: 62ps (80ps UI) H2 with NEXT Aggressors (12.5Gbps)
Column Column Column
1 2 3
Rx
Tx Tx Tx
Eye Height: 137mVp-p Eye Width: 59ps (80ps UI)
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I-Trac™ Connector: Electrical Characterization Report
Frequency Domain Analysis Overview: The Molex CTV is designed to evaluate connector performance is a variety of test conditions. To derive maximum performance understanding, with various signaling conditions, both long and short via scenarios are recorded in the VNA data below. Signal pairs A2, A3, C3, G1, G2, G3, J1, L1 and L2, show I/L and R/L performance with longer via stubs while pairs A1, C1, C2, J2, J3 and L3 show improved performance due to shorter stubs. Differential Insertion Loss (6-pair Pattern)
Insertion Loss (dB)
dB @ 3Ghz dB @ 6 Ghz
Freq @ 3 dB (GHz)
Via Stub Length (mils)
Signal Pair L3 -0.41 -0.78 10.6 17.9 Pair J3 -0.78 -2.21 8.2 17.9 Pair G1 -1.86 -3.28 6.0 68.6 Pair C2 -0.15 -0.43 11.3 17.9 Pair A1 -0.19 -0.49 8.8 17.9
* Pair G1 includes via stub effects Estimated PCB losses removed from data in table above
Effective Digital
BW (Gb/s) Signal Pair L3 > 20 Gb/s Pair J3 >16 Gb/s
Pair G1* >11 Gb/s* Pair C2 > 20 Gb/s Pair A1 >16 Gb/s
* Pair G1 includes via stub effects Estimated PCB losses removed from data in table above
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I-Trac™ Connector: Electrical Characterization Report
Pair A1: Shortest Path, Shortest Via Stub, PCB Losses Removed
MOLEX INCORPORATED Pair L3: Longest Path, Shortest Via Stub, PCB Losses Removed
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I-Trac™ Connector: Electrical Characterization Report
Pair J3: 2nd Longest Path, Shortest Via Stub, PCB Losses Removed
Pair G1: 3rd Longest Path, Long Via Stub, PCB Losses Removed
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I-Trac™ Connector: Electrical Characterization Report
Differential Return Loss (6-pair Pattern)
Minimum Return Loss (dB)
≤ 3GHz ≤ 6GHz Via Stub Length
(mils) Signal
L1 -12.15 -9.30 85.3 L2 -13.39 -10.24 85.3 L3 -20.00 -16.47 17.9 J1 -11.56 -8.54 85.3 J2 -17.24 -13.45 17.9 J3 -16.27 -14.06 17.9 G1 -12.39 -9.33 68.6 G2 -16.41 -9.81 85.3 G3 -11.89 -9.57 68.6 C1 -21.46 -14.84 17.9 C2 -19.65 -15.57 17.9 C3 -15.80 -11.05 85.3 A1 -19.77 -13.01 17.9 A2 -17.92 -10.36 68.6 A3 -17.99 -9.38 85.3
Return loss measurements at dB on or below 3 and 6 GHz
Test fixture not de-embedded from measurement.
MOLEX INCORPORATED 2222 WELLINGTON COURT, LISLE, IL 60532-1682
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I-Trac™ Connector: Electrical Characterization Report
Pair A1: Shortest Path, Shortest Via Stub
Pair L3: Longest Path, Shortest Via Stub
MOLEX INCORPORATED 2222 WELLINGTON COURT, LISLE, IL 60532-1682
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I-Trac™ Connector: Electrical Characterization Report
Pair J3: 2nd Longest Path, Shortest Via Stub
Pair G1: 3rd Longest Path, Long Via Stub
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I-Trac™ Connector: Electrical Characterization Report
Isolation (6-pair Pattern)
The four Isolation tables below provide the minimum isolation values, in dB, for a victim signal line in all four of the mixed mode parameters. The measurements were taken with the VNA attached to the victim signal lines on the motherboard, and the “aggressor” lines on the daughter card. The tables below show the worst-case dB isolation:
Victim: J2 Aggressors: J1, J3, L1, L2, L3, G1, G2, G3 Victim: G2 Aggressors: G1, G3, J1, J2, J3, C1, C2, C3
Driven Differential Mode/Listen Differential Mode Minimum Isolation (dB) Freq < 3Ghz Freq < 6 GHz Freq < 10GHz
Signal J2 -23.47 -19.66 -16.54 G2 -25.38 -21.45 -20.27
Driven Differential Mode/Listen Common Mode
Minimum Isolation (dB) Freq < 3Ghz Freq < 6 GHz Freq < 10GHz
Signal J2 -26.72 -25.59 -25.57 G2 -28.78 -28.16 -20.80
Driven Common Mode/Listen Differential Mode
Minimum Isolation (dB) Freq < 3Ghz Freq < 6 GHz Freq < 10GHz
Signal J2 -26.68 -23.89 -23.24 G2 -25.50 -25.80 -28.65
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I-Trac™ Connector: Electrical Characterization Report
Driven Common Mode/Listen Common Mode Minimum Isolation (dB) Freq < 3Ghz Freq < 6 GHz Freq < 10GHz
Signal J2 -18.08 -21.26 -19.92 G2 -17.85 -21.20 -22.20
Aggressor L3, Victim J2
MOLEX INCORPORATED 2222 WELLINGTON COURT, LISLE, IL 60532-1682
TEL 630-969-4550 FAX 630-969-4550 TLX 254069
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I-Trac™ Connector: Electrical Characterization Report
Aggressor J2, Victim G2
MOLEX INCORPORATED 2222 WELLINGTON COURT, LISLE, IL 60532-1682
TEL 630-969-4550 FAX 630-969-4550 TLX 254069
Page 43