Speech Synthesis LSI Series Ver.3 - Rohm
Transcript of Speech Synthesis LSI Series Ver.3 - Rohm
Speech Synthesis LSI SeriesVer.3.0
C o n n e c t w i t h I o T
*LAPIS Semiconductor study
Proven customer support provided for over 40 years
P
*
Supports
external memory
Qualified under
the AEC-Q100
automotive
standard
Built-in
long playback
memory
Built-in
short playback
memory
Speech Synthesis LSI series
LAPIS Semiconductor
Memory
Amp
ADPCM2HQ-ADPCMSynthesis
Simple
operation High audio
quality
Greater space
savings
Multiple
functions
In addition to leveraging sound technologies ranging from
audio compression/decompression and acoustic processing
to digital filters and amps, LAPIS Semiconductor's wide
lineup of speech synthesis LSIs integrate peripheral
technologies such as P2ROMTM and flash memory.
The broad portfolio includes series with built-in ROM ideal for
voice guidance/alarm/message/sound playback along with
high reliability types optimized for automotive applications.
Our focus on ‘enhanced sound quality’ has been
well-received by customers for many years.
We deliver solutions and support that meet customer
demands while providing added value.
*LAPIS Semiconductor study
Product development that takes intoaccount the needs of the times
Wide lineup ranges from simpleto high performance types
Proven customer support provided for over 40 years
*
LAPIS Semiconductor speech synthesis LSIs allow users to immediately add high quality voice functionality
to virtually any applicationLAPIS Semiconductor
Speech Synthesis LSIs feature:
LAPIS Semiconductor
Speech Synthesis LSIs feature:
LAPIS Semiconductor
Speech Synthesis LSIs feature:
t
s Simple
operationSimple
operation r
is High audio
qualityHigh audio
quality
r
is Greater space
savingsGreater space
savings
◆Enables easy audio playback by sending a simple command from the MCU
◆48kHz Max sampling
frequency (middleware
typically from 8kHz to 12kHz)
◆Built-in high performance
DAC and filter
◆Highly integrated design
from speech synthesis
engine to speaker amp
reduces the number of
external parts
◆Fewer external parts
reduces the failure rate
LAPIS Semiconductor
Speech Synthesis LSIs feature:
s Multiple
functionsMultiple
functions
◆Multiple built-in audio-related functions. Equipped with fail-safe functions including playback
sound detection for automotive use
•Simultaneous multi-channel playback function
•ROM editing functionand more...
Multiple functionsHigh fidelity/
high compressiondecoder
Simultaneousvocalization
Editingfunction
Speed andpitch conversion
Onboardwriting
All-in-one design
Decoder(hardware)
Amp
FilterMemory
Comprehensive support from LSI selection to mass productionFull services provided, including sound creation
Customer Tasks
Select the LSI series/ROM capacity
Create a phrase list
Create original audio
Voice analysis and editing
Complete the ROM data
STEP1. STEP3.
STEP4.
STEP5.
STEP2.
LAPIS Semiconductor and/or Customer Tasks
Select the LSI based on set requirements
Write before shipment
Applications
Speech? Soundeffects?
Melody?
PlaybackTime
Address
1 Good MorningGood Afternoon2
3
Speech
Studio recording
Editing
Volume adjustment
Mixing
Equalizing
Melody/sound effect creation
Existing source
Ad
dit
iona
l rec
ord
ing
(in
som
e ca
ses)
Add
ition
al re
cord
ing
(in s
ome
case
s)D
emo/
corr
ectio
n
05
Automotive-grade
ML2253x series
Flash Memory ROM Capacity
The ML2253x series of automotive-grade 4 channels speech synthesis LSIs
with built-in Flash memory are optimized serial audio interfaces and voice data.
Features include HQ-ADPCM, 16bit D/A converter, and low-pass filter for
achieving high sound quality, along with an integrated 1.0W monaural speaker
amp that enables direct speaker drive.
A failure detection function is also built in capable of detecting malfunctions.
All functions necessary for audio output are integrated on a single chip, making
it possible to easily add voice functionality by simply adding this LSI. *The maximum external memory that can be connected (there is no internal memory)
ML2253x series
to 2017 2018 2019 future from 2020
ParameterAdvantages of ROHM’s
New ProductsConventional Product
ML22Q573
New ProductML22Q53x/ML22530
Audio Interface
Flash memory rewrite fromMCU
ROM Capacity
Internal speaker amp
Simultaneous soundgeneration (mixing) function
Playback abnormality detection
Speaker disconnect/Short-circuit detection
Operating Temperature
None
None
4Mbit (Flash)
1W Class AB(8Ω, DVDD=5V)
4 channels 4 channelsEnables 4 channels simultaneous
playback of in-vehicle notification sounds
None LSI failure detection function added
Short-circuit detection only Enhanced functionality
–40°C to +105°CSupports high temperature operation:
+105°C
Serial Audio Interface
Available
16/4/2Mbit
1W Class AB(8Ω, DVDD=5V)
Available
Speaker disconnect/Short-circuit detection included
–40°C to +105°C
Supports audio playback from internal memory and external audio input
Rewrite possible after shipment
Expanded memory variety
Provides Class AB operation withoutconcern for radiation noise
Thermistor
Speech Synthesis LSIs
ML225xx series
ML223xx series
ML22594 (6Mbit)ML22Q553 (4Mbit)ML22(Q)573 (4Mbit)ML22572 (2Mbit)
ML22Q374 (696Kbit)ML22Q394 (696Kbit)
ML22Q535 (16Mbit)ML22Q533 (4Mbit)ML22Q532 (2Mbit)ML22530 (External ROM)
onalityyImproved funnncctioctionaaannceand performaaamanc
Enhanced failure detectionEnhanced failure detection▶Integrated failure detection functions
(Playback/Clock abnormality detection)
▶Built-in fail-safe functions(Short circuit/High-temperature/
Command transfer error detection)
▶Additional I/F (Serial audio I/F(I2S)etc.)
▶AEC-Q100 qualified
High performance・High fidelityHigh performance・High fidelity▶Guaranteed +105°C operation
▶High audio quality/high compression algorithms
▶Built-in fail-safe functions (High-temperature/Command transfer error detection)
▶Internal 1.0W speaker amp
Simple・CompactSimple・Compact▶Guaranteed +85°C operation
▶Internal 1.0W Class D speaker amp
▶Simple and Compact
Ideal for long audio playback in automotive applications
ML22Q532
ML22Q533
ML22Q535
ML22530
2Mbit
4Mbit
16Mbit
128Mbit*
06
Enables rewriting to internal/external Flash memoryfrom the MCU via SPI I/F
The ML22Q53x and ML22530 allow data to be
rewritten to the internal Flash and external
memory, respectively, via the MCU’s SPI I/F.
In addition, audio data can be rewritten in
the field even after product shipment.
Equipped with a variety of fail-safe functions
Multiple built-in fail-safe functions,
such as for detecting playback
abnormalities, speaker pin
short-circuits, internal LSI
temperature, supply voltage drops,
and MCU command transfer errors,
make it possible to monitor for
a variety of LSI failure modes.
Short-circuit detectionPlayback abnormality detection
Output becomes H when groundfaults occur between the SP pins
(output normally L)
Output becomes H duringabnormal playback
High temperature error detection
Speech Synthesis
LSIs
Detection
Circuit
ThermistorThermistor
ERR outputCPU
Output becomes H at high temperatures(output normally L)
Command transfer error detection
Speech Synthesis
LSIs
ERR outputCPUSPI
I/FComparator
SI
SCK
SO
Inputcommands
twice
If the commands are differenttwo times, the output becomes H
(output normally L)
ERR outputCPU
SP+ pin
SP– pin
Short-circuitdetection
Short-circuit
Short-circuit
Feature
1
Feature
2
Enhanced failure detection
High performance・High fidelity
Simple・Compact
Rewriting audio data
ML22Q53x
MCU
Internal
Flash
memory
SPI I/F Pin
SPI I/F Pin
Rewritable
MCU
External
Flash
memoryRewritable
ML22530
Playbackcheck
MCU
Logic Analog
Provides fault detection fromthe input to the speaker pins
07
ML2257x series ML223xx series
Built-in speaker amp ensures stable operation at +105°C
Backside die pad featuring superior heat dissipation ensures high temperature operation
Automotive-grade speech synthesis LSIs are offered featuring
a guaranteed operating temperature range of –40°C to
+105°C. Integrated memory and speaker amp, together with
support for high temperature operation, ensure worry-free
use in automotive applications.
The exposed backside die pad enables heat dissipation through
the substrate, making it possible to suppress temperature rise
within the LSI (including the speaker amp) and ensure stable
performance even at an ambient temperature of +105°C.
Applicable Models: ML22572, ML22(Q)573, ML22Q553, ML22594
Guaranteed +105°Coperating temperature
Backside Die Bond
Mold Resin
Die BondPaste
Frame
Device Chip
Spacer ChipDie BondPaste
Thermal dissipation to the substrate suppresses temperature rise
Terminal Terminal
Data expansion possible by connecting external memory to the internal ROM
Memory can be expanded by connecting external memory
up to 128Mbit to the internal 6Mbit Mask ROM. Storing
common sound data in the internal ROM and using external
memory (capacity depends on the model) to store extended
data facilitates customer development and inventory
management.
Applicable Models: ML22594
Advantages of external memory
MCU
Japanese
Wear yourseatbelt
English
Speech Synthesis ICs
Buuu-n
Peee peeeTick tick(blinker sound)Tick tick
(blinker sound)
Peee peeeWear yourseatbelt
Peee peee
Smooth
replacement of
extended data
Common Phrases
External memory
Thermistor
The ML2257x series features a guaranteed operating
temperature of +105°C Max and integrates a 4 channels
mixing function along with speaker amp.
Multiple fail-safe functions required for automotive
applications are also built-in, including detection of
the internal LSI temperature, supply voltage drops,
and MCU command transfer errors.
MaskROM Flash Memory ROM Capacity
Pin compatibility
*Integrated 6Mbit allows external memory to be connected
Integrated oscillator and Class D amp reduces component count
The built-in high accuracy 4.096MHz+1.5% (–10°C to +50°C)
oscillator and Class D amp require almost no peripheral
parts and enable audio playback by simply connecting to
a speaker. In addition, the compact package reduces
mounting area.
Reduced mounting area
Conventional
MCU Speech Synthesis LSIs
Class D AmpOscillator
Speaker
LAPIS Semiconductor
MCU Speech Synthesis LSIs
Class D AmpOscillator
Speaker
Built-in
ass D AmOscill
Reduces the number of
components
from 5 to 3
Reduces the number of
components
from 5 to 3
Ideal for short audio playback in automotive applications
Feature
1
Feature
2
Feature
3
Automotive-grade Speech Synthesis LSIs
2Mbit
4Mbit
4Mbit
6Mbit*
692Kbit
692Kbit
—
ML22Q573
ML22Q553
—
ML22Q374
ML22Q394
ML22572
ML22573
—
ML22594
—
—
シートベルトを締めて下さい
シートベルトを締めて下さい
08
Tick tick(blinker sound)
Fail-safe functions ensure high system reliability
Worry-free fail-safe functions
4 built-in error flags for detecting
speaker pin short-circuits,
internal LSI temperature,
supply voltage drops, and
MCU command transfer errors
make it possible to notify
the control MCU of
abnormalities via the ERR pin.
Enables simultaneous playback of up to 5 channels (4 channels audio playback + 1 channel external input). What’s more, the volume of each channel can be independently adjusted, providing greater ease-of-use.
5 channels mixing and independent volume adjustment
The ML22572, ML22(Q)573, ML22Q553, and ML22594
integrate a mixing function that enables simultaneous
playback of 4 internal and 1 external channels.
This makes it possible to play multiple sound effects, audio,
and external audio input at the same time. The volume of
each channel can be independently adjusted. And users can
play mixed sounds at a certain volume without changing
the volume of the original audio.
Applicable Models: ML22572, ML22(Q)573, ML22Q553, ML22594
GAIN
GAIN
channel5
SPAmp.
DAC
16bitDAC
VOL
ADPCM
channel1
CPU
CPU I/F
Independent volume control in 3 stages
channel2
channel3
channel4
Peeepeee
Tick tick(blinker sound)
Seatbelt warning
Buuu-n
Seatbelt
warning
Buuu-n
Peeepeee
MIXING
AIG AVOL
External input
Short-circuit detection
Applicable Models: ML22Q553, ML22594, ML22Q374, ML22Q394
High temperatureerror detection
SpeechSynthesis LSIs
DetectionCircuit
ThermistorThermistor
ERR outputCPU
Output becomes Hat high temperatures(output normally L)
Applicable Models:ML22572, ML22(Q)573
Supply voltagedrop detection
SpeechSynthesis LSIs
Vref
ComparatorComparator
CPUERR output
When the voltage drops belowthe set voltage the output
becomes H(output normally L)
Applicable Models:ML22572, ML22(Q)573
Command transfererror detection
SpeechSynthesis LSIs
ERR outputCPUSPI
I/FComparator
SI
SCK
SO
Inputcommands
twice
If the commands are differenttwo times, the output
becomes H(output normally L)
Applicable Models:ML22572, ML22(Q)573
Flash memory types support onboard writingOnboard writing for each customer based on destination
The ML22Q573, ML22Q553, ML22Q374, and ML22Q394
are Flash memory types that enable onboard writing. This
allows audio data to be uploaded while mounted on
the customer’s board. Incorporating a speech synthesis LSI
on board facilitates inventory management, making it possible
to customize voice data according to the destination. In addition,
the flexible design enables rewriting before shipment as well
as audio data to be updated at service centers.
Note: Onboard write data must be purchased from a write manufacturer
Applicable Models: ML22Q573, ML22Q553, ML22Q374, ML22Q394
Shipment to English-speakingcountries
Shipment to Chinese-speakingcountries
Shipment to Korean-speakingcountries
Inventory management ofsystem boards by mounting
speech synthesis LSIs Hello!
你好。
Speech
Synthesis LSIs
Onboard program
System board
System board
System board
ERR outputCPU Short-circuit
detection
Short-circuit
Short-circuit
Reduces the number of
components
from 5 to 3
Feature
4
Feature
5
Feature
6
SP+ pin
SP– pin
Output becomes Hwhen ground faults occur
between the SP pins(output normally L)
Tick tick(blinker sound)
09
ML226xx series (Built-in Flash Memory)
Flash Memory The ML226xx series is equipped with 4Mbit to 32Mbit
Flash memory. The large memory capacity is ideal for long
audio playback such as voice guidance, while Flash
memory makes rewriting of audio data possible.
ROM CapacitySerial I/FI2C I/F
ML228xx/7xx series
ML226xx series
e
ML22Q626/666 (32Mbit)
ML22Q625/665 (16Mbit)
ML22Q624/664 (8Mbit)
ML22Q623/663 (4Mbit)
ML22825/865/725/765 (16Mbit)
ML22824/864/724/764 (8Mbit)
ML22823/863/723/763 (4Mbit)
ParameterAdvantages of ROHM’s
New ProductsConventional Product
ML2282x/ML2286x
New ProductML22Q62x/ML22Q66x
ROM Types
ROM Capacity
Playback mode
Max Phrase Count
Internal speaker amp
Speaker disconnect/Short-circuit detection
Speaker Amp Supply
P2ROM™
4/8/16Mbit
4bit ADPCM28bit straight PCM
8bit non-linear PCM16bit straight PCM
1,024 4,096 4x higher phrase count
0.7W Class AB(8Ω, DVDD=5V)
Built-in high efficiency Class D amp with higher Max output
None Enhanced functionality
Same potential as DVDD3V MCU/5V speaker amp
combo possible
Flash Memory
4/8/16/32Mbit
HQ-ADPCM4bit ADPCM2
8bit straight PCM8bit non-linear PCM16bit straight PCM
1.0W Class D/AB(8Ω, DVDD=5V)
Available
Different potential as DVDD
Enables rewriting to Flashmemory from the MCU via SPI
Expanded memory variety
Utilizes market-provenhigh fidelity, high compression
HQ-ADPCM
to 2017 2018 2019 future from 2020
▶Built-in flash memory (can be rewritten from MCU*)
▶Built-in high fidelity, high compression algorithm(HQ-ADPCM)
▶Internal 1.0W speaker amp (Class AB/D)
▶Selectable internal/external oscillator
▶Integrated fault detection function(Speaker disconnect detection, Short-circuit detection)
▶Built-in P2ROMTM
▶4bit ADPCM2
▶Internal 0.7W speaker amp (Class AB)
▶Speed · pitch conversion
Ideal for long audio playback in industrial and consumer applications
High performance · High fidelityHigh performance · High fidelity
Long playback Speech Synthesis LSIs
onalityyImproved functiom ctionaand performancen manc
*Only ML22Q62x/22620 can be rewritten from MCU.
ML22Q663
ML22Q664
ML22Q665
ML22Q666
ML22Q623
ML22Q624
ML22Q625
ML22Q626
4Mbit
8Mbit
16Mbit
32Mbit
10
Enables rewriting to internal Flash memory from the MCU via SPI I/FThe ML22Q62x allows data to be rewritten to
the internal Flash memory via the MCU’s SPI I/F
In addition, audio data can be rewritten in the field
even after product shipment.
Built-in high output, high efficiency Class D ampThe ML22Q62x and ML22Q66x
integrate a high efficiency, high
output 1W Class D amp. Class D
amps provide greater efficiency and
generate less heat than conventional
Class AB amps.
Built-in speaker fault detection functionBoth the ML22Q62x and ML22Q66x are
equipped with failure detection functions for
detecting speaker disconnections and
short-circuits. This allows for immediate
notification of speaker failures. Speaker output
is stopped when a short-circuit is detected to
prevent overcurrent.
High performance · High fidelity
Feature
1
Feature
2
Feature
3
Rewriting audio data
ML22Q62x
Disconnection/short-circuit detection function
Speaker Output Power vs. Efficiency
100
80
60
40
20
00 1,000
Speaker Output Power (mW)
Effi
cie
ncy (%
)
2,000
Class DClass ABAve.
efficiency improved
40%
Short-circuit
Disconnection
Internal
speaker amp
Disconnectiondetection
Short-circuitdetection
Error Output
MCU SPI I/F Pin
RewritableInternal
Flash
memory
11
ML228xx series ML227xx series (Built-in P2ROMTM)
Development TAT Comparison
Audio DataCreation
6 to 8 weeks
Prototype Mass Production
3 to 4 weeks
6 to 8 weeks
Audio DataCreation
Mass Production
CarefulDevelopment
Mass Production
ShortenedDevelopment
Small to Large-ScaleProduction
9 to 12 weeks (shortened)
1/4 the time of Mask ROMMass production
in approx. 1 month
LSI Development
The ML228xx series includes a mixing function that
provides simultaneous playback of 2 internal and 1 external
channels while enabling the volume to be adjusted for
each sound. It is also possible to prioritize each channel.
For example, users can mix and use external voice calls
while generating voice guidance and sound effects using
the speech synthesis LSI. In addition, since the speaker
amp function can be used independently for external
voice data, it can be shared within the system as an amp
to reduce costs.
Integrated mixing function for 2 internal and 1 external channelsExternal input is also possible, allowing the speaker amp to be used independently
3 channels mixing and independent volume adjustment
Applicable Models:
ML22863, ML22864, ML22865, ML22823, ML22824, ML22825
GAIN
GAIN
channel3
SPAmp.
DAC
16bitDAC
VOL
ADPCM
channel1
CPU
CPU I/F
channel2
Ping pong
GoodAfternoon
MIXING
There’s a visitor.
AIG AVOL
留守メニュー 再生
通 話
モニター
GoodAfternoon
External input
Independent volume control in 3 stages
The ML228xx and ML227xx integrate
LAPIS Semiconductor’s proprietary P2ROMTM.
The LSIs can be put in standby mode during assembly,
then written to with audio data after receiving an order,
significantly shortening both sampling creation and mass
production TAT.
Large ROM capacity is ideal for long audio playback such
as voice guidance.
P2ROM™
Without pitch/Speed conversion
With pitch/Speed conversion
Without pitch/Speed conversion
With pitch/Speed conversion
ROMCapacity
Serial I/FI2C I/F
P2ROMTM achieves shorter TAT Reduces inventory and delivery risks
The ML228xx and ML227xx integrate LAPIS Semiconductor’s
proprietary P2ROMTM memory technology for storing
audio data. This provides ROHM the capability to
immediately ship prototype samples and shorten mass
production TAT for customers by half. Development TAT
can be shortened to around one month, about a quarter
that of Mask ROM. P2ROMTM enables one-time writing in
the customer’s environment, making it possible to verify
the sound quality on the spot without taking additional
time. (Write shipment only from LAPIS Semiconductor for
mass production)
Ideal for long audio playback in industrial and consumer applications
Feature
1
Feature
2
Reduces the number of
components
from 5 to 3
Mask ROMProducts
P2ROMTM
Products
No prototype required
There’s a visitor.
Ping pong
ML22863
ML22864
ML22865
ML22763
ML22764
ML22765
ML22823
ML22824
ML22825
ML22723
ML22724
ML22725
4Mbit
8Mbit
16Mbit
Long playback Speech Synthesis LSIs
12
ML2256x series ML223xx series
The ML223xx series includes a disconnection detection
function that can provide notification (i.e. via LED) in the event
no sound is output due to disconnection between the speaker
amp and speaker. Passing current between SPP and SPM
enables detection through High/Low determination. This
ensures worry-free operation even in the event of speaker
disconnection.
Applicable Models: ML22Q374, ML22Q394
Applicable Models: ML22Q374, ML22Q394
The built-in high accuracy 4.096MHz+1.5% (–10°C to +50°C)
oscillator and Class D amp require almost no peripheral
parts and enable audio playback by simply connecting to
a speaker. In addition, the compact package reduces
mounting area.
Applicable Models: ML22Q374, ML22Q394
Disconnection detection function
Speaker Output Power vs. Efficiency
100
80
60
40
20
00 1,000
Speaker Output Power (mW)
Effi
cie
ncy (%
)
2,000
Class DClass AB
The ML2256x and ML223xx series are equipped with 692Kbit to
4Mbit ROM. Both series include pin-compatible Flash memory
and Mask ROM types, and share similar characteristics.
Developed based on Flash memory products, mass production
can be carried out with either Mask ROM products or Flash
memory shipped blank (unwritten).
Select the best format according to application needs.
Integrated Class D amp ensures high efficiency output
Class D speaker amps are capable of 1.0W (Max) output,
feature low heat generation even at high (audio) volumes,
and minimize heat dissipation measures. In addition,
efficiency is excellent at low battery power, reducing current
consumption and prolonging battery life.
ROM CapacityFlash MemoryMaskROM
Ideal for short audio playback in industrial and consumer applications
Feature
1
Feature
2
Feature
3
Reduced mounting area
Conventional
MCU Speech Synthesis LSIs
Class D AmpOscillator
Speaker
LAPIS Semiconductor
MCU Speech Synthesis LSIs
Oscillator
Speaker
Built-in
Oscill
Reduces the number of
components
from 5 to 3
Reduces the number of
components
from 5 to 3
Integrated oscillator and Class D amp reduces component count
Built-in disconnection detection function eliminates the need to worry about speaker failure
Ave. efficiency improved
40%
Pin compatibility
DisconnectionDisconnectiondetection CPU
SPP
SPM
ERR
ERR output
SPAmp.
ERR output
H Disconnection
L Connection
Detection requestCPU
I/F
Detect speaker
failure
ML22562
ML22563
—
—
—
ML22Q563
ML22Q374
ML22Q394
2Mbit
4Mbit
692Kbit
692Kbit
Short playback Speech Synthesis LSIs
13
ML226xx series ML224xx series
Easily enable voice generation from external memory
Controlling external memory allows ROHM Speech Synthesis LSIs to
play back audio data without placing a load on the MCU. Voice
generation is easily achieved by inputting control commands of only a
few bytes from an MCU.
High fidelity, high compression HQ-ADPCM makes it possible to reduce memory capacity
The ML226xx series adopts the newly developed high fidelity, high
compression voice algorithm HQ-ADPCM that provides a clearer
sound and richer audio range while reducing data size compared with
conventional ADPCM, providing a more comfortable listening
experience. For example, melodies and sound effects that are degraded
with ADPCM and cannot be played with uncompressed PCM can be
compressed with HQ-ADPCM, ensuring superior sound quality while
reducing memory capacity. Up to 80% compression is possible vs
4bit ADPCM and 20% compared with 16bit ADPCM.
HQ-ADPCM enables high fidelity audio compression
Comparison of Data VolumeRequired for 30s Playback
16bitPCMApprox.
7.7Mbit Approx.
3Mbit
HQ-ADPCM
Approx.
1.9Mbit
4bitADPCM
Speech
Melody
Sound
Effects
Conventional
Reduced approx. 68%Reduced approx. 68%
16bitPCM
CD quality sound and data
With HQ-ADPCM
With Conventional ADPCM
Sound qualityHigh
Required data volumeLarge
Image
nd data
HQ-ADPC
onventtion
ConventionalConventional
HQ-ADPCMHQ-ADPCM
Built-in speaker amp
External Flash memory type
MCU
B
Speech Synthesis LSIs
Speech Synthesis LSIs
Serial Flash Memory
(Voice Data)
Play/Stop commands only
Thank you for
your purchase
No need to send audio data via MCU
SpeakerAmplifiers
Select the capacityaccording to
playback time(128Mbit or less)
Applicable Models: ML22620, ML22660
General-PurposeMCU
The ML226xx and ML224xx
series support external serial
memory up to 128Mbit.
Ideal for long audio playback.
Applicable Models: ML22620, ML22660
Speaker Output Power vs. Efficiency
Integrated Class D amp ensures high efficiency output
Class D speaker amps are capable of 1.0W (Max) output, feature low
heat generation even at high (audio) volumes, and minimize heat
dissipation measures. In addition, efficiency is excellent at low battery
power, reducing current consumption and prolonging battery life.
Ideal for long audio playback using external memory in industrial and consumer applications
Feature
1
Feature
2
Feature
3
Speech Synthesis LSIs control external memory, facilitating voice generation
100
80
60
40
20
00 1,000
Speaker Output Power (mW)
Effi
cie
ncy (%
)
2,000
Class DClass AB
Ave. efficiency improved
40%
Enablescompression ofmelodies andsound effects
ML226xx series
ML224xx series
to 2017 2018 2019 future from 2020
ML22620
ML22660
ML22420
ML22460
▶Internal 0.7W speaker amp (Class AB)
▶4bitADPCM2
▶4ch mixing
Supports external memory
▶Built-in high fidelity, high compression algorithm (HQ-ADPCM)
▶Internal 1.0W speaker amp(Class AB/Class D)▶Selectable internal/external oscillator
▶Integrated fault detection function (speaker disconnect detection, short-circuit detection)
High performance · High fidelityHigh performance · High fidelity
Speech Synthesis LSIs
Improved functionalitym ctional yand performancen manc
14
ML610Q300 series
Reduced approx. 68%
Conventional
HQ-ADPCM
Speech Synthesis LSIs
Achieves audio output functionality on a single chip■ Low-pass filter reduces noise
■ Audio algorithms
4bit ADPCM2, 8bit PCM (Non-linear/Straight),
16bit PCM (Straight)
■ Equipped with 1W (Max) speaker amp at 5V
■ Supply voltage range: 2.2V to 5.5V
Highperformance
with low powerconsumption
High outputspeaker amp
3V/5Vcompatibility
High fidelityaudio
playback
High performance 8bit CPU
U8 core■ Original RISC-type CPU
■ 3-stage pipeline structure enables 1 instruction
per clock operation
■ 8bit operation features equivalent performance
to 16bit MCUs
Easily enable audio playback
■ Audio playback functionality is achieved by
simply setting audio data in the register
■ Integrating 4-word FIFO into the audio register
makes it possible to extend the interval
between audio data request interrupts
LAPIS Semiconductor MCUs with speech output function incorporate an oscillator, EEPROM, speech synthesis LSI, speaker amp, and other peripheral components, contributing to set miniaturization.
Speaker
OscillatoratorOscilla
EEPROM
SpeakerSensor
Speech Synthesis LSIs
SpeakerAmp
General-PurposeMCU
General-PurposeMCU
Sensor Audio Playback8bit MCUs
Space-saving monolithic designreduces failure riskConventional systems require 5 chips
Fewerexternal
parts
ML610Q300 series Elements Integrating peripheral components saves space and reduces failure risk
The ML610Q300 series of MCUs incorporate an original RISC
type 8bit CPU U8 core.
Compared to conventional middleware audio playback, audio
quality is superior, control is easier, and MCU performance can
be maximized.
Pipeline processing
1 Clock 1 Command
Clock
Fetch InstructionA
Decode
Execute
None Included Flash Memory P2ROM™
LCD Driver ROM Capacity
Ideal for audio playback using a single chip in industrial and consumer applications
Audio Playback Conditions
16bit PCM at 16kHz
Audio data request interrupt time
250µsec
Feature
1
Feature
2
Feature
3
InstructionA
InstructionB
InstructionB
InstructionB
InstructionC
InstructionC
InstructionC
InstructionA
ML610Q304
ML610Q360
—
—
—
ML610Q380
96KByte
160KByte
128KByte
None
16Mbit
None
(Audio data storage)
Audio playback 8bit MCUs
High performance · High fidelity
15
Development Support Tools
[Speech LSI Utility]
CD (Software [included])
PC
Amp
Speaker Dynamic speakers 8Ω and above
Power supply cable [included]
SDCB
A reference board is
mounted on the SDCB
Waveform/Phrase editing
Listening evaluation
Device evaluation
Various referenceboardsSpeech LSI Utility
SDCK (Sound Device Control Kit)
The Edit ROM function allows multiple phrases to be played in succession. The following functions can be configured using the Edit ROM function.
• Continuous playback (The specified number of continuous playbacks is unlimited, depending only on the memory capacity.)
• Silence insertion function (20ms to 1,024ms)
The Edit ROM function enables efficient use of the audio ROM memory capacity. Also, phrases can be played back continuously in a single
process without sending commands each time with an MCU, significantly reducing CPU load.
[Phrase Configuration Example using the Edit ROM Function] [ROM Data Conversion]
Speech Management Area
The weather
will be sunny Rain
today Tomorrow’s
weather will be
Edit ROM Area (Blank)
Phrase 1 The weather will be sunny
Phrase 2 The weather Rain today
Phrase 3 Tomorrow’s weather
Phrase 4 Tomorrow’s weather
Phrase 5 The weather Tomorrow’s weatherSilence
●A development tool for creating, writing, and listening to ROM data stored in LAPIS Semiconductor’s speech synthesis LSI.
●Enables a series of evaluations utilizing both hardware (SDCB and reference board) and software (Speech Synthesis LSI Utility)
●Optional starter kit makes it easy to begin development using LAPIS Semiconductor’s speech MCUs
SDCB (Sound Device Control Board)
The SDCB (Sound Device Control Board) enables
writing and evaluation to OTP/Flash by connecting
to a reference board that integrates LAPIS
Semiconductor’s speech synthesis LSI.
Target Device Reference BoardConnecting to the SDCB (Sound Device Control
Board) allows users to write and playback audio
data. In addition, usage and evaluation is possible
via MCU control by connecting to the customer's
system board.
Speech LSI UtilitySpeech LSI Utility is a tool for operating the SDCB.
Everything from waveform editing and ROM data
creation to sample writing and evaluation are
enabled.
SDCK (Sound Device Control Kit)
The Edit ROM function reduces memory capacity along with CPU load
today
will be sunny today
Rain today
will be sunny today Rain today
■ Facilitates operation from waveform editing to audio creation
■ Compatible with all models■ Compact SDCB (70×90mm)
USB cable
[included]
16
65.5 81.9 98.9 131.1 262.1 327.7 395.7 524.3 327.7 409.6 494.6 655.4
16.4 20.5 24.7 32.8 65.5 81.9 98.9 131.1 163.8 204.8 247.3 327.7
4.1 5.1 6.2 8.2 16.4 20.5 24.7 32.8 20.5 25.6 30.9 41.0
2.0 2.6 3.1 4.1 8.2 10.2 12.4 16.4 10.2 12.8 15.5 20.5
Memory size(Ex.)
■ HQ-ADPCM features a compression rate around 5x higher than that of 16bit PCM (uncompressed)
16bit PCM [Sec.](Uncompressed)
ADPCM2 [Sec.](Compressed)
HQ-ADPCM [Sec.](Compressed)
16Mbit(2MByte)
4Mbit(512KByte)
1Mbit(128KByte)
512Kbit(64KByte)
Relationship BetweenCompression Rateand Playback Time (With 16bit PCM=1)
1(16bit PCM)
4×(ADPCM2)
5×(HQ-ADPCM)
16kHz
8kHz
12.8kHz
10.7kHz
16kHz
8kHz
12.8kHz
10.7kHz
16kHz
8kHz
12.8kHz
10.7kHz
Get started as soon as you open the box
Standalone audio evaluation is possible without connecting to a PC
Easily start program development using the included program development support tool and sample program
Utilize the included audio data conversion tool to incorporate audio data into the control program
Speech MCU Development Starter Kit
Audio playback time for each memory size and sampling frequency
Easy!
Easy!
Easy!
●ML610Q304 Reference Board
●ML610Q304 Demo Board
●nanoEASE
●Speaker
●Cable Set
●USB Memory (Includes the following)
ML610Q304 Speech MCU Starter Kit Package
Audio Output Function Type
Cable Set
USB Memory
Reference Board
nanoEASE
8Ω Dynamic Speaker
Demo Board
ML610Q304 Speech MCU Starter KitMain Contents
Complete set of program development support tools
Complete set of audio data conversion tools
Audio scale playback sample program
17
Product Specifications
Segment Type 8bit MCU with Built-In LCD Driver
Automotive-grade Speech Synthesis LSIs (P.05 to 08)
Audio Playback 8bit MCUs (P.14)
Short Playback Speech Synthesis LSIs (P.12)
Standard 8bit MCUs (Industrial-grade)
Part No.OperatingFrequency Oscillator
4.096MHz4.000MHz
4.096MHz
4.096MHz
4.096MHz
ROM Capacity(bit) No. of Phrases
MaxPlayback Time
Flash2M
Flash4M
Flash16M
Mask ROM2M
Mask ROM4M
Flash4M
Flash4M
Flash692K
External128M Max
OperatingTemperature
(°C)
–40 to +105
–40 to +105
–40 to +105
–40 to +85
TQFP48
SSOP30
SSOP30
SSOP30
OperatingVoltage
(V)CPU I/F
SP AmpOutput (W)/
Class
MixingCount
(Internal)Other
2.7 to 3.6 or3.3 to 5.5
2.7 to 5.5
4.5 to 5.5
2.0 to 5.5
4,096
1,024
30
90sec.*1
192sec.*1
13min.*1
109min.*3
1.0/Class AB
1.0/Class AB
1.0/Class AB
1.0/Class D
4ch
4ch
4ch
1ch
Fail-safe
MCU rewrite*7
Failure detection
Speaker pinshort detection
function
Speaker pinshort detection
function
Disconnectiondetection
Speaker pinshort detection
functionI2C
I2C
Clock syncserialI2C
Clock syncserial
Clock syncserial
Clock syncserial
1,024*5
(Internal 512, External 512)
Mask 6M*4
External128M Max
Internal 304sec.*1
External 109min.*3
*5 Total of 512 phrase internal Mask and 512 phrase external memory
*6 1024 phrases (1 bank) x 4 banks
*7 In the case of clock sync serial
*1 Max playback time with HQ-ADPCM at 6.4kHz sampling frequency
*2 Max playback time with ADPCM2 at 6.4kHz sampling frequency
*3 Max playback time with HQ-ADPCM and external memory (128Mbit Max) at 6.4kHz sampling frequency
*4 Internal 6Mbit Mask can be connected to external memory (128Mbit)
ML22Q532
ML22Q533
ML22Q535
ML22530
ML22572
ML22573
ML22Q573
ML22Q553
ML22594
ML22Q374
ML22Q394
InternalExternal
External
External
Internal
99sec.*1
202sec.*1
28sec.*2
Mask2M
Mask4M
Flash692K
Flash4M
4.096MHz
4.096MHz
–40 to +85
–40 to +85
SSOP302.7 to 5.5
2.0 to 5.5
1,024
30
99sec.*1
1.0/Class AB
1.0/Class D
4ch
1ch
Fail-safe
Disconnectiondetection
Speaker pinshort detection
function
Clock syncserial
Clock syncserial
ML22562
ML22563
ML22Q563
ML22Q374
ML22Q394
External
Internal
202sec.*1
28sec.*2
Package
Part No.OperatingFrequency Oscillator
ROM Capacity(bit) No. of Phrases
MaxPlayback Time
OperatingTemperature
(°C)
OperatingVoltage
(V)CPU I/F
SP AmpOutput (W)/
Class
MixingCount
(Internal)Other Package
TSSOP20
TSSOP20
TSSOP20
TSSOP20
ML610Q380 2.2 to 5.532.768kHz(Built-in RCoscillation/
Crystal oscillation)
8.192MHz 0.122µs30.5µs
2.0µA Flash 128K — Flash ROM 2K 7 4 34–40 to +70
ML610Q304 2.0 to 5.532.768kHz(Built-in
RC oscillation)8.192MHz 0.122µs/
30.5µs2.7µA –40 to +85 Flash 96K 2K Flash ROM 1K 1 3 11
ML610Q360 2.2 to 3.6 32.768kHz(Crystal oscillation) 8.192MHz 0.122µs/
30.5µs1.7µA –40 to +85 Flash
P2ROM™160K 3K P2ROM™ :
16Mbit2K 8 3 29
Part No.
Operating Conditions ROM/RAM Functions/Features
Functions/Features
OperatingVoltage
(V)
Operating Frequency (Max) MinInstruction
Execution Time
MinInstruction
Execution Time
CurrentConsumption(Typ@HALT)
OperatingTemperature
(°C)ROM Type
ROM Capacity(Byte)
Data FlashCapacity
(Byte)
Audio DataStorage Area
RAM Capacity(Byte)
Port
Low-Speed Clock High-Speed Clock Input OutputInput/Output
Input/Output
Part No.
Operating Conditions ROM/RAM
OperatingVoltage
(V)
Operating Frequency (Max) CurrentConsumption(Typ@HALT)
OperatingTemperature
(°C)ROM Type
ROM Capacity(Byte)
Data FlashCapacity
(Byte)Audio Data
Storage AreaRAM Capacity
(Byte)Port
Low-Speed Clock High-Speed Clock Input Output
18
Supports external memory Speech Synthesis LSIs (P.13)
Long Playback Speech Synthesis LSIs (P.09 to 11)
I2C
I2C
I2C
I2C
4.096MHz4.000MHz
4.096MHz
External128M Max
External128M Max
–40 to +70
–40 to +85
TQFP32WQFN32
SSOP30
Failure detection
—
—
2.7 to 3.6 or3.3 to 5.5
2.7 to 5.5
4,096
1,024
109min.*3
87min.*2
1.0/Class D
0.7/Class AB
4ch
4ch
MCU rewriteFailure detection
Failure detection
—
Clock syncserial
I2C
Clock syncserial
ML22620
ML22660
ML22420
ML22460
InternalExternal
External
4.096MHz4.000MHz
4.096MHz
Flash4M
Flash8M
Flash16M
Flash32M
–40 to +70
–40 to +85
TQFP32WQFN32
TQFP32WQFN32
SSOP30
SSOP30
SSOP30
SSOP30
2.7 to 3.6 or3.3 to 5.5
4,096
192sec.*1
397sec.*1
13min.*1
27min.*1
192sec.*1
397sec.*1
13min.*1
27min.*1
161sec.*2
325sec.*2
11min.*2
161sec.*2
325sec.*2
11min.*2
161sec.*2
325sec.*2
11min.*2
161sec.*2
325sec.*2
17min.*2
1.0/Class AB,Class D
1.0/Class AB,Class D
0.7/Class AB
0.7/Class AB
0.7/Class AB
0.7/Class AB
4ch
4ch
2ch
1ch
1ch
2ch
MCU rewriteFailure detection
Speed and pitch conversion
Speed and pitch conversion
Clock syncserial
Clock syncserial
Clock syncserial
ML22Q623
ML22Q624
ML22Q625
ML22Q626
ML22Q663
ML22Q664
ML22Q665
ML22Q666
ML22823
ML22824
ML22825
ML22723
ML22724
ML22725
ML22863
ML22864
ML22865
ML22763
ML22764
ML22765
InternalExternal
4.096MHz4.000MHz
Flash4M
Flash8M
Flash16M
Flash32M
–40 to +702.7 to 3.6 or
3.3 to 5.5
2.7 to 3.6 or4.5 to 5.5
4,096
1,024*6
InternalExternal
External
P2ROMTM
4MP2ROMTM
8M
P2ROMTM
16M
4.096MHz –40 to +852.7 to 3.6 or
4.5 to 5.51,024*6External
P2ROMTM
4M
P2ROMTM
8M
P2ROMTM
16M
4.096MHz –40 to +852.7 to 3.6 or
4.5 to 5.51,024*6External
P2ROMTM
4M
P2ROMTM
8M
P2ROMTM
16M
4.096MHz –40 to +852.7 to 3.6 or
4.5 to 5.51,024*6External
P2ROMTM
4M
P2ROMTM
8M
P2ROMTM
16M
Part No.OperatingFrequency Oscillator
ROM Capacity(bit) No. of Phrases
MaxPlayback Time
OperatingTemperature
(°C)
OperatingVoltage
(V)CPU I/F
SP AmpOutput (W)/
Class
MixingCount
(Internal)Other Package
Part No.OperatingFrequency Oscillator
ROM Capacity(bit) No. of Phrases
MaxPlayback Time
OperatingTemperature
(°C)
OperatingVoltage
(V)CPU I/F
SP AmpOutput (W)/
Class
MixingCount
(Internal)Other Package
6(16bit×3)
4(16bit×2)
8(16bit×4)
8bit Timer
8bit Timer
Functions/Features
Package CodePWM WDT ADC (Method)
Serial Port SupplyVoltage
Detection
SupplyVoltage
Detection
LCD DriverExternalInterruptFactor
ExternalInterruptFactor
Speaker Amp Output(W)/Class Other
I2C SSIO UART
Functions/Features
Package CodePWM WDT ADC (Method)
Serial PortLCD Driver
Speaker Amp Output(W)/Class Other
I2C SSIO UART
— 1 10bit×3(Sequential)
Master/Slave
×12 Half duplex
×1— — 9
1.0(5V operating voltage)/
Class D
Audio playback/ADPCM decoder/
internal speaker amp
P-VQFN28-0505-0.50/P-SSOP30-56-0.65
P-WQFN32-0505-0.50
— 1 12bit×4(Sequential)
— 2Half duplex×2(Full duplex×1/Half duplex×1)
VLS×1 — 70.5
(3V operating voltage)/Class AB
Audio playback/ADPCM decoder/
internal speaker ampP-TQFP64-1010-0.50
16bit×2 1 10bit×8(Sequential)
Master×1
2 Half duplex×2
BLD×1 96 dot Max24seg.×4com.
50.6
(5V operating voltage)/Class AB
Audio playback/ADPCM decoder/
internal speaker ampP-QFP80-1414-0.65