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Microphone Technology Leadership V 1.0

BSE CO., LTD

58B-4L, 626-3, GOZAN-DONG, NAMDONG-KUINCHON-SI. KOREATEL :(8232) 550-1780FAX :(8232) 554-6206

4 0 5 8 1 7-

SPECIFICATION OF ANALOG MEMS MICROPHONE

MODEL NO. : MOE-C110T42-K1DIRECTIVITY : OMNI-DIRECTIONALSOUND PORT : TOP PORT TYPE

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Microphone Technology Leadership V 1.0

1. INTRODUCTIONThis specification is for the SMD possible Analog MEMS (Top port) Microphone which has endurable reflow

temperature of up to 260 for over 15 seconds.

2. MODEL NO.MOE-C110T42-K1

3. ELECTRICAL CHARACTERISTICS

4. MEASUREMENT CIRCUIT

Temp. = 23 ± 2 Room Humidity = 65 ± 5 %

NO. Parameter Symbol ConditionLimits

UnitMin. Center Max.

1 Sensitivity SVdd=2.0V, f=1kHz, S.P.L=1Pa,0dB=1V/Pa

-45 -42 -39 dB

2 Output impedance ZOUT Vdd=2.0V 300 Ω

3 Current consumption IDSS Vdd=2.0V 50 250 uA

4 Signal to Noise Ratio S/N A-weighting at 1kHz 1Pa 55 59 dB

5 Sensitivity Change across Voltage Vdd=1.5V ~ 3.6V No Change dB

6 Operating Voltage Vdd 1.5 2.0 3.6 V

7 Total Harmonic Distortion THD

At 100dB SPL 1 %

At 115dB SPL 10 %

VP

MEMS Unit

AMP

Pin4

Pin1

Pin2, 3

1uF

Vdd:2.0V

Output

GND

MIC Case

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Microphone Technology Leadership V 1.0

5. TYPICAL FREQUENCY RESPONSE CURVE ( FAR FIELD )

Far Field Measurement ConditionTemperature : 23 ± 2 Supply Voltage : 2.0V Acoustic stimulus : 1Pa ( 94 SPL at 1 ) at 50 from the loud-speaker.

The loud-speaker must be calibrated to make a flat frequency response input signal. Position : The frequency response of microphone unit measured at 50 from the loud-speaker

6. MECHANICAL CHARACTERISTICS※ PCB design & Pin size can be changed by model No.

SMD Type

3.76

±0.

1

2.95±0.11.10±0.1

MOE-C110T42-K1

1 0 0 1 0 0 0 1 0 0 0 0- 2 0

- 1 5

- 1 0

- 5

0

5

1 0

1 5

2 0

[ Am

plitu

de ;

Dec

ibel

]

[ F r e q u e n c y ; H e r t z ]

F r e q u e n c y R e s p o n s e

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Microphone Technology Leadership V 1.0

Dimensions (Unit : mm)

- Mechanical dimensions, Land Pattern

OrientationMarking

Recommended

PCB land pattern (Unit : mm)

Recommended

solder stencil pattern (Unit : mm)

- thickness of metal mask: 0.10 mm

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Microphone Technology Leadership V 1.0

7. Packaging Specification

- Reel

• 13” reel for the mass production stage. (Unit : mm)

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Microphone Technology Leadership V 1.0

7. Packaging Specification

- Taping

Unit : mm

A0 4.06±0.10 E 1.75±0.10

B0 3.30±0.10 F 5.50±0.05

K0 1.30±0.10 T 0.30±0.05

D0 1.50±0.10 W 12.00±0.30

SECTION A-A'

T

K0

A'

A

P0

EF

W

B

D0

DETAIL B (2:1)

A0

B0

[ Note ]1. Direction of parts : See above pictures.2. Microphone total quantity (13” Reel) : 5,700pcs

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Microphone Technology Leadership V 1.0

8. RELIABILITY TEST CONDITIONS

9 . TEMPERATURE CONDITIONS

9.1 STORAGE TEMPERATURE : -40 ~ +100

9.2 OPERATING TEMPERATURE : -40 ~ +100

Note : After test conditions are performed, the sensitivity of the microphoneshall not deviate more than ±3dB from its initial value.

TEST DESCRIPTION

TEMPERATURESTORAGE

[High Temperature Storage]+70±2 environment for 200 hours.(The measurement to be done after 2 hours of conditioning at room temperature)

[Low Temperature Storage]-25±2 environment for 200 hours.(The measurement to be done after 2 hours of conditioning at room temperature)

HUMIDITY +70±2 and 95±2%RH environment for 200 hours.(The measurement to be done after 2 hours of conditioning at room temperature)

TEMPERATURECYCLE

5 cycles of temperature change.+70±2 for 1hr, at 20±2 for 30 min, at -25±2 for 1hr(The measurement to be done after 2 hours of conditioning at room temperature)

THERMAL SHOCK

32 cycles of temperature change.from –40 to 85 for 1hr Changing time about 5 min(The measurement to be done after 2 hours of conditioning at room temperature)

HIGH TEMPERATURE AND HUMIDITY

+85±2 and 85±2%RH environment for 120 hours.(The measurement to be done after 2 hours of conditioning at room temperature)

ESD(Electrostatic

Discharge)

HBM (Human Body Model) : 2kV Expose 10 Times.MM (Machine Model) : 0.2kV Expose 10 Times.CDM (Charged Device Model) : 0.5kV Expose 10 Times.

VIBRATION To be no interference in operation after vibrations.10 to 55 for 1 minute full amplitude 1.52 , for 2 hours at three axes

DROP To be no interference in operation after dropped to steel floor12 times from 1.5 meter height in state of packing

REFLOWSENSITIVITY 3 reflow cycles. Refer to reflow profile from specification item 11.

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Microphone Technology Leadership V 1.0

10. MEASUREMENT SYSTEM

11. REFLOW PROFILE (Guaranteed Maximum Reflow Condition)

Parameter Specification Parameter Specification

Average temp. gradientin preheating

2.5/s Time above 250 Max. 10 s

Soak time 2-3 minutes Peak temp. in reflow 255(-0/+5)

Time above 217 Max. 60 s Temp. gradient in cooling Max. –5/ s

Time above 230 Max. 50 s

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Microphone Technology Leadership V 1.0

12. Recommended Pick-up nozzle

12.2 Nozzle position : MIC Center- Nozzle inner diameter size : Max. Ø1.0

12.1 Nozzle position : The opposite side of sound hole- Nozzle inner diameter size : Max. Ø1.5- position : 0.63mm away from the MIC center

3.76

2.9

5

( 0.7)0.20

0.7 (slit hole)

1.18

Max. Ø1.50 (Nozzle inner diameter)

0.63 (Nozzle position)

3.76

2.9

5

( 0.7)

Max. Ø1.00 (Nozzle inner diameter)

0.20

0.7 (slit hole)

1.18