Smart packaging for medicine - hcpc-europe.org · Smart packaging for medicine adherence: Use,...
Transcript of Smart packaging for medicine - hcpc-europe.org · Smart packaging for medicine adherence: Use,...
Smart packaging for medicine
adherence:
Use, technological building blocks and applications
Corné Rentrop
© Holst Centre
Smart packaging:
• Connected world
• Customer engagement
• Security
Smart Packaging
© Holst Centre
Connected packaging …..
MLA DELIVERS WEATHER BASED RECIPES
… for customer adherence (?)
© Holst Centre
The internet of everything
http://www.siggyvolgt.nl/2013/11/vergeet-internet-of-things-het-wordt.html
Example: Smart Blister
Smart packaging for medicine adherence
Corné Rentrop
© Holst Centre
• Features
� Simple
� All electronics in footprint blister
� Printed resistance ladder
� Monitor when en what pill is pushed through
� NFC communication
Smart Medical Blisters
© Holst Centre
Non-Compliant patient, (red bar “forgotten” black arrow “double doses” red dots “out of the time window”). Glucose value too high when pill is not taken on time.
Therapy Compliance
© Holst Centre
E-communicative packaging for pharma
Smart blisters Support
centre
Patient
Medical devices
RFID/NFC
GSM/GPRS wireless network
GSM/GPRS wireless network
DataGator
• Smart pill blister addresses key health issue: medication non-compliance / non-adherence
• Developed jointly with DSM/TCG
© Holst Centre
Challenges of smart blister
Features:• Assembled • “3D”-system• High cost• Added to existing package,
not compatible with R2R
The Holst approach
e.g. StoraEnso Pharma DDSi
Holst Centre System in Foil
Near Future:• Fully integrated • 2D-System in Foil• Low cost, mass fabrication• Roll to Roll compatible
Smart Label: Environmental monitoring
Other Examples ….
Corné Rentrop
© Holst Centre
• Smart tag
• Humidity sensor
• Temperature sensor
• NFC
Smart label:
• Temperature, humidity sensor
• Data storage
• NFC enabled
Smart label: Integration on paper
© Holst Centre
Use cases:
• Report Max./Min. temperature and humidity during transport
• Actual temperature and humidity
• App assisted
© Holst Centre
Smart packaging
Smart label:
• Foil integration
• Temperature and ammonia sensor
• Ultrathin chip
© Holst Centre
• Envelope
• Track and trace
• Antenna 300m
• Chip
• Password control
• Web-acces
Printed registered mail
• 300 m communication
• Password control
• Web-access
• Embossed switches
Smart Packaging: Track and trace envelope
© Holst Centre
• Envelope
• Track and trace
• Antenna 300m
• Chip
• Password control
• Web-acces
Electronic lay-out
• Screen printing
• Roll-to-roll (up to 20m/min.)
• Flash sintered
• Component integration
Smart Packaging: Track and trace envelope
© Holst Centre
Smart envelope – track and trace
Electronic layout
Antenna performance
Wireless communication
Web access and security
Envelope Design
© Holst Centre
.. or can even be shaped into 2.5D objects… or that can be shaped into a 3D surface
© Holst Centre
… or PCB’s that are stretchable… or stretchable
© Holst Centre
Smart shelve:
Pressure sensors in series
Storage management
Wireless communicating
Internet of things
Smart packaging
How to create smart packaging?
Corné Rentrop
Smart Label: Environmental monitoring
© Holst Centre
Components
© Holst Centre
Multi disciplinary approach
Substrate
Printing/ inks
SensorsPlacing components
Electronics/logic
Graphical industry
© Holst Centre
Screen printing: resolution
•routinely print 30 µm line and spacing (60 µm pitch)
•(first steps towards 20 µm line and spacing)
© Holst Centre
Inkjet printing
• 15 µm line / spacing achievable
© Holst Centre
• Printed Thermistor
• Printed H2S sensor
• Printed humidity sensor
Interdigitated finger structure monitors:
• Temperature
• Humidity
• Gasses (H2S)
Sensing platform: interdigitated fingers
© Holst Centre
• Chip pad
• Antenna
• Switch
• Sensor
Printing of electrical components:
• Switch
• Antenna
• Chip pad
Sensing platform: Switches
© Holst Centre
• Smart tag
• Humidity sensor
• Temperature sensor
• NFC
Paper sensor tag:
• Chip (NFC)
• Antenna
• Sensor platform
Electronic components: Pick and place
© Holst Centre
Summary Components
© Holst Centre
- Component integration - Antenna - Chip - NFC- Sensor
- Applications: - Smart packaging - Wearables - Human machine interfaces
- Printed sensors- ECG, EMG, EEG .. - Temperature - Gas (H2S) - Humidity
Final remarks