signal integrity overview bw - ITESO course/lectures/signal... · FR4 is US$2/sq ft (D. Reed, 2003)...

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Signal Integrity and High-Speed Interconnects January-May 2006 Dr. J. E. Rayas Sánchez http://iteso.mx/~erayas [email protected] 1 An Overview on Signal Integrity Dr. José Ernesto Rayas Sánchez 2 Dr. J.E. Rayas Sánchez Outline Review of market and technology trends A Signal Integrity (SI) definition An introduction to SI terminology

Transcript of signal integrity overview bw - ITESO course/lectures/signal... · FR4 is US$2/sq ft (D. Reed, 2003)...

Page 1: signal integrity overview bw - ITESO course/lectures/signal... · FR4 is US$2/sq ft (D. Reed, 2003) Dr. J.E. Rayas Sánchez 14 High-Speed Digital Design Physical design becomes crucial:

Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

1

An Overview on Signal Integrity

Dr. José Ernesto Rayas Sánchez

2Dr. J.E. Rayas Sánchez

Outline

Review of market and technology trends

A Signal Integrity (SI) definition

An introduction to SI terminology

Page 2: signal integrity overview bw - ITESO course/lectures/signal... · FR4 is US$2/sq ft (D. Reed, 2003) Dr. J.E. Rayas Sánchez 14 High-Speed Digital Design Physical design becomes crucial:

Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

3Dr. J.E. Rayas Sánchez

Technology Trends

The minimum dimension of transistors has been continuously decreasing: 25 µm in 1960 to 0.13µm in 2005

The number of transistors per chip has continue to double every 1.5 year (Moore’s law)

CPU operating frequency has continuously increase

Denser and faster buses have appeared

Faster memories are required

Cost of interconnects remain a small fraction (<5%) of the system cost

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Decreasing Dimension of Transistors

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

5Dr. J.E. Rayas Sánchez

Decreasing Dimension of Transistors (cont)

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Decreasing Dimension of Transistors (cont)

State-of-the-art silicon transistors can operate above 1 THz

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

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Moore’s Law

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CPU Operating Frequency

(H. Heck, 2005)

Processor Frequency

0.1

1

10

100

1000

10000

1970 1975 1980 1985 1990 1995 2000 2005 2010Year

Freq

uenc

y [M

Hz]

4004

80088080

8085808680888018680286

80386486DX

486DX2486DX4

Pentium®Pentium® Pro

Pentium® IICeleron®

Pentium® IIIPentium® 4

Frequency

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

9Dr. J.E. Rayas Sánchez

Denser and Faster Buses

486DX2 Processor (~1992) Pentium® 4 Processor (2003)

▪ 3 major buses ▪ 4 major buses▪ 33 MHz max frequency ▪ 66-800 MHz max frequency▪ 4 byte bus width ▪ 4-16 byte bus width

CPU100 MHz

L2 Cache

PCI Chipset PCI SlotsFPM/EDODRAM

32 bit33 MHz

32 bit33 MHz

32 bit12 MHz

(H. Heck, 2005)

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Denser and Faster Buses (cont)System Bus Frequency

0.1

1

10

100

1000

1970 1975 1980 1985 1990 1995 2000 2005 2010Year

Freq

uenc

y [M

Hz]

4004

800880808085

8086808880186

8028680386486DX486DX2486DX4

Pentium®Pentium® ProPentium® II

Celeron®Pentium® IIIPentium® 4

System Bus Frequency

(H. Heck, 2005)

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

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Faster and Denser Memories

1

10

100

1000

10000

1981

1983

1985

1987

1989

1991

1993

1995

1997

1999

2001

Year

Peak

Ban

dwid

th [M

B/s

]

(H. Heck, 2005)

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Cost of Interconnects

Interconnect makes up < 5% of the system cost– Most technical problems can be solved with $– High volume PC market can’t afford extra cost

Designing Multi-GHz interconnects to fit in sub $1000 PCs is a huge challenge

(H. Heck, 2005)

Motherboard & Connectors (< 5% of total)

Monitor +Video Card

Hard DiskCPU

Sound +Speakers

MemoryCase

MotherboardComponents

Power Supply

CDROM

Fax/ModemO/S

Approximate Cost Breakdown of a PC

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

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Cost of Interconnects (cont)

FR4 has been the standard choice for PCBs in the last four decadesOther dielectrics have better performance: polyethylene (PE), polytetrafluoroethylene (PTFE)PTFE-based laminates can cost up to US$100 per squared footFR4 is US$2/sq ft

(D. Reed, 2003)

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High-Speed Digital Design

Physical design becomes crucial: connectors, backplanes, packages, PCB structures, material properties, etc.

Analog techniques (analog electronics, RF and microwave engineering) are used to solve most signal integrity problems

© Copyright 2003 Agilent Technologies, Inc.

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

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High-Speed Digital Design (cont)

Eye Diagrams (for a 25-inch channel)1 Gbps, 200 psec/div 2.5 Gbps, 80 psec/div

5 Gbps, 40 psec/div 7.5 Gbps, 27 psec/div

© Copyright 2003 Agilent Technologies, Inc.

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What is Signal Integrity (SI)?

It is an engineering practice that aims at ensuring reliable high-speed data transmission and reception, without polluting the electromagnetic spectrum and without damaging any device

SI effectively combines concepts and techniques from the following disciplines:

– microwave and RF engineering– electromagnetics– physical design– analog electronics– communications, and – digital design

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

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SI Problems Appear at Different Levels

(M. Nakhla, 2004)

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SI Problems Appear at Different Levels (cont)

(A. Weisshaar, 2004)

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

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Effective Signal Integrity Practices

Tracking down the cause of signal integrity problems after the hardware has been created can be extremely complicated

(R. Mellitz, 2003)

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Signal Integrity Issues

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

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Tools and Concepts for Signal Integrity Issues

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CAD Tools for SI

CAD tools allow addressing many signal integrity issues during simulation

Appropriate simulation strategies improve the understanding of highly complex signal integrity phenomena

If the simulation is accurate enough, many signal integrity problems can be solved before they actually exist

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Signal Integrity and High-Speed InterconnectsJanuary-May 2006

Dr. J. E. Rayas Sánchezhttp://iteso.mx/~erayas [email protected]

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Conclusions

System performance and functionality increase over time

In the PC market, sales decrease sharply when the price exceeds the volume desktop price barrier

Interconnect components account for < 5% of system cost

Interconnects impose severe limitations in system performance

Interconnect engineers must satisfy increased performance demands without increasing the cost of the solution

SI problems are challenging, but many tools and concepts can be used to alleviate them