Semicon West · PDF fileBGE – July 14th, 2016 Semicon West – San Francisco, CA...
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Semicon West 2016
Transcript of Semicon West · PDF fileBGE – July 14th, 2016 Semicon West – San Francisco, CA...
Semicon West 2016
Acknowledgements
o Stephen Tobin
o Samsung Austin Semiconductor, Machine Learning
o Jason Malik
o Samsung Austin Semiconductor, Metrology
o Dr. Dragan Djurdjanovic
oUniversity of Texas, Mechanical Engineering
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Outline
Introduction
Undersensitivity: We need more data!
Oversensitivity: Whoa, too much data!
Incongruity: Wow, too many formats!
IP Security: Hey, whom can I trust?
Summary
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Daily Fab Concerns
Data sampling rate is not 100% – Sometimes not even close!
Sample set analyses are not real time – Sometimes not even close!
Primary Goal/Question: Right now, is my tool/process running such that there will be no adverse yield or throughput impact on the next wafer?
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Yield-Up Complexity – Short Ramp Time
Typical Yield Improvement Dynamics
Parametric
Systematic
Yield
Quarters (1990s)
Months (Today)
Random
Errors
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Need more actionable information in real time now
Metrology Complexity – 3D Structure
Planar to Vertical Transistor Architecture
Source
Drain
Gate
Planar MOSFET Vertical FinFET
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Need more 3D structural information now
Today, nearly two thirds of the non-radioactive elements are used in every chip!
Material Complexity – IC Periodic Table
‘70s ’80s-’90s
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Need more monitoring and control
info now
Defect Complexity – Photomask Cleanliness
Particulates – Ultrapure Water needs <200pcs/liter @ >50nm
– Max defect size on mask ~7% of wafer CD
– Size spec needs to track with node shrinks
– 14nm: 1.0nm 10nm: 0.7nm (7Å) … U
P
Mask
Wafer
Mask
Wafer
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Need more and better inspection information now
Process Complexity: Double Patterning
Spacer Type:
Ref: Paul Zimmerman
Previously took only one lithography step
Ref: Brian Wang
Litho-Etch-Litho-Etch:
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Need more inline SPC results information now
The IC Lithographer’s Paradox
1.0
0
.5
1.5
‘85 ‘90 ‘95 ‘00 ‘05 ‘10
i-line
365
g-line
436 KrF
248
V UV DUV1 DUV2 VUV EUV ‘10
Numerical
Aperture
k2
(NA)2 = Depth of Focus
Minimum
Feature
Size
Sub-Wavelength! Imm
ers
ion
Tech
no
logy
Resolution =
NA
k1
F2
157
ArF
193
Lord Rayleigh
1.35
Sn
13
‘15
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Need a working lithography solution now
EUV: “Only 1-2 years away” …since 2005
o Pros o Resolution
o Cheaper than Octuple Patterning
o Cons o Source Power Inadequate
o Resist Maturity (RLS)
o Mask Defectivity (No Pellicle)
o Tin Drop Generation Weak
o Vacuum (High Maintenance)
o High Cost of Consumables
o Subwavelength at 10nm
Source: Google Images
Are we there yet?!
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Need to get off my soapbox now
Data Analysis in the Past: Isolated Focus
Individual tools and processes only
Input Settings -Mach Constants -FDC Parameters
Test Wafers
Process Recipes
Output Values -SPC Results -Log Files -Sensor Data
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Massive Amounts of Data Ignored
Only small quantities of data could be collected, analyzed, and acted upon…
BGE – July 14th, 2016 Semicon West – San Francisco, CA
But more information was ignored than used!
Equipment Complexity: TMI (too much info)
Sensory Overload! (>100,000 sensors) BGE – July 14th, 2016 Semicon West – San Francisco, CA
Goal: 100% of Data Analyzed and Applied
Use all data to produce
actionable info for:
o ‘like’ tools/processes
o prior and following
tools/processes
o facilities conditions
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Too Much For Humans To Digest!
Toward high end of Sensors AND Products!
# Se
nso
rs
log # Products
Low
Med
High
100 101 102 103 104 105 106 107 108
Commercial Jet
Bars of Soap
Semiconductor Process
Life-Death Important
Not Life-Death Important
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Back To The Future!
Reduces the set of variables to the significant few
Year # Variable
Interactions Sensors
Per Wafer Analysis Method
# People Needed to Review All Data
1975 1-2 200 Review All Data 1
1985 1-2 500 Test Hypotheses 3
1995 1-2 5000 Model Based
Problem Solving
25
2005 1-3 50,000 Model Based
Problem Solving
250
Today 1-4 >1,000,000 Machine Learning 5000
200 1
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Compatibility & Security Issues
o Legacy systems not designed to collaborate
o Unequal security levels
o Some data are proprietary to each party:
Vendor [chamber+frame] User [fab+enterprise] Customer
o Attached directly to Mfg floor control systems o High risk to production schedule impact
o Data are stored in different formats o Product throughput/output planning & analysis
o Yield/Quality analysis and control
o Financials
We have lots of data, but much is not yet in
a format that can be used as information.
BGE – July 14th, 2016 Semicon West – San Francisco, CA
vs.
o Undersensitivity
o More sensors/data on critical tools, processes, etc.
o Oversensitivity
o More data compute horsepower and memory
o More efficient analysis techniques (move only select data)
o Incongruity
o More capability to combine & analyze unstructured data
o IP Security
o More clarification of what data are truly proprietary
o More sharing of what data remains
Summary & Help Needed
BGE – July 14th, 2016 Semicon West – San Francisco, CA
Thank You!
