Slide 1 |

ASML Holistic Lithography Open Your Window to Shrink

Bert Koek, SVP litho applications Semicon West, July 14, 2009

Slide 2 |

Shrink is good…except when it’s not

• Shrink reduces manufacturing cost and improves device performance

• However, shrink results in smaller process windows which compromise yield by restricting production tolerances

Slide 3 |

Holistic lithography provides a window to shrink

• Holistic lithography is the intelligent integration of computational lithography, wafer lithography and process control.

• Before manufacturing, holistic lithography optimizes the process window at lower R&D cost

• During manufacturing, holistic lithography keeps the process in the “sweet spot” of the window.

Process Window Process Control

Slide 4 |

Optimized process window

Slide 5 |

Actual scanner data enables better process windowScanner

Data Scanner Model

Pattern Optimization:Enlarge process window

Pattern Verification:Reduce test exposures

Scanner Tuning:Define optimum scanner setting

Slide 6 |

Faster time-to-money

Experiment 1 Experiment 2 Experiment 3

Time

Cost

Slide 7 |

Faster time-to-money

Design verification is known much earlier:• reducing design proofs• reducing R&D cost• reducing time to volume ramp-up• higher yield at ramp to volume

Slide 8 |

Tachyon SMO (Source Mask Optimization)

By co-optimizing the illumination and reticle, SMO will calculate perfect light conditions and line shapes for an optimal process window.

Slide 9 |

Introducing FlexRay™

FlexRay freeform illumination technology replaces a traditional illuminator and DOE* combination with a programmable micro-mirror array. This allows it to render any SMO** defined pupil shape in a matter of minutes.

* diffractive optical element

** source mask optimization

Slide 10 |

Mask and freeform source co-optimization improve process window

50

75

100

125

150

Quadrupolesource

4x node DRAM Contact• XT:1900i, 1.35NA• 6% AttPSM• k1 < 0.35

Sequential SMO

Tachyon SMOCo-Optimization

72 nm

120 nm

130 nm

Dep

th o

f Foc

us

Quadrupolesource

Hexapolesource

Free-formsource

104 nm

Slide 11 |

74 nm Depth of Focus@ 5% EL

ASML quadrupole illumination shape

Tachyon SMO & FlexRay in Logic contact pattern: Results in larger process window and lower mask complexity

110 nm Depth of Focus@ 5% EL

ASML freeform illumination shape

Slide 12 |

Reticle Specific Optimization combined with FlexRay illumination source adjustment Compensating reticle bias errors while maintaining OPC validity

Sourceadjustment

Width = 44.1 nmGap = 58.4 nm+2 nm

Wafer CD

Width = 44.1 nmGap = 58.4 nm

+2 nm bias error yields 6.5 nm gap error

Width = 44.1 nmGap = 51.9 nm+2 nm

Slide 13 |

Tachyon OPC+Tachyon SMO

Pattern Optimization

ASML holistic lithography application flow to optimize the process window

Scanner tuning knob setting

Scanner data

Tachyon LMC

Verification

LithotunerFlexRay

Scanner Tuning

Slide 14 |

Improved production control

Slide 15 |

Scanner tuning pre-sets and control loops for better production control

MeasurementMask design Monitor wafers Process wafers

TuningScanner tuning Scanner Setting Verification Process Control

Slide 16 |

Better control for higher yield

Maintenance 1Maintenance 2

Maintenance …

Slide 17 |

Better control for higher yield

Slide 18 |

BaseLiner scanner stability is a complete scanner enhancement solution which maintains overlay and focus stability of TWINSCAN while increasing system availability.

BaseLiner™ scanner stability

Slide 19 |

BaseLiner: Smaller variation in process window, increased availability

System standardSystem drift is countered by performing regular on-tool calibrations according to the ASML maintenance schedule to maintain the system within specified performance.

Tighter control to support smaller process windowThe process window can be maintained by performing more frequent calibrations, but this reduces availability/productivity and therefore decreases wafers-per-day.

BaseLinerBaseLiner eliminates additional calibrations and applies corrections more frequently. Measurements are done off-tool using monitor wafers. Tighter control with increased wafers- per-day

calib

ratio

n

calib

ratio

n

Focu

s an

d ov

erla

y dr

ift

Time

calib

ratio

n

Time

Time

Slide 20 |

BaseLiner: overlay stability improvement* Including strategy to maintain stability

Maintenance

* Matched, full wafer on XT:1900i

BaseLiner

Without BaseLiner

1 month

Ove

rlay

0

5

10

15

20

25

30

Maintenance Maintenance

5 nm

Slide 21 |

SMOFlexRay

Tuning

ASML holistic lithography flow for manufacturingFaster ramp up and higher yield

BaseLinerControl

Data

Data

design/ mask data

Scanner settings

Scanner settings

Scanner settings

Scanner settings

Wafer data

Wafer data

Slide 22 |

Holistic lithography provides a window to shrink

• Holistic lithography is the intelligent integration wafer lithography, computational lithography and process control

• Holistic lithography leverages increased and improved data integration to provide more control, better performance and higher yield

Data

Measurement

Process Control

Slide 23 |

Eclipse™ Holistic Lithography packages

Slide 24 |

ASML makes Holistic Litho available via Eclipse

• Eclipse is a package of application- and node-specific products and services from our Holistic Lithography portfolio

• Eclipse packages provide chipmakers a window to shrink with cost reduction beyond traditional cost-per-layer

Slide 25 |

ASML makes Holistic Litho available via Eclipse

FlexRayTachyon SMO

BaseLiner

FlexRayTachyon SMO

BaseLinerTachyon SMO