SDC Server Sao Jose

Roberto BrandãoAMD Brasil

AMD Technology Update- Servers and Stream Processors -

2

Agenda

The Green IT challenge

Stream Processors

Project Shanghai

AMD Opteron on the work

CPU Roadmap

3

Notebooks1 and 2 cores

Platform certification

Notebooks1 and 2 cores

Platform certification

Servers2 and 4 cores

Up to 8 processors

FireStream accelerators

Servers2 and 4 cores

Up to 8 processors

FireStream accelerators

DesktopsUp to 4 cores

Native multi-core

DesktopsUp to 4 cores

Native multi-core

AMD computing products

Infrastructure Infrastructure

Chipsets Graphics cards

The Green IT Challenge

5

The Green IT Challenge

6

Performance por watt

• US datacenters consume more power than five 1000 megawatt nuclear power plants – at a cost of almost $3 billion• This is 150% more than the consumption in 2001

7

7

AMD CoolCore™ Technology Turns off Blocks of Logic When Not in Use

Coarse Control (Core) Ex, FPU (hottest part of die)

Memory Controller Reads (turn off write logic)

Writes (turn off read logic)

Fine Control (Core) Incrementally Smaller

Sections

FPU

Memory ControllerL3

L1

FPU

Memory ControllerL3

L1

L2L1

Core 1 Core 2

Core 3 Core 4

AMD Opteron

9

8-core system comparison

CS

MEMORYMEMORY

MEMORY

MEMORYM

EMORY

MEMORY

AMD

Twice the number of memory

controllersMoving data affected by FSB

Bottleneck

FSBFSB

HyperTransport

10

HPC Performance Advantage

100% = Xeon E5472

13%

19%

The results stated above reflect results published on www.spec.org and www.amd.com as of June 23, 2008. The STREAM, FLUENT, STAR-CD, and LS-DYNA comparisons above are based on results measured in AMD’s performance lab. For the latest results visit http://www.spec.org/ and http://www.amd.com.

62%

33%

25%

14%

11%

2%

0% 20% 40% 60% 80% 100% 120% 140% 160% 180%

STREAM Copy

FLUENT

STAR-CD

LS-DYNA

SPECompMbase®2001

SPECfp®_rate2006

17% Average Performance

Advantage for Opteron 2356

http://www.spec.org/

http://www.amd.com/

http://www.spec.org/cpu2006/results

http://www.amd.com/

11

The Clear Leader for HPC Efficiency

Benchmark Rating(higher is better)

Energy Usage

(lower is better)

Rating per

Energy Usage

(higher is better)

FLUENT (CFD)

sedan_4m, 8 cores133% 86.7% 154%

LS-DYNA (FEA)

3 Vehicle Collision, 8 cores114% 99.6% 115%

STAR-CD (CFD)

A_Class_6m, 8 cores125% 93.9% 133%

Relative to Xeon E5472 processor-based server

Based on measurements at AMD performance labs as of June 23, 2008. FLUENT results based on FLUENT 12 beta release from ANSYS, Inc. Performance on the final software release may vary. LS-DYNA results based on LS-DYNA mpp970 release from LSTC. STAR-CD results based on STAR-CD v4.02 release from CD-adapco.

Higher performance and lower power consumption – the CLEAR leader

12

Introducing “Shanghai”

The new price/performance-per-watt leader for x86 servers.

1

Immersion lithography contributes to major power and performance benefits

2

Still the industry’s most manageable and consistent server platform

3

New innovations result in superior virtualization and power management capabilities

4

Unprecedented levels of price/performance for businesses5

13

AMD Technology Leadership Roadmap

180nm 130nm 90nm 65nm 45nm 32nm

2000 2002 2004 2006 2008 2010

CuInterconne

ctLow-K

dielectricStrained-Si

Multi-Strain

Transistor

130nm

2003

SOI

2003 AMD Opteron™

2005 Dual-Core

AMD Opteron™

2007Quad-Core

AMD Opteron™

14

Independent DynamicCore Technology

Independent DynamicCore Technology

AMD CoolCore™Technology

AMD CoolCore™Technology

Dual Dynamic PowerManagement™


Low-Power DDR2Memory

Low-Power DDR2Memory

…and these power-efficiency features…and these power-efficiency features

AMD Wide Floating-Point Accelerator

AMD Wide Floating-Point Accelerator

AMD MemoryOptimizer Technology




AMD BalancedSmart Cache


These performance-enhancing features…These performance-enhancing features…

Previous-generation innovations that continue

Low-Power DDR2 Memory

Dual Dynamic Power Management™

~150%

100%

Dual-Core*

Quad-Core*

*Stream bandwidth comparison of Second-Generation & Third-Generation AMD Opteron™ processor

15

L3 Cache IndexDisable3

L3 Cache IndexDisable3

RASRAS

Enhanced RVIEnhanced RVIAMD Smart FetchAMD Smart Fetch

45nm with ImmersionLithography






HyperTransport ™ Technology 3.02

HyperTransport ™ Technology 3.02

PerformancePerformance

Innovations new to this generation

DDR2-800

Enhanced Pre-fetching

2x Core Probe Bandwidth1

Up to 21% CPU Power Savings

Greater Frequency1

Core 3 Core 4Core 1 Core 2

L1

L2

Integrated Memory Controller

L3

L2 L2 L2

L1L1 L1

8MB: 2x total cache1

Faster World Switch1 Superior Data Integrity


L1

L2


L3

L2 L2 L2

L1L1 L1

Up to 17.6GB/s

HT3CPU CPU

1. Compared to Quad-Core AMD Opteron™ (“Barcelona” vs. “Shanghai”)2. Available Q2’09 on all new product introduction3. Planned availability in 2009 for select operating systems (to be determined)



Power EfficiencyPower Efficiency


L1

L2


L3

L2 L2

L2

L2

L1

L1

L1 L1

VM1 VM2Virtual Memory 1 Virtual Memory 2

Physical Memory

Performance90nm

65nm45nm

Pow

er

~35% Lower Idle Power1

VirtualizationVirtualization

16

Record-setting Performance

4P Java Performance

AMD Opteron™ Processor Model 8384

“Shanghai” (2.7 GHz)

Intel Xeon ProcessorModel X7460“Dunnington”

(2,66 GHz)

$2149 $2729

26% better performance for 2P servers with 29% lower processor price 24% better performance for 4P servers with 21% lower processor price

* All results based on SPECjbb®2005. See backup slide 23 for system configuration and details. Pricing reflects 1kU tray pricing published on http://www.amd.com and http://www.intel.com as of October 16, 2008 and/or suggested “Shanghai” 1kU price at launch.

24 cores

16 cores

0%

50%

100%

150%

200%

OLTP Virtualization Java Integer Floating Point

PercentageHigher is better

Dual-Core AMD Opteron™ Processor Model 2224 SEQuad-Core AMD Opteron™ Processor Model 2356Quad-Core AMD Opteron™ "Shanghai" ProcessorQuad-Core Intel Xeon Processors

Relative Performance

Intel = *NEW* X5482 (3.2GHz / 1600 FSB)

0%

50%

100%

150%

200%





0%

50%

100%

150%

200%





2P SPECfp

http://www.amd.com/

http://www.intel.com/

Accelerated Computing

18

Acceleration Concepts

Reduction in Latency

Add-in Chipset “SocketFiller”

PackageIntegration

CoreIntegration

Outside the system Closer to the cores

Chipset

PCI-E

PCIe Accelerator

Acc

eler

ato

r

CPU

Accelerator

AMD OpteronSocket

HTX Accelerator

Accelerator

AMD OpteronSocket

OpteronSocket

1919

Enhancing GPUs for ComputationRV770 Architecture

AMD FireStream SDKAMD FireStream SDKOpen systems approach to

drive broad customer adoption

AMD MulticoreCPUs

AMD Runtime

Compilers Libraries 3rd Party Tools

Brook+ RapidmindACML/Cobra

Compute Abstraction Layer (CAL)

AMD Stream Processors

750 MHz

800

GDDR5 3.6 Gbps

1.2 teraFLOPS

2GB

160W

Compute PowerCompute Power

Core Clock SpeedCore Clock Speed

Stream ProcessorsStream Processors

Memory TypeMemory Type

MemoryMemory

Peak Board PowerPeak Board Power

20

http://developer.amd.com/

21

AMD in 7 of the Top10

22

Cache L3

AMD native quad-core

PCI-e PCI-e

Chipset

FSB

Chipset

HyperTransport

AMD64

Memorycontroller

Memorycontroller

Hyper TransportInterface

Core1

Core2

Core1

CacheL2

CROSSBAR

Core3

Core4

Cache L2 Cache L2

Core2

CacheL2

Core3

CacheL2

Core4

CacheL2

23

2008 GPU – Crossbar

Evolving to enable Fusion

2006 GPU – Ring Bus

24

OpenCL Compliance Giving Programmers a Fully Open Cross-Platform Interface

The OpenCL Working Group consists of major industry players like AMD, Apple, IBM, Intel and Nvidia

The Working Group is on track to ratify and publish the specification later this year

OpenCL compliant implementation will begin rolling out next year

AMD is participating in the Khronos OpenCL Working Group to help AMD is participating in the Khronos OpenCL Working Group to help define an industry standard for define an industry standard for GPGPUGPGPU programming programming

25

Open Standards:Open Standards:

DirectX, OpenCLDirectX, OpenCL

Gaming Science

Productivity Entertainment

CAL, Brook+

A complete solution based on:-Open Standards-SDK-Usage Scenarios

Ecosystem Model for ATI Stream Computing

26

AMD + Tyan + SDC

27

[email protected]

[email protected]

28

Trademark Attribution

AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and/or other jurisdictions. Other names used in this presentation are for identification purposes only and may be trademarks of their respective owners.

©2008 Advanced Micro Devices, Inc. All rights reserved.

SDC Server Sao Jose

Technology

Transcript of SDC Server Sao Jose