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School of Microelectronic Engineering
Present and Future Prospects of Semiconductor Industry In Malaysia
ByRamzan Mat AyubTimbalan Dekan, Unit R&D, UniMAP
Azlan ZakariaHead of MEMS and CMOS GroupMimos Berhad
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Presentation Outline
The Evolution of Semiconductor Technology
Industry Structure
Technology Challenges & Trends
Semiconductor Industry in Malaysia
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The Evolution of Semiconductor Technology
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What is Semiconductor Technology?
The technology to produce IC microchips
IC chips are the backbone of the computer industry and have spurred related technologies such as software and internet
Every product of the information age is an offspring of IC technology
IC chips increasingly control functions in cars, TVs, VCRs, cameras, mobile phones, toys, etc.
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The Evolution of Transistor / IC
Transistor is the basic building block of ICs.
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First Transistor, Bell Lab 1947
John Bardeen and Walter Brattain, demonstrateda solid state device made from germanium. Theyobserved that when electrical signals were appliedto contacts on germanium, the output power waslarger than the input. These results were publishedIn 1948.
William Shockley, found out how the bipolar transistorfunctioned and published the theory in 1949.
Three of them shared the Nobel Prize in physics in1956,
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First Transistor and Its Inventors
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Semiconductor industry developed rapidly and germanium based transistor quickly replaced vacuum tubes in electronics equipment due to:
smaller size lower power consumption (enable portable applications) lower operating temperature quicker response time
Single crystal silicon and germanium based devices introduced in 1950 and 1952 respectively (better defect control, hence higher yield).
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Shockley left Bell Labs in 1956, to start his own lab in San Francisco Bay, California. Nowadays known as Silicon Valley. His lab has attracted talented scientist such as Robert Noyce and Gordon Moore.
Gordon Moore and Robert Noyce left Shockley in 1957 to start Fairchild Semiconductor.
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First IC Device by Jack Kilby, Texas Instruments 1958
1st fabricated by Bell Labs in 1958. Jack Kilby demonstrated functional IC, fabricated on germanium strip consists of;
one transistor one capacitor 3 resistors
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First Silicon IC Chip by Robert Noyce, Fairchild Camera, 1961
Fairchild Semiconductor produced the 1st commercialICs in 1961. This IC consists of only 4 transistors sold for USD 150 a piece.
NASA was the main customer.
In 1968, Robert Noyce cofounded Intel Corp. withAndrew Groove and Gordon Moore.
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IC Design: 1st IC
1st IC design by hand (Jack Kilby)
Currently, hundreds of designers workon single product to design, validateand lay outed will take several monthsto complete with the help of CADtools.
Main considerations; performance die size design time and cost testability
IC Design: State of The Art ICCMOS Inverter - basic building block of digital MOS design
Layout
Cross section
1980’s Technology … Wafer Cross section
1990’s Technology … Wafer Cross section
2000’s Technology … Wafer Cross section
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Wafer Fabrication: From Design to Wafer
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HDL Coding
FPGA Prototyping
Testbench Development & RTL Simulation
Synthesis & Optimization
Gatelevel Simulation
Static Timing Analysis
Design For Testability Implementation
Floorplanning & Place Route
Physical Verification
Post Layout Simulation
Mask Design
Fabrication & Wafer Probing
Packaging, Assembly & Test
Typical Design Flow
The Design Tools:
Software
• Front End – Synopsys• Back End – Monterey/Cadence• Mask Artwork – Cadence
Hardware
• SUN Workstation
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Typical Fabrication Flow
Main Process Modules (CMOS 1P2M 3.3V)1. Wells Formation2. Active Area Definition 3. Device Isolation (LOCOS)4. Vt Adjust5. Polygate Definition6. Source & Drain Formation7. Pre Metal Dielectrics Deposition (PMD)8. Contact Definition9. Metal-1 Deposition & Patterning10. Inter-Metal Dielectrics Deposition (IMD)11. Via Definition12. Metal-2 Deposition & Patterning13. Passivation14. Pad Definition
Full integration may require 300-500 process steps (4 – 6 weeks to be completed)
FRONT END PROCESS(creating an electrically isolated devices)
BACK END PROCESS(connecting the devices to form the desiredcircuit function.)
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IC Product Category
CMOSBased-Technology
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Industry Structure
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Semiconductor Manufacturing
A multi-dicipline processes, involved;
Circuit design Manufacturing material Clean room technology, processing, equipment Wafer processing technology Die testing Chip packaging and final test
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Design Services
Mask MakingWafer
ManufacturingWaferTest
Assembly & Final Test
SDIP SSOP QFP BGA
5 Major Industry Components
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Semiconductor Industry Structure
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IC Design Centers/ EDA
Providers
IC Manufacturers
Mask Shops
Packaging & Testing
Companies
Supporting Companies
MySem, MyMS, Intel, Altera,Cadence, Synopsis
MySem, Silterra, 1st Silicon, Infineon
TMC Taiwan, Dupont Singapore, Photronic Singapore
Unisem, Carsem, Malaysian Pacific Industries, ASE, National Semiconductor, Freescale, AIC etc.
Applied Materials, ASM, Varian, Verteq, Tel, Hitachi Kokosai, SEH etc
IC Design Centers/ EDA Providers
IC Manufacturers
Mask Shops
Packaging & Testing Companies
Supporting Companies
Full support chain of semiconductor companies
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Semiconductor Manufacturing Business Models
Design/IPSystems
IDM Model
Marketing/Sales(B2C)
•Companies: IBM, Intel, Texas Instruments
•Pros: Control over their own roadmap
•Cons: Cost, risk, swings in utilization
•Prerequisite: Must be a $7B+ to support
Aggressive manufacturing.
Manufacturing
Fablite Model
Design/IPSystems
Marketing/Sales(B2B)
Manufacturing
Foundry partners
Manufacturing
•Companies: Motorola, Infineon, ADI•Pros: Have some control over process technology, yet chance to have access toleading edge technology.•Cons: Once decision is made to reduce orStop investment, ability to reverse is difficult.
Fabless Model
Design/IPSystems
Marketing/Sales(B2B)
Foundry partners
•In 1990 only 7 fabless companies existed ; Today more than 100 fabless companies exist worldwide
•Many companies such as Motorola, TI, Tosibha, LSI Logic plan to outsource > 50% of its production
•Second & third tier IDM’s would be forced to adopt a pure fabless model or fablite strategy to remain viable
•Organic fabless growth — fabless growth consistently outpaces overall industry
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Why Fabless?
•Model allows necessary focus on system/design level for success•Manage the risk related to the high cost of building and maintaining a fab•Economies of scale/efficiency•Fabless companies are expected to account for more than 60% of the total semiconductor revenues by 2010•Fabless company funding sequentially increased 62 percent year-over-year in 2004
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Fabless Facts – Revenue Growth
$0
$50,000
$100,000
$150,000
$200,000
$250,000
87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02
$0
$2,000
$4,000
$6,000
$8,000
$10,000
$12,000
$14,000
$16,000
$18,000
Semi Industry Fabless Industry
The fabless sector has continuously achieved faster growth than the overall industry.
Semi Industry (in millions)
Fabless (In
millions)
Source - FSA
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Technology Trends & Challenges
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Moore’s Law
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Moore’s Law, Intel Product
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IC Integration Scale
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Feature Size and Wafer Size
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Road Map Semiconductor Industry
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Technology Improvement Trends
TREND EXAMPLE
Integration Level
Number of Components/ Chip
Cost Cost per function/ Increased functionality at incremental cost
Speed Microprocessor Clock rate
Power Increased battery life through design of low power IC’s in Mobile devices
Compactness
Introduction of concepts like System On Chip to reduce size and weight of the product with increased functionalities
Functionality Nonvolatile Memory
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Technology Parameters 1975
1997 2003
Chip Complexity (Index to 1)
1 10 100
Feature Size Reduction (micrometer)
2 0.25 0.08
Chip Size Increase (mm2) 30 150 600
Wafer Diameter (mm) 50 200 300
Facility Automation (%) 5 60 80
Die Yield (% good) 40 85 95
Line Yield (% good) 40 85 95
Assembly/ Test Yield (%) 90 99 99
Technology Advancements Comparison
Key Inferences•Continuously increasing density of transistors on single chip
•More functionality on a single chip
•More yield at lower costs
•Reduction of costs through facility automation
•Increase in the number of chips per wafer
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Technology Challenges (Opportunities)Key Challenges
Description
Design
•Challenges in design with increased density (reduced line width)
•Chips with increasing heterogeneity (integration)
•Complexity in interaction between design levels
•Difficulties of convergence and predictability of the design process
•Challenges in designing mixed signal designs and RF design due to convergence products
Material
•Challenges of low power and current requirements (proper doping to reduce the current leakage)
•Material with High K dielectric constant to increase device performance
•There is need for a new, large-area substrate for wafers with more than 300 mm diameter
•New materials for gates and dielectrics make gate etching process more difficult.
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Technology Challenges (Opportunities)
Key Challenges
Description
Fabrication
•Concurrent development of circuits and processes using test element groups (TEG’s) & simulation
•Robust circuit and processes factoring manufacturing fluctuations
•Defective product analysis and counter measure prototyping by means of quick turnaround time(QTAT)
•Declining number of masks leading to increase in number of chips per wafer:
–Reducing chip size–Expanding the area from which chips can be obtained–Manufacturing of increased wafer diameter of 300 mm
Assembly and Packaging
•Lower cost materials and processes to meet new requirements •Reliability under thermal cycling (stress and moisture)•Compatibility with harsh environments (automotive)•Increasing reliability for soldering process•New materials for Opto packaging
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Technology Challenges (Opportunities)Key Challenges Description
Defect Reduction
•Need for new failure analysis as the traditional failure analysis is likely to be inadequate due to:
–Classification speed of defects
–The number of defects that can be handled
•Speed of chemical element analysis
•UV defect inspection equipment for wafers failing at 130 nm node
Testing
•Achieving low test costs and high test reliability
•New test requirements for technology >100nm
•Ability to test for cross talk induced failures caused by high-density interconnect
•Testing embedded mixed analog/ digital circuits
•Use of design for test (DFT) for testing high-speed devices
•Need for higher order DFT for SoC testing
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The International Technology Roadmap for Semiconductors, known throughout the world as the ITRS, is the fifteen-year assessment of the semiconductor industry’s future technology requirements. These future needs drive present-day strategies for world-wide research and development among manufacturers’ research facilities, universities, and national labs.
www.itrs.net
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ITRS 2006 Update
Executive Summary System Drivers DesignTest & Test EquipmentProcess Integration, Devices & StructuresRF & A/MS Technologies for Wireless CommunicationEmerging Research Devices was not updated for 2006, refer to 2005 Chapter Front End ProcessesLithographyInterconnectFactory IntegrationAssembly & PackagingEnvironment, Safety & HealthYield EnhancementMetrologyModeling & Simulation
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New ICT Era : Nanocomputing
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Semiconductor Industry- Past Trends
Year over Year Semiconductor Industry Growth Rates
Source: World Semiconductor Trade Statistics
•10 year CAGR between 10% & 20%
•Worst ever Semiconductor industry downturn witnessed in 2001-02
•Industry witnessed a –ve growth rate of around 30% during the downturn
•Revival of semiconductor industry in 2004
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Semiconductor Industry- Manufacturing Trends
Source: World Semiconductor Trade Statistics (WSTS)
Outsourcing of Semiconductor Manufacturing showing strong trends •Major indicators of
Semiconductor industry like Foundry Revenues, CAPEX spending witnessing downward trend in 2001& 2002
•Foundry Revenues, CAPEX spending & Semiconductor Revenues graph in consonant with each other
•EDA revenues increasing consistently (except during downturn) as continuous advancing technology forcing industry to upgrade EDA tools
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Semiconductor Industry Forecasts
0
50
100
150
200
250
300
2002 2003 2004 2005 2006 2007 2008
-5
0
5
10
15
20
25Revenues in $ Billion Growth Rate
Source: Frost and Sullivan
•World wide semiconductor revenue expected to rise to $199 billion from $166 billion in 2003
•Chip market is expected to decline by 2.3%in 2006 due to overcapacity
•New growth cycle expected to commence in 2007
•Revenues expected to reach $266 billion by 2008
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Semiconductor CAPEX Spending
2003 2004 2005 2006 2007 2008
Semiconductor Capital Spending
29,661 44,763 50,767 43,058 35,693 39,872
Growth (%) 7.5 50.9 13.4 -15.2 -17.1 11.7
Capital Equipment 22,824 37,317 42,912 35,230 27,806 32,439
Growth (%) 10.3 63.5 15 -17.9 -21.1 16.7
Wafer Fab Equipment
16,742 27,364 31,144 25,848 20,598 23,176
Growth (%) 3.5 63.4 13.8 -17 -20.3 12.5
Packaging and Assembly Equipment
3,060 4,994 5,114 3,602 2,949 3,988
Growth (%) 30.5 63.2 2.4 -29.6 -18.1 35.2
Automated Test Equipment
3,021 4,960 6,655 5,780 4,260 5,275
Growth (%) 39.4 64.2 34.2 -13.1 -26.3 23.8Source: WSTS & SIAAll Revenue Figures are in $Millions
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Semiconductor Industry in Malaysia
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Can be classified into 3 sub-sectors (MIDA);
electronics components semiconductor device (35 -40% of total electronic exports) linear & digital ICs, memories, MCU, opto-e etc capacitors, relay, switches, transformers etc.
consumer electronics audio products, VCD players, phones
industrial electronics public phone exchanges, satellite receivers, transmission eq.
Electronic Industry Structure
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Increased considerably from <3 billion units / annum in 1980 to 18 billion units / annum in 2004.
In 1990-2003 period, average increament per annum ~ 16.5%, much stronger growth in 2004 (28.2%)
Earning from exports, from RM35.5 billion in 1996 to RM89.3 billion in 2004.
Semiconductor Production Output
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Semiconductor Production Output MALAYSIA: Production of Semiconductors (Million Units)
Year Output
1989 2,262
1990 2,565
1991 2,689
1992 3,121
1993 3,491
1994 3,410
1995 4,757
1996 5,237
1997 7,432
1998 8,951
1999 9,959
2000 16,373
2001 13,524
2002 15,036
2003 15,958
2004 18,228
Source : MIDA
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Semiconductor Exports
MALAYSIA: Exports of Semiconductors
Year Exports (RM Million)
1996 35.5
1997 40.8
1998 54.4
1999 65.4
2000 71.1
2001 60.5
2002 72.9
2003 85.1
2004 89.2
Source : MIDA
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THE SEMICONDUCTOR INDUSTRYIN MALAYSIA As at 2004
Number of Companies 40
MAJOR COMPANIES:
ASSEMBLY AND TESTINGIntel, AMD, Motorola, Agilent, Texas Instrument, National Semiconductor, Fairchild, Hitachi, NEC Toshiba, Fujitsu, Infineon Technologies, STMicroelectronics, ASE Electronics, MPI (Carsem), Unisem, Globetronics, AIC, ChipPac.
SILICON WAFER PROCESSINGMEMC Electronics Material, ShinEtsu, Wacker NSCE
WAFER FABRICATIONSCG Industries, MIMOS, Silterra, 1st Silicon, Infineon Technologies (New)
CHIP DESIGNAltera Corporation, MIMOS
MAJOR SUPPORTING INDUSTRIES:
LEADFRAMESMPI (Dynacraft), M-SMM Electronics, Shinko, Kyushu Matsushita Electric, Mitsui High-Tec, Possehl Besi Electronic, AKN Technology.
BONDING WIRESTanaka Electronics, Malaysian Electronics Materials
BURN IN AND TESTING SERVICESTS Matrix, KESM Industries, KESP
Source: MIDA
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Developed rapidly to become one of the country’s major industries within the manufacturing sector since the establishment of the 1st
semiconductor plant in Penang (1972)
Played a major role towards country’s industrialization (30% of current manufacturing output and 25% of country’s manufactured exports).
Progressing from labor-intensive operations to state of the art robotic manufacturing that produce the latest product.
Nevertheless, manufacturing activities are still dominated by the the lower end assembly and test.
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Malaysia – Presence in the Value Chain
Design & Developme
nt
Masking
R&D Packaging
Testing
Physical Design
Logical Design
Dicing
Substrate
FabricationEquipment
Photo-resists
Lead Frame
Test Equipment
Bonding
EDA Tools
Product Manufacturin
g
Components
Product Design
EMS
Plastic Molding
Precision Componen
ts
EndProduc
t
Optical
PC & Peripherals
Consumer Electronics
Industrial Electronics
Automotive
Others
Bio-medical
Wafer Processing
Chemical and Ultra pure gases
Strong Current CompetenceLimited Current Competence – Need to be strengthened
Competence to be developed End user presence
Fabrication
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Embarking to move up further into the higher technology value chain chip making;
Wafer Fabrication (Foundry) MIMOS Fab – 1995 1st Silicon – Feb 2001, Owned by Sarawak Gov (RM 6.5B) Silterra Malaysia – Mac 2001, Owned by Khazanah (RM4.5B) Infineon Technologies – 2005, Siemen AG
Chip Design MIMOS (MyMS) Altera Corp Agilent Technologies Motorola (MSC) Intel Design Centre
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Electronic Products
Semiconductor Assembly & Test
Wafer Fabrication
Silicon Wafer Manufacturing
Design
Industry Status
Industrial Electronics (MNCs, Local)
Consumer Electronics (MNCs, Local)
MNCs, Local (Major Share in Global Exports)
Silterra,1st Silicon, MIMOS
MIMOS/Universities
MNCs
Source: MIMOS Analysis based on IMP2 Report
Integrated Value Chain
Add Value, Focus
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Increase Local Content
• Assumptions– Value of design: 10% of product value
– Profit margin: 25% of product value
1998 1999 2000 2001 2002Projected Malaysian Semiconductor Demand (RM million)
24,612.1 29,681.8 36,411.6 45,232.3 51,132.1
Targeted Indigenous Product Content (%)
0.5 0.7 5.0 10.0 25.0
Projected Total Indigenous value (RM million)
92.3 155.8 1,365.4 3,392.4 9,587.3
Projected Indigenous Design value (RM million)
12.3 20.8 182.1 452.3 1,278.3
Source: MIMOS Analysis
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Industry
• Infrastructure
• New materials
• Methodology
• D & M process
• Expertise
• Products
• Technology
• Growth
R&D Centre
Universities
National Strategy
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KSF’s & Challenges for MalaysiaSuccess Factors Challenges
R&D, Design & Development and Fabrication
•Absence of a highly evolved R&D/design environment
•Current factor conditions (Education system)
•High costs of setting up niche research institution (s)
•Close proximity of other technology centers like, Taiwan, South Korea, Japan, Singapore, Israel, India
Sustainable world class manufacturing facility with global process standards
•Low exposure to international clients; regionally focused with spare manufacturing capacity
•Capital intensive nature calling for regular investment for upgrading
Rapid & successful R&D and process innovation in semiconductor fab & packaging
•Competencies in fabrication and packaging NOT translated into creation of process innovations
•Need for Packaging and testing excellence center
Retain MNC companies currently engaged in packaging, assembly and testing
•MNCs looking for presence of “value add” activities in existing locations; Need strong RSI and factor conditions
•Strategies to remain in the country driven by HQ
Strong RSI Presence •Local companies and SMEs need to continuously upgrade to meet international quality standards and maintain competitiveness
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Conclusion
Semiconductor technology is a strategic knowledge in the ICT era
Semiconductor industry is the key to the country’s competitiveness and growth.
Chip design and wafer fabrication are the KSF in securing the country as a major semiconductor based component / product producer.