Red (655 nm) and Infrared Emitter (940 nm) Draft Version α ...€¦ · DRAFT - This design is for...

2019-07-05 1

DRAFT - This design is for Reference only. Subject to change without notice.

2016-11-11

Red (655 nm) and Infrared Emitter (940 nm)

Draft Version α.2

SFH 7015

Ordering Information

Features:

• SMT package with red (655 nm) and IR emitter (940 nm)

• Suitable for SMT assembly

• Available on tape and reel

• Emitters can be controlled separately

• Emitter 1 = red, Emitter 2 = IR

Applications

• Biomonitoring

Notes

Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which

can be hazardous to the human eye. Products which incorporate these devices have to follow the safety

precautions given in IEC 60825-1 and IEC 62471.

Type: Package: Ordering Code

SFH 7015 SMT Multi CHIPLED Q65112A7658

2019-07-05 2


Draft Version α.2 SFH 7015

Maximum Ratings

Characteristics (TA = 25 °C)

Parameter Symbol Values Unit

Operating and storage temperature range Top; Tstg -40 ... 85 °C

Reverse voltage VR 5 V

ESD withstand voltage(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)

VESD 2 kV

Emitter 1 (red)

Forward current IF (DC) 40 mA

Surge current

(tp ≤ 400 µs, D = 0 .005)

IFSM 0.6 A

Power consumption Ptot 120 mW

Emitter 2 (IR)

Forward current IF (DC) 60 mA

Surge current(tp ≤ 200 µs, D = 0.005)

IFSM 1 A

Total power dissipation Ptot 110 mW

Note: The stated maximum ratings refer to one chip, unless otherwise specified.


Emitter 1 (red)

Peak wavelength(IF = 20 mA, tp = 20 ms)

(typ) λpeak 660 nm

Centroid wavelength(IF = 20 mA, tp = 20 ms)

(typ) λcentroid 655 nm

Spectral bandwidth at 50% of Imax

(IF = 20 mA, tp = 20 ms)(typ) ∆λ 17 nm

Half angle (typ) ϕ ± 60 °

Dimensions of active chip area (typ) L x W 0.3 x 0.3 mm x

mm

Rise and fall time of Ie ( 10% and 90% of Ie max)(IF = 100 mA, RL = 50 Ω)

(typ) tr, tf 17 ns

Forward voltage

(IF = 20 mA, tp = 20 ms)

max typ min

VF

2.80

2.101.65

V


2019-07-05 3


Reverse current

(VR = 5 V)

IR not designed for

reverse operation

µA

Total radiant flux(IF = 20 mA, tp = 20 ms)

(typ) Φe 13 mW

Radiant intensity

(IF = 20 mA, tp = 20 ms)

(typ) Ie, typ 4 mW/sr

Radiant intensity(IF = 20 mA, tp = 20 ms)

(min) Ie, min 2 mW / sr

Temperature coefficient of Ie or Φe

(IF = 20 mA, tp = 20 ms)

(typ) TCI -0.7 % / K

Temperature coefficient of VF

(IF = 20 mA, tp = 20 ms)(typ) TCV -1.7 mV / K

Temperature coefficient of wavelength

(IF = 20 mA, tp = 20 ms)

(typ) TCλ 0.18 nm / K

Thermal resistance junction - ambient, mounted on PC-board (FR4) 1) page 16

(max) RthJA 590 K / W

Emitter 2 (IR)

Peak emission wavelength(IF = 20 mA, tp = 20 ms)

(typ) λpeak 950 nm

Centroid wavelength

(IF = 20 mA, tp = 20 ms)

(typ) λcentroid 940 nm

Spectral bandwidth at 50% of Imax

(IF = 20 mA, tp = 20 ms)(typ) ∆λ 42 nm

Half angle (typ) ϕ ± 60 °

Dimensions of active chip area (typ) L x W 0.3 x 0.3 mm x mm

Rise and fall times of Ie ( 10% and 90% of Ie max)(IF = 100 mA, RL = 50 Ω)

(typ) tr / tf 16 ns

Forward voltage(IF = 20 mA, tp = 20 ms)

max typ min

VF

1.61.31.0

V

Reverse current (typ (max)) IR not designed for

reverse operation

µA

Total radiant flux(IF = 20 mA, tp = 20 ms)

(typ) Φe 10 mW

Radiant intensity

(IF = 20 mA, tp = 20 ms)

(typ) Ie, typ 3 mW/sr


2019-07-05 4



Radiant intensity

(IF = 20 mA, tp = 20 ms)

(min) Ie, min 1.5 mW/sr

Temperature coefficient of Ie or Φe

(IF = 20 mA, tp = 20 ms)(typ) TCI -0.3 % / K

Temperature coefficient of VF

(IF = 20 mA, tp = 20 ms)

(typ) TCV -0.8 mV / K

Temperature coefficient of wavelength(IF = 20 mA, tp = 20 ms)

(typ) TCλ 0.3 nm / K

Thermal resistance junction - ambient, mounted on

PC-board (FR4) 1) page 16 (max) RthJA 670 K / W



2019-07-05 5


Diagrams

Emitter 1 (red)

Relative Spectral Emission 2) page 16

Irel = f(λ), TA = 25°CRadiant Intensity 2) page 16

Ie / Ie(20 mA) = f(IF), single pulse, tp = 25 µs, TA= 25°C

5500

nm

%

OHF05734

Irel

λ600 650 700 750

10

20

30

40

50

60

70

80

100OHF05735

310

FI102 mA

(20 mA)e

5

10 -1

10

5

0

101

102

101010

eΙΙ

2019-07-05 6



Max. Permissible Forward Current

IF, max = f(TA), RthJA = 590 K / WForward Current 2) page 16

IF = f(VF), single pulse, tp = 100 µs, TA= 25°C

Permissible Pulse Handling Capability

IF = f(tp), TA = 25 °C, duty cycle D = parameterPermissible Pulse Handling Capability

IF = f(tp), TA = 85 °C, duty cycle D = parameter

SFH 7014

0 20 40 60 80T

A

[°C]

0

10

20

30

40I

F

[mA]SFH 7014

2.0 2.5 3.0 3.5 4.0 4.5V

F

[V]

0.005

0.01

0.05

0.1

0.5I

F

[A]

SFH 7014

10-5 10-4 10-3 0.01 0.1 1 10 100t

p

[s]

0.0

0.2

0.4

0.6I

F

[A]

: D = 1: D = 0,5: D = 0,2: D = 0,1: D = 0,05: D = 0,02: D = 0,01: D = 0,005

SFH 7014

10-5 10-4 10-3 0.01 0.1 1 10 100t

p

[s]

0.0

0.1

0.2

0.3

0.4

0.5

I

F

[A]

: D = 1: D = 0,5: D =0,2: D =0,1: D =0,05: D =0,02: D =0,01: D =0,005


2019-07-05 7


Diagrams

Emitter 2 (IR)

Relative Spectral Emission 2) page 16

Irel = f(λ), TA = 25°CRadiant Intensity 2) page 16

Ie / Ie(20 mA) = f(IF), single pulse, tp = 100 µs, TA= 25°C

8000

nm

%

OHF04134

20

40

60

80

100

Irel

λ850 900 950 1025

OHF05669

310

Ιe

(20 mA)e

Ι

FI102110100 mA

10-2

10-1

100

101

210

2019-07-05 8



Max. Permissible Forward Current

IF, max = f(TA), RthJA = 670 K / WForward Current 2) page 16

IF = f(VF), single pulse, tp = 100 µs, TA= 25°C

Permissible Pulse Handling Capability

IF = f(tp), TA = 25 °C, duty cycle D = parameterPermissible Pulse Handling Capability

IF = f(tp), TA = 85 °C, duty cycle D = parameter

SFH 7014

0 20 40 60 80T

A

[°C]

0

20

40

60I

F

[mA]

0

I

OHF05642

F

VF

mA

V

102

310

010

110

1 2 3 4

SFH 7014

10-5 10-4 10-3 0.01 0.1 1 10 100t

p

[s]

0.0

0.2

0.4

0.6

0.8

1.0I

F

[A]

: D = 1: D = 0,5: D = 0,2: D = 0,1: D = 0,05: D = 0,02: D = 0,01: D = 0,005

SFH 7014

10-5 10-4 10-3 0.01 0.1 1 10 100t

p

[s]

0.0

0.2

0.4

0.6I

F

[A]

: D = 1: D = 0,5: D =0,2: D =0,1: D =0,05: D =0,02: D =0,01: D =0,005


2019-07-05 9


Radiation Characteristics 2) page 16

Irel = f(ϕ), TA= 25°C

Package Outline

Dimensions in mm.

0

0.2

0.4

1.0

0.8

0.6

ϕ

1.0 0.8 0.6 0.4

0˚10˚20˚40˚ 30˚ OHL01660

50˚

60˚

70˚

80˚

90˚

100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

2019-07-05 10



Pinning

Pin Description

1 NC

2 Cathode Emitter 1 (655 nm)

3 Anode Emitter 1/2

4 Cathode Emitter 2 (940 nm)

Approximate Weight:

3 mg

Recommended Solder Pad

Dimensions in mm.


2019-07-05 11


Reflow Soldering Profile

Product complies to MSL Level 3 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300

t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

OHA04612

Profil-Charakteristik

Profile Feature

Ramp-up Rate to Preheat*)

25 °C to 150 °C2 3 K/s

Time tS TSmin to TSmax

tS

tL

tP

TL

TP

100 12060

10 20 30

80 100

217

2 3

245 260

3 6

Time25 °C to TP

Time within 5 °C of the specified peaktemperature TP - 5 K

Ramp-down Rate*TP to 100 °C

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Ramp-up Rate to Peak*)

TSmax to TP

Liquidus Temperature

Peak Temperature

Time above Liquidus temperature

Symbol

Symbol

Einheit

Unit

Pb-Free (SnAgCu) Assembly

Minimum MaximumRecommendation

K/s

K/s

s

s

s

s

°C

°C

480

2019-07-05 12



Taping

Dimensions in mm.

Tape and Reel

8 mm tape with 3000 pcs. on ∅ 180 mm reel

D0

2P

P0

1P

WFE

Direction of unreeling

N

W1

2W

A

OHAY0324

Label

Leader:Trailer:

13.0

Direction of unreeling

±0.2

5

min. 160 mm *min. 400 mm *

*) Dimensions acc. to IEC 60286-3; EIA 481-D


2019-07-05 13


Tape dimensions [mm]Tape dimensions in mm

Reel dimensions [mm]Reel dimensions in mm

Barcode-Product-Label (BPL)

Dry Packing Process and Materials

Note:Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.

Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC.

W P0 P1 P2 D0 E F

8 + 0.3 / -0.1 4 ± 0.1 2 ± 0.05

or

4 ± 0.1

2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 3.5 ± 0.05

A W Nmin W1 W2max

180 8 60 9 11.4

OHA04563

(G) GROUP:

1234567890(1T) LOT NO: (9D) D/C: 1234

(X) PROD NO: 123456789

(6P) BATCH NO: 1234567890

LX XXXX

RoHS Compliant

BIN1: XX-XX-X-XXX-X

MLX

Temp STXXX °C X

Pack: RXX

DEMY XXX

X_X123_1234.1234 X

9999(Q)QTY:

SemiconductorsOSRAM Opto

XX-XX-X-X

EXAMPLE

X_X123_1234.1234 X

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

XXX

X_X123_1234.1234 X

XX-XX-X-X

EXAMPLE

EXAMPLE

Pack: RXX

DEMY

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

EXAMPLE

(9D) D/C: 1234

EXAMPLE

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EXAMPLE

(6P) BATCH NO: 1234567890EXAMPLE

SemiconductorsOSRAM Opto

EXAMPLE

EXAMPLE

X_X123_1234.1234 X

Pack: RXX

DEMY

X_X123_1234.1234 X

(9D) D/C: 1234(9D) D/C:

1234567890(6P) BATCH NO: 1234567890

OSRAM Opto

XXX

X_X123_1234.1234 X

XX-XX-X-X

Pack: RXX

DEMY

Semiconductors

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity Indicator

MIL-I-8835

If wet,

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6 H

ours

a) H

um

idity

Indic

ato

r C

ard

is >

10%

when read a

t 23 ˚C

± 5

˚C

, or

reflo

w, vapor-

phase

reflo

w, or equiv

ale

nt pro

cessin

g (peak p

ack

age

2. A

fter th

is b

ag is

opened, devic

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ill b

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d to in

frare

d

1. S

helf

life in s

eale

d b

ag: 24 m

onth

s a

t < 4

0 ˚C

and <

90%

rela

tive

hum

idity (

RH

).

Mois

ture

Leve

l 5a

at fa

cto

ry c

onditio

ns o

f

(if bla

nk,

seal d

ate

is id

entica

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ith d

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code).

a) M

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d w

ithin

b) S

tore

d a

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body tem

p.

3. D

evic

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akin

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re m

ountin

g, if:

Bag s

eal d

ate

Mois

ture

Leve

l 1

Mois

ture

Level 2

Mois

ture

Level 2a

4. If b

akin

g is

required,

b) 2a o

r 2b is

not m

et.

Date

and tim

e o

pened:

refe

rence

IP

C/J

ED

EC

J-S

TD

-033 for bake

pro

cedure

.

Flo

or tim

e s

ee b

elo

w

If b

lank,

see b

ar code la

bel

Flo

or tim

e >

1 Y

ear

Flo

or tim

e 1 Y

ear

Flo

or tim

e 4 W

eeks1

0%

RH

.

_<

Mois

ture

Leve

l 4

Mois

ture

Level 5

˚C).

OP

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ON

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CTO

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MO

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bag c

onta

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CA

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Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or

tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If b

lank,

see

bar code label

2019-07-05 14



Transportation Packing and Materials

Dimensions of transportation box in mm

Width Length Height

191 ± 5 195 ± 5 30 ± 5

OHA02044

PACKVAR:

R077Additional T

EXT

P-1+Q-1

Multi TOPLED

Muste

r

OSRAM Opto

Semiconductors

(6P) BATCH N

O:

(X) P

ROD NO:

10

(9D) D/C

:

11(1T) LOT N

O:

210021998

123GH1234

024 5

(Q)Q

TY: 2000

0144

(G) G

ROUP:

260 C R

T

240 C R

3

220 C R

MLBin3:Bin2: Q

-1-20

Bin1: P-1-20

LSY T676

22a

Temp ST

R18DEMY

PACKVAR:

R077Additional T

EXT

P-1+Q-1

Multi TOPLED

Muste

r

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) P

ROD NO:

10

(9D) D/C

:

11(1T) LOT N

O:

210021998

123GH1234

024 5

(Q)Q

TY: 2000

0144

(G) G

ROUP:

260 C R

T

240 C R

3

220 C R

MLBin3:Bin2: Q

-1-20

Bin1: P-1-20

LSY T676

22a

Temp ST

R18DEMY

OSRAM

Packing

Sealing label

Barcode label

Mois

ture

Leve

l 3

Flo

or tim

e 168 H

ours

Mois

ture

Leve

l 6

Flo

or tim

e 6 H

ours

a) H

um

idity

Indic

ato

r C

ard

is >

10%

when read a

t 23 ˚C

± 5

˚C

, or

reflow

, va

por-

phase

reflo

w, or equiv

ale

nt pro

cess

ing (peak p

acka

ge

2. A

fter th

is b

ag is

opened, devic

es t

hat w

ill b

e s

ubje

cted to in

frare

d

1. S

helf

life in

seale

d b

ag: 24 m

onth

s at < 4

0 ˚C

and <

90%

rela

tive h

um

idity (

RH

).

Mois

ture

Level 5a

at fa

cto

ry c

onditi

ons o

f

(if bla

nk, se

al d

ate

is id

entic

al w

ith d

ate

code).

a) M

ounte

d w

ithin

b) S

tore

d a

t

body t

em

p.

3. D

evic

es r

equire b

akin

g, befo

re m

ountin

g, if:

Bag s

eal d

ate

Mois

ture

Leve

l 1

Mois

ture

Leve

l 2

Mois

ture

Leve

l 2a

4. If b

akin

g is

required,

b) 2a o

r 2b is

not m

et.

Date

and tim

e o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD

-033 for bake

pro

cedure

.

Flo

or tim

e s

ee b

elo

w

If b

lank, see b

ar co

de la

bel

Flo

or tim

e >

1 Y

ear

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or tim

e 1 Y

ear

Flo

or tim

e 4 W

eeks1

0%

RH

.

_<

Mois

ture

Leve

l 4

Mois

ture

Level 5

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TO S

EM

ICO

ND

UC

TOR

S

MO

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ITIV

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ag c

onta

ins

CA

UTIO

N

Flo

or tim

e 72 H

ours

Flo

or tim

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ours

30 ˚C

/60%

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.

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LE

VE

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If b

lank, se

e

bar code label

Barcode label


2019-07-05 15


Disclaimer

OSRAM OS assumes no liability whatsoever for any use of this document or its content by recipient

including, but not limited to, for any design in activities based on this preliminary draft version.

OSRAM OS may e.g. decide at its sole discretion to stop developing and/or finalising the underlying design at any

time.

Language english will prevail in case of any discrepancies or deviations between the two language wordings.

Attention please!

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances.

For information on the types in question please contact our Sales Organization.?If printed or downloaded, please find

the latest version in the Internet.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

?By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any

costs incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose!

Critical components* may only be used in life-support devices** or systems with the express written approval of

OSRAM OS.

*) A critical component is a component used in a life-support device or system whose failure can reasonably be

expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that

device or system.

**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or

maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be

endangered.

2019-07-05 16



SMILE Sprint 25 Review

Glossary

1) only one chip on

2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or

calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily

correspond to the actual parameters of each single product, which could differ from the typical data and calculated

correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data

will be changed without any further notice.

Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserd.

Red (655 nm) and Infrared Emitter (940 nm) Draft Version α ...€¦ · DRAFT - This design is for...

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Transcript of Red (655 nm) and Infrared Emitter (940 nm) Draft Version α ...€¦ · DRAFT - This design is for...