Quality Assurance Procedures for LPU and all related components
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Transcript of Quality Assurance Procedures for LPU and all related components
LPU and subassembly Quality Assurance checklist
LPU Serial Number____________________
QA performed By _____________________
Date of Installation____________________
Quality Assurance Procedures for LPU and all related components.
Prior to any assembly of all LPU systems and subsystemsthe following procedures will be used to perform a Quality Assurance Inspection so that the integrity of all systems will be maintained.Inspection is required of all components listed below prior to beginning the manufacturing of the LPU and subsystems. This procedure is to be used in conjunction with the LPU Assembly manual. This will allow the assemblers to familiarize themselves with the components described in this procedure.
Electronic Components:
Carrier BoardDIO BoardWIM CardWIM Interface BoardLPU Power SupplyL-Com Boards and WIM Filter Board
Cables:
LC-1LC-2Interface Board to Carrier Board Cable
Connectors and switch:
WIM card to Carrier Board Ribbon Cable connectors
Mechanical Components:
LPU ChassisVGA BracketPower switch BracketWIM Card Window PanelVent screensLPU I/O Port PanelsPower switch bracket
Carrier Board Passed FailedPhysical distribution of pinsare correct for all connectorsConnector shells are undamagedMissed solder connectionsBoard is free of all flux and solder residue.Circuit Board is free from Physical defectsJack nut brackets are properly InstalledProcessor is installed on carrier board and Screwed in place with correct mounting screwsInspect for proper seating of processor to the carrier board
DIO Board Passed FailedPhysical distribution of pinsare correct for all connectorsAll Connector shells are undamagedMissed solder connections on back of boardCircuit board is free of all flux and solder residue.Circuit Board is free from Physical defects
WIM Card Passed FailedConnector shells are free of damage
Power and USB B connector free of any physical damage
LED display is free of damageMissed solder connections on back of boardCircuit Board is free from Physical defectsRemove ground wire from Load Cell side of board replace jack nut
WIM Interface cardsPassed Failed
No Physical damage to the board
Continuity test across solder points on PWR1 5v_Ret and +5v. It must read open
No unsoldered connections
LPU Power Supply and componentsPassed Failed
Inspect power supply for any defectsPower supply is wired correctlyAll Spade terminals are crimped properlyNo excessive bare wire is exposed fromSpade terminalsSpade terminals are oriented downwardNo loose wires on 20 pin Molex connector Molex connector is wired correctlyAll voltages have been tested and are correctInspect Power Supply Filter for any damage
L-Com Boards and WIM Filter Pass FailedNo Physical damage to L-COM and WIM Filter boardsNo unsoldered points on back of L-Com Ferrule connection from L-Com board to WIM filter are secureNo unsoldered connections or overlapping solder on WIM Filter BoardWIM Filter is wired correctly per installation manual and is connected to the Line side of L-COM boardNo physical damage to Load cell connector
WIM Cables and Connectors Passed FailedLC1 and LC2 cables insure wires are connected correctly and ferrules are properly crimped and are not loose. LC1 and LC2 cables are labeled accordinglyWIM Ribbon Connectors insure that ribbons are securely crimped to the connector and there is no damage to shellInspect all wires associated with LPU power switchInsure proper operation of switch using OHM meter
Mechanical Quality Assurance Checklist
LPU Chassis and chassis components Passed FailedInspect chassis for any physical damage or defectsInspect screw studs for any damageInsure cover closes properlyInspect side screens for any damage or defectsInspect I/O Port Panel for any damageInspect VGA bracket for any damageInspect the power switch bracketFor any damage Inspect WIM Card Window Panels for any damageInspect Vent screens for any damage