Quad Flat Pack No-Lead (QFN)extra.ivf.se/eqs/dokument/3. QFN Presentation.pdf · 2011. 4. 18. ·...
43
130 © 2004 - 2010 Quad Flat Pack No-Lead (QFN)
Transcript of Quad Flat Pack No-Lead (QFN)extra.ivf.se/eqs/dokument/3. QFN Presentation.pdf · 2011. 4. 18. ·...
130
©2
004 -
2010Q
uad
Fla
t P
ack N
o-L
ead
(Q
FN
)
131
©2
004 -
2010
QF
N: W
hat
is
it?
Q
uad F
lat
Pa
ck N
o L
ead o
r
Quad F
lat
Non-L
eaded
O
verm
old
ed
leadfr
am
ew
ith b
ond p
ads
exposed o
n the b
ottom
and a
rranged a
long
the p
eriphery
of th
e p
ackage
‘T
he p
oor
man’s
ball
grid a
rray’
132
©2
004 -
2010
QF
N (
con
t.)
A
lso k
now
n a
s
!B
ott
om
Te
rmin
ate
d C
om
po
ne
nt
(BT
C)
!M
icro
Le
ad
Fra
me
(ML
F)
!O
the
rs (
LF
-CS
P,
ML
P,
LP
CC
, Q
LP
, H
VQ
FN
, e
tc.)
D
evelo
ped in the e
arly to
mid
-1990’s
by M
oto
rola
, T
oshib
a,
Am
kor,
etc
.
S
tandard
ized b
y J
ED
EC
/EIA
J in late
-1990’s
F
aste
st gro
win
g p
ackage type
133
©2
004 -
2010
QF
N P
ackag
ing:
Tre
nd
s
In
itia
l fo
cu
s o
n s
ing
le-r
ow
of
I/O
pin
s
!1
x 2
mm
(3
le
ad
) to
14
x 1
4 m
m (
12
0 le
ad
s)
E
xp
an
sio
n in
to a
dd
itio
na
l ro
ws
!D
ua
l ro
w in
cre
ase
s I
/O c
ou
nt
to a
bo
ve
15
0
!A
SE
off
erin
g m
ulti-ro
w (
ad
va
nce
d Q
FN
)
Q
FN
se
em
s t
o b
e g
rad
ua
lly
pro
gre
ssin
g t
ow
ard
s la
nd
gri
d a
rra
y (
LG
A)
co
nfig
ura
tio
n
134
©2
004 -
2010
QF
N T
ren
ds
(co
nt.
)
O
ffe
red
in
a v
ari
ety
of
pitch
es
!0
.4m
m s
ee
ms t
o b
e t
he
mo
st
po
pu
lar
N
um
ero
us p
acka
ge
ou
tlin
e v
ers
ion
s (
JE
DE
C)
!M
O-1
96
(1
99
8)
!A
va
ilab
le in
tw
o (
DF
N)
an
d f
ou
r-sid
ed
O
ffe
red
in
a v
ari
ety
of
thic
kn
esse
s!
VQ
FN
, W
QF
N,
UQ
FN
, X
QF
N (
based o
n J
ED
EC
sta
ndard
o
utlin
e d
ocu
me
nt)
!D
ow
n t
o 0
.45
mm
pro
file
he
igh
t
135
©2
004 -
2010
135
QF
N (
con
t.)
E
xp
ecte
d t
o d
om
ina
te le
ad
co
un
ts b
etw
ee
n 8
to
68
!O
bsole
scence o
f Q
FP
and S
OP
?
!S
OJ a
lre
ad
y w
ide
ly u
na
va
ilab
le
In
cre
asin
gly
po
pu
lar
for
po
we
r a
nd
RF
co
mp
on
en
ts!
Ca
n r
esu
lt in
asym
me
tric
pa
cka
ge
desig
ns
O
the
r va
ria
tio
ns
!S
ing
ula
ted
(pu
nch
ed
) a
nd
sa
we
d
136
©2
004 -
2010
136
QF
N A
dvan
tage
s: S
ize
and
Co
st
S
ma
ller,
lig
hte
r a
nd
th
inn
er
tha
n c
om
pa
rab
le le
ad
ed
p
acka
ge
s!
Allo
ws f
or
gre
ate
r fu
nctio
na
lity p
er
vo
lum
e
R
ed
uce
s c
ost
!C
om
po
ne
nt
ma
nu
factu
rers
: M
ore
IC
s p
er
fra
me
!O
EM
s:
Re
du
ce
d b
oa
rd s
ize
A
tte
mp
ts t
o lim
it t
he
fo
otp
rin
t o
f lo
we
r I/
O d
evic
es
ha
ve
pre
vio
usly
be
en
sty
mie
d f
or
co
st
rea
so
ns
!B
GA
ma
teria
ls a
nd
pro
ce
ss to
o e
xp
en
siv
e
137
©2
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2010
137
Ad
van
tage
s: M
anufa
ctura
bilit
y
S
ma
ll p
acka
ge
with
ou
t p
lace
me
nt
an
d s
old
er
pri
ntin
g c
on
str
ain
ts o
f fin
e p
itch
le
ad
ed
de
vic
es
!N
o s
pe
cia
l h
an
dlin
g/t
rays to
avo
id b
en
t o
r n
on
pla
na
r p
ins
!E
asie
r to
pla
ce
co
rre
ctly o
n P
CB
pa
ds t
ha
n f
ine
pitch
QF
Ps,
TS
OP
s,
etc
.
!L
arg
er
pa
d g
eo
me
try m
ake
s f
or
sim
ple
r so
lde
r p
aste
prin
tin
g
!L
ess p
ron
e t
o b
rid
gin
g d
efe
cts
wh
en
pro
pe
r p
ad
de
sig
n a
nd
ste
ncil
ap
ert
ure
s a
re u
se
d.
R
ed
uce
d p
op
co
rnin
gm
ois
ture
se
nsitiv
ity issu
es –
sm
alle
r p
acka
ge
138
©2
004 -
2010
138
Ad
van
tage
s: T
her
mal
Per
form
ance
M
ore
dire
ct
the
rma
l p
ath
with
la
rge
r a
rea
!D
ie
Die
Attach
Therm
al P
ad
So
lde
r
Board
Bond P
ad
!Ja
for
the
QF
N is a
bo
ut
ha
lf o
f a
lea
de
d c
ou
nte
rpa
rt (
as p
er
JE
SD
-51
)
!A
llow
s f
or
2X
in
cre
ase
in
po
we
r d
issip
atio
n
139
©2
004 -
2010
139
Ad
van
tage
s: I
nd
uct
ance
A
t h
igh
er
op
era
tin
g f
req
ue
ncie
s,
ind
ucta
nce
of
the
go
ld w
ire
an
d lo
ng
le
ad
-fra
me
tra
ce
s w
ill a
ffe
ct
pe
rfo
rma
nce
In
du
cta
nce
of
QF
N is h
alf its
le
ad
ed
co
un
terp
art
be
ca
use
it
elim
ina
tes g
ullw
ing
lea
ds a
nd
sh
ort
en
s
wir
e le
ng
ths
http://a
p.p
ennn
et.com
/dis
pla
y_art
icle
/1539
55/3
6/A
RT
CL/n
one/n
one/1
/The-b
ack-e
nd-p
rocess:-
Ste
p-9
-QF
N-S
ingu
latio
n/
Po
pu
lar
for
RF
De
sig
ns
140
©2
004 -
2010
140
QF
N: W
hy
No
t?
Q
FN
is a
‘next genera
tion’te
chnolo
gy for
non-c
onsum
er
ele
ctr
onic
OE
Ms d
ue to
concern
s w
ith
!M
an
ufa
ctu
rab
ility
!C
om
pa
tib
ility
with
oth
er
OE
M p
roce
sse
s
!R
elia
bili
ty
A
ccepta
nce o
f th
is p
ackage, especia
lly in
long-life, severe
environm
ent, h
igh-r
el
applic
ations, is
curr
ently lim
ited a
s a
result
141
©2
004 -
2010
141
QF
N M
anufa
ctura
bili
ty: B
on
d P
ads
N
on
So
lde
r M
ask D
efin
ed
Pa
ds P
refe
rre
d (
NS
MD
)
!C
op
pe
r e
tch
pro
ce
ss h
as t
igh
ter
pro
ce
ss c
on
tro
l th
an
so
lde
r m
ask p
roce
ss
!M
ake
s f
or
mo
re c
on
sis
ten
t, s
tro
ng
so
lde
r jo
ints
sin
ce
so
lde
r
bo
nd
s t
o b
oth
to
ps a
nd
sid
es o
f p
ad
s
U
se
so
lde
r m
ask d
efin
ed
pa
ds (
SM
D)
with
ca
re
!C
an
be
use
d t
o a
vo
id b
rid
gin
g b
etw
ee
n p
ad
s,
esp
ecia
lly
be
twe
en
th
erm
al a
nd
sig
na
l p
ad
s.
!P
ads c
an g
row
in s
ize q
uite a
bit b
ased o
n P
CB
mfg
capabili
ties
142
©2
004 -
2010
Bo
nd P
ads
(co
nt.
)
C
an
lo
se
so
lde
r vo
lum
e t
hro
ug
h v
ias
in t
he
rma
l p
ad
s
!O
ffse
t via
fro
m c
en
ter
of
the
pa
d
!M
ay n
ee
d t
o t
en
t, p
lug
, o
r ca
p v
ias
to k
ee
p s
uff
icie
nt
pa
ste
volu
me
!T
enting a
nd p
luggin
g v
ias
is o
ften n
ot
well
contr
olle
d a
nd
ca
n le
ad
to
pla
ce
me
nt
an
d c
he
mic
al e
ntr
ap
me
nt
issu
es
!E
xe
rcis
e c
are
with
de
vic
es p
lace
d o
n o
pp
osin
g s
ide
of Q
FN
!C
an
cre
ate
pla
ce
me
nt
issu
es if
so
lde
r “b
um
ps”
are
cre
ate
d
in v
ias
!C
an
cre
ate
so
lde
r sh
ort
co
nd
itio
ns o
n t
he o
pposin
g d
evic
e
!C
ap
pin
g is a
mo
re r
ob
ust,
mo
re e
xp
en
siv
e p
roce
ss t
ha
t
elim
inate
s t
hese c
oncern
s
143
©2
004 -
2010
143
Bo
nd P
ads
(co
nt.
)
E
xte
nd
bo
nd
pa
d 0
.2 –
0.3
mm
be
yo
nd
pa
cka
ge
fo
otp
rin
t
!M
ay o
r m
ay n
ot sold
er
to c
ut edge
!A
llow
s f
or
be
tte
r vis
ua
l in
sp
ectio
n
R
ea
lly n
ee
d X
-ra
y fo
r b
est re
su
lts
!A
llow
s f
or
ve
rifica
tio
n o
f b
rid
gin
g,
adequate
sold
er
covera
ge a
nd
vo
id p
erc
en
tag
e
!N
ote
: Lackin
g in g
ood c
rite
ria
for
accepta
ble
void
ing
144
©2
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2010
144
Man
ufa
ctura
bili
ty: Ste
nci
l D
esig
n
S
ten
cil
thic
kn
ess a
nd
ap
ert
ure
de
sig
n c
an
be
cru
cia
l fo
r m
an
ufa
ctu
rab
ility
!E
xcessiv
e a
mount
of
paste
can induce
float, lifting the Q
FN
off the b
oard
!E
xce
ssiv
e v
oid
ing
ca
n a
lso
be
in
du
ce
d
thro
ug
h in
ap
pro
pria
te s
ten
cil
de
sig
n
F
ollo
w m
an
ufa
ctu
rer’s g
uid
elin
es
!G
oa
l is
2-3
mils
of so
lde
r th
ickn
ess
R
ule
s o
f th
um
b (
the
rma
l p
ad
)
!R
atio o
f apert
ure
/pad ~
0.5
:1
!C
on
sid
er
mu
ltip
le,
sm
alle
r a
pe
rtu
res
(avoid
larg
e b
ricks o
f sold
er
paste
)
!R
ed
uce
s p
rop
en
sity f
or
so
lde
r b
alli
ng
145
©2
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2010
145
Man
ufa
ctura
bili
ty: R
eflo
w &
Mo
istu
re
Q
FN
so
lde
r jo
ints
are
mo
re s
usce
ptib
le t
o d
ime
nsio
na
l ch
an
ge
s
C
ase
Stu
dy:
Mili
tary
su
pp
lier
exp
eri
en
ce
d s
old
er
se
pa
ratio
n u
nd
er
QF
N
Q
FN
su
pp
lier
ad
mitte
d t
ha
t th
e p
acka
ge
wa
s m
ore
su
sce
ptib
le t
o
mo
istu
re a
bso
rptio
n t
ha
t in
itia
lly e
xp
ecte
d!
Re
su
lte
d in
tra
nsie
nt
sw
elli
ng
du
rin
g r
eflo
w s
old
eri
ng
!In
du
ce
d v
ert
ica
l lif
t, c
au
sin
g s
old
er
se
pa
ratio
n
W
as n
ot
po
pco
rnin
g!
No
evid
en
ce
of
cra
ckin
g o
r d
ela
min
atio
nin
co
mp
on
en
t p
acka
ge
146
©2
004 -
2010
146
Man
ufa
ctura
bili
ty: R
eflo
w P
rofi
le
R
eflo
w r
am
p r
ate
ca
n in
flu
en
ce
vo
id a
nd
cra
ck
form
atio
n
Ca
se
Stu
dy
M
an
ufa
ctu
rer
exp
eri
en
ce
d d
ram
atica
lly d
iffe
rin
g
de
fect
rate
s o
n a
QF
N b
ein
g a
sse
mb
led
in
mu
ltip
le
loca
tio
ns
!D
efe
ctive Q
FN
sshow
ed v
ery
hig
h r
ate
s o
f void
ing.
In
itia
lly,
no
ob
vio
us d
rive
r!
No
co
mp
on
en
t n
or
sig
nific
an
t d
esig
n c
ha
ng
es,
!Id
en
tica
l a
sse
mb
ly p
roce
ss a
nd
PC
B m
an
ufa
ctu
rer
D
iffe
ren
ce
in
ra
mp
ra
tes w
ere
ke
y!
Both
heating a
nd c
oolin
g
147
©2
004 -
2010
Man
ufa
ctura
bilit
y: R
eflo
w P
rofi
le (
con
t.)
S
tro
ng
in
dic
atio
ns o
f vo
idin
g a
nd
cra
ck p
rop
ag
atio
n
M
atc
hin
g c
rack f
ace
s s
ug
ge
st
so
me
de
gre
e o
f b
ritt
le
fra
ctu
re
148
©2
004 -
2010
148
Ref
low
Pro
file
(co
nt.
)
Pre
an
d P
ost
resu
lts o
f O
ven
Pro
file
Ch
an
ge
Pre
Pro
file
Ch
an
ge
Post P
rofile
Change
149
©2
004 -
2010
149
Man
ufa
ctura
bilit
y: Q
FN
Jo
int
Insp
ecti
on
C
oncave fill
et possib
le w
ith b
oth
saw
ed o
r punched Q
FN
!S
hort
sto
rage tim
es, active flu
x
G
reate
r opport
unity w
ith p
unched Q
FN
!M
ore
copper
exposed
Sin
gula
ted
thro
ugh s
aw
ing
Sin
gula
ted
thro
ugh p
unchin
g
150
©2
004 -
2010
150
Man
ufa
ctura
bilit
y: Q
FN
Jo
int
Insp
ecti
on
C
on
ve
x o
r a
bse
nce
of
fille
t h
igh
ly lik
ely
!E
tch
ing
of
lea
dfr
am
eca
n p
reve
nt
pa
d f
rom
re
ach
ing
ed
ge
of
pa
cka
ge
!E
dg
e o
f b
on
d p
ad
is n
ot p
late
d fo
r so
lde
rab
ility
151
©2
004 -
2010
151
QF
N S
ingu
lati
on
Pro
cess
Sin
gula
ted
opera
tion
Title
: R
elia
bili
ty a
sp
ects
of
ele
ctr
onic
de
vic
es f
or
adva
nce
d r
eq
uir
em
en
ts
Au
tho
r(s):
Flo
ria
nS
ch
uß
ler,
Mic
ha
el R
osch
, Jo
ha
nn
es H
orb
er,
Kla
us F
eld
ma
nn
Jo
urn
al: C
ircu
it W
orl
d
Ye
ar:
20
08
, V
olu
me
: 3
4,
Issu
e:
3,
Pa
ge
: 2
3 -
30
152
©2
004 -
2010
152
Man
ufa
ctura
bilit
y: Q
FN
Jo
int
Insp
ecti
on
A
la
rge
co
nve
x f
ille
t is
oft
en
an
in
dic
atio
n o
f is
su
es
!P
oo
r w
ett
ing
un
de
r th
e Q
FN
!T
iltin
g d
ue
to
exce
ssiv
e s
old
er
pa
ste
un
de
r th
e t
he
rma
l p
ad
!E
leva
ted
so
lde
r su
rfa
ce
te
nsio
n,
fro
m in
su
ffic
ien
t so
lde
r p
aste
un
de
r th
e t
he
rma
l p
ad
, p
ulli
ng
th
e p
acka
ge
do
wn
153
©2
004 -
2010
Cas
e Stu
dy
Hig
h r
ate
of in
itia
l fa
ilure
s in
th
e fie
ld
154
©2
004 -
2010C
om
ponent m
anufa
ctu
rer
recom
mended s
tencil
desig
n
155
©2
004 -
2010
Unre
flow
ed
sold
er
paste
156
©2
004 -
2010
157
©2
004 -
2010
158
©2
004 -
2010
158
Man
ufa
ctura
bili
ty: R
ewo
rk
C
an
be
difficu
lt t
o r
ep
lace
a p
acka
ge
an
d g
et
ad
eq
ua
te s
old
eri
ng
of
the
rma
l /
inte
rna
l p
ad
s.
!M
ini-ste
ncils
, p
refo
rms,
or
reb
um
pte
ch
niq
ue
s c
an
be
use
d
to g
et
su
ffic
ien
t so
lde
r vo
lum
e
N
ot
dir
ectly a
cce
ssib
le w
ith
so
lde
rin
g iro
n a
nd
wir
e
!P
ort
ab
le p
reh
ea
ters
use
d in
co
nju
nctio
n w
ith
so
lde
rin
g iro
n
can s
implif
y s
mall
scale
repair p
rocesses
C
lose
pro
xim
ity w
ith
ca
pa
cito
rs o
fte
n r
eq
uir
es
ad
jace
nt
co
mp
on
en
ts t
o b
e r
eso
lde
red
/ re
pla
ce
d a
s
well
159
©2
004 -
2010
159
Man
ufa
ctura
bilit
y: B
oar
d F
lexu
re
A
rea a
rray d
evic
es a
re k
now
n to h
ave b
oard
flexure
lim
itations
!F
or
SA
C a
tta
ch
me
nt,
ma
xim
um
mic
rostr
ain
ca
n
be
as lo
w a
s 5
00
ue
Q
FN
has a
n e
ven low
er
level of com
plia
nce
!L
imite
d q
ua
ntifia
ble
kn
ow
led
ge
in
th
is a
rea
!M
ust
be
co
nse
rva
tive
du
rin
g b
oa
rd b
uild
!M
axim
um
cu
rva
ture
no
t sp
ecifie
d b
y I
PC
-70
93
,
no
t ca
lled
ou
t b
y m
ost
co
mp
on
en
t m
an
ufa
ctu
rers
160
©2
004 -
2010
160
Rel
iab
ility
: T
her
mal
Cyc
ling
O
rder
of m
agnitude r
eduction in tim
e to
failu
re fro
m Q
FP
!3X
reduction fro
m B
GA
D
rive
n b
y d
ie /
pa
cka
ge
ra
tio
!4
0%
die
; tf
= 8
K c
ycle
s (
-40
/ 1
25
C)
!75%
die
; tf
= 8
00 c
ycle
s (
-40 / 1
25C
)
D
rive
n b
y s
ize
an
d I
/O#
!44 I/O
; tf
= 1
500 c
ycle
s (
-40 / 1
25C
)
!56 I/O
; tf
= 1
000 c
ycle
s (
-40 / 1
25C
)
V
ery
de
pe
nd
en
t u
po
n s
old
er
bo
nd
with
therm
al pad
BG
A: 3,0
00 to 8
,000
QF
N: 1,0
00 to 3
,000
QF
P: >
10,0
00
161
©2
004 -
2010
161
Indust
ry R
esp
on
se t
o T
her
mal
Cyc
ling
JE
DE
C
!S
pecific
ation b
ody for
com
ponent m
anufa
ctu
rers
JE
DE
C J
ES
D4
7
!G
uid
elin
es for
new
com
ponent qualif
ication
!R
equires 2
300
cycle
s o
f 0 to 1
00C
!T
esting is o
ften d
one o
n thin
board
s
IP
C
!S
pecific
ation b
ody for
ele
ctr
onic
OE
Ms
IP
C 9
701
!R
eco
mm
en
ds 6
00
0cycle
s o
f 0 to 1
00C
!T
est board
s s
hould
be s
imila
r th
ickness a
s
actu
al desig
n
162
©2
004 -
2010
162
BIG
PR
OB
LE
M
JE
DE
C r
equirem
ents
are
60%
less than IP
C
an
dte
sting o
n a
thin
board
can e
xte
nd
lifetim
es b
y 2
X –
4X
W
hat does this
mean?
!T
he
co
mp
on
en
ts y
ou
bu
y m
ay o
nly
su
rviv
e
50
0 c
ycle
s o
f 0
to
10
0C
W
hat m
ust you d
o?
!C
om
po
ne
nts
at
risk m
ust
be
su
bje
cte
d t
o r
elia
bili
ty
an
aly
sis
163
©2
004 -
2010
163
Th
erm
al C
yclin
g: C
on
form
al C
oat
ing
C
are
mu
st
be
ta
ke
n w
he
n u
sin
g c
on
form
al co
atin
g o
ve
r Q
FN
!C
oating c
an infiltra
te u
nder
the Q
FN
!S
mall
sta
ndoff h
eig
ht
allo
ws c
oating t
o c
ause lift
H
am
ilto
n S
un
dstr
an
d f
ou
nd
a s
ign
ific
an
t re
du
ctio
n in
tim
e t
o
failu
re (
-55
/ 1
25
C)
!U
ncoate
d:
2000 t
o 2
500 c
ycle
s
!C
oate
d: 300 to 7
00 c
ycle
s
A
lso d
riven b
y s
old
er
join
t
sensitiv
ity to tensile
str
esses
!D
am
ag
e e
vo
lutio
n is f
ar
hig
her
than for
shear
str
esses
Wri
gh
tson, S
MT
A P
an
Pac 2
007
164
©2
004 -
2010
QF
N a
nd T
her
mal
Cyc
ling
B
ottom
Lin
e: Q
FN
sare
very
sensitiv
e
!T
ran
sla
tio
n:
QF
Ns
ca
n b
e a
s r
elia
ble
as B
GA
s,
bu
t sp
ecia
l co
nsid
era
tio
n is r
eq
uir
ed
!P
acka
ge
ma
teri
al p
rop
ert
ies,
so
lde
r jo
int
he
igh
t,
asse
mb
ly m
ate
ria
ls
T
ime to failu
re d
uring 0
to 1
00C
can r
ange
from
<200 c
ycle
s to >
5000 c
ycle
s
165
©2
004 -
2010
QF
N P
ackag
e M
ater
ial P
rop
erti
es
S
om
e h
i-re
lO
EM
s a
re c
hara
cte
rizin
g
packages b
efo
re p
lacem
ent on b
oard
C
om
paring c
oeffic
ient of th
erm
al expansio
n
(CT
E)
of
QF
N t
o b
oa
rd C
TE
166
©2
004 -
2010
QF
N S
old
er J
oin
t H
eigh
t
S
om
e D
fR c
usto
mers
do s
old
er
mask d
efined
therm
al pads
E
nsure
s m
inim
um
sold
er
join
t heig
ht equal to
sold
er
mask thic
kness
!T
yp
ica
lly 1
to
2 m
il
!N
ot
alw
ays a
we
ll co
ntr
olle
d p
roce
ss
167
©2
004 -
2010
QF
N A
ssem
bly
Mat
eria
ls
Q
FN
scan s
how
incom
patibili
ty to s
tandard
coating a
nd p
ottin
g m
ate
rials
S
om
e O
EM
s h
ave b
een forc
ed to c
hange
assem
bly
mate
rials
or
dam
aro
und the Q
FN
168
©2
004 -
2010
168
Rel
iab
ility
: B
end
Cyc
ling
L
ow
de
gre
e o
f co
mp
lian
ce
an
d la
rge
fo
otp
rin
t ca
n
als
o r
esu
lt in
issu
es d
uri
ng
cyclic
fle
xu
re e
ve
nts
E
xa
mp
le:
IR t
este
d a
5 x
6m
m Q
FN
to
JE
DE
C J
ES
D2
2-B
11
3
!V
ery
lo
w b
eta
(~
1)
!S
ug
ge
sts
britt
le f
ractu
re,
po
ssib
le a
lon
g t
he
in
terf
ace
169
©2
004 -
2010
169
Rel
iab
ility
: D
endri
tic
Gro
wth
L
arg
e a
rea
, m
ulti-
I/O
an
d lo
w s
tan
do
ff c
an
tra
p f
lux
un
de
r th
e Q
FN
P
roce
sse
s u
sin
g n
o-c
lea
n f
lux s
ho
uld
be
re
qu
alif
ied
!P
art
icu
lar
co
nfig
ura
tio
n c
ou
ld r
esu
lt in
we
ak o
rga
nic
acid
co
nce
ntr
atio
ns a
bo
ve
ma
xim
um
(1
50
–20
0 u
g/in
2)
T
ho
se
pro
ce
sse
s n
ot
usin
g n
o-c
lea
n f
lux w
ill lik
ely
exp
eri
en
ce
de
nd
ritic
gro
wth
with
ou
t m
od
ific
atio
n o
f
cle
an
ing
pro
ce
ss
!C
ha
ng
es in
wa
ter
tem
pe
ratu
re
!C
ha
ng
es in
sa
po
nifie
r
!C
ha
ng
es t
o im
pin
ge
me
nt
jets
170
©2
004 -
2010
170
Den
dri
tic
Gro
wth
(co
nt.
)
T
he e
lectr
ic fie
ld s
trength
betw
een a
dja
cent conducto
rs is a
str
ong d
river
for
dendritic
gro
wth
!V
oltage / d
ista
nce
D
igital te
chnolo
gy typic
ally
has a
maxim
um
fie
ld s
trength
of
0.5
V/m
il
!T
SS
OP
80
with
3.3
VD
C p
ow
er
an
d 1
6 m
il p
itch
P
revio
us g
enera
tion a
nalo
g / p
ow
er
technolo
gy h
ad a
maxim
um
field
str
ength
of 1.6
V/m
il
!S
OT
23
with
50
VD
C p
ow
er
an
d 5
0 m
il p
itch
In
troduction o
f Q
FN
has r
esulted in
ele
ctr
ic fie
lds a
s h
igh a
s
3.5
V/m
il
!2
4V
DC
an
d 1
6 m
il p
itch
171
©2
004 -
2010
171
Den
dri
tic
Gro
wth
(co
nt.
)
S
om
e c
om
po
ne
nt
ma
nu
factu
rers
are
aw
are
of
this
is
su
e a
nd
se
pa
rate
po
we
r a
nd
gro
un
d!
Lin
ea
r T
ech
no
log
ies (
left
) h
as s
tro
ng
se
pa
ratio
n p
ow
er
an
d
gro
un
d
!In
ters
il(r
igh
t) h
as p
ow
er
an
d g
rou
nd
on
ad
jace
nt
pin
s
172
©2
004 -
2010
172
QF
N: R
isk M
itig
atio
n
A
sse
ss m
an
ufa
ctu
rab
ility
!D
eg
ree
of
reflo
w p
rofilin
g
!C
on
tro
l o
f b
oa
rd f
lexu
re
!D
OE
on
ste
ncil
de
sig
n
!D
ual ro
w Q
FN
is e
specia
lly d
ifficult
A
sse
ss r
elia
bili
ty
!O
wn
ers
hip
of
2n
dle
ve
l in
terc
on
ne
ct
is o
ften lackin
g
!E
xtr
ap
ola
te t
o n
ee
de
d f
ield
re
liab
ility
!S
om
e c
om
pa
nie
s h
ave
re
ba
lled
QF
N
to d
ea
l w
ith
co
nce
rns
