Compliant RELIABLE Stable microstructure High yield …extra.ivf.se/eqs/dokument/Candor.pdf · New...

1

Thomas Kolossa / Balver ZinnHead of Techn. Department / Sales Manager EuropeCertified IPC-A-610 Trainer (CIT)[email protected]

Josef Jost / Balver ZinnManaging Director

[email protected]

Make the case that SN100C has a suite of properties that make it

The Ideal Pb-Free Solder !!• Compliant • Stable microstructure

RELIABLE

• High yield in optimised processes

• Cost effective

The alloy that revolutionized Pb-free solder formulation

2

• Balver Zinn Group

• Influence of micro alloying additions on metallurgical properties of lead free alloys

– Base– Micro alloying additions

• Germanium• Nickel

Agenda

3

1973 Josef Jost Zinn und Metallgroßhandel founded

1976 Building Productionhall and office in Balve

1977/84 Building magazin in Balve

1983 Balver Zinn KG Josef Jost

1986/87 Building Productionhall and office Zinc in Garbeck

1990/91 Ba-Ti-Loy wire manufacturing in Garbeck

1991 QS- certificate acc. DIN 9001 / 9002

1992/93 Zinc wire manufacturing in Garbeck

1994/96 Building magazin in Garbeck

2000 Certification DIN 14001

2002 Cooperation with Nihon Superior, Japan

2003 Wireproduction in Malaysia

1999 Balver Zinn Josef Jost GmbH&Co KG

2007 Merge of Balver Zinn / Cobar

Balver Zinn History

4

1983 Cobar BV founded

1987 No-clean fluxes

1989 Siemens, Ericson, Nokia qualifications

1990 Set Synthetic flux trend

1992 No-clean solderpaste

1994 VOC-free trend, Introduce Low-VOC trend, ISO-9001

1997 ISO-14001, Paste master, Only VOC free supplier Delphi

2001 Pb-free solderpaste

2003 Founding CSP (Cobar Soldering Products)

2005 ISO-TS-16949

2007 Automation paste production

2004 Automation flux production

2007 Merge of Balver Zinn / Cobar

Cobar History

5

2007 Merging of Cobar in BalverZinn group, 1 company – 2 brands

2008 SN100C-XF3, Restructure distributor network

2009 SN100CS / i –SAC / 396-DRX

Network of global license partners offers optimum support all over the world

Cobar History

6

Blintroper Weg 11

Auf dem Werenfelde 10-12

Aluminiumstraat 2

Balver Zinn_Cobar

7

Jost Zinc FounderCapacity: 2700to./Month(Single Mould Casting)

3350to./Month(Wire, Continius Casting)Alloy: Zn, ZnAl; ZnTi, ZnMn, etc.Market: Automotive , Surface Treatment, Targets, etc.

Balver Zinn Josef Jost (Recycling)Capacity: 950to./Month (Single-Continius Casting)Alloy: Sn; SnPb; SAC; SN100C; etc.Market: Automotive; Medicin; Consumer;etc.

BaTiLoyCapacity: 450to./Month(Wire; Anodes)Alloy: Sn; SnPb; SAC; SN100C; etc.Market: Automotive; Medicin; Consumer etc.

CobarCapacity: 10.000l / Day (Flux)

900kg / Day (Paste)Alloy: SnPb; SAC; SN100C; etc.Market: Automotive; Medicin; Consumer; etc.

Balver Zinn_Cobar

8

KEY

Regional Headoffice

+ Production site

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+

∇

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+

+

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••

••

•

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•

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•••

•

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••

EuropeAustria • IVSBelgium ⊗ CobarBulgaria • KasiCzech Republic • PBTDenmark • Candor KemiskeEstonia • Candor OyFinland • Candor OyFrance • Dilectro • ArnaudGermany • Balver ZinnGreece • AsteriadisHungary • ATT HungaryIreland • DKLItaly • Tecnolab • CabelpiuLithuania/Latvia • Erbsloeh BalticNetherlands ⊗ CobarNorway • Candor ABPoland • C.H. ErbsloehRomania • ATT Hungary • LTHD Slovenia • ATT • AmtestSpain • Solder. Techn. • IndutecSweden • Candor ABUnited Kingdom • DKL

•

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∇

+

+

Headoffice

Distributor/Partner•

⊗∇

AsiaChina - • WKKHong Kong • WKKIndia • ProsemtechIndonesia • ChallengerJapan ⊗ CobarMalaysia •+ ChallengerPhilippines • WKKRussia • DialElectroluxHong Kong ∇ CobarTaiwan •+ Eugene •WKKThailand •Korea • ChangwonVietnam • WKK

Africa & Middle EastIsrael • LantekTurkey • SelasSouth Africa • PEM TechnologiesNorth Africa • Hartech

Australia & New Zealand• Coltronics

Latin AmericaBrazil •+ Soft Metais

••

••

•• •

•North AmericaCanada

USA ∇ CSP• Captec• PMR Representatives• Torenko & Associates• SRS & Associates• Simlar Associates• Surface Mount solutions• Luff Tool• WJB Sales• Simlar Associates

Mexico •

A very distinguished and very well trained network of distributors / representatives and partnersRemote manufacturing sites ensures quick deliveries as well as safety back up in case of complete shutdown

Current Partner Network

9

Production World Wide

10

• Productfamily SN100C™ (SnCu0,7Ni0,05Ge0,005)EU985486 / JP3152945 / US6180055

• SN100CS / SN100CeS (SnCu0,7NiGe0,01)• SN100CLS / SN100CLe+S (SnCu0,7NiGe0,01)

• Productfamily ii--SACSAC (SnAgCu) (SnAgCu) Iowa US6231691B1

• i-SAC105 (SnAg1,0Cu0,5Co0,0045Ge0,0045)• i-SAC205 (SnAg2,0Cu0,5Co0,0045Ge0,0045)• i-SAC305 (SnAg3,0Cu0,5Co0,0045Ge0,0045)• i-SAC387 (SnAg3,8Cu0,7Co0,0045Ge0,0045)

• Productfamily SCAN-Ge (SnAgCuNiGe) DE19816671C2 / US 6179935B1 / JP3296289

• SCAN-Ge (SnAg0-4Cu0-2Ni0,05Ge0,01)

Balver Zinn News

11

- BaseTin (Sn):

Copper (Cu):

Silver (Ag):

Derivates:

SnCu - Eutectic: MP 227 °C

SnAg - Eutectic: MP 221°C

SnAgCu - Eutectic: MP 217 °C

Non-Eutectic-Solders

- Micro alloying additionsGermanium

Nickel

Base and Micro alloying additions

12

The success of SN100C has prompted Nihon Superior’s competitors to respond with SAC305 alternatives. Based on the same model of Sn-0.7Cu+X+Y

Senju responded with Sn-0.7Cu+0.3Ag+P and then Sn-0.7Cu+Ni+P

Cookson responded with an alloy based on old patent for a lead-free plumbing solder Sn-0.7Cu+0.3Ag+0.1Bi+Rare Earth Elements+P (SACX0307)

Then with SACX0307 Plus (+Ni), SACX0807 Plus

Kester responded with K100 (Sn-0.7Cu+Ni+P?)

Then K100LD (Sn-0.7Cu+Ni+Bi+P)

Fuji Electric got a patent for Sn-Ag-Cu+Ni+Ge

Licensee Felder markets as Sn100Ni+

MRI came up with Sn-Cu+Co

Licensee Qualitek markets Sn-Cu+Co as SN100e

Why bother with these when SN100C

is readily available around the world

History of Pb free Solder Devlopment

13

The Ge acts as an antioxidant and surface active agent

13

15 minute Ramp to 340°C

30 minute cool

Sn-0.7Cu-0.05Ni Sn-0.7Cu-0.05Ni+Ge

K Watling, A Chandler, K Nogita. A Dahle, University of Queensland, Submitted for publication

SnCuNi SnCuNi+Ge

- Oxidation Resistance

SN100C

The Germanium-Effect

14

Cu6Sn5 Ni3Sn2

Lattice Constants

a 0.4125nm 0.4190nm 1.6% difference

c 0.5198nm 0.5086nm 2.2% difference

Melting Point 415°C 1246°C

Copper and Nickel form Intermetallics with Copper with similar Close Packed Hexagonal Crystal Structures

Almost the same crystal dimensions

The Nickel-Effect

15

20μm Ni

No Ni

• Ni selectively incorporates in Cu6Sn5

• No Ni in the tin matrix

The Nickel-Effect

(Cu,Ni)6Sn5

16

Tin-Copper Phase DiagramPhase transformation from hexagonal Cu6Sn5 to monoclinic Cu6Sn5’with volume change

Nickel stabilizes the hexagonal close packed form of the Cu6Sn5ensuring the integrity of the intermetallic layer

- Microstructural StabilityThe Nickel-Effect

17

• Transformation from hexagonal to monoclinic at 186°C • 2.15% volume increase• Fewer deformation modes available

The Nickel-Effect

Hexagonal Monoclinic

- Microstructural Stability

18

The Nickel-Effect

η’- η Cu6Sn5, Heated/cooled at 1 °C/min*

η-hexagonal stabilised (Cu,Ni)6Sn5, Heated/cooled at 1°C/min**

*Fig4 (b) from G. Ghosh and M. Asta: Journal of Materials Research, 20(2005) 3102-3117.** (Cu,Ni)6Sn5 taken from Sn0.7Cu0.05Ni alloy, DSC by Nihon Superior Co. Ltd.


19

The Nickel-Effect

500 μm


20

~9% Ni

Electron Diffraction Pattern

Electron Diffraction Pattern

Transmission Electron Micrograph

Transmission Electron Micrograph

- Microstructural StabilityThe Nickel-Effect

21 21

The Nickel-Effect

Sn0.7Cu0.05Ni

~ 3 at% Ni in (Cu,Ni)6Sn5

(Cu,Ni)6Sn5

Sn0.7Cu

Cu6Sn5

Cu6Sn5Cu6Sn5

Cu6Sn5

SnAg3Cu0,5


22

Measure total crack length

The Nickel-Effect- Microstructural Stability

23

0

0.1

0.2

0.3

0.4

0.5

Sn07Cu Sn3Ag07Cu Sn07Cu005Ni

BGA Alloys

(No.

or L

engt

h of

Cra

cks)

/(IM

C L

engt

h)

Normalised Crack NumbersNormalised Crack Length

The Nickel-Effect- Microstructural Stability

24

Slower Growth of Ni-stablized (Cu,Ni)6Sn5

The Nickel-Effect- IMC Morphology

25

Periodical triangle pattern model

x

y

h0

More Uniform Morphology of Ni-stablized (Cu,Ni)6Sn5

The Nickel-Effect- IMC Morphology

Mor

phol

ogy,

(y/x

)

26

IMC Growth on OSP Finish

0

1

2

3

4

SnPb SnAgCu SnCu SnCuNi

Solder Alloy

Inte

rmet

allic

Thi

ckne

ss

(mic

rons

)

Initial IMC Thickness IMC Thickness After Thermal Cycling

SN100C

- Intermetallic Growth

(-40C - +125C 4000 cycles)

The Nickel-Effect

27

The Nickel-Effect- Intermetallic Growth

28

Nominal Cu Loss of Extended Contact with SAC305 and Sn-Cu-Ni

0

10

20

30

40

50

60

1.5 fpm 3.0 fpm 4.5 fpm

Conveyor Speed

% C

u Lo

ss SAC305

Sn-Cu-Ni

Effect of Contact Time on Lead-Free Wave SolderJim Morris & Richard Szyanowski

Speedline Technologies APEX 2008

- Copper Erosion Rate

The stabilized (Cu,Ni)6Sn5 dissolves in solder more slowly

The Nickel-Effect

29

L

Measure LengthApply Vacuum

Molten Solder

The Ragone Test

- Fluidity

The Nickel-Effect

30

Stable Effect

Unstable Effect

Fluidity Length

- Fluidity

The Nickel-Effect

Sn-0,7Cu-Ni

31

The Ni-modified Sn-0.7Cu almost matches 63/37

1.1% difference

- Fluidity

The Nickel-Effect

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Oxygen Free Copper Ring

�Flux: JIS Standard Flux A�B��Melting Temp.: 255 °C��Immersion Depth: 6mm��Immersion Speed: 4mm�s��Immersion Time: 20 s��Withdrawal Speed: 2mm�s

20mm

2.0 mm Ø

Solder Bath

- “Drainage”

The Nickel-Effect

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Before Dipping

After Dipping

Icicle Length

- “Drainage”

The Nickel-Effect

34

0200400600800

1000

Sn-0.7Cu

Sn-0.7Cu-0.06Ni

Sn-0.7Cu-0.06Ni+Ge

Icic

le L

eng

th (

mic

ron

s)65%

reduction

39% reduction

SN100C®

- “Drainage”

The Nickel-Effect

35

0200400600800

100012001400

Sn-3.0Ag-0.5Cu

Sn-0.7Cu-0.3Ag

Sn-0.7Cu+Ag+Bi

Sn-0.7Cu

Sn-0.7Cu-0.06Ni

Sn-0.7Cu-0.06Ni+Ge

Icic

le L

engt

h (m

icro

ns)

85% Reduction

SN100C®

- “Drainage”

The Nickel-Effect

36

Processparameter

37

Alloy System

Melting Point

°C

Typical Process Temperatures (°C)Wire Wave ReflowTip

TemperatureSolder

TemperaturePeak

TemperatureSN100C 227 330-380 255-265 240-250

Sn-Ag-Cu 217 330-380 255-265 230-255Sn-Pb 183 330-380 245-260 205-220

A higher melting point does not necessarily mean a higher process temperature

Processparameter

38

Competitor claim “Slow to Wet”

Processparameter

39

Keys are:• Flux with activity that can survive thermal profile • Contact time in wave long enough to heat all of joint to wetting

temperatureOther process factors:• Good flux penetration of through hole• Sometime better to have lower preheat to ensure flux in through

hole is in good condition when solder wave contacts joint• Use single wide wave of improved design

Design points; • Termination not too tight in hole• Use thermal relief on ground planes• Specify solderable PCB finish (Lead-free HASL- SN100CL)• Specify solderable component termination finish (Sn)

Achieving Barrel FillProcessparameter

40

Regular Dual Wave

Extended Contact with flow designed to maximize heat transfer

Dual Wave

The issue in achieving hole fill is HEAT TRANSFER

Higher temperature solder is one factor

Machine design can have a more powerful effect

Processparameter

41

Optimizing Wave Soldering Thermal Profile

Processparameter

42

Conventional Wave Soldering Nozzle system

Nozzle designed for high efficiency and maximum heat transfer

Processparameter

43

Processparameter

44

• SN100C is a low flow stress/high ductility “compliant”alloy and in that regard is similar to Sn-37Pb

• Performance in service tends to follow the Jean-Paul Clech strain energy model

44

Lead-Free and Mixed Assembly Solder Joint Reliability Trends- J-P Clech IPC Printed Circuits Expo SMEMA Council APEX Designer Summit O4

Hard solder gives better service than complaint

solder

Compliant solder gives better

service than hard solder

Reliability

45

SnPb

SnAgCu

SnAg

SnCu

Mechanical properties of Sn-Cu similar to those of Sn-Pb

Reliability

46

What a competitor says

• In complex assemblies with many components with different CTE compliance, an ability to accommodate strain at low stress without early embrittlement, is a good property for the solder used to join them.

• SnPb solder is compliant.

• SAC alloys suffer softening as the pre-precipitation Ag3Sn phase that gives the alloys their higher yield stress releases from the tin matrix.

Reliability

47

Sn-3.8Ag-0.7Cu / HAL-SnCuNi / FR4 / CMC1206: 3000 Cycles -40-+125°C

Sometimes a solder can be too strong!

Reliability

48

Reliability

49

Ageing of SAC Alloys

Creep Strain Rate

Reliability

50


Creep Strain Rate

Reliability

51


Creep Strain Rate

Reliability

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Creep Strain Rate

Reliability

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Creep Strain Rate

Reliability

54

SN100C typically matches the reliability of SAC alloys

54

N63% = 903 cycles for SN100CN63% = 908 cycles for SAC405N63% = 794 cycles for SnPb

Paresh Limaye, Konstantza Lambrinou, Bart VandeveldeThermal Cycling for 0°C to 100°C cycling. Results for SnCuNiGe, SAC405 and SnPb IMEC, 30th June 2006

Thermal Cycling 0-100°C 8x8 CSP

SnPbSN100C

SAC405

Reliability

55

• Components– Leaded -- 44 Pin Thin Scale Outline Package (TSOP)

– Leadless -- 2512 Thin Film Chip Resistor– Solder Ball -- 96 Pin Chip Scale Package (CSP)

• Test Methods– Vibration to 30G– Thermal cycling -40 – 125°C

55

DfR Solutions Testing

Alloys Tested: SN100C, SAC305 SnPb

Reliability

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• Vibration Testing- 30G-Resistor

SAC305SN100C

SnPb

DfR ResultsReliability

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• Vibration Testing - 30G-CSP

57

SAC305

SN100C SnPb


58

• Vibration-30G-TSOP

58

SAC305

SN100C

SnPb


59

• Thermal cycling – 40-125°C-Resistor

59

SAC305

SN100C

SnPb


60

• Thermal cycling- -40 – 125°C-TSOP

60

SAC305

SN100C

SnPb


61 61

SAC305

SN100C

SnPb

Thermal cycling -40 – 125°C-CSP


62

BFE Consortium Testing

-40 – 125°C

Reliability

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DAGE 4000HS High Speed Impact Tester

Deformation SpeedsShear: 10-4000mm/secTension: 1 - 400mm/sec

Impact Strength

Dropped from a height of

200mm = 2000mm/sec

Reliability

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In Shear

Test piece moves

Fixed shear tool with force measurement sensor

10 4000mm/sec

Impact Strength Reliability

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Schematic of Impact Test Method for BGA

Sensor in impact head measures force “F”

Measure head displacement “s”

50μm

In Very Slow

Motion


66


67

(c)

Type III

Type II

Type I

10mm/s

100mm/s

4000mm/s

Impa

ct s

hear

forc

e (N

)

0

5

10

15

0 200 400 600 800

Type III (10mm/s) Type II (100mm/s)

Type I (4000mm/s)

Displacement (μm)

Type I Type II Type III

Deformation energy beforethe maximum force

Deformation energy after the maximum force (Energy released by crack

Brittle fracture


68

Type I Fracture

Reliability

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Type III Fracture

Reliability

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Sn-CuE

nerg

y (m

J)

Displacement rate (mm/sec)

Maxim

um force (N

)

SN100C


Ene

rgy

(mJ)

Maxim

um force (N

)

Type III

Type II

Sn-Pb

Ene

rgy

(mJ)


Maxim

um force (N

)

Sn-Ag-Cu


Ene

rgy

(mJ)

Maxim

um force (N

)

Type III

Type II

Type I

Type III

Type III

Type IIType IIType IIType II Type I

Type I

Type II

Type I

Effect of Displacement Rates (2 x Reflow)

Type III

Reliability

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Sn-Cu

Sn-Pb

SN100C

Sn-Ag-Cu

Ene

rgy

(mJ)

Maxim

um force (N

)

Ene

rgy

(mJ)

Maxim

um force (N

)

Ene

rgy

(mJ)

Maxim

um force (N

)

Ene

rgy

(mJ)

Maxim

um force (N

)

Type II

Type II Type II

Type IType I Type II Type II

Type II

Type IType I

Type II Type II Type II

Type II Type IIType I

Type I

Type I

Type I

Type I

Effect of heat treatments, High speed shear (4000mm/sec)

Reliability

72

SN100C maintains toughness to cryogenic temperatures

72

0

10

20

30

40

50

60

70

-200 -180 -160 -140 -120 -100 -80 -60 -40 -20 0 20 40 60 80 100

Temperature, oC

Frac

ture

toug

hnes

s, J

/cm

2Sn-5%AgSn-4%Ag-0.5%CuSn-3%Ag-0.5%CuSn-37%PbSn-0.7%Cu(Ni)99.99%SnSn-0.7%Cu

Reference: Ratchev et al.,(IMEC) A Study of Brittle to Ductile Transition Temperatures in Bulk Pb-Free Solders, EMPC 2005 (IMAPs-Europe), June 12-15, Brugge, Belgium.

SAC305

SN100C

Low Temperature Impact Strength

Reliability

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Thermo-Electromigration

High Density Packaging User Group (HDPUG) Project.

Reliability

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Thermo-ElectromigrationReliability

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JESD22A121 –“Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes”

Copper wire hot dip coated with the tested alloy was bent into U shape and tested according to:

• -40/+85°C 10 Inspect at 500 and 1000cycles No Whiskers!

No Whiskers!

Some 50μm whiskers in area of compressive stress on bend

~12mm

~25mm

Coating in Compression

Whiskers grow when there is compressive stress and conditions that

t

SN100C

• 60°C/87% RH Inspect at 1000, 2000, 3000 hours

• 30°C/60% RH Inspect at 1000, 2000, 3000 hours

Whisker SusceptibilityReliability

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After an initial period of growth whiskers on SN100C do not grow further

Whiskers on SAC305 continue to grow…

… probably driven by ongoing corrosion

Whisker Length as a Function of Hours at 60C/87%RH

0

50

100150

200

1000 2000 3000

Hours

Whi

sker

Len

gth

(mic

rons

)

SN100CSAC305SnPb

Reliability

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Corrosion Resistance

After Exposure to a Marine EnvironmentSN100C SAC305

Silver increases susceptibility to corrosion

Reliability

78

Reliability

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• SN100C is a proven Pb-free solder with which can deliver high yield high reliability soldering for most printed circuit board assemblies on standard soldering equipment at peak assembly temperatures that do not compromised board and component integrity

• Successful soldering of thermally challenging assemblies can be achieved with equipment that has been designed to maximise heat transfer to achieve wetting temperature quickly without excessive overshoot.

Summary

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Thank you for your Attention!

Compliant RELIABLE Stable microstructure High yield …extra.ivf.se/eqs/dokument/Candor.pdf · New...

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