Probe card preparation
description
Transcript of Probe card preparation
![Page 1: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/1.jpg)
Probe card preparation
Y. Kwon(Yonsei Univ.)
for EQENG, Notice, & Yonsei
![Page 2: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/2.jpg)
Contents• PIN layout & pad definition from
CERN• Probe pin layout plan• Schematics for probe card circuit• Transparent chuck under considera-
tion
![Page 3: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/3.jpg)
PAD layoutTotal 103 pads to make contact
![Page 4: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/4.jpg)
PAD sizeWe want dual pin contact for each pad.
![Page 5: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/5.jpg)
Needle layout
Invisible
Chip
![Page 6: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/6.jpg)
Specification
1. 103 x 2 = 206 pins.
3. 8 LEDs to check probe card position by eye.4. Contact status check at every 10 ms.
5. Contact status report by ethernet.
0. Dual pins for each pad Pin A for external connection (power/ground/IO), Pin B to check pin contact with the pad
2. 14 + 3 relays as switches when we decouple pin A and pin B
![Page 7: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/7.jpg)
Algorithm to check contact
1. Disconnect power/input using relay.2. Send 1.8(V) logic pulse to each digital input pad via
pin A and read pin B.
If no pair read back, raise chuck via .If any pair reads back, 3. Start careful adjustment ’. 4. Send 1.8(V) sequential logic pulse to other digital input
pad via pin A and read pin B.
5. Raise ’ up until all input pad pairs read back.6. Send 1.8(V) sequential logic pulse to digital input pads
via pin A and read pin B. (We will skip step 6 if we worry damage by electrical shock).
![Page 8: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/8.jpg)
7. Raise ’ up until all input pad pairs read back.8. FPGA pull down for power pin B, FPGA pull up for ground pin B. 9. Disconnect FPGA output for pin A.10. Connect power.11. Check FPGA pin status12. Raise ’ up until all pin B status is OK.13. Disconnect pin B for analog input.
Use LED to display current status properly.
FPGA flexibility enables variation of algorithm.
![Page 9: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/9.jpg)
Pin A
Pin B
Input
![Page 10: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/10.jpg)
Pin A Pin B
Output
![Page 11: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/11.jpg)
Pin B’s
Power
![Page 12: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/12.jpg)
Pin B’s
Ground
![Page 13: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/13.jpg)
Transparent chuck?
![Page 14: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/14.jpg)
Chucks in preparation
Optimum number of vacuum holes to be decided.
![Page 15: Probe card preparation](https://reader036.fdocuments.in/reader036/viewer/2022062305/568161a6550346895dd1631d/html5/thumbnails/15.jpg)
Summary• Probe pin layout investigated.• Probe card schematics ready.• Transparent chuck in preparation.