PRO MATE II Device Support - Farnell element14 · PRO MATE® II DEVICE SUPORT 1999 Microchip...

PRO MATE® II DEVICE SUPORT

Information contained in this publication regarding device applications and the like is intended by way of suggestiononly. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated withrespect to the accuracy or use of such information. Use of Microchip’s products as critical components in life supportsystems is not authorized except with express written approval by Microchip.

1999 Microchip Technology Incorporated. All rights reserved.

The Microchip logo and name, PIC, PICmicro, PICMASTER, PRO MATE, and KEELEOQ are registered rademarks ofMicrochip Technology Incorporated in the U.S.A. and other countries. MPLAB, and Smart Serial are trademarks of Microchip Technology in the U.S.A. and other countries.

All product/company trademarks mentioned herein are the property of their respective companies.

1999 Microchip Technology Inc. DS30243H

PRO MATE® II Device Support

DS30243H 1999 Microchip Technology Inc.

PRO MATE® II DEVICE SUPPORT

Table of Contents

General InformationIntroduction .......................................................................................... 1

Highlights ............................................................................................. 1

About This Guide ................................................................................. 1

Recommended Reading ...................................................................... 3

The Microchip Internet Web Site .......................................................... 4

Development Systems Customer Notification Service ......................... 5

Customer Support ................................................................................ 7

Chapter 1. Socket Modules1.1 Introduction ................................................................................ 9

1.2 Highlights ................................................................................... 9

1.3 Currently Supported Devices and Socket Modules ................... 9

1.4 Socket Life Expectancy and Cleaning Procedures .................. 13

Chapter 2. Programming Devices with Calibration

2.1 Introduction .............................................................................. 15

2.2 Highlights ................................................................................. 15

2.3 Programmer Dialogs ................................................................ 16

2.4 Calibration Windows ................................................................ 17

Chapter 3. Programming KEELOQ® Devices3.1 Introduction .............................................................................. 19

3.2 Highlights ................................................................................. 19

3.3 Programming Overview ........................................................... 19

3.4 Key Generation ........................................................................ 21

3.5 Manufacturer’s Code ............................................................... 22

3.6 HCS200 Options ...................................................................... 24

3.7 HCS201 Options ...................................................................... 25

3.8 HCS300/301/320 Options ........................................................ 26

1999 Microchip Technology Inc. DS30243G1-page iii


3.9 HCS360 Options ......................................................................28

3.10 HCS361 Options ......................................................................30

3.11 HCS410 Options ......................................................................32

3.12 HCS412 Options ......................................................................35

3.13 HCS512 Options ......................................................................38

Chapter 4. Programming Memory Devices4.1 Introduction ..............................................................................39

4.2 Highlights .................................................................................39

4.3 Programming Overview – Memory Devices .............................39

Index.......................................................................................................... 41

Worldwide Sales and Service.................................................................. 44

DS30243G1-page iv 1999 Microchip Technology Inc.

®
PRO MATE II DEVICE SUPPORT
General Information

IntroductionThis chapter contains general information that will be useful to know before using this document.

HighlightsThe information you will garner from this chapter:

• About this Guide

• Recommended Reading

• The Microchip Internet Website

• Development Systems Customer Notification Service

• Customer Support

About This Guide

Document LayoutThis document describes how to use PRO MATE II as a development tool to program firmware to a target device. The manual layout is as follows:

• Chapter 1: Socket Modules – Lists the part numbers for the socket modules that support each device and discusses the life expectancy and cleaning procedures for the different socket types.

• Chapter 2: Programming Devices with Calibration – How to program PIC12CXXX, PIC14C000, and PIC16C505 devices.

• Chapter 3: Programming KEELOQ® Devices – How to program KEELOQ devices.

• Chapter 4: Programming Memory Devices – How to program mem-ory devices.

• Index – Cross-reference listing of terms, features, and sections of this document.

• Worldwide Sales and Service – A listing of Microchip sales and service locations, and telephone numbers worldwide.

1999 Microchip Technology Inc. DS30243G1-page 1


Conventions Used in this GuideThis manual uses the following documentation conventions:

UpdatesAll documentation becomes dated, and this device specification is no exception. Since MPLAB, PRO MATE II and other Microchip tools are constantly evolving to meet customer needs, some MPLAB dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site to obtain the latest documentation available.

Documentation Conventions

Description Represents Examples

Angle Brackets: < > Delimiters for special keys. <TAB>, <ESC>

Italic characters Referenced books. MPLAB™ User’s Guide

Courier Font User entered code or sample code.

#define ENIGMA

Underlined, Italics Text with Right Arrow

Defines a menu selection from the menu bar.

File > Save

0xnnn 0xnnn represents a hexadeci-mal number where n is a hexa-decimal digit.

0xFFFF, 0x007A

In-text Bold Characters Designates a button. OK, Cancel

DS30243G1-page 2 1999 Microchip Technology Inc.

General Information

Recommended ReadingThis document describes PRO MATE II socket modules and device-specific programming options. For more information on using the PRO MATE II and general programming procedures, please refer to the PRO MATE II User’s Guide. For the latest PRO MATE II information, please refer to the README.PRO file.

README.PRO

For the latest information on PRO MATE II, read the README.PRO file (ASCII text file) included with the PRO MATE II software. This README file contains update information that may not be included in this document.

PRO MATE II User’s Guide (DS30028)

This user’s guide describes how to set up and use PRO MATE II. General programming procedures are detailed for PICmicro®, KEELOQ and memory devices.

MPLAB User’s Guide (DS51025)

Comprehensive guide that describes installation and features of Microchip’s MPLAB Integrated Development Environment, as well as the editor and simulator functions in the MPLAB environment.

Technical Library CD-ROM (DS00161)

This CD-ROM contains comprehensive data sheets for Microchip PICmicro devices available at the time of print. To obtain this disk, contact the nearest Microchip Sales and Service location (see back page) or download individual data sheet files from the Microchip website (http://www.microchip.com).

Embedded Control Handbook Vol.1 & 2 (DS00092 & DS00167)

These handbooks contain a wealth of information about microcontroller applications. To obtain these documents, contact the nearest Microchip Sales and Service location (see back page).

The application notes described in these manuals are also obtainable from Microchip Sales and Service locations or from the Microchip web site (http://www.microchip.com).

Microsoft Windows Manuals

Microchip software documentation assumes that you are familiar with the Microsoft Windows operating system. Many excellent references exist for this software program, and should be consulted for general operation of Windows.



The Microchip Internet Web SiteMicrochip provides on-line support on the Microchip World Wide Web (WWW)site.

The web site is used by Microchip as a means to make files and informationeasily available to customers. To view the site, the user must have access tothe Internet and a web browser, such as Netscape® Communicator orMicrosoft® Internet Explorer®. Files are also available for FTP download fromour FTP site.

Connecting to the Microchip Internet Web Site

The Microchip web site is available by using your favorite Internet browserto attach to:

http://www.microchip.com

The file transfer site is available by using an FTP program/client to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of services. Users maydownload files for the latest Development Tools, Data Sheets, ApplicationNotes, User’s Guides, Articles, and Sample Programs. A variety of Microchipspecific business information is also available, including listings of Microchipsales offices, distributors, and factory representatives. Other data available forconsideration is:

• Latest Microchip Press Releases• Technical Support Section with Frequently Asked Questions • Design Tips• Device Errata• Job Postings• Microchip Consultant Program Member Listing• Links to other useful web sites related to Microchip Products• Conferences for products, Development Systems, technical information,

and more• Listing of seminars and events


General Information

Development Systems Customer Notification ServiceMicrochip started the customer notification service to help our customers keep current on Microchip products with the least amount of effort. Once you subscribe to one of our list servers, you will receive email notification whenever we change, update, revise or have errata related to that product family or development tool. See the Microchip WWW page for other Microchip list servers.

The Development Systems list names are:

• Compilers

• Emulators

• Programmers

• MPLAB

• Otools.

Once you have determined the names of the lists that you are interested in, you can subscribe by sending a message to:

[email protected]

with the following as the body:

subscribe <listname> yourname

Here is an example:

subscribe programmers John Doe

To UNSUBSCRIBE from these lists, send a message to:

[email protected]


unsubscribe <listname> yourname

Here is an example:

unsubscribe programmers John Doe

The following sections provide descriptions of the available Development Systems lists.

CompilersThe latest information on Microchip C compilers, Linkers and Assemblers. These include MPLAB-C17, MPLAB-C18, MPLINK, MPASM as well as the Librarian, MPLIB for MPLINK.

To SUBSCRIBE to this list, send a message to:

[email protected]


subscribe compilers yourname



EmulatorsThe latest information on Microchip In-Circuit Emulators. These include MPLAB-ICE and PICMASTER®.


[email protected]


subscribe emulators yourname

ProgrammersThe latest information on Microchip PICmicro device programmers. These include PRO MATE II and PICSTART Plus.


[email protected]


subscribe programmers yourname

MPLABThe latest information on Microchip MPLAB, the Windows Integrated Development Environment for development systems tools. This list is focused on MPLAB, MPLAB-SIM, MPLAB’s Project Manager and general editing and debugging features. For specific information on MPLAB compilers, linkers and assemblers, subscribe to the COMPILERS list. For specific information on MPLAB emulators, subscribe to the EMULATORS list. For specific information on MPLAB device programmers, please subscribe to the PROGRAMMERS list.


[email protected]


subscribe mplab yourname

OtoolsThe latest information on other development system tools provided by Microchip. For specific information on MPLAB and its integrated tools refer to the other mail lists.


[email protected]


subscribe otools yourname


General Information

Customer SupportUsers of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Corporate Applications Engineer (CAE)

• Hot line

Customers should call their distributor, representative, or field application engineer (FAE) for support. Local sales offices are also available to help customers. See the back cover for a listing of sales offices and locations.

Corporate applications engineers (CAEs) may be contacted at (480) 786-7627.

In addition, there is a Systems Information and Upgrade Line. This line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive any currently available upgrade kits.

The Hot Line Numbers are:

1-800-755-2345 for U.S. and most of Canada, and

1-480-786-7302 for the rest of the world.



NOTES:


®
Chapter 1. Socket Modules

1.1 IntroductionThis chapter lists the part numbers for the socket modules that support each device and discusses the life expectancy and cleaning procedures for the different socket types. These sockets work on both PRO MATE and PRO MATE II. For socket modules with two sets of screws, the longer screws are for PRO MATE and the shorter screws are for PRO MATE II.

1.2 HighlightsThe topics covered in this chapter are:

• Currently Supported Devices and Socket Modules

• Socket Life Expectancy and Cleaning Procedures

1.3 Currently Supported Devices and Socket Modules

Table 1.1 defines the acronyms for the microcontroller device packages. Table 1.2 lists the part numbers for the socket modules that support each device.

Table: 1.1 Device Package Names

DIP Dual Inline Package PLCC Plastic Leaded Chip Carrier

SOIC Small Outline Integrated Circuit MQFP Metric Quad Flat Pack

SSOP Shrink Small Outline Package TQFP Thin Quad Flat Pack

1999 Microchip Technology Inc. DS30243H-page 9


Table: 1.2 Socket Module and Supported Devices Cross-Reference

Model Name/Part Number

PinCount

DIP SOIC SSOP PLCC MQFP TQFP

24CXX/24LCXX

8 AC004001 AC004002 — — — —

93CXX/93LCXX

8 AC004001 AC004002 — — — —

HCS200 8 AC004001 AC004002 — — — —HCS201 8 AC004001 AC004002 — — — —HCS300 8 AC004001 AC004002 — — — —HCS301 8 AC004001 AC004002 — — — —HCS320 8 AC004001 AC004002 — — — —HCS360 8 AC004001 AC004002 — — — —HCS361 8 AC004001 AC004002 — — — —HCS410 8 AC004001 — — — — —HCS412 8 AC004001 AC164002 — — — —HCS512 8 AC164001 — — — — —PIC12C508 8 AC124001 AC124001 — — — —PIC12C508A 8 AC124001 AC124001 — — — —PIC12C509 8 AC124001 AC124001 — — — —PIC12C509A 8 AC124001 AC124001 — — — —PIC12CE518 8 AC124001 AC124001 AC164026 — — —PIC12CE519 8 AC124001 AC124001 AC164026 — — —PIC12C671 8 AC124001 AC124001 — — — —PIC12C672 8 AC124001 AC124001 — — — —PIC12EC673 8 AC124001 AC124001 — — — —PIC12EC674 8 AC124001 AC124001 — — — —PIC14C000 28 AC144001 AC144002 AC124002 — — —PIC16C505 14 AC124001 AC164026 — — — —PIC16C52 18/20 AC164001 AV164002 AC164015 — — —PIC16C54 18/20 AC164001 AV164002 AC164015 — — —PIC16C54A 18/20 AC164001 AV164002 AC164015 — — —PIC16C54B 18/20 AC164001 AV164002 AC164015 — — —PIC16C54C 18/20 AC164001 AV164002 AC164015 — — —PIC16C55 28 AC164001 AV164002 AC164015 — — —PIC16C55A 28 AC164001 AV164002 AC164015 — — —PIC16C554 18/20 AC164010 AC164010 AC164018 — — —PIC16C558 18/20 AC164010 AC164010 AC164018 — — —PIC16C56 18/20 AC164001 AC164002 AC164015 — — —PIC16C56A 18/20 AC164001 AC164002 AC164015 — — —

Shaded area indicates not applicable.* When using a 28-pin device in a 40-pin socket, align pin 1 to the pin 1 indicator (socket is top justified).

DS30243H-page 10 1999 Microchip Technology Inc.


PIC16C57 28 AC164001 AC164002 AC164015 — — —PIC16C57C 28 AC164001 AC164002 AC164015 — — —PIC16C58A 18/20 AC164001 AC164002 AC164015 — — —PIC16C58B 18/20 AC164001 AC164002 AC164015 — — —PIC16C62A 28 AC164012 AC164017 AC164021 — — —PIC16C62B 28 AC164012 AC164017 AC164021 — — —PIC16C620 18/20 AC164010 AC164010 AC164018 — — —PIC16C620A 18/20 AC164010 AC164010 AC164018 — — —PIC16C621 18/20 AC164010 AC164010 AC164018 — — —PIC16C621A 18/20 AC164010 AC164010 AC164018 — — —PIC16C622 18/20 AC164010 AC164010 AC164018 — — —PIC16C622A 18/20 AC164010 AC164010 AC164018 — — —PIC16CE623 18/20 AC164010 AC164010 AC164018 — — —PIC16CE624 18/20 AC164010 AC164010 AC164018 — — —PIC16CE625 18/20 AC164010 AC164010 AC164018 — — —PIC16C63 28 AC164012 AC164017 — — — —PIC16C63A 28 AC164012 AC164017 — — — —PIC16C64A 40/44 AC164012 — — AC164013 AC164014 AC164020PIC16C642 28 AC164012 AC164017 — — — —PIC16C65A 40/44 AC164012 — — AC164013 AC164014 AC164020PIC16C65B 40/44 AC164012 — — AC164013 AC164014 AC164020PIC16C66 28 AC164012 AC164017 — — — —PIC16C662 40/44 AC164012 — — AC164013 AC164014 AC164020PIC16C67 40/44 AC164012 — — AC164013 AC164014 AC164020PIC16C71 18 AC164010 AC164010 — — — —PIC16C710 18 AC164010 AC164010 AC164018 — — —PIC16C711 18 AC164010 AC164010 AC164018 — — —PIC16C715 18 AC164010 AC164010 AC164018 — — —PIC16C72 28 AC164012 AC164017 AC164021 — — —PIC16C72A 28 AC164012 AC164017 AC164021 — — —PIC16C73A 28 AC164012 AC164017 — — — —PIC16C73B 28 AC164012 AC164017 — — — —PIC16C74A 40/44 AC164012 — — AC164013 AC164014 AC164020PIC16C74B 40/44 AC164012 — — AC164013 AC164014 AC164020PIC16C76 28 AC164012 AC164017 — — — —PIC16C77 40/44 AC164012 — — AC164013 AC164014 AC164020PIC16C773 28 AC164012 AC164017 AC164021 — — —PIC16C774 40/44 AC164012 — — AC164013 — AC164020


PinCount





PIC16F83 18 AC164010 AC164010 — — — —PIC16F84 18 AC164010 AC164010 — — — —PIC16F84A 18 AC164010 AC164010 — — — —PIC16F877 40/44 AC164012 — — AC164013 — AC164020PIC16C923 64/68 AC164025 — — AC164022 — AC164023PIC16C924 64/68 AC164025 — — AC164022 — AC164023PIC17C42A 40/44 AC174001 — — AC174002 AC174004 AC174005PIC17C43 40/44 AC174001 — — AC174002 AC174004 AC174005PIC17C44 40/44 AC174001 — — AC174002 AC174004 AC174005PIC17C752 64/68 AC174009 — — AC174007 — AC174008PIC17C756 64/68 AC174009 — — AC174007 — AC174008PIC17C756A 64/68 AC174009 — — AC174007 — AC174008PIC17C762 80/84 — — — AC174012 — AC174011PIC17C766 80/84 — — — AC174012 — AC174011


PinCount





1.4 Socket Life Expectancy and Cleaning Procedures

Microchip uses socket modules from several manufacturers. Table 1.3 gives the expected life (in number of automatic insertions) and cleaning method for each socket module as reported by the manufacturer.

1.4.1 ManufacturerLook at the socket module to determine the name of the manufacturer. The Yamaichi socket is not labeled; identify a Yamaichi socket by looking for the letters IC51– (as the prefix to a part number) on the socket.

1.4.2 InsertionsThe expected life for manual insertions has been found to be less than the manufacturer’s reported number. The number of manual insertions depends on the socket condition and how often the socket is cleaned.

Careless insertions or dirty socket conditions can bring the number of insertions down to less than 5,000. Cleanliness and care in inserting devices into a socket are most important with surface mount devices as the socket contactors must remain planar to function properly.

Any bent or nonplanar contacts will result in a failure. Nonplanar socket module contacts occur earlier in the life of a socket module when devices are inserted manually into a socket module. Early contact failure from manual insertions is due to the nonrepeatability of the manual insertion method. Therefore, the listed number of insertions may not be reached for sockets where devices are inserted manually. No good method exists to ensure that the contacts are planar.

Table: 1.3 Socket Life Expectancy and Cleaning Method

Manufacturer Insertions Cleaning Method

Aries (28 pin) 10,000 #2

AMP (18 pin) 25,000 #2

3M Textool 10,000 #1

AMP (Dip) 25,000 #2

3M Textool (SOIC) 10,000 #1

Aries 10,000 #2

Yamaichi 25,000 #1



1.4.3 Cleaning MethodMethod #1 – Methyl Alcohol

Clean with methyl alcohol, and then blow off the contacts with dry compressed air.

Method #2 – Not Recommended

There is no cleaning procedure for this socket type. If contacts get extremely contaminated, replace the socket module.

DANGER Methyl alcohol is highly flammable. Use methyl alcohol in a well ventilated area away from sparks, flames or any other source of ignition. Methyl alcohol is poisonous and may cause blindness if taken internally. Avoid inhaling methyl alcohol vapor.


®

2.1 IntroductionThis chapter deals exclusively with information about programming devices with calibration:

• PIC12C508/508A

• PIC12C509/509A

• PIC12CE518

• PIC12CE519

• PIC12C671

• PIC12C672

• PIC12EC673

• PIC12EC674

• PIC14C000

• PIC16C505


• Programmer Dialogs

• Calibration Windows



2.3 Programmer DialogsPRO MATE II Device Programmer and Configuration Bits dialogs for devices requiring calibration are the same as any other PICmicro device (Figure 2.1and Figure 2.2). Follow the instructions detailing how to program PICmicro devices in the PRO MATE II User’s Guide (DS30028).

Figure 2.1: Device Programmer Dialog – PIC14C000

Figure 2.2: Configuration Bits Dialog – PIC14C000



2.4 Calibration WindowsThe calibration data is displayed in a separate window by selecting Window > Calibration Data.

On windowed devices, the calibration data should be read out of the device andstored in a file prior to first use. Once saved, calibration files may be loadedusing File > Import.

Figure 2.3: Calibration Data – PIC14C000

Figure 2.4: Calibration Data – All Other Devices



NOTES:


®
Chapter 3. Programming KEELOQ® Devices

3.1 IntroductionThis chapter deals exclusively with information about programming KEELOQ devices.


• Programming Overview

• Key Generation

• Manufacturer’s Code

• HCS200 Options

• HCS201 Options

• HCS300 Options

• HCS301 Options

• HCS320 Options

• HCS360 Options

• HCS361 Options

• HCS410 Options

• HCS412 Options

• HCS512 Options

3.3 Programming OverviewProgramming of KEELOQ Encoders requires four steps:

1. Select the encoder2. Enter the manufacturer's code3. Select the decoder4. Select the encoder options.

A KEELOQ encoder can be selected as you would any other device supported by PRO MATE II (Figure 3.1).



Figure 3.1: Device Programmer Dialog – HCS200

The next step is to click on the Program button. The user will then be prompted for two 20-bit custodian keys (Figure 3.2). These are combined to form the manufacturer’s code. The manufacturer’s key is used in key generation as described later in this document.

Figure 3.2: Enter Key Dialog – Custodian Key 1

The appropriate dialog for the selected device will be displayed (Figure 3.3). The user should then select a Decoder. Some of the decoders have multiple key generation methods. If the selected decoder has different key generation options, the user will be prompted to select these options at that time. After this, the user should select the encoder options as desired. These options are described later in this document for each HCS device.

Once all options are selected, programming can begin. Click Program to program the device or Close to exit without programming.



Figure 3.3: Program Security Device Dialog – HCS200

As seen in the different data sheets, there are a multitude of interdependent options available to the user. These options are automatically set by the software to allow the encoder to be compatible with the selected decoder.

3.4 Key GenerationThe key generation options and process is described in detail in the Technical Brief Secure Learning RKE Systems Using KEELOQ Encoders (DS40144). A summary is given below.

KEELOQ encoder transmissions have two parts. The unencrypted portion consists of the encoder’s serial number and other status bits such as button status. The second portion (HOP code) is encrypted and contains information such as the synchronization counter, counter overflow bits and discrimination values.

Every KEELOQ encoder has its own encryption and decryption key pair. Key generation has three parts as shown in Figure 3.4 below. The first part, the manufacturer’s code, is an input to the key generation algorithm. The manufacturer’s code (64 bits) customizes the key generation algorithm to a specific manufacturer. This means that if two manufacturers use the same algorithm, and same source (e.g., serial number of 123) the key pairs generated will be different. The encoders produced by one manufacturer won’t be learnable on decoders produced by a second manufacturer and prevents the cloning of transmitters by competitors. The second part is also an input to the key generation algorithm. This second part is called the Source of the key generation. This can either be the encoder’s serial number or the encoder’s seed. The third part of key generation is the key generation algorithm.

The algorithm and source are automatically selected when the user selects a decoder as shown in Figure 3.4. If, as in the HCS512, the key generation source or algorithm can be changed, the user will be shown the options when the decoder is selected. This allows the user to select the key generation method being used in the system.



Figure 3.4: KEELOQ Key Generation

3.5 Manufacturer’s CodeWhen an HCS product is selected as the device to be programmed by the PRO MATE II programmer, the Enter Key dialog box is displayed when Program is pressed. As mentioned in Section 3.4, the manufacturer’s code is very important to prevent cloning of transmitters and should be carefully guarded. To ensure that the manufacturer’s code remains secret two trusted people, key custodians, should be given a 20-digit number each. This prevents the entire manufacturer’s code being entrusted to a single person. The two custodian keys are XORed to form the manufacturer’s code.

3.5.1 Entering the Manufacturer’s CodeEach of two key custodians are required to enter their custodian key an HCS part is first selected. The two custodian keys, if entered correctly, are used to generate the manufacturer’s code. The first 16 digits entered by each custodian are used to generate the manufacturer’s code, while the last 4 digits are a checksum. The checksum digits prevent the custodian from entering an incorrect manufacturer’s code as this directly influences the encryption keys that are generated. If the checksum entered does not match the key entered, the custodian will be asked to re-enter the key.

It is only possible to enter the manufacturer’s code once during each session, when Program is first selected. This prevents the manufacturer’s code being inadvertently changed during a programming session.

3.5.2 Calculating Custodian Key ChecksumThe user should enter the 16-digit portion used to calculate the manufacturer’s code and press the Calculate Checksum button. This will allow the program to generate a checksum for the user. The checksum will be calculated and the complete 20-digit custodian key displayed on the screen. The key should be written down and stored securely.

Manufacturer’s Code

Seed • XOREncryption KeySerial Number

Source Algorithm

• KEELOQ Key Generation



3.5.3 Changing the Manufacturer’s CodeIt is possible that a manufacturer would like to have different manufacturer’s codes for different product lines. It is not possible to change the manufacturer’s code during a programming session. This prevents the manufacturer’s code being inadvertently changed during a programming session.

To change the manufacturer’s code, exit PRO MATE II and enter the new manufacturer’s code when the program is restarted.

3.5.4 Key Generation Source and AlgorithmsThe key generation source and algorithms are selected when the user selects a decoder. The source and algorithm selected for each decoder is given in Table 3.5.

Table: 3.5 KEELOQ Decoder Key Generation Methods

Decoder Source Algorithm

Serial Number

Seed Decryption Algorithm

SIMDEC* No key generation. The simple decoder uses the manufacturer’s code

MCDEC* X X

MCSLRN* X X X

HCS512 X X X X

*The MCDEC, MCSLRN and SIMDEC decoders are software decoders. These decoders have been written as a “quick start” to a customer who would like to write a custom decoder. The source code for the decoders and application note describing each of the decoders is available by ordering DS40149 from your local Microchip representative.



3.6 HCS200 OptionsThe programming dialog for HCS200 devices is shown in Figure 3.6. Selectable options in this dialog are described in Table 3.1. Options automatically set are described in Table 3.2.


Table 3.1: Selectable Options – HCS200

Option Description

User Serial Number

The encoder’s 28-bit (7-hex digits) serial number should be entered here. If the Auto Increment check box is selected, the serial number and/or user seed will be automatically incremented when an encoder is successfully programmed.

Baud Rate Select 400 uS All: Basic Pulse Width (BPW) of 400 µs with all the code words transmitted.200 uS 1/2: BPW of 200 µs and one in two code words transmitted.

Low Voltage Trip Low: VLOW bit in transmission set at VDD = 4V.High: VLOW bit in transmission set at VDD = 8V.

Table 3.2: Options Automatically Set – HCS200

Option Set To

SEED The 32-bit SEED is a randomly generated number.

EN_KEY The 16-bit envelope key is set to 0000 and envelope encryption is disabled in the configuration word.

Discrimination Bits The discrimination bits in the configuration word are set to mirror the 12 least significant bits of the serial number.

EENC Envelope Encryption Select bit in the configuration word is automatically cleared as none of the decoders currently support envelope encryption.






Option Description

User Serial Number


Baud Rate Select 400 uS All: Basic Pulse Width (BPW) of 400 µs with all the code words transmitted.200 uS 1/2: BPW of 200 µs and one in two code words transmitted.

Low Voltage Trip Low: VLOW bit in transmission set at VDD = 4V.High: VLOW bit in transmission set at VDD = 8V.

Extended Serial Number

If checked, the full 32-bit serial number is transmitted. If not checked, the most significant nibble of the serial number is replaced by the function code.

Start Pulse Enable If checked, a Start pulse is transmitted before the first transmission.

Minimum 4 Tx If checked, at least four complete code words are transmitted each time the encoder is activated, even if all buttons are released.

S3 Set If checked, S3 is always transmitted as a 1. If not checked, S3 in the transmitted function code mirrors the value of S2.



3.8 HCS300/301/320 OptionsThe programming dialog for HCS300/301/320 devices is shown in Figure 3.8. Selectable options in this dialog are described in Table 3.5. Options automatically set are described in Table 3.6.

Figure 3.8: Program Security Device Dialog – HCS300/301/320


Option Set To

SEED The 32-bit SEED is a randomly generated number.

COUNTER The counter is initially set to 0000.

Table 3.5: Selectable Options – HCS300/301/320

Option Description

User Serial Number


Counter Overflow None: None of the overflow bits are set.Once: One of the overflow bits are set.Twice: Both overflow bits are set.

Low Voltage Trip Low: VLOW bit in transmission set when VDD = 3.5V (HCS300) and VDD=8V (HCS301, HCS320).High: VLOW bit in transmission set when VDD = 2.2V (HCS300) and VDD = 3.5V (HCS301, HCS320).



Baud Rate Select 400 uS All: Basic Pulse Width (BPW) of 400 µs with all the code words transmitted.200 uS 1/2: BPW of 200 µs and one in two code words transmitted.100 uS 1/2: BPW of 100 µs and one in two code words transmitted.100 uS 1/4: BPW of 100 µs and one in four code words transmitted.

Auto Shutoff Timer The automatic shutoff can be enabled preventing the battery of a transmitter going flat if the transmitter is accidentally pressed in a pocket or purse.

Table 3.6: Options Automatically Set – HCS300/301/320

Option Set To

SEED* The 32-bit SEED is a randomly generated number.

EN_KEY The 16-bit envelope key is set to 0000 and envelope encryption is disabled in the configuration word.

Discrimination Bits The discrimination bits in the configuration word are set to mirror the 12 least significant bits of the serial number.

EENC Envelope Encryption Select bit in the configuration word is automatically cleared as none of the decoders currently support envelope encryption.

* Not available on the HCS320

Table 3.5: Selectable Options – HCS300/301/320 (Continued)

Option Description



3.9 HCS360 OptionsThe programming dialog for HCS360 devices is shown in Figure 3.9. Selectable options in this dialog are described in Table 3.7 and Table 3.8. Options automatically set are described in Table 3.9.



Option Description

User Serial Number


Modulation Format If this is enabled, the transmitted string is Manchester modulated, if the option is not enabled Pulse Width Modulation (PWM) is used.

Baud Rate Select See Table 3.8.

Code Word Blanking

Every alternate code word can be blanked out, thereby, increasing the amount of power transmitted per transmission if needed.

Delayed Mode If this is enabled the encoder will transmit a delayed transmission after a time, see the HCS360 Data Sheet (DS40152) for more details.



Auto Shutoff Timer If this bit is enabled, the encoder will automatically shutoff after about a time (dependent on the transmission speed) preventing the battery of a transmitter going flat if the transmitter is accidentally pressed in a pocket or handbag.

Counter Overflow If this is enabled, the overflow bit will be set.

Table 3.8: Baud Rate Select

OptionModulation Format

PWM Manchester

400 uS or 800 uS 400 µs Basic Pulse Width (BPW)

800 µs BPW.

200 uS Long or 400 uS Long Time Out

200 µs BPW with a time-out value of about 30s if time-out is enabled.


200 uS Short or 400 uS Short Time Out



100 uS or 200 uS 100 µs BPW. 200 µs BPW.


Option Set To

SYNC_A Counter set to 0

SEED_0, SEED_1, SEED2

The 48-bit SEED is a randomly generated number.

SEED The SEED bit in the configuration word is set if a decoder that uses secure learn is selected.

IND The IND bit in the configuration word always cleared disabling independent mode.

USRA0, USRA1 The USRA bits in the configuration words are set equal to the serial number bits 9 and 10 extending the discriminator to 10 bits.

USRB0, USRB1 The USRB bits in the configuration word are set to 00.

XSER The XSER bit in the configuration word is always set to 00.

TMPSD The TMPSD bit in the configuration word is always set to 0.

Table 3.7: Selectable Options – HCS360 (Continued)

Option Description






Option Description

User Serial Number


Modulation Format This selects between PWM and VPWM modulation of data.

Transmission Format

See Table 3.11.

Baud Rate Select Slow: Basic Pulse Width of 400 µs.Fast: Basic Pulse Width is 200 µs.

Code Word Blanking

Every alternate code word can be blanked out, thereby, increasing the amount of power transmitted per transmission if needed.

Delayed Mode If this is enabled, the encoder will transmit a delayed seed transmission after about 3 seconds. See the data sheet for more details.



Auto Shutoff Timer If this bit is enabled, the encoder will automatically shutoff after a time (dependent on the transmission speed) preventing the battery of a transmitter going flat if the transmitter is accidentally pressed in a pocket or handbag.

Counter Overflow If this is enabled, the overflow bit will be set.

Table 3.11: Transmission Format

OptionModulation Format

PWM VPWM

1/3 – 2/3 or Tx Wakeup Disabled

A to PWM duty cycle

is used.

No wakeup pulse train transmitted on first transmission.

1/6 – 2/6 or Tx Wakeup Enabled A to PWM duty cycle

is used.

A wakeup pulse train is transmitted before the first code word.


Option Set To

SYNC_A Counter set to 0

SEED_0, SEED_1, SEED2

The 48 bit SEED is a randomly generated number.

SPM The SPM bit in the configuration word is always set to 1.

SEED The SEED bit in the configuration word is set if a decoder that uses secure learn is selected.

IND The IND bit in the configuration word always cleared disabling independent mode.

USRA0, USRA1 The USRA bits in the configuration words are set equal to the serial number bits 9 and 10 extending the discriminator to 10 bits.

USRB0, USRB1 The USRB bits in the configuration word are set to 00.

XSER The XSER bit in the configuration word is always set to 00.

TMPSD The TMPSD bit in the configuration word is always set to 0.


Option Description

13---

23---

16---

26---






Option Description

User Serial Number


Seed/IFF2 No Seed: No seed is transmitted even if the seed button combination is pressed. Only 1 key is available for IFF challenge – response.Limited Seed: Seed transmissions allowed for a maxi-mum of 255 transmissions, only 1 key available for IFF challenge – response.Seed: Seed transmissions always allowed, only 1 key available for IFF challenge –response.2 Key IFF: No seed transmissions are allowed, 2 keys available for IFF challenge – response.



Key 2/Seed/Transport Code

This location in the HCS410’s memory map is used for the seed (if enabled by Seed/IFF2), as Key 2 (if enabled by Seed/IFF2) and as the transport code.Random: The transport code, second key, and seed is a random number.User defined: The user can type in a 64 bit seed value which will be used as the Key 2/Seed/Transport code.

User EEPROM The user can enter a 64 bit (16 hex digits) value for user EEPROM.

Low Voltage Trip Low: The VLOW bit in a transmission is set when VDD drops below the low trip point (nominally 2.2V).High: The VLOW bit in a transmission is set when VDD drops below the high trip point (nominally 4.4V).

RF Baud Rate See Table 3.14.

IFF Baud Rate Slow (200 uS): Inductive Basic Pulse Width (IBPW) set to 200 µs.Fast (100 uS): Inductive Basic Pulse Width (IBPW) set to 100 µs.

Overflow None: No overflow bits set.Once: One of the overflow bits set.Twice: Both overflow bits set.

Anti Collision/XP RF

None: Anticollision and proximity activation modes both disabled.Anticollision: Anticollision mode enabled.Proximity Activation: Proximity activation mode enabled, anticollision mode disabled.RF Echo: anticollision mode enabled, transponder responses echoed on RF line.

Code Word Blanking

When this option is checked codes will be blanked depending on the setting of RF Baud Rate.

Intelligent Damping

If this option is enabled intelligent damping will be enabled.

Min 3 Tx If checked, at least three complete code words are transmitted each time the encoder is activated, even if all buttons are released.

LED Output If this option is enabled S2 doubles as an LED line.

Delayed Increment If this option is enabled, the counter will be incremented by 12, 20 seconds after the last button press.




Option Description



Table 3.14: RF Baud Rate

OptionBasic Pulse Width (BPW) Code Words

Transmitted*PWM Manchester

00 (slow) 400 µs 800 µs All

01 200 µs 400 µs 1 of 2

10 100 µs 200 µs 1 of 2

11 (fast) 100 µs 200 µs 1 of 4

* If enabled by code word blanking


Option Set To

Modulation Format The modulation format is set to PWM.

Discrimination Bits The discrimination bits in the configuration word are set to mirror the 10 least significant bits of the serial number

Counter The counter is set to 0.






Option Description

User Serial Number


Seed/IFF2 No Seed: No seed is transmitted even if the seed button combination is pressed. Only 1 key is available for IFF challenge – response.Limited Seed: Seed transmissions allowed for a maxi-mum of 128 transmissions, only 1 key available for IFF challenge – response.Seed: Seed transmissions always allowed, only 1 key available for IFF challenge – response.2 Key IFF: No seed transmissions are allowed, 2 keys available for IFF challenge – response.



Key 2/Seed/Transport Code

This location in the HCS412’s memory map is used for the seed (if enabled by Seed/IFF2), as Key 2 (if enabled by Seed/IFF2) and as the transport code.Random: The transport code, second key, and seed is a random number.User defined: The user can type in a 60 bit seed value which will be used as the Key 2/Seed/Transport code.

User EEPROM The user can enter a 64 bit (16 hex digits) value for user EEPROM.

Low Voltage Trip Low: The VLOW bit in a transmission is set when VDD drops below the low trip point (nominally 2.2V).High: The VLOW bit in a transmission is set when VDD drops below the high trip point (nominally 4.4V).

RF Baud Rate See Table 3.17.

IFF Baud Rate Slow (200 uS): Inductive Basic Pulse Width (IBPW) set to 200 µs.Fast (100 uS): Inductive Basic Pulse Width (IBPW) set to 100 µs.

Overflow None: No overflow bits set.Once: One of the overflow bits set.Twice: Both overflow bits set.

Anti Collision/XP RF

None: Anticollision and proximity activation modes both disabled.Anticollision: Anticollision mode enabled.Proximity Activation: Proximity activation mode enabled, anticollision mode disabled.RF Echo: Anticollision mode enabled, transponder responses echoed on RF line.

ASK/FSK Control ASK: This option allows ASK control signals to be out-put.FSK: This option allows FSK control signals to be out-put.

Transmission Format

PWM: PWM encoding of data being transmitted.Manchester: Manchester encoding of data being trans-mitted.

S2/LC Pin S2: The S2LC pin is used as a button input pin.LC: The S2LC pin is used as a inductive input pin.

Code Word Blanking

When this option is checked codes will be blanked depending on the setting of RF Baud Rate.

Intelligent Damping

If this option is enabled intelligent damping will be enabled.


Option Description



Min 4 Tx If checked, at least four complete code words are trans-mitted each time the encoder is activated, even if all buttons are released.

Long Preamble If this option is enabled, a long preamble is transmitted before the first code word.

Delayed Increment If this option is enabled, the counter will be incremented by 12, 20 seconds after the last button press.



Table 3.17: RF Baud Rate

OptionBasic Pulse Width (BPW) Code Words

Transmitted*PWM Manchester

00 (slow) 400 µs 800 µs All

01 200 µs 400 µs 1 of 2

10 100 µs 200 µs 1 of 2

11 (fast) 100 µs 200 µs 1 of 4

* If enabled by code word blanking


Option Set To

RF Enable This option is disabled.

Demodulator Mode

This option is disabled.

Discrimination Bits The discrimination bits in the configuration word are set to mirror the 10 least significant bits of the serial number

Counter The counter is set to 0.


Option Description



3.13 HCS512 OptionsThe programming dialog for HCS512 devices is shown in Figure 3.13. Selectable options in this dialog are described in Table 3.19.



Option Description

Key Generation Source

Serial Number: The serial number is used as the key generation source, also know as normal learn mode.Seed: The seed is used as the key generation source, also known as secure learn.

Key Generation Algorithm

Decryption: The decryption algorithm is used, with the key generation source and manufacturer’s code, as inputs to generate the encoder key.XOR: The XOR algorithm is used, with the key genera-tion source and manufacturer’s code, as inputs to gen-erate the encoder key. The XOR algorithm can only be used if the seed is used as the key generation source.

Sleep Mode If checked, sleep mode is enabled. Sleep mode can be used to reduce current consumption when no RF signal is present. During sleep, the clock stops, significantly reducing operating current.


®
Chapter 4. Programming Memory Devices

4.1 IntroductionThis chapter deals exclusively with information about programming memory devices.

4.2 HighlightsThe topic covered in this chapter is:

• Programming Overview – Memory Devices

4.3 Programming Overview – Memory DevicesPRO MATE supports many of Microchip‘s Memory devices, specifically the 24 (I2C™) and 93 (Microwire®) series Serial EEPROMs.

The data displayed in the Program Memory window will be in by -16 for those parts that support a by -16 mode, and by -8 for those devices that only support by-8. The HEX file format is standard INHX8M format for either the by -8 or by -16 devices.

Device selection is done via the Device Programmer dialog interface. Once a device is selected, there may be additional selections for the Smart Serial™ devices. These additional options allow the user to select the High Endurance Block, the Write Protect Starting Block, and the Number of Write Protect Blocks.

All programming/verifying is done at 5 volts VDD, and the user can perform the standard functions, Read, Blank Check, Programming, and Verification.

Figure 4.1: Device Programmer Dialog – 24AA00



NOTES:


PRO MATE® II DEVICE SUPPORT

Index

Numerics24 Series Serial EEPROMs ....................................3993 Series Serial EEPROMs ....................................39

CCalibration Data ..........................................................17Calibration Devices, Programming ......................15Calibration Files ..........................................................17Calibration Window ...................................................17Customer Support .......................................................7

DDevice Package Acronyms .......................................9Document Conventions .............................................2

EEncoders, Programming ..........................................19

HHCS200 Options ........................................................24HCS201 Options ........................................................25HCS300/301/320 Options .......................................26HCS360 Options ........................................................28HCS361 Options ........................................................30HCS410 Options ........................................................32HCS412 Options ........................................................35HCS512 Options ........................................................38

IInternet Address ...........................................................4

KKEELOQ Encoders, Programming ......................19Key Generation ...........................................................21

MManufacturer’s Code ................................................22Memory Devices, Programming ............................39Microchip Internet Web Site .....................................4

PPackage Types .............................................................9PIC12CXXX Programming .....................................15PIC14C000 Programming .......................................15PIC16C505 Programming .......................................15

Programming Devices with Calibration .............. 15Programming Memory Devices ............................ 39

SSecure Data Products, Programming ................. 19Serial EEPROMs ....................................................... 39Socket Cleaning Methods ...................................... 14Socket Life Expectancy ........................................... 13Socket Modules ........................................................... 9Supported Devices ................................................... 10

WWWW Address ............................................................. 4



NOTES:


Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumedby Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s productsas critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchiplogo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.

1999 Microchip Technology Inc.

All rights reserved. © 1999 Microchip Technology Incorporated. Printed in the USA. 11/99 Printed on recycled paper.

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AMERICAS (continued)TorontoMicrochip Technology Inc.5925 Airport Road, Suite 200Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253

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ASIA/PACIFIC (continued)SingaporeMicrochip Technology Singapore Pte Ltd.200 Middle Road#07-02 Prime CentreSingapore 188980Tel: 65-334-8870 Fax: 65-334-8850Taiwan, R.O.CMicrochip Technology Taiwan10F-1C 207Tung Hua North RoadTaipei, Taiwan, ROCTel: 886-2-2717-7175 Fax: 886-2-2545-0139

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11/15/99

WORLDWIDE SALES AND SERVICE

Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs and microperipheral products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.

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