WelcomeWelcome

Introduction

• STATS ChipPAC Ltd. is a premier service provider of semiconductor packaging design, assembly, test and distribution solutions.

• To maintains efficiency, all machine for all department must be at the greatest status

• In IC Assembly FOL, Preventive Maintenance is one of the way to maintains efficiency for Gold Wire Bonding machine

Stats Chippac Malaysia

( SCM )

SCM History & MilestoneStarted Operation - 1974

Land Area - 18 acres

Floor Space - 483,000 sq. ft.

Team Members - 2300

Services - Analog, RF & Mixed Signal Testing

- LFCSP & BCC Portfolio Additions

- Discrete Power Assembly & Test

- Product Logistics & Distribution

Production Capacity - 25 Million units per week

B3 B2B1

Plant Layout

1974 1989 1999 20002004

ChipPAC

Stats ChipPAC Malaysia Organization

Pamela Tan, Exec. Secretary

CL TanDirectorPower

Operations

HS LewPresident / MD

PrembajV.P.Test

Operations

LA KhooSr. Director

IC Assembly Engg & New Product Introduction

Ronnie OngDirector

QRA

Terence ChinDirector

IT & Facilities

ST GohDirector

CS, Ind. Engg, Product Planning

& Logistics

KK WongSr. Director

IC Assembly Operations

BaharomDirector

HR

Janet WongDirector

Procurement, Matls Planning & Warehousing

FL SeowDeputy Director

Finance

IC AssemblyDie Bank

Process Flow IC FOL

Wafer Thickness (1st)

Wafer Thickness (2nd)

Wafer Detapping

Wafer Back Grind

Wafer Tapping

2nd Optical Inspection

Wafer Saw

Wafer Mount

Coverlay (QFNs)

Die Attach

Wire Bond

Pre Bond Plasma Cleaning(QFNp)

Laser Strip ID Marking

Die Attach Cure

3rd Optical Inspection

Post Bond Plasma

Cleaning(QFNs)

Customer’s requirementAccording to package

Proper Outfit To Enter Clean Room – IC Assembly

Smock/jumpsuit& Face cover Name tag

ESD wrist's strap

Finger cots

IC Assembly – Products/Services

BCC – BUMP CHIP CARRIER

LeadMOUNTING PAD

Die

EPOXY GROUND RING

TIE BAR

DIE

EPOXY

LEAD

BOND PAD

QFNp – QUAD FLAT NO LEAD PUNCH QFNs – QUAD FLAT NO LEAD SAWN

PADDLE

DIE

EPOXY

LEAD

BOND PAD

Gold Wire Bonding Machine – K&S 8028

Power Control

LCD Monitor

Microscope

MHS Input.Magazine Handler

Bond head

MHS OutputMagazine

Signal Tower

XY Table

Work Holder

Wire Container

Butang kecemasan

MMIMan Machine Interface

Numeric Keypad

Purpose/Scopefor Preventive Maintenance

OP

ER

ATO

RS

LIN

E M

AIN

TEN

AN

CE

1. CLEANING

2. EXAMINE

3. SMALL RECOVERY

4. REPAIRING

5. MAINTENANCE

6. CALIBRATING

7. BUY- OFF

8. CONTINUES EFFICIENCY

PM

TEC

HN

ICIA

NS

EN

GIN

EER

S / C

I TEA

M

PM work flowMachine on

PM due date

Stop production & clearing

workholder (MA)

Cleaning

Calibrating

Setup

Test bond

Ready for production (MA)

i. Acknowledge PMii. Switch - OFF machineiii. Opening coversiv. Cleaning machine using vacuum

cleanerv. Greasing Rails/Slidersvi. Removing stains (using Methanol

chemical)vii. Switch – ON machine

i. Configure Heat-Blockii. Removing EFO & Wireiii. Calibrating Work-Holder

i. Railsii. Clampiii. Indexeriv. X-sensorv. Jam detectvi. Tucker eject

iv. Calibrating Bond-Headi. Z-axis adjustmentii. Bond forceiii. Ultra-Sonic Generator

(USG)iv. EFO height

v. Other calibration ( if needed )

i. Attach heat-Block & Clamp insert

ii. Acknowledge SETUPiii. Download bond

programiv. Teach H/B positionv. Calibrate crosshair-

offset note: starting using dummy or production

i. Teach bond positionii. Align overlay with

die

i. Go to AUTO menuii. Run/Stop bondingiii. Correct Crosshair-offset on

pad

i. Up & Lot Startii. Check the bonding program (must

PASSED)iii. Check list and dummy is ready to

send to QC

Conclusion

• PM is important so that the machine can run longer without many serious problem and better efficiency

• The out-come from IT and UTeM’s ways of educating produce excellent chemistry to produce an excellent future engineer