PowerEdge M630

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PowerEdge M630

WelcomeThis reference guide is both an instructional aid and online reference for the Dell ™ PowerEdge ™ M630 modular server.The technologies and features are described to better prepare technicians to provide outstanding support to Dellcustomers.

Dell PowerEdge M630

RTS Dates: Worldwide 2014–12–02

Department

s:

Global Services andDeployment

Authors: Alan Khoo

Contributing Sources:

EM: Andy Berke

WWSPM: MargaritaMartinez

InfoDev

Contacting Dell

To contact Dell regarding issues with this reference guide, click Contact Us.

Dell – Restricted – Confidential

© 2014 Dell | For Dell Employees and Dell Service Providers only | Legal | Contact1

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Copyright

Copyright© 2015 Dell Inc. All rights reserved. This product is protected by U.S. and international copyright andintellectual property laws. Dell™ and the Dell logo are trademarks of Dell Inc. in the United States and/or other jurisdictions. All other marks and names mentioned herein may be trademarks of their respective companies.

Contents

Welcome......................................................................................................................................... 1Dell PowerEdge M630..................................................................................................................................................... 1

Contacting Dell................................................................................................................................................................ 1

Copyright......................................................................................................................................................................... 2

Using This Reference Guide........................................................................................................6Navigation........................................................................................................................................................................ 6

Notes, Cautions, Warnings, and Tips.............................................................................................................................. 6

Browser Requirements....................................................................................................................................................6

Additional Required Software..........................................................................................................................................6

Course Introduction..................................................................................................................... 7Goal.................................................................................................................................................................................. 7

Objectives.........................................................................................................................................................................7

Course Delivery Method..................................................................................................................................................7

Prerequisites.....................................................................................................................................................................7

Product Overview......................................................................................................................... 8Product Positioning.........................................................................................................................................................8

Product Features............................................................................................................................................................. 9

Product Comparison.......................................................................................................................................................9

Technical Specifications................................................................................................................................................10Supported Operating Systems...................................................................................................................................... 12

Quick Resource Locator ...............................................................................................................................................13

Block Updates..............................................................................................................................14Q1 2015 Block................................................................................................................................................................14

BIOS Update.............................................................................................................................................................14

Lifecycle Controller Update.....................................................................................................................................15

iDRAC8 Version 2.10.10.10...................................................................................................................................... 15

Intel Chipset Driver Update..................................................................................................................................... 15

Q2 2015 Block............................................................................................................................................................... 16

Chassis Overview.........................................................................................................................17Front Panel Features and Indicators..............................................................................................................................17Chassis Assembly...........................................................................................................................................................19

Chassis LEDs..................................................................................................................................................................20

Hard Drive Indicator Patterns................................................................................................................................. 20

iDRAC Direct LED Indicator Codes......................................................................................................................... 21

Field Service Information.......................................................................................................... 22Field Service Overview.................................................................................................................................................. 22

Product Overview..........................................................................................................................................................23

Product Positioning.................................................................................................................................................23

2 Dell – Restricted – Confidential© 2014 Dell | For Dell Employees and Dell Service Providers only | Legal | Contact

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Safety Precautions.........................................................................................................................................................24

Standby Power.........................................................................................................................................................24

Bonding....................................................................................................................................................................24

Electrostatic Discharge Protection.........................................................................................................................24

The ESD Field Service KitAnti-Static MatWrist Strap and Bonding Wire................................................................26

ESD Wrist Strap Tester.............................................................................................................................................27

Insulator Elements................................................................................................................................................... 27

Consider the Working Environment.......................................................................................................................28

ESD Packaging.........................................................................................................................................................28

Transporting Sensitive Components...................................................................................................................... 29

ESD Protection Summary........................................................................................................................................29

Lifting Equipment.................................................................................................................................................... 29

Tools and Utilities..........................................................................................................................................................30

Hand Tools.............................................................................................................................................................. 30

Need to Know................................................................................................................................................................30

Critical Callouts....................................................................................................................................................... 30

Product Comparison...............................................................................................................................................38

Common Error Messages....................................................................................................................................... 39

Version Control........................................................................................................................................................41Start Up/Shut Down Sequence............................................................................................................................... 41

Diagnostics and Indicators............................................................................................................................................42

Hard Drive Indicator Patterns..................................................................................................................................42

iDRAC Direct LED Indicator Codes.........................................................................................................................43

Enhanced Pre-boot System Assessment (ePSA)....................................................................................................44

System Board Connectors.............................................................................................................................................51

System Board Jumper Settings.....................................................................................................................................52

Disassembly and Reassembly....................................................................................................................................... 53

Cover........................................................................................................................................................................53

Cooling Shroud........................................................................................................................................................54

Processor/DIMM Blank............................................................................................................................................55Memory....................................................................................................................................................................56

2.5” Hard Drive.........................................................................................................................................................58

1.8” Solid State Drive............................................................................................................................................... 60

Internal Dual SD Module......................................................................................................................................... 62

rSPI Card..................................................................................................................................................................64

SD vFlash Card.........................................................................................................................................................65

I/O Module Mezzanine Card...................................................................................................................................67

Network Daughter Card..........................................................................................................................................68

Heat Sink and Processor......................................................................................................................................... 69

Hard Drive Backplane..............................................................................................................................................74

Hard Drive/SSD Cage...............................................................................................................................................77

System Board...........................................................................................................................................................78

System Battery......................................................................................................................................................... 81

PCIe Extender/Storage Controller Card.................................................................................................................83

PERC and HDD Replacement.................................................................................................................................84

Update BIOS..................................................................................................................................................................86

Re-enabling the Trusted Platform Module (TPM)..................................................................................................86

Restoring the Service Tag Using Easy Restore.............................................................................................................87

Update the Service Tag........................................................................................................................................... 87





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Installation......................................................................................................................................................................87

Placemat.................................................................................................................................................................. 87

Initialization..............................................................................................................................................................88

Basic Configuration.................................................................................................................................................88

Quick Resource Locator ..............................................................................................................................................89

Technology and Components..................................................................................................91iDRAC8...........................................................................................................................................................................91

Acquiring Licenses................................................................................................................................................... 91

New Features........................................................................................................................................................... 91

iDRAC Quick Sync (R630, R730 and R730XD Only)...............................................................................................92

Configurable Temperature and Power Thresholds............................................................................................... 92

iDRAC Robustness and Self-Healing...................................................................................................................... 93

Tech Support Report...............................................................................................................................................93

Lifecycle Controller.......................................................................................................................................................94

iDRAC8 with Lifecycle Controller...........................................................................................................................94

Benefits of Using iDRAC with Lifecycle Controller................................................................................................94

What’s New In This Release?...................................................................................................................................94

Key Features.............................................................................................................................................................94

Starting Lifecycle Controller................................................................................................................................... 95Processor.......................................................................................................................................................................96

Processor Features..................................................................................................................................................96

Supported Processors............................................................................................................................................. 97

Chipset........................................................................................................................................................................... 97

Memory..........................................................................................................................................................................98

General Memory Module Installation Guidelines...................................................................................................99

Mode Specific Guidelines..................................................................................................................................... 100

Sample Memory Configurations........................................................................................................................... 101

Storage.........................................................................................................................................................................103

Hard Drive/SSD Bay Numbering...........................................................................................................................104

Express Flash (PCIe SSD).......................................................................................................................................104Backplane.................................................................................................................................................................... 105

General Configuration Notes................................................................................................................................106

PERC9.......................................................................................................................................................................... 106

PERC H330............................................................................................................................................................ 106

PERC H730.............................................................................................................................................................107

PERC H730P...........................................................................................................................................................107

Internal Dual SD Module............................................................................................................................................. 107

IDSDM New Features.............................................................................................................................................107

Supported Operating Systems.............................................................................................................................. 108

Network Daughter Card..............................................................................................................................................109

PCIe Mezzanine Card..................................................................................................................................................109

Supported Mezzanine Cards.................................................................................................................................109

PCIe Mezzanine Card Installation Guidelines.......................................................................................................110

Fabric Connection for M1000e............................................................................................................................. 110

Fabric Connection for VRTX.................................................................................................................................. 111

Mezzanine Population Rule................................................................................................................................... 112

Trusted Platform Module ............................................................................................................................................114

System Board Block Diagram......................................................................................................................................115

BIOS and UEFI............................................................................................................................ 117




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Pre-operating System Management Applications......................................................................................................117

Using Navigation Keys..................................................................................................................................................117

About System Setup.....................................................................................................................................................118

F2 – BIOS (System Setup)............................................................................................................................................118

System Setup Main Menu...................................................................................................................................... 119

System BIOS Settings Screen................................................................................................................................ 119

System Information Screen................................................................................................................................... 121

System Memory Screen.........................................................................................................................................122

Processor Settings Screen.....................................................................................................................................123

SATA Settings Screen.............................................................................................................................................126

Boot Settings Screen.............................................................................................................................................128

Network Settings Screen.......................................................................................................................................130

Integrated Devices Screen.....................................................................................................................................131

Serial Communication Screen.............................................................................................................................. 133

System Profile Settings Screen..............................................................................................................................135

System Security Screen......................................................................................................................................... 138

Miscellaneous Settings Screen............................................................................................................................. 140

F10 – Lifecycle Controller...........................................................................................................................................142

F11 – UEFI Boot Manager............................................................................................................................................142Entering Boot Manager......................................................................................................................................... 142

Boot Manager Main Menu.....................................................................................................................................143

Changing the Boot Order........................................................................................................................................... 144

Choosing the System Boot Mode...............................................................................................................................144

Assigning a System and/or Setup Password.............................................................................................................. 144

Deleting or Changing an Existing System and/or Setup Password...........................................................................145

Troubleshooting....................................................................................................................... 146Minimum to POST....................................................................................................................................................... 146

Minimum Components......................................................................................................................................... 146

Known Issues...............................................................................................................................................................146

Disabling a Forgotten Password................................................................................................................................. 147Troubleshooting System Memory.............................................................................................................................. 148

Troubleshooting Hard Drives......................................................................................................................................148

Troubleshooting Solid State Drives............................................................................................................................ 149

Troubleshooting USB Devices.................................................................................................................................... 149

Troubleshooting an Internal SD Card.........................................................................................................................149

Troubleshooting Processors.......................................................................................................................................150

Troubleshooting System Board.................................................................................................................................. 150

Troubleshooting the NVRAM Backup Battery............................................................................................................150

Additional Resources................................................................................................................151Document History.................................................................................................................... 152





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Using This Reference Guide

Navigation

To navigate through this reference guide, select topics using either the left navigation menu or the Previous and Nextbuttons at the top right of each page.

Reference content may be accessed sequentially or randomly depending on your needs.

Notes, Cautions, Warnings, and Tips

The following symbols are used to highlight information that is of special significance to the topic.

NOTE: A NOTE highlights information of special interest or importance to the reader. Failure to read the note willnot result in physical harm to the reader, equipment, or data. A Note may not contain safety information, whichmust always be presented in cautions or warnings.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid

the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

Tip: A TIP indicates important information to help you work more effectively and to assist you in providingcustomers with the best experience.

Browser Requirements

Dell online reference guides work with Internet Explorer 8.x and later, Chrome, and Firefox. If you experience browser-

related problems, contact us.

Additional Required Software

Adobe Acrobat PDF (.pdf) files require Acrobat Reader. Download Acrobat Reader and obtain additional information fromthe Adobe website at http://get.adobe.com/reader/?promoid=JOPDC.


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Course IntroductionThis is the online reference material for the Dell ™ PowerEdge ™ M630 modular server. The material introduces newtechnologies and features specific to the Dell PowerEdge M630 in an effort to better prepare technicians to providesupport to our customers.

Goal

The goal of this reference guide is to provide the information that Technical Support agents, Dell Service Providers, andGlobal Deployment and Field personnel need to provide outstanding customer support of the Dell PowerEdge M630.

Objectives

After completing this course, you will be able to do the following:

• Identify the internal features and specifications of the Dell PowerEdge M630 module server.

• Locate and identify all external chassis features and connectors.

• Identify installation and configuration processes for the Dell PowerEdge M630 module server.

• Identify any new technologies implemented and explain their significance.• Locate and reference any resources within this document which can be used to troubleshoot the Dell PowerEdge

M630 functionality issues.

• Remove and replace all Field Replaceable Units (FRUs) in the Dell PowerEdge M630 module server.

Course Delivery Method

This course is designed as an online self-study module.

Prerequisites

Completion of the following:

• Server New Hire



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Product OverviewThe Dell ™ PowerEdge ™ M630 is an ultra-efficient blade server combining up to 36 cores of Intel® processing powerand 24 DIMMs of DDR4 memory in a dense, easy-to-manage platform ideal for data center workloads.

Product Positioning

The Dell PowerEdge M630 designed for use with the Dell PowerEdge M1000e blade enclosure and Dell PowerEdge VRTXconverged infrastructure. The Dell PowerEdge M630 offers exceptional scalability in environments ranging from IT as aservice providers and private clouds to remote and branch offices.

• Performance

– 2S Intel® Xeon® E5–2600 v3 Processors (18 cores max each CPU; 36 total max cores, full server processor stack

– 2 x PCIe x8 Gen 3 Mezzanine Cards

– Half-height single slot blade

– Dual SD cards for redundant hypervisor

• Availability

– 24 DIMMs (768 MB)

– Up to 4 x 1.8” SSD or two 2 x 2.5”

– PERC 9/SAS HBA/Chipset SATA

– Management: iDRAC8 Enterprise with Lifecycle Controller 3.x

– Hot-plug, redundant power/cooling (chassis)

• Expandability, I/O, Storage




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– Up to two Mezzanine Cards

– 4 x 1GbE, 2 x 10GbE, 4 x 10GbE LOMs

– Managed Persistent Storage Options: 2x Express Flash PCIe Flash SSD

Product Features

The Dell ™ PowerEdge ™ M630 is a half-height blade, two socket blade server with up to 24 DIMMs, storage capacity of

up to four drive bays, and Intel® Xeon® E5-2600 v3 processors.

The Dell PowerEdge M630 is packed with the following features:

• Leading storage performance and flexibility with 1U drive density

• Cutting edge I/O capabilities: flexible LOMs, simple and cost effective aggregation with IOA, and I/O virtualizationwith Network Partitioning (NPAR) 2

• iDRAC 8 bringing System Management automation to mainstream IT.

Product Comparison

The following table compares the Dell ™ PowerEdge ™ M630 to the Dell PowerEdge M620 blade server.

Product Features Comparison

Feature Dell PowerEdge M620 Dell PowerEdge M630

Processors Intel® Xeon® processor E5-2600 v2product family

Intel Xeon processor E5-2600 v3product family

Memory • 24 x DDR3 RDIMM, UDIMM, andLRDIMM

• Up to 768 GB

• 24 x DDR4 RDIMM and LRDIMM

• Up to 768 GB

Disk Drive 2.5” – 6Gb SAS, 3Gb SATA 2.5” – 12Gb SAS/6Gb SATA, 1.8” – 6GbSATA

RAID Controller S110

H310 - Mini FX2 Specific

S130

H330, H730, and H730P – Mini Blade

PCIe SSD Yes Yes

Backplane Type 2 x 2.5”

• SATA only

• SAS/SATA

• PCIe SSD

2 x 2.5” — New backplane design

• SATA only – From PCH

• SAS/SATA – From PERC

• PCIe SSD – From PCIe ExtenderModule

4 x 1.8”

• uSATA – From PCH

• uSATA – From PERC

NIC bNDC: 2 x 10GbE, 4 x 10GbE bNDC: 2 x 10GbE, 4 x 10GbE, 4 x 1GbE

USB USB 2.0 One USB 2.0 and one USB 3.0 (frontports)

I/O Up to two x8 PCIe Gen3 SFFMezzanine

• Up to two x8 PCIe Gen3 SFFMezzanine

• Up to two x8 Gen2 PCIe switchMezzanine for VRTX



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Heat Sink Type 57mm (24 DIMMs), 77mm (20 DIMMs),97mm (16 DIMM-Fresh Air)

68mm (24 DIMMs), 86mm (20 DIMMs)

Fresh Air support with limited CPU andmemory sku.

Trusted Platform Module (TPM) On board TPM 1.2 TPM Modular (FIPS TPM 1.2)

Remote Management iDRAC7 (Express/Enterprise) withLifecycle Controller 2

iDRAC8 (Express/Enterprise) withLifecycle Controller 3

Internal Dual SD Module (IDSDM) Yes, on Management Riser Yes, on IDSDM

Technical Specifications

Dell ™ PowerEdge ™ M630 Technical Specifications

Feature Description

Processor

Processor type One or two Intel® Xeon® processor E5-2600 v3 product

family

Memory

Architecture 2133 MT/s, 1866 MT/s, 1600 MT/s, or 13333 MT/s DDR4DIMMs

Memory module sockets Twenty-four 288-pin

Memory module capacities:

RDIMMs 4 GB (single-rank), 8 GB (dual-rank), and 16 GB (dual-rank)

LRDIMMs 32 GB (quad-rank)

Minimum RAM 4 GB (single processor configuration)

Maximum RAM 768 GB (with 32 GB LRDIMMs)

RAID controllers

Controller types PERC H330, PERC H730P, and PERC H730

Drives

Hard drives Up to two 2.5”, hot-swappable SAS/SATA/PCIe SSDs orSAS/SATA hard drives

SSDs Up to four 1.8”, hot-swappable SATA SSDs

Optical drive External optional USB DVD

NOTE: DVD devices are data only.

Flash drive Internal optional USB

Internal optional SD card

Optional vFlash card (with integrated iDRAC8 Enterprise)

Connectors




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Feature Description

Front:

USB One 4-pin, USB 2.0-compliant and one 4-pin, USB 3.0-compliant

Internal

SD Two internal SD cards dedicated for the hypervisorOne SD card dedicated for future vFlash support

Mezzanine Cards

Mezzanine slots Two PCIe x8 Gen 3 slots mezzanine card supporting dualport 10 Gb Ethernet, quad port 10 Gb Ethernet, quad port 1Gb, FC8 Fiber Channel, FC16 Fiber Channel, or Infiniband®

mezzanine cards.

Video

Video type Matrox G200 VGA controller integrated with iDRAC

Video memory 2 GB shared with iDRAC application memoryBattery

NVRAM backup battery CR 2032 3.0 V lithium coin cell

Physical

Height 19.23 cm (7.57 inch)

Width 5.03 cm (1.98 inch)

Depth 54.43 cm (21.43 inch)

Weight (maximum) 6.8 kg (14.99 lb)

Environmental

Storage temperature –40 °Celsius to 65 °Celsius (–40 °Fahrenheit to 149°Fahrenheit) with a maximum temperature gradation of 20°Celsius per hour.

Standard operating temperature Continuous operation: 10 °Celsius to 35 °Celsius at 10% to80% relative humidity (RH), with 29 °Celsius max dewpoint. De-rate maximum allowable dry bulb temperatureat 1 °Celsius per 300 m above 900 m (1 °Fahrenheit per550 ft).

The following conditions apply to the standard operatingtemperature:

• Certain system hardware configurations may requirereductions in the upper temperature limits.

• System performance may be impacted when operatingabove 30 °Celsius or with a fan fault.





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Feature Description

Expanded operating temperatureNOTE: When operating in the expanded temperaturerange, system performance may be impacted.

NOTE: When operating in the expanded temperaturerange, ambient temperature warnings may be

reported on the LCD and in the System Event Log.

≤ 1% of annual operating hours –5 °Celsius to 45 °Celsius at 5% to 90% RH with 29°Celsius dew point.

NOTE: Outside the standard operating temperature(10 °Celsius to 35 °Celsius), the system can operatedown to –5 °Celsius or up to 45 °Celsius for amaximum of 1% of its annual operating hours.

For temperatures between 40 °Celsius and 45 °Celsius, de-rate maximum allowable dry bulb temperature by 1°Celsius per 125 m above 950 m (1 °Fahrenheit per 228 ft).

Expanded operating temperature restrictions • Do not perform a cold startup below 5 °Celsius.

• 135 W (4 core, 6 core, or 8 core) and 145 W processorsare not supported.

• The following do not support the expanded operatingtemperature range:

– PCIe SSDs

– Non Dell-qualified peripheral cards and/orperipheral cards greater than 25 W

• When populating the blade slots in the M1000eenclosure with only Dell PowerEdge M630 blades:

– Install 86 mm width heat sink for processors of 120

W or more.– Install 68 mm width heat sink for processors of lessthan 120 W.

– If you install a blade with two processors in theM1000e enclosure, all blade slots in the enclosuremust have Dell PowerEdge M630 blades with thesame configuration (Dell PowerEdge M630 bladeswith two processors). However, vacant blade slotsin the enclosure can be installed with blade blanks.

Supported Operating Systems

The Dell ™ PowerEdge ™ M630 supports the following operating systems.

• Microsoft® Windows® Server 2008/2012 R2 (with Hyper-V® enabled)

• Microsoft Windows Server 2012 (with Hyper-V enabled)

• Microsoft Windows Server 2008/2012 Datacenter (with Hyper-V enabled)

• Microsoft Windows Server 2008 R2 SP1 (with Hyper-V enabled)

• Microsoft Windows Server 2008 R2 SP2 x64/x86 (with Hyper-V enabled)

• Novell® SUSE® Linux Enterprise Server

• Red Hat® Enterprise Linux®




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Optional Hypervisors:

• Citrix® XenServer®

• VMware® vSphere® ESXi™

For more information on the specific versions and additions, please refer to Dell.com/OSsupport.

Quick Resource Locator

A useful feature included with the new 13G servers is the Quick Resource Locator (QRL) — a model-specific QuickResource (QR) code on Dell™ PowerEdge™ servers. Use your phone to access the Dell QRL app to learn more about thespecific product in front of you. This QR code provides quick access to the following:

• Step-by-step videos, including overviews of system internals and externals, as well as detailed, concise, task-orientedvideos, and installation wizards.

• Reference materials, including searchable owner’s manual content, LCD diagnostics, and an electrical overview.

• Service Tag lookup, so you can quickly gain access to your specific hardware configuration information and warrantyinformation.

• Contact with Dell via a direct link to get in touch with technical support and sales teams, and provide feedback directto Dell.

These codes provide an easy way to retrieve the critical support information you need when you need it. This makes

more efficient and effective management for your data center hardware.

Use the QRL to get immediate access to system information and how-to videos. This can be done by visitingdell.com/QRL or by using your smartphone or tablet and a model-specific QR code located on your Dell PowerEdgesystem. To try out the QR code, scan the following image.



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Block UpdatesThis topic contains information on block updates.

Q1 2015 Block

RTS Date: April 07, 2015

In April of 2015, Dell released the following updates to the Dell ™ PowerEdge ™ FC630/M630:

• BIOS Update

• Lifecycle Controller Update

• iDRAC8 Version 2.10.10.10

• Intel® Chipset Driver Update

• Added new Memory:

– PR5D1 – DIMM,32GB,2133,2RX4,8G,DDR4,R

• Added new processor:

– 56H61 – PRC,E52658V3,2.2,30M,HSL,M1 (for M630 only)

– PH0T5 – PRC,E52685V3,2.6,30M,HSL,M1

• Added new network cards:

– Y348Y – CRD,NTWK,13G,BNDC,4X10,IN,10KR

– DX69G – CRD,NTWK,BNDC,2X10KR,INTEL

– Y5M7N – CRD,NTWK,10G,SFP+,DP,INTEL,V3 (FH)

– 5N7Y5 – CRD,NTWK,10G,SFP+,DP,INT,LP,V3

– DDJKY – CRD,NTWK,4X10G,SFP+,INTEL– P90KD – CRD,NTWK,PCIE,10G,NIC,DP,EMX,L

– 196TN – CRD,NTWK,MEZZ,NIC,DP,EMULEX

– R6D8Y – CRD,NTWK,BNDC,NIC,EMULEX,DP,KR

• Added Supported Operating Systems:

– VMware® ESXi™ 5.1 U3

– VMware ESXi 5.5 U2

– VMware ESXi 6.0 (factory install and web posting)

– XenServer 6.5 (factory install)

– Red Hat® Enterprise Linux® 7.0 (shipping)

• Added new power source:

– MVP7C – PWR SPLY,2000W,RDNT,13G,DELTA

BIOS Update

Fixes

The following are the fixes for BIOS update:

• Fixed Non-Volatile Memory Express (NVMe) device surprise-removal issue.




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• Fixed an issue with some complex USB monitors.

• Fixed an issue where Controlled Turbo using RACADM did not follow profile settings.

• Fixed a console redirection output issue that was not shutting-off when 'Serial Communication' is set to OFF.

• Fixed an issue where the system and mouse are frozen when selecting the "Blink" option while configuring Dell NVMePCIe SSD under the Device Settings HII menu.

Enhancements

The following are the enhancements for BIOS update:

• Updated the Intel processor and memory reference code to MR11.

• Updated the Intel Xeon® processor E5-2600 V3 product family processor microcode to 0x2D.

• Updated the Intel Management Engine (ME) firmware version to SPS_E5_03.00.07.154.0_MR1-G_WBG_REL.

• Updated the BIOS HII Setup menu.

• Enable airflow (Cubic Feet per Minute (CFM)) and Exhaust Temperature for Power Thermal Aware Solution (PTAS).

• Added Workload profile feature.

Lifecycle Controller Update

Added Supported Operating Systems:

• Microsoft® Windows Server® 2012

• Microsoft Windows Server 2012 R2

• Microsoft Windows Server 2008 R2 SP1

• Red Hat Enterprise Linux 6.5 x86_64

• Red Hat Enterprise Linux 7.0 x86_64

• SUSE® Linux Enterprise Server 11 SP3 x86_64

• SUSE Linux Enterprise Server 12 x86_64

• VMware ESXi

• Citrix XenServer®

NOTE: If you select VMware ESXi, Citrix XenServer, or select the Any Other Operating System option, make surethat you prepare the drivers required for installing these operating systems because the drivers not available.

iDRAC8 Version 2.10.10.10

NOTE: For more information about the iDRAC8 2.10.10.10 update, please refer to the reference material link below.

Internal Link: iDRAC8

External Link: iDRAC8

Intel Chipset Driver Update

Fixes

The following are the fixes for Intel Chipset Driver update:

• Full Speed barcode scanner may fail to enumerate when connected behind a USB2.0.

• USB3.0 Pendrive may fail to enumerate when connected behind a USB3.0 Hub after an S4 power cycle.

• Fixed BSOD 0x9F that may occur during long S3 stress test.



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Chassis OverviewThe following pages contain an overview of the chassis.

Front Panel Features and Indicators

Dell ™ PowerEdge ™ M630 Front Panel Features and Indicators

2.5” Chassis

Dell PowerEdge M630 Front Panel Features and Indicators

1.8” Chassis

Chassis Front

Item Indicator, Button, orConnector

Icon Description

1 Hard drives/SSDs2.5 inch hard

drive system

Two 2.5 inch hot-swapSAS/SATA/PCIe SSDs orSAS/SATA hard-drives.

1.8 inch SSD

system

Four 1.8 inch hot-swapSATA SSDs.





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Chassis Front

Item Indicator, Button, orConnector

Icon Description

2 USB2 connector Allows a USB device to be connected to thesystem.

3 USB1/iDRAC managedUSB port

The USB management port can function as aregular USB port or provide access to the iDRACfeatures. For more information, see the iDRAC

User’s Guide at www.dell.com/esmmanuals .

4 Management indicator The management indicator lights when theiDRAC controls the USB1 port for managementfunctions.

5 Status indicator Provides information about the status of thesystem.

6 Blade power-on indicator,power button

The power-on indicator lights when the bladepower is on. The power button controls thepower supply output to the system.

7 Blade handle Used to slide the blade server out of the

enclosure.


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Chassis Assembly

Chassis Assembly

Item Descriptions

1 Restore Serial Peripheral Interface (rSPI) Card

2 PCIe Mezzanine Card Connector (2)

3 Network Daughter Card (NDC)

4 Memory Module (24)

5 Cooling Shroud

6 Hard Drive/SSD Backplane

7 Processor 2

8 Processor 1





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Chassis LEDs

The following pages contain the information about chassis LEDs.

Hard Drive Indicator Patterns

The hard-drive/SSD (Solid State Drives) indicators display different patterns as drive events occur in the system.

NOTE: The blade server must have a hard-drive/SSD or a hard-drive blank installed in each drive bay.

1. Drive activity indicator (green) 2. Drive status indicator (green and amber)

NOTE: If the drive is in Advanced Host Controller Interface (AHCI) mode, the status LED (on the right side) does not

function and remains off.


Drive-Status Indicator Pattern Condition

Blinks green two times per second Identifying drive or preparing for removal.

Off Drive ready for insertion or removal.

NOTE: The drive status indicator remains off until alldrives are initialized after system power is applied.Drives are not ready for insertion or removal duringthis time.

Blinks green, amber, and then turns off Drive predicted failure.

Blinks amber four times per second Drive failed.

Blinks green slowly Drive rebuilding.

Steady green Drive online.




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Drive-Status Indicator Pattern Condition

Blinks green three seconds, amber three seconds, and offsix seconds

Rebuild aborted.

iDRAC Direct LED Indicator Codes

NOTE: The iDRAC Direct LED indicator will not light up for the USB mode.

1. iDRAC Direct Status Indicator

The table below displays iDRAC Direct activity when configuring iDRAC Direct using the management port.


Convention iDRAC Direct LEDIndicator Pattern

Condition

A Green Lights green for a minimum of 2 seconds or until file transfer begins.

B Flashing green Indicates file transfer or any operation tasks.

C Green and turns off Indicates that the file transfer is successful.

D Flashing amber Indicates that the file transfer failed.

The table below displays iDRAC Direct activity when configuring iDRAC Direct using your laptop and cable.


iDRAC Direct LEDIndicator Pattern

Condition

Solid green for two

seconds

Indicates that the laptop is connected.

Flashing green (on fortwo seconds and off fortwo seconds)

Indicates that the laptop connected is recognized.

Turns off Indicates that the laptop is unplugged.





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Field Service InformationThe information in this section is specifically for field service personnel who perform installation, diagnosis, and repairactivities. Field personnel are required to know the information and procedures in this section whether or not theyperform all the service tasks. Information in this section is required knowledge, but should never override regional orlocal policy and procedure.

Field Service Overview

Field service information for the Dell ™ PowerEdge ™ M630 includes the following content:

• Dell PowerEdge M630 Overview – High-level description of the Dell PowerEdge M630 that includes features andfunctions, product-to-product comparison and supported operating systems (OS), if applicable. OEM brandinginformation is also included.

• OEM Branding – Information about the OEM features of the Dell PowerEdge M630 including required specialprocesses, notes, callouts that the technician needs to know to service it.

• Safety Precautions – Generic safety precautions for every service event.

• Tools and Utilities – Hand tools, diagnostic tools or utilities, software applications, or GUIs that are required toservice the Dell PowerEdge M630.

• Need to Know – Specific callouts about this system, common error codes, version control for BIOS, firmware orsoftware for OEM, required startup or shutdown sequences, new product technologies, and componentscomparison. For networking products, the switch, user name, and password defaults are included in this section.

• Diagnostics and Indicators – Visual information about the health and state of the system.

• System Board Connectors – Information on system board connectors.

• System Board Jumper Settings – Information on system board jumper settings.

• Disassembly and Reassembly – Instructions for removing and replacing each replaceable part, with informationneeded before, during, and after parts replacement.

• Update BIOS – Information and procedures for updating the BIOS after the Dell PowerEdge M630 has been serviced.

• Restoring the Service Tag Using Easy Restore – The procedure for updating the Service Tag. This procedure isrequired when a system board or chassis is replaced to ensure that the system functions properly and can be verified.

• Installation – The placement, information about rack rails, cabling, system initialization, and basic configuration.

• Quick Resource Locator – Information on the new Quick Resource Locator (QRL) feature on the System InformationLabel (SIL).




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Product Overview

The Dell ™ PowerEdge ™ M630 is an ultra-efficient blade server combining up to 36 cores of Intel® processing powerand 24 DIMMs of DDR4 memory in a dense, easy-to-manage platform ideal for data center workloads.

Product Positioning

The Dell PowerEdge M630 designed for use with the Dell PowerEdge M1000e blade enclosure and Dell PowerEdge VRTXconverged infrastructure. The Dell PowerEdge M630 offers exceptional scalability in environments ranging from IT as aservice providers and private clouds to remote and branch offices.

• Performance

– 2S Intel® Xeon® E5–2600 v3 Processors (18 cores max each CPU; 36 total max cores, full server processor stack

– 2 x PCIe x8 Gen 3 Mezzanine Cards

– Half-height single slot blade

– Dual SD cards for redundant hypervisor

• Availability

– 24 DIMMs (768 MB)

– Up to 4 x 1.8” SSD or two 2 x 2.5”

– PERC 9/SAS HBA/Chipset SATA

– Management: iDRAC8 Enterprise with Lifecycle Controller 3.x

– Hot-plug, redundant power/cooling (chassis)

• Expandability, I/O, Storage

– Up to two Mezzanine Cards





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There are two recognized types of ESD damage: catastrophic and intermittent failures.

• Catastrophic —The damage causes an immediate and complete loss of device functionality. An example ofcatastrophic failure is a memory DIMM that has received a static shock and immediately generates a "No POST/NoVideo" symptom with a beep code emitted for missing or nonfunctional memory.

NOTE: Catastrophic failures represent approximately 20 percent of ESD-related failures.

• Intermittent —The DIMM receives a static shock, but the tracing is merely weakened and does not immediatelyproduce outward symptoms related to the damage. The weakened trace may take weeks or months to melt, and in

the meantime may cause degradation of memory integrity, intermittent memory errors, etc.

NOTE: Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate ofintermittent failures means that most of the time when damage occurs, it is not immediately recognizable.

The more difficult type of damage to recognize and troubleshoot is the intermittent (also called latent or “walkingwounded”) failure. The following image shows an example of intermittent damage to a memory DIMM trace. Althoughthe damage is done, the symptoms may not become an issue or cause permanent failure symptoms for some time afterthe damage occurs.

Do the following to prevent ESD damage:

• Use a wired ESD wrist strap that is properly grounded.

The use of wireless anti-static straps is no longer allowed; they do not provide adequate protection.

Touching the chassis before handling parts does not ensure adequate ESD protection on parts with increasedsensitivity to ESD damage.

• Handle all static-sensitive components in a static-safe area. If possible, use anti-static floor pads and workbench pads.

• When handling static-sensitive components, grasp them by the sides, not the top. Avoid touching pins and circuitboards.



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• When unpacking a static-sensitive component from its shipping carton, do not remove the component from the anti-static packing material until you are ready to install the component. Before unwrapping the anti-static packaging, besure to discharge static electricity from your body.

• Before transporting a static-sensitive component, place it in an anti-static container or packaging.

The ESD Field Service Kit

The unmonitored Field Service kit is the most commonly used. Each Field Service kit includes three main components:anti-static mat, wrist strap, and bonding wire.

Anti-Static Mat

The anti-static mat is dissipative and should be used to safely place parts on during service procedures. When using ananti-static mat, your wrist strap should be snug and the bonding wire should be connected to the mat and to bare-metalon the system being worked on. Once deployed properly, service parts can be removed from the ESD bag and placeddirectly on the mat. Remember, the only safe place for ESD-sensitive items are in your hand, on the ESD mat, in thesystem, or inside a bag.

Wrist Strap and Bonding Wire

The wrist strap and bonding wire can be either directly connected between your wrist and bare metal on the hardware ifthe ESD mat is not required, or connected to the anti-static mat to protect hardware that is temporarily placed on themat. The physical connection of the wrist strap and bonding wire between your skin, the ESD mat, and the hardware isknown as bonding. Use only Field Service kits with a wrist strap, mat, and bonding wire. Never use wireless wrist straps.

Always be aware that the internal wires of a wrist strap are prone to damage from normal wear and tear, and must bechecked regularly with a wrist strap tester in order to avoid accidental ESD hardware damage. It is recommended to testthe wrist strap and bonding wire a minimum of once per week.




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ESD Wrist Strap Tester

The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is best practice toregularly test the strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the best

method for doing this test. If you do not have your own wrist strap tester, check with your regional office to find out ifthey have one. To perform the test, plug the wrist-strap’s bonding-wire into the tester while it is strapped to your wristand push the button to test. A green LED is lit if the test is successful; a red LED is lit and an alarm sounds if the test fails.

Insulator Elements

It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are insulatorsand often highly charged.





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Consider the Working Environment

Before deploying the ESD Field Service kit, assess the situation at the customer location. For example, deploying the kit

for a server environment is different than for a desktop or portable environment. Servers are typically installed in a rackwithin a data center; desktops or portables are typically placed on office desks or cubicles.

Always look for a large open flat work area that is free of clutter and large enough to deploy the ESD kit with additionalspace to accommodate the type of system that is being repaired. The workspace should also be free of insulators thatcan cause an ESD event. On the work area, insulators such as Styrofoam and other plastics should always be moved atleast 12 inches or 30 centimeters away from sensitive parts before physically handling any hardware components.

ESD Packaging

All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are preferred.However, you should always return the damaged part using the same ESD bag and packaging that the new part arrived in.The ESD bag should be folded over and taped shut and all the same foam packing material should be used in the originalbox that the new part arrived in.

ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts should neverbe placed on top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on theESD mat, in the system, or inside an anti-static bag.




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Transporting Sensitive Components

When transporting ESD-sensitive components such as replacement parts or parts to be returned to Dell, it is critical toplace these parts in anti-static bags for safe transport.

ESD Protection Summary

It is strongly suggested that all field service engineers use the traditional wired ESD grounding wrist strap and protectiveanti-static mat at all times when servicing Dell products. In addition, it is critical that engineers keep sensitive partsseparate from all insulator parts while performing service and that they use anti-static bags for transporting sensitivecomponents.

Lifting Equipment

WARNING: Do not lift greater than 50 pounds. Always obtain assistance from another person or persons, or use

a mechanical lifting device.

Adhere to the following guidelines when lifting equipment:

1. Get a firm balanced footing. Keep your feet apart for a stable base, and point your toes out.

2. Bend your knees. Do not bend at the waist.

3. Tighten stomach muscles. Abdominal muscles support your spine when you lift, offsetting the force of the load.

4. Lift with your legs, not your back.

5. Keep the load close. The closer it is to your spine, the less force it exerts on your back.

6. Keep your back upright, whether lifting or setting down the load. Do not add the weight of your body to the load.Avoid twisting your body and back.

7. Follow the same techniques in reverse to set the load down.





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Tools and Utilities

A set of tools is required to service the Dell ™ PowerEdge ™ M630 system. The following images illustrate the requiredtools and the optional tools.

Hand Tools

A set of required and optional tools are necessary to service the product.

• #1 and #2 Phillips screwdrivers

• T8 and T10 Torx drivers

• Wrist grounding strap connected to ground• Hex nut driver – 5 mm

• ESD mat

• Needle-nose pliers help in disconnecting cables andconnectors in hard-to-reach locations.

• Small flat-head screwdriver helps in disconnectingsmall cables from boards.

Need to Know

Before you begin servicing the Dell ™ PowerEdge ™ M630, you must read the following information:

• Critical callouts

• NUDDs

• Common error messages

• Version control• Startup/shutdown sequence

Critical Callouts

Restoring the Service Tag Using Easy Restore

The easy restore feature allows you to restore system Service Tag, iDRAC License, UEFI Configuration, OEM ID Module,and the System Configuration Data after replacing the system board. All data is backed up in a backup flash deviceautomatically. If BIOS detects a new system board, and the Service Tag in the backup flash device, BIOS prompts the userto restore the backup information.




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NOTE: In a scenario where both control panel and system board are dispatched, it is recommended to replace thecontrol panel first and attempt a power on to complete the backup process. Then proceed to replace the systemboard.

NOTE: The OEM ID Module restore is available on iDRAC8 v2.20.20.20 and above.

To restore the Service Tag using Easy Restore:

1. Power on the system.

If BIOS detects a new system board, and the Service Tag is present in the backup flash device, BIOS displays theService Tag, the status of the license, and the UEFI Diagnostics version.

2. Press Y to restore the Service Tag, license, and diagnostics information, or;

Press N to navigate to the Lifecycle Controller based restore options, or;

Press to restore data from a previously created Hardware Server Profile.

After the restore process is complete, BIOS prompts to restore the system configuration data.

3. Press Y to restore the system configuration data, or;

Press N to use the default configuration settings.

After the restore process is complete, system reboots.

Trusted Platform Module (TPM) Installation

In 13G, the Trusted Platform Module (TPM) chip is on a Plug In Module (PIM). The 13G TPM is bound to one and only onesystem board.

CAUTION: Do not attempt to remove the TPM plug-in module from the motherboard. Once the TPM plug-in

module is installed, it is cryptographically bound to that specific motherboard. Any attempt to remove an

installed TPM plug-in module breaks the cryptographic binding, and it cannot be re-installed or installed onanother motherboard.

New TPM chip has to be dispatch, if system configured with TPM chip. Field engineer needs to install a new TPM chipafter system board replacement.

To install the TPM chip, use the following steps:

1. Align the edge connectors on the TPM with the slot on the TPM connector.

2. Insert the TPM into the TPM connector such that the plastic bolt aligns with the slot on the system board.

3. Press the plastic bolt until the bolt snaps into place.



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Item Description

1 TPM

2 TPM Connector

3 Slot of the TPM Connector

4 Plastic Bolt

5 Slot on the System Board

Heat Sink Options

There are 2 types of heat sink available on the Dell ™ PowerEdge ™ M630.

• For processors up to 105 W, 120 W, or 135 W, use heat sinks of 68 mm width.

• For processors up to 135 W (four core, six core, or eight core) or 145 W, use heat sinks of 86 mm width.




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Heat Sink Artwork Label for CPU 1 and CPU 2

NOTE: All replacement heat sinks will be copper-colored.

NOTE: Mixing processors of different wattages is not supported.

Heat Sink with DIMM Installation Rule





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Heat Sink Options

Heat Sink CPU DIMM (Max) DIMM (RAS)

68 mm (93 GVP

and D4T8T)

≤ 135W/12C 24 3 DIMM per

Channel (DPC)

24 3 DPC

86 mm (XCDC0and CPC1C)

≥135W/8C/6C/4C

20 Ch 0/2: 3 DPC

Ch 1/3: 2 DPC

16 2 DPC

DDR4 Memory Installation Procedure

Do not rock or zip the DIMM. The DIMM is not flat along bottom edge.

C-Stack — Mini-PERC Mounting

The new mini-PERC mounting is secured with two screws on the cable connector side. In 12G, the mini-PERC ismounted with two tabs.




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New 2.5” Hard Drive Carriers

To transition to plastic carriers, follow the below steps:

• Add two plastic rails.

• Add two EMI springs.

• 12G carriers physically fit in 13G servers, but are NOT supported.

• Less heat retention:





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– Thermal effects (metal rails retained heat that will affect thermals within 13G chassis).

• Cost effective.

New 1.8” SSD Carrier

12G to 13G transition:

• New design for 13G.

• Different design than what is currently used on 12G blade servers.

Accessing iDRAC Interface over Direct USB Connection (iDRAC Direct)

With the 13th generation of servers, one of the front panel USB ports is used by iDRAC for management purposes, such asfor pre-provisioning and troubleshooting. The port has an icon to indicate that it is a management port. All13th generation servers with LCD panels support this feature. This port is not available in a few of the 200-500 modelvariations that are ordered without the LCD panel.




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Item Description

1 iDRAC USB Management Port

In 13th generation servers, the new iDRAC Direct feature allows you to directly connect your laptop or PC USB port to theiDRAC USB management port. This allows you to interact directly with iDRAC interfaces (such as the Web browser,RACADM, and WSMAN) for advanced server management and servicing.

You must use a Type A/A USB cable to connect the laptop (a USB Host Controller) to the iDRAC in the server (a USBdevice). No special software is required on the management laptop/PC. The supported OS are Windows® 7, Windows 8,and Ubuntu 12.

When iDRAC behaves as a USB device and the management port mode is set to Automatic, the USB port is always usedby iDRAC. The port does not switch automatically to the OS.





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To access the iDRAC interface over the USB port:

1. Connect a Type A/A USB cable from the laptop to the iDRAC Direct USB management port. The management LED(if present) turns green and remains ON for two seconds.

NOTE: The Type A/A USB cable is not included with the purchase of Dell PowerEdge servers. The cable can bepurchased online through Dell Total Solutions.

2. Wait for the IP address to be assigned to the laptop (169.254.0.4) and iDRAC (169.254.0.3).

3. Start using the iDRAC network interfaces such as the Web interface, RACADM, or WS-Man.

4. When iDRAC is using the USB port, the LED blinks, indicating activity. The blink frequency is four blinks per second.

5. After using, disconnect the cable. The LED will turn itself off.

Enhanced BIOS Key

There is enhanced key behavior during POST, which allows the customer to toggle between // functionsduring POST.

Product Comparison

The following table compares the Dell ™ PowerEdge ™ M630 to the Dell PowerEdge M620 blade server.



Processors Intel® Xeon® processor E5-2600 v2product family

Intel Xeon processor E5-2600 v3product family

Memory • 24 x DDR3 RDIMM, UDIMM, andLRDIMM

• Up to 768 GB

• 24 x DDR4 RDIMM and LRDIMM

• Up to 768 GB

Disk Drive 2.5” – 6Gb SAS, 3Gb SATA 2.5” – 12Gb SAS/6Gb SATA, 1.8” – 6GbSATA

RAID Controller S110

H310 - Mini FX2 Specific

S130

H330, H730, and H730P – Mini Blade




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PCIe SSD Yes Yes

Backplane Type 2 x 2.5”

• SATA only

• SAS/SATA

• PCIe SSD

2 x 2.5” — New backplane design

• SATA only – From PCH

• SAS/SATA – From PERC

• PCIe SSD – From PCIe Extender

Module4 x 1.8”

• uSATA – From PCH

• uSATA – From PERC

NIC bNDC: 2 x 10GbE, 4 x 10GbE bNDC: 2 x 10GbE, 4 x 10GbE, 4 x 1GbE

USB USB 2.0 One USB 2.0 and one USB 3.0 (frontports)

I/O Up to two x8 PCIe Gen3 SFFMezzanine

• Up to two x8 PCIe Gen3 SFFMezzanine

• Up to two x8 Gen2 PCIe switch

Mezzanine for VRTX

Heat Sink Type 57mm (24 DIMMs), 77mm (20 DIMMs),97mm (16 DIMM-Fresh Air)

68mm (24 DIMMs), 86mm (20 DIMMs)

Fresh Air support with limited CPU andmemory sku.

Trusted Platform Module (TPM) On board TPM 1.2 TPM Modular (FIPS TPM 1.2)

Remote Management iDRAC7 (Express/Enterprise) withLifecycle Controller 2

iDRAC8 (Express/Enterprise) withLifecycle Controller 3

Internal Dual SD Module (IDSDM) Yes, on Management Riser Yes, on IDSDM

Common Error Messages

The Event Message Reference contains the error and event information generated by firmware and other agents thatmonitor system components. These events might be logged, presented to the user on one of the system managementconsoles, or both logged and displayed.

Each event consists of the following fields:

Event Message Fields

Item Description

Message ID The unique alphanumeric identifier for the event. Thisidentifier can be up to eight characters long and consistsof two parts:

• Message ID Prefix — Up to four alphabetic characters.

• Message ID Sequence — Up to four numeric digits.

Message The message text that is displayed to the user or logged asa result of the event. If the message has variable content init, the variable substitution is reflected by text in italics.These substitution variables are described in theArguments field of the event.



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