1. Personal Profile1.1 Introduction1.2 Education1.3 Employment

2. Qualification2.1 ROHM Electronics2.2 Philips Electronics NV2.3 NXP Semiconductors

3. Competencies

Mechanical Engineer

20 years in Manufacturing

Industry18 years in Electronics

Engineering, Manufacturing, Purchasing

Worked & Lived in Philippines,

Japan and

Hong Kong

Loves Surfing the Internet

and Dog Walking

Avid Dog Lover – 6 Dogs

Reynaldo Garcia

De Guzman

Rey“King”

in Spanish

1.1 Introduction

1.2 EducationPrimary School

Gen T De Leon Elementary SchoolSecondary School

Philippine Science High School

University of the Philippines Bachoelor of Science in Mechanical Engineering

Registered Mechanical Engineer (RME)

Six Sigma NXP

Mastering the Semiconductor Business Ashridge Business School

Product of the Government School System

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1.3 Employment2 years

Philippine CompanyMetal and Machine Works

Engineering Design, Fabrication, Installation7 years

Japanese CompanyIntegrated Circuit

Equipment Maintenance, Process Engineering

5 years

CATV AmplifiersDutch Company

Manufacturing

6 years

Dutch CompanyDiscrete and Mix Signals ICs

Global Sourcing

Japan, Philippines, China, Malaysia, Thailand, - 3B USD per Yr- Ranked #20 in the Semicon- Ranked #1 for MCR and MCC

- Lighting, Medical, Consumer, Semiconductor- 30BUSD per yr, Ranked #5 in Semicon- CATV Amplifier 60MUSD per Yr, Ranked #1 worldwide

Philippines, Hong Kong, Thailand, China, Malaysia, Taiwan, Netherlands- IC, Modules, NFC, Sensor, Powers- 6BUSD per YR, Ranked #15 in Semicon- Ranked #1 for Trans, Diodes, RFID, NFC

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20Mounter

Sawing Die BonderWire Bonder

Molding Plating

Japanese Mindset

FMEA, SPC BM

PM LEAN/Kaizen

5S,4M. 5W1H, 3Why’s,7QC Tools, Lean, PDCA 2.1 Qualification

MuraMuda MuriLEAN TOOLS

1 piece Manufacturing5S Visual ManagementPoka YokePoint of Use StorageVSMStandard WorkSMEDKanbanLevel MixTPMFMEA

7 QC TOOLS

Flow ChartChecklist / Tally SheetControl ChartHistorgramIshikawa DiagramParretto ChartScatter Diagram

7 MANAGEMENT / PLANNING TOOLS

Node ChartAffinity DiagramInterrelationship DiagramMatrix DiagramProcess DeiagramPriority DiagramTree Diagram

5 PROCESS IMPROVEMENT TOOLS

SIPOCPDCAFMEA5WhysRoot Cause Analysis

8 Waste

TransfortInventoryMotionWatiting TimeOver ProcessingOver ProductionDefectsTalent

Japanese Concepts

6S5M5W+2HQCDSMAndonJIT

LEAN TPS TQM

EvaluateDO

Opportunities For Improvement

Analyze

Solution

PLAN

ReDo / Standardize / Share / Recognize / AwardACT

Confirm the ResultCHECK

ROHM

Map Measure

Explore Evaluate

Define Develop

Impreove Implement

Control Conform

PHILIPS / NXP

ROHM Electronics Philippines Inc (Senior Section Manager, 1993 – 2000) - Start Up of the first ROHM Electronics IC Factory in the Philippines - Thorough knowledge and Hands On practice of Japanese Manufacturing system and mindset

o Kaizen / Lean Manufacturing o 7QC tools o 5S o FMEA

- Transfer, Installation, Maintenance and Improvements of the whole Front Line Machineries (2 Mounters, 10 Dicers, 200 Die Bonders, 600 Wire Bonders, 100 Molding Machines, 8 Plating Equipments)

- Machine Design and Process Improvements o Multi Gang Sawing o DB pick up sensor o DB Universal Pickup tool o Localization (Japan to Philippines to Thailand o WB Capillary Refurbishing, o Universal adjustment jig o Floating Press Plate (Leaf Spring Design) o 3 piece Heater Insert o Speed Up of Equipment (Loading Gear Replacement, Bond Parameter increase, Plunger design Change) o Energy Conservation initiative (Reduction of Electrical Usage)

- Supervision and Management of Technical Team o Technical and Systems Training o Periodic Performance Review o Team Bonding Activities o Licensing of Engineers and Technicians

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2.1 Qualification (con’t)

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CATV Amplifier Assembly and Test 60+ MUSD/ Year, Ranked # 1 in sales worldwide

Manufacturing

Supply Chain

Quality

Engineering

Production

Labor Intensive, 1000+ Operators and 50 Sups / Engs/Techs

Kaizen Project to Generate Savings amounting to 10 MUSD/ Year

2.2 Qualification

Philips Semiconductors Philippines Inc (Manufacturing Manager, 2000 – 2005) - Daily Operational Performance Reviews and Gap Intervention (Outputs, Machine Downtime, Quality Trends, Special Issues) - Improvement Project Implementation with Multi-cultural Cross Functional Teams

o Line Automation (Die Attach, Testing and Cap Sealing) leading to faster throughput time and fewer manpower o Lead Time Reduction (Ceramics) o Change of Heat Sink material (Thinner Nickel Plating, reduced copper content) o Transparent Caps to prevent pirated or fake products o Subcontracting of none core Processes (Transformer Making) o Change from Gold to Aluminum bonding o Line Layout Optimization o Operator certification system

- New Product Introduction o Optical CATV Amplifier Line o Low Cost CATV Amplifier (Compete with Chinese Design)

- Motivational Activities with Subordinates o Team Bonding Sessions o Bi Annual Performance Review and Career Development Planning o Quarterly Town Meetings

- Periodic Update to Top Management of Business Balance Score Card /Key Performance Indexes Status (Daily Calls, Emails, Weekly Conference calls and Meetings)

- Interaction with Labor and Government Representatives to prevent or resolve government regulatory issues.

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2.2 Qualification (con’t)

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Global Sourcing Manager

Assembly Plants

Business Line

Engineering

2.3 Qualification

Sourcing Strategy200+ MUSD/ Year Spend

Year on Year Reduction of 5%

Worldwide Vendors

NXP Semiconductors Hong Kong LTD (Senior Sourcing Manager, 2005 – 2011) - Developed and implemented the Sourcing Strategies for Bonding Wires, Lead Frames, Molding Compound, and Packing

Materials for all NXP assembly sites. - Working with cross functional teams to develop and implement materials or process improvement projects to reduce operational

cost o Gold to copper wire conversion o Thinner Gold Wires introduction and conversion o Reduced gold wire content via alloy bonding wires o Reduced shorted wires via insulated bonding wires o Change to low cost carrier tapes from Polycarbonate (PC) to Polystyrene (PS) to Polyethylene (PET) to Paper o Change from Plastic to Paper reels o Thinner Packing Materials introduction and conversion o Green Mold Compound conversion o Low Cost Mold Compound (Change of Resin, Filler or Chemical composition) o Recycling (Packing Materials, Wire Spools, etc) o Vendor Reduction (Trivial Many to Significant Few) and Business Partnership Development o Consolidation of Pellet Sizes and Classes o Subcontracting of none core Processes (Pelletizing of Mold Compound) o Selective Plating (Reduce Silver or Gold Spot size and thickness, One side Nickel plating) o None MOQ procurement o Gold Wire Spool standardization (size and color) o Multi Row Lead Frame processing (2 rows to 4 rows) o Increased Spool Length to reduce Line Down Time (500m to 1000m Carrier Tapes, 5000m Gold Wires, etc)

- Negotiation with Suppliers to Achieve Best in Class Commercial Terms o Reduced Payment Terms from 90 days to 30 days on high spend items o Implementation of Vendor Managed Inventories to reduce in-house stocks (Ship to Stock) o Optimized MOQ (Solder Wires, Packing Materials) o Develop with Vendors Near-by Custom Bonded Warehouse concept o Auction of Scrap Materials (From Local to Global)

- Supplier Management o New Vendor Identification, Evaluation, Introduction, Rating, Improvement o Standardized way of working through eSourcing,(Evaluation and Acceptance of RFP / RFQ via On-Line Reverse

Auction to both vendors and end users using Ariba Platform) o Quality Issue and Claims Resolution (Solder Voids from Die Attach Paste, Metal Particles in Molding Compound, Peel

Off Tape Covers, Lead Frame Discoloration, etc) o Contract Management: Negotiation, Acceptance and Signing via three way discussion with Corporate Legal, Purchasing

and Vendor o Internal and Supplier Quality Audits based on TS16949

- Direct Involvement in Multi-Cultural Project Teams o Material Roadshows, Improved Forecasting, Japan Tsunami Supply Availability, Line Transfer to China and Malaysia) o Chairmanship of Material Commodity and Project Teams

- Resolution of High Level Line issues Covering Quality, Delivery or Cost (Japan Tsunami, Factory Fires from Supplier, Sudden Upturn or Downturn, etc.)

- Periodic Communication and Presentation to Top Management of Key Achievement, Project Updates and BBSC/KPI Status (Weekly Conference Calls, Monthly Management Meetings, Quarterly Conventions)

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2.3 Qualification (con’t)

NXP Semiconductors Hong Kong LTD (Senior Sourcing Manager, 2005 – 2011) - Developed and implemented the Sourcing Strategies for Bonding Wires, Lead Frames, Molding Compound, and Packing

Materials for all NXP assembly sites. - Working with cross functional teams to develop and implement materials or process improvement projects to reduce operational

cost o Gold to copper wire conversion o Thinner Gold Wires introduction and conversion o Reduced gold wire content via alloy bonding wires o Reduced shorted wires via insulated bonding wires o Change to low cost carrier tapes from Polycarbonate (PC) to Polystyrene (PS) to Polyethylene (PET) to Paper o Change from Plastic to Paper reels o Thinner Packing Materials introduction and conversion o Green Mold Compound conversion o Low Cost Mold Compound (Change of Resin, Filler or Chemical composition) o Recycling (Packing Materials, Wire Spools, etc) o Vendor Reduction (Trivial Many to Significant Few) and Business Partnership Development o Consolidation of Pellet Sizes and Classes o Subcontracting of none core Processes (Pelletizing of Mold Compound) o Selective Plating (Reduce Silver or Gold Spot size and thickness, One side Nickel plating) o None MOQ procurement o Gold Wire Spool standardization (size and color) o Multi Row Lead Frame processing (2 rows to 4 rows) o Increased Spool Length to reduce Line Down Time (500m to 1000m Carrier Tapes, 5000m Gold Wires, etc)

- Negotiation with Suppliers to Achieve Best in Class Commercial Terms o Reduced Payment Terms from 90 days to 30 days on high spend items o Implementation of Vendor Managed Inventories to reduce in-house stocks (Ship to Stock) o Optimized MOQ (Solder Wires, Packing Materials) o Develop with Vendors Near-by Custom Bonded Warehouse concept o Auction of Scrap Materials (From Local to Global)

- Supplier Management o New Vendor Identification, Evaluation, Introduction, Rating, Improvement o Standardized way of working through eSourcing,(Evaluation and Acceptance of RFP / RFQ via On-Line Reverse

Auction to both vendors and end users using Ariba Platform) o Quality Issue and Claims Resolution (Solder Voids from Die Attach Paste, Metal Particles in Molding Compound, Peel

Off Tape Covers, Lead Frame Discoloration, etc) o Contract Management: Negotiation, Acceptance and Signing via three way discussion with Corporate Legal, Purchasing

and Vendor o Internal and Supplier Quality Audits based on TS16949

- Direct Involvement in Multi-Cultural Project Teams o Material Roadshows, Improved Forecasting, Japan Tsunami Supply Availability, Line Transfer to China and Malaysia) o Chairmanship of Material Commodity and Project Teams

- Resolution of High Level Line issues Covering Quality, Delivery or Cost (Japan Tsunami, Factory Fires from Supplier, Sudden Upturn or Downturn, etc.)

- Periodic Communication and Presentation to Top Management of Key Achievement, Project Updates and BBSC/KPI Status (Weekly Conference Calls, Monthly Management Meetings, Quarterly Conventions)

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2.3 Qualification (con’t)

o Strategy Formulation, Buy Off and Implementation o Factory Transfer, Qualification and Performance Improvement o BBSC KPI Performance Monitoring and Gap Intervention o Project Management in a Multicultural, Cross Functional and Highly Matrix Organization o New Product Introduction (from Launching to Mass Production) o Continuous Improvement Projects Development and Implementation (Kaizen, Lean Manufacturing, Six Sigma

Blackbelt) o Communication and Presentation to Key Stakeholders (Suppliers, Peers, Government Representatives, Labor

Union, Business Line, Customers and Corporate Top Management) o Technical Know How in High-End Electronic Manufacturing Equipment and Process o People Handling Skills in Personnel Management, Performance Appraisal and Motivational Activities o Supplier Development, Top Level Negotiation and Contract Management o Business Relationship and Understanding of Way of Working with China Based Suppliers o High Level and Urgent Problem Quick Response and Resolution o Multi Language Proficiency in English (Native), Filipino (Native) Japanese (Business), Chinese (Conversational) o Overall Profit and Loss Management and Accountability o Computer Literacy (Windows, SAP, ERP, eSourcing, Datawarehouse)

3. Competencies

PRIORITY MATRIX - Rey G De Guzman - Senior Commodity Manager (Lumileds)ITEM DESCRIPTION Weight Low Med High Actual Max REMARKS

1 2 3 4 5 Score ScoreREQUIREMENTSEducation . Masters or Bachelor Degree in

Material Engineering, Mechanical or Electrical Engineering.

5 5 25 25BS Mechanical Engineering from University of the Philippines gained via NSTA Scholarship. Registered Mechanical Engineer with Professional Regulation Commissio.

. Candidates with MBA will have added advantage. 5 5 25 25

Mastering the Semiconductor Business, a mini MBA course from Ashridge Business School, UK given to High Potential Candidates of PHILIPS. Post Training in Six Sigma Blackbeltin NXP

Experience . At least 7 to 12 years of relevant working experience, preferably in semiconductor backend / PCB manufacturing industry.

5 5 25 25

20 year Manufacturing Industry experience. 18 years from top Semiconductor Multinational Companies (ROHM, PHILPS, NXP), covering Engineering, Manufacturing and Global Sourcing in Back End operations.

RESPONSIBILITIESA) Commodity Strategy Development

. Develop and deploy commodity strategies including risk assessment

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- Developed and executed the Global Sourcing Strategy for direct materials with an annual spend portfolio of over 200MUSD having 50+ key suppliers and covering the 6 NXP Assembly Sites (HK, CN, TW, PH, MY and TH) and The Netherlands. - Coverage includes Lead Frames, Glue, Solder Adhesives, Bondwires, Epoxy Mold Compound and Packing Materials, plus other materials requiring top level discussion (lead wire for diodes, magnetic core for CATV, etc)

. Drive the supply market analysis and technology scouting

5 5 25 25

- Facilitated supplier roadshows to gain new inputs on technology and industry trends. - Participated in exhibits and conventions. - Execute data mining, market research and benchmark analysis to support and define directions for price negotiations, strategic initiatives, and key decisions. - Coordinate with Innovation and Engineering team to gather or inform new developments in material technology.

B) Spend Management

. Define key cost drivers and deploy pricing principles and savings targets

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- Oversee 50+ global vendors, with 2,000 parts numbers used for IC, Transistors, Diodes, Power, Sensors, RFID, NFC and Modules. Familiarity in using ERP, SAP, Datawarehouse. - Expert knowledge of price formula calculation, bottlenecks, leadtime, and market dynamics

. Manage the global negotiation process and deliverables

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Spearheaded the price negotiation and cost reduction workshops (CReW) to generate ideas for savings Increased the payment terms from 30 to 90 days for top vendors with spend coverage of 100+MUSDIn depth understanding of China vendors and supply chain processes. Implemented VMI with Consignment. Knowledgeable in VAT Rebates.

. Report on team performance (projects, negotiation, financial results)

5 5 25 25Owns and drives the BBSC for the concerned commoditiesReport results on a weekly, monthly and quarterly basis, and share best practice semiannually to all key stakeholders.

. Manage the saving projects (TCO / Strategic cost management)

5 5 25 25Define, Develop and Manage cost reduction projects togetehr with the Commodity Team and key stakeholders, as agreed in the CSD.

C) Contracting . Manage supplier contracting process according to (ICAP) guidelines.

5 5 25 25Person responsible for developing, executing and closing NDA, GPA, TPD and QDS. Initiates the 3 party discussions between Sourcing, Vendor and Corporate Legal departments. Formalize the activity using the Purchase Contract Approval process.

. Ensure the contents of the master data is consistent and accurate

5 5 25 25Knowledgeable on Contract Management System (CMS)

D) Supply Base Management & Development

. Define approved supplier l ists and differentiated supplier relationships 5 5 25 25

Spearheaded the optimization of NXP Semiconductor’s Preferred Supplier List (PSL). Expedited the West to East movements of suppliers, sourced and developed China and Asia based merchants, and consolidated vendor base from trivial many to significant few.

. Manage right sizing of the supplier base and component diversity 5 5 25 25

Spearheaded the optimization of NXP Semiconductor’s Preferred Supplier List (PSL). Expedited the West to East movements of suppliers, sourced and developed China and Asia based merchants, and consolidated vendor base from trivial many to significant few.

. Ensure implementation of the commodity strategy in: supplier selection, component design-in, Single/second sourcing, product l ife cycle pricing and Early Supplier Involvement.

5 5 25 25

Instrumental in professionalizing the Supplier Management system by partnering with the program management office in reviewing, revising and standardizing the NXP Semiconductors corporate purchasing manualEnsure that all sourcing activities are aligned with the agreed CSD.Established networks and relationships with key suppliers for in Asia, Europe and US. (Sumitomo, Mitsui, Henkel, Advantek, ITW, Heraeus, Muehlbauer, Possehl, KNS, FCI, Enomoto, Hitachi, Gotoh and 40+ other vendors)

. Improve supplier performance (measured via GSRS) of key suppliers and 5 0 0

Owns and drives the Global Supplier Rating System for Materials (GSRS-M) covering Technology, Quality, Delivery, and Cost. Conducts Quarterly Business Review (QBR)Meeting with vendors, together with the cross functional team (purchasing, engineering, quality), agree and implement improvement activities as needed

mitigate supply risk via risk assessments and mitigation plans

5 5 25 25Knowledgeable in conducting SMRA (Supplier Market Risk Analysis)

E) Supply Quality & Sustainability

. Ensure compliance to supplier release/approval process and sustainability guidelines

5 5 25 25

- Introduce, Conduct SQS Audit and Qualify new vendors in the supply based as needed (ie. CPAK, Sumitomo). - Communicate and coordinate the accomplishment and submission of sustainability requirements (Code of Conduct, Supplier Self-Assessment, Hazardous and Banned Substances Declaration, Restricted Substances Declaration, Conflict Materials Declaration)

. Manage the deliverables of the supplier development process for selected key suppliers with a performance gap.

5 5 25 25

- Acts as the central point of escalation for urgent issue resolution requiring top management intervention. Covers line stop, quality problems, indemnification and liabilities. Available 24/7 to mitigate and find resolution. - Conducts Quarterly Business Review (QBR)Meeting with vendors, together with the cross functional team (purchasing, engineering, quality), agree and implement improvement activities as needed

F) People Management

. Define and deploy commodity target for commodity buyers and organize performance review with input of Co-assessors

5 5 25 25

- Leadership of the NXP Semiconductors Commodity Team. Rebuild the organization from the ground up. Drive the team to formulate, deploy and manage the material roadmap and process enhancement projects in accordance with the global sourcing strategy. Periodically communicate the progress status to top management - Collaborated with factory engineering in NPI activities. Participated in the development of UTLP, Micro USB, RFID and NFC product lines. - Experienced in motivating and influencing cross functional indirect reports across a highly matrix organization (12 purchasing engineers in 6 assembly sites)

. Provide regular feedback to CT members on their performance

5 5 25 25

- Hands on experience in PDP, Performance Appraisal, Coaching and Succession planning. - High level of written, oral communication and presentation skills. Fluency in English and Tagalog. Conversational skills in Japanese and basic Chinese. Multi-Cultural awareness and wears different hats for different occasions. Professional computer skills in Excel, PowerPoint, Outlook.

Others Flexibility to Relocate and Travel 5 5 25 25 Can relocate to Singapore as needed. 100% flexibility to travel since living alone in HK. Immediately Available to be on board at short notice

Total 500 500

3. Competencies (con’t)