PECVD DRIE Anelva Sputter Dry Etch– Tool status Update Feb 2014 DRIE – Load lock O-Ring changed....
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pe cvd- office hrs Dr ie- non office hrs rie fl- office hrs rie cl- non office hrs sputter 1- office hrs sputter 2 - non office hrs E- be am evptr-office hrs CP D - non office hrs RF-Anelva Sputtering- of fi ce hrs Thermal Evaporator- no n of fice hrs 0 100 200 300 400 500 600 Equipment Utilization Chart- February 2014 Total hrs
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Transcript of PECVD DRIE Anelva Sputter Dry Etch– Tool status Update Feb 2014 DRIE – Load lock O-Ring changed....
pecvd- of-fice hrs
pecvd-
non of-fice hrs
Drie- of-fice hrs
Drie-
non of-fice hrs
rie fl- of-fice hrs
rie fl-
non of-fice hrs
rie cl- of-fice hrs
rie cl-
non of-fice hrs
sputter 1- of-fice hrs
sputter 1-
non of-fice hrs
sputter 2- of-fice hrs
sputter 2 -
non of-fice hrs
E-beam
evptr-of-fice hrs
E-beam
evptr-
non-of-fice hrs
CPD - of-fice hrs
CPD -
non of-fice hrs
RF-Anelva
Sputter-ing- of-fice hrs
Equip 1- non of-fice hrs
Thermal Evapo-ra-tor- of-fice hrs
Thermal Evapo-ra-tor- non of-fice hrs
Used
70 2 NaN 32 4 NaN 57 10 NaN 26 2 NaN 180 164 NaN 52 24 NaN 92 40 NaN 31 2 NaN 152 0 NaN 144 8
Not Used
110 358 NaN 146 356 NaN 123 350 NaN 154 358 NaN 0 196 NaN 128 336 NaN 72 308 NaN 114 336 NaN 28 360 NaN 36 352
Down-time
0 0 NaN 2 0 NaN 0 0 NaN 0 0 NaN 0 0 NaN 0 0 NaN 16 12 NaN 35 22 NaN 0 0 NaN 0 0
Un-available
0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180 NaN 0 180
To-tal
180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540 NaN 180 540
50
150
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Equipment Utilization Chart- February 2014
Tota
l hrs
Nov
Dec
Jan
Feb
Nov
Dec
Jan
Feb
Nov
Dec
Jan
Feb
Nov
Dec
Jan
Feb
Nov
Dec
Jan
Feb
Nov
Dec
Jan
Feb
Nov
Dec
Jan
Feb
Nov
Dec
Jan
Feb
Nov
Dec
Jan
Feb
Nov
Dec
Jan
Feb
Used
14
0 76
70
NaN
34
39
27
32
NaN
47
47
37
57
NaN
17
23
32
26
NaN
180
136
176
180
NaN
32
20
52
52
NaN
96
76
104
92
NaN
87
32
18
31
NaN
116
84
120
152
NaN
96
80
104
144
Not Used
82
21
102
110
NaN
144
90
153
146
NaN
132
88
143
123
NaN
162
104
148
154
NaN
0 0 4 0 NaN
140
116
128
128
NaN
84
64
68
72
NaN
93
78
85
114
NaN
64
96
60
28
NaN
84
100
76
36
Downtime
84
114
2 0 NaN
2 6 0 2 NaN
1 0 0 0 NaN
1 8 0 0 NaN
0 4 0 0 NaN
8 4 0 0 NaN
0 0 8 16
NaN
0 25
77
35
NaN
0 0 0 0 NaN
0 0 0 0
Unavailable
0 45
0 0 NaN
0 45
0 0 NaN
0 45
0 0 NaN
0 45
0 0 NaN
0 40
0 0 NaN
0 40
0 0 NaN
0 40
0 0 NaN
0 45
0 0 NaN
0 0 0 0 NaN
0 0 0 0
Total
180
180
180
180
NaN
180
180
180
180
NaN
180
180
180
180
NaN
180
180
180
180
NaN
180
180
180
180
NaN
180
180
180
180
NaN
180
180
180
180
NaN
180
180
180
180
NaN
180
180
180
180
0 180
180
180
180
10
30
50
70
90
110
130
150
170
190
Equipment Utilization Chart- ComparisonT
ota
l h
rs
RIE-Fl RIE-ClE-beam
EvaporatorSputter Coater1
Sputter Coater2 CPD Thermal
Evap.
PECVD DRIE Anelva Sputter
Dry Etch– Tool status Update Feb 2014 • DRIE
– Load lock O-Ring changed . Ordered for new set. – Wafer transport issue – robot arm aligned.– Process: scallop smoothening trials in progress
• DRIE deep etches with S-Type wafer – scallops• FGA anneals @1000DegC show no effect• Scallop etch in RIE • SEM imaging and process tuning in progress
• RIE – Scallops smoothening
• Combined process with DRIE.• using Anisotropic Si etch (RIE) smoothening scallops.• Result – scallop reduced to 145nm from 1.3 µm.• Trials for deeper etch and scallop size to be done.
– SiO2 plastering
• Trench filling by PECVD SiO2 , followed by RIE SiO2 etch. • Work in progress for better conformal deposition.
SiO2 plastering
Reduced scallop
• PECVD vacuum leak in load lock –VAT valve to arrive tomorrow!
Process is done in manual mode
Technical Note
