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PCB workshop at ESTEC October 2009 Page 1 Tesat-Spacecom GmbH & Co.KG PROPRIETARY INFORMATION © Tesat-Spacecom GmbH & Co.KG reserves all rights including industrial property rights and all rights of disposal such as copying and passing to third parties Author: Ingo Kerner File: PCB_Präsentation_Audit_290909 Datum: September 2009 PCB workshop at ESTEC in Noordwijk ESA MIL IPC
Transcript of PCB workshop at ESTEC in Noordwijk - esmat.esa.intesmat.esa.int/materials_news/pcb_workshop/tesat...
PCB workshop at ESTEC October 2009 Page 1Te
sat-
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ecom
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bH &
Co.
KG
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PCB workshop at ESTEC in Noordwijk
ESA MIL IPC
PCB workshop at ESTEC October 2009 Page 2Te
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KG
PRO
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KG
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rves
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ng
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IntroductionIntroduction
Thomas Maihöfer Dipl.- Ing (FH)
1970 Born in Mutlangen 1991 – 1995 Course of studies in surface coating at FH Aalen1995 – 2000 Process Engineer in PCB manufacturing at STP
in Sindelfingen 2001 – 2005 Application Engineer for PCB tools at Kemmer Präzision
in LorchSince 2006 Development Engineer at Tesat Spacecom for PCB
production
Thomas Maihöfer PCB and PlatingTesat Spacecom GmbH & Co. KGGerberstraße 49D- 71522 BacknangPhone: +49 (0) 7191 - 930 1203E-mail: [email protected]
PCB workshop at ESTEC October 2009 Page 3Te
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ecom
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KG
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KG
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stria
l pro
perty
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ts a
nd a
ll rig
hts o
f disp
osal
such
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opyi
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nd p
assin
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ties
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hor:
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ner
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le: P
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enta
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Aud
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PCB workshop at ESTEC October 2009 Page 4Te
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ecom
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bH &
Co.
KG
PRO
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Tes
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pace
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Gm
bH &
Co.
KG
rese
rves
all
right
s inc
ludi
ng
indu
stria
l pro
perty
righ
ts a
nd a
ll rig
hts o
f disp
osal
such
as c
opyi
ng a
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assin
g to
third
par
ties
Aut
hor:
Ingo
Ker
ner
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le: P
CB_
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Aud
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0909
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PCB workshop at ESTEC October 2009 Page 5Te
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ecom
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bH &
Co.
KG
PRO
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INFO
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Tes
at-S
pace
com
Gm
bH &
Co.
KG
rese
rves
all
right
s inc
ludi
ng
indu
stria
l pro
perty
righ
ts a
nd a
ll rig
hts o
f disp
osal
such
as c
opyi
ng a
nd p
assin
g to
third
par
ties
Aut
hor:
Ingo
Ker
ner
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le: P
CB_
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enta
tion_
Aud
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0909
Dat
um: S
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9
PCB workshop at ESTEC October 2009 Page 6Te
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Spac
ecom
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bH &
Co.
KG
PRO
PRIE
TA
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INFO
RM
AT
ION
©
Tes
at-S
pace
com
Gm
bH &
Co.
KG
rese
rves
all
right
s inc
ludi
ng
indu
stria
l pro
perty
righ
ts a
nd a
ll rig
hts o
f disp
osal
such
as c
opyi
ng a
nd p
assin
g to
third
par
ties
Aut
hor:
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Ker
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le: P
CB_
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Aud
it_29
0909
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um: S
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PCB workshop at ESTEC October 2009 Page 7Te
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Spac
ecom
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bH &
Co.
KG
PRO
PRIE
TA
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INFO
RM
AT
ION
©
Tes
at-S
pace
com
Gm
bH &
Co.
KG
rese
rves
all
right
s inc
ludi
ng
indu
stria
l pro
perty
righ
ts a
nd a
ll rig
hts o
f disp
osal
such
as c
opyi
ng a
nd p
assin
g to
third
par
ties
Aut
hor:
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Ker
ner
Fi
le: P
CB_
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Aud
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PCB workshop at ESTEC October 2009 Page 8Te
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Spac
ecom
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bH &
Co.
KG
PRO
PRIE
TA
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INFO
RM
AT
ION
©
Tes
at-S
pace
com
Gm
bH &
Co.
KG
rese
rves
all
right
s inc
ludi
ng
indu
stria
l pro
perty
righ
ts a
nd a
ll rig
hts o
f disp
osal
such
as c
opyi
ng a
nd p
assin
g to
third
par
ties
Aut
hor:
Ingo
Ker
ner
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le: P
CB_
Präs
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Tesat PCB Technology TeamTesat PCB Technology Team
Input´s / Output`s
Customer serviceApproval PCB`s
Quality assuranceQuality audit
Innovation In-line process control
Job preparation
PCB Audit 2009 September 2009 Page 9Te
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PRO
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FOR
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TIO
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© T
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Printed Circuit Board Manufacturing: Features
Layer count up to: 18
max. total thickness: 3.2 mm
min. core thickness: 70 µm
Aspect ratio for plated through vias: 7 : 1
Aspect ratio for micro vias: 0.5 : 1
Lines / Spacing: 120 µm / 150 µm
Construction: 2 – n – 2
Min. hole size: 300 µm
Impedance value: +/- 10%
AOI inspection: 100%
Electrical test: 100%
PCB workshop at ESTEC October 2009 Page 10Te
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ecom
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bH &
Co.
KG
PRO
PRIE
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AT
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KG
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s inc
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perty
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ts a
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ll rig
hts o
f disp
osal
such
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0909
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um: S
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PCB Surface Tin/Lead reflow Copper/Lead diffusion layer Electroless Nickel/Gold
PCB Product Overview Multilayer Radio frequency PCB Metal core Multilayers Heatsinks Microvia Multilayer Multi-Dielectric Board COB-Technology PCB Impedance control application Flex and Rigid-flex boards
PCB workshop at ESTEC October 2009 Page 11Te
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KG
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KG
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ng
indu
stria
l pro
perty
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ts a
nd a
ll rig
hts o
f disp
osal
such
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opyi
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assin
g to
third
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Aut
hor:
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le: P
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enta
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Dat
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Inspection
Microsectioning
Analysis of sample
AOI inspection
Microsection preparation
Visual inspection
Electrical test
Specifiations:
ESA specifikation (since 1968)
ECSS-Q70-10A/11A
MIL-PRF55110F
MIL-P50884D
IPC 6012 ;6013 ; 6016
Tests, Inspections, AnalysesTests, Inspections, Analyses
PCB workshop at ESTEC October 2009 Page 12Te
sat-
Spac
ecom
Gm
bH &
Co.
KG
PRO
PRIE
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INFO
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AT
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at-S
pace
com
Gm
bH &
Co.
KG
rese
rves
all
right
s inc
ludi
ng
indu
stria
l pro
perty
righ
ts a
nd a
ll rig
hts o
f disp
osal
such
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opyi
ng a
nd p
assin
g to
third
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Aut
hor:
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le: P
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enta
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Aud
it_29
0909
Dat
um: S
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New Developments for High Rel Applications and future trendsNew Developments for High Rel Applications and future trends
HDI boardsHDI boards with µ-Via Technology goals:
Denser packaging High reliability due to selective hole formation
New world of design freedom
Other surface finish Electroless Nickel / Gold Electroless Nickel / Palladium / Gold Solder resist
Fine structure Line, Space and Pad Size to reduce
pitches
PCB workshop at ESTEC October 2009 Page 13Te
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Spac
ecom
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bH &
Co.
KG
PRO
PRIE
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AT
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pace
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bH &
Co.
KG
rese
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ng
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l pro
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ts a
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ll rig
hts o
f disp
osal
such
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opyi
ng a
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assin
g to
third
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Aut
hor:
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Ker
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le: P
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enta
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Aud
it_29
0909
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um: S
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r 200
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New Developments for High Rel Applications and future trendsNew Developments for High Rel Applications and future trends
Low CTE for assembly Metal layers Carbon layers (C-Film) Composite material of Epoxy and Low
CTE material in buildup
Quality characteristicsLow CTE in x,y and z-axisHigh Glass Transition TemperatureHigh Peel StrengthHigh Dielectric ConstantLow Dissipation FactorHigh Thermal Conductivity
Metal layers
Carbon layers
PCB workshop at ESTEC October 2009 Page 14Te
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bH &
Co.
KG
PRO
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pace
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KG
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rves
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ludi
ng
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stria
l pro
perty
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ts a
nd a
ll rig
hts o
f disp
osal
such
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opyi
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assin
g to
third
par
ties
Aut
hor:
Ingo
Ker
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le: P
CB_
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enta
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Aud
it_29
0909
Dat
um: S
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Thank you
for your attention
