Patent Pending

SinkPADTM

Th ll Effi i t PCB T h l f

Patent Pending

Thermally Efficient PCB Technology for the LED Application

Sinkpad Corporation

1

R5Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.

PRESENTATION OUTLINE

Thermal Challenges In The LED Applications

How it is Addressed? Metal Back PCB Technology

Is There a Better Way? SinkPADTM Technologyy gy

What Would I Gain Using SinkPADTM?

Comparisons Of “Metal Back” & “SinkPADTM” Comparisons Of Metal Back & SinkPADTM

Potential Applications

Test Data

Conclusion

2R5

THERMAL CHALLANGES

Increasing Trend For LED Power Increasing Trend For LED Power

Increasing Trend For Higher Brightness

Primary Thermal Path: Conduction Cooling

Higher Thermal Resistance

Power Density Increasing – more LEDs in a small area

Long Life Expectation Long Life Expectation

3R5

How Heat Issues Addressed Historically?

Metal Back PCB TechnologyExample: MCPCB, Aluminum PCB etc…type products

THERMALLY CONDUCTIVE DIELECTRICS Arlon 92ML – 2.0W/m.kExample: MCPCB, Aluminum PCB etc…type products Bergquist – 2.2-3.0W/m.k Doosan – 2.0W/m.k Denka Hit Plate – 2.0-8.0 W/m.k DuPont CoolLam – Polyimide based – 0.80W/m.k ITEQ- IT859 GTA – 2.0W/m.k Laird Technology HKA 3 0W/m k

Thermally Conductive Dielectric

Laird Technology HKA – 3.0W/m.k Polytronics – 2.7W/m.k Sekisui – 2.0W/m.k Ventec - VT 4A1 – 1.6W/m.k

Thermally Conductive Dielectric (TC~ 1 to 4 W/m.k)

Thermal Pad Z-axis HeatThermal Pad or Bond Pad

Metal Thermal Conductivity (TC)Al ~135-180W/m.k

Z-axis Heat Transfer rate:

Only 1-4 W/m.kCu ~385W/m.k

Z-axis heat transfer is limited by the TC & thickness of the Dielectric Material4R5

Is There a Better Way to Remove Heat?

YES

SinkPADTM TechnologySinkPADTM Technology

5R5

What is SinkPAD?

SinkPADTM is a MCPCB Technology gyWhich Provides

Direct Thermal Path to Hot LEDDirect Thermal Path to Hot LED

6R5

“SinkPADTM” TECHNOLOGY

Direct Heat Transfer (NO dielectric barrier)Patent Pending

Circuit Layer

Standard Dielectric material

SinkPAD

Z-axis Heat

Metal Thermal Conductivity (TC)Al ~135-180W/m.kCu ~385W/m.k

Transfer rate: 150-385 W/m.k

Cu 385W/m.k

Z-axis heat transfer is same as the TC of the base material used7R5

“SinkPADTM” TECHNOLOGY

Top View of a SinkPADTM PCBPatent Pending

SinkPAD

Circuit padCircuit traces

8R5

COMPARISION OF “METAL BACK” & “SinkPAD”

“Metal Back PCB” “SinkPADTM PCB”Patent Pending

Higher Thermal Resistance Slow Heat Transfer Rate

Special Dielectric Required

Thick Base Metal Required

Direct Thermal Path Fast Heat Transfer Rate

Standard Dielectric Used

Thinner Base Metal Optionsq

Limited to Epoxy dielectric only Metal is Insulated Thermally From The Component

p

Epoxy, Polyimide or any typical dielectric can be used Metal is Connected Thermally to the Component

“No” PCB Design Change Required No PCB Design Change Required

9R5

“SinkPADTM” TECHNOLOGY

Multilayer Examples

“ l k C ” “SinkPADTM PCB”

Patent Pending

PTH Pl t d Th h H l

Does not increase thermal resistanceSubstantial increase in thermal resistance

“Metal Back PCB” SinkPADTM PCB

PTH = Plated Through Holes

Limitation: Components can be assembled only on one side of the PCB10R5

REQUIREMENT TO USE SinkPADTM

Patent Pending

“Thermal Path” should be electrically neutral or isolated from the Anode and Cathode within the LED package Example packages:Anode and Cathode within the LED package. Example packages:

Neutral Thermal Path packages Luxeon Rebel

Elec. Active Thermal Path packages Osram - Golden Dragon

Cree – XP, XR, XTE. XBD, XML MT-G, MCE Everlight– Shuen, Shwo, Yi, Tsan series Luminus – PhlatLight SST-90, SSM80 Osram – OSLON SSL

g Seoul - Z-Power Avago Moonstone Emitter

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Osram OSLON SSL Nichia - N219 Seoul Z5P, Z5M Samsung 3535 Can not solder directly to the

SinkPADTM surfaceR5

SinkPADTM Product FamilyPatent Pending

SinkPAD P/N Base Metal Base Metal thickness

SP-A530 ALUMINUM 5052 ~0.032” (~0.80mm)

SP-A540* ALUMINUM 5052 ~0.040” (~1.0mm)

SP-A560* ALUMINUM 5052 ~0.063” (~1.60mm)

SP-A630 ALUMINUM 6061 ~0.032” (~0.80mm)

SP-A640 ALUMINUM 6061 ~0.040” (~1.0mm)SP A640 ALUMINUM 6061 0.040 ( 1.0mm)

SP-A660 ALUMINUM 6061 ~0.059” (~1.50mm)

SP-C40 COPPER ~0.040” (~1.0mm)

SP-C60 COPPER ~0.059” (~1.50mm)

* Most running product

12R5

POTENTIAL APPLICATIONS

Commercial / Industrial lights

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POTENTIAL APPLICATIONS

Street lights

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POTENTIAL APPLICATIONS

Back lights

15R5

POTENTIAL APPLICATIONS

PAR38 bulbs

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POTENTIAL APPLICATIONS

Residential down lights

17R5

TEST DATA

SinkPAD v/s MCPCB thermal data

thSinkPAD Rth: 0.45 0C/W

th MCPCB Rth : 1.75 0C/W

deg

C)

deg

C)

Power (W)Power (W)

dT*

dT*

18R5

SinkPADTM makes a lot of sense at mid to high power application, for example the new Cree XML can be driven up to 3A. At this power level, It can be a big difference in junction temp

TEST DATA, Cree 1-XPG

SinkPAD v/s Typical Aluminum back PCB thermal data

19R5

TEST DATA, Cree 9-XPG

SinkPAD v/s Conventional MCPCB thermal data (IR Camera)

MCPCB SinkPAD PCB

- Cree XPG 9 LEDs- Current: 1 Amp.- Power: 3W each- PCB ~ 1”x1”

1410 C 1190 C

20R5

SinkPADTM PCB & Aluminum PCB mounted onto a separate heatsink. LEDs on a SinkPADTM pcb running ~220C cooler than on the conventional MCPCB

TEST DATA, Luxeon Rebel at 700mA

SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)

- Luxeon Rebel at 700mALuxeon Rebel at 700mA

MCPCB Type-1MCPCB Type 1MCPCB Type-24

MCPCB-1MCPCB 1

MCPCB-2

Test was conducted by Quadica Developments Inc

21R5

LED on a SinkPADTM PCB running ~290C cooler than on the MCPCB-1 and 100C cooler than the MCPCB-2

TEST DATA, Luxeon Rebel at 1A

SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)

- Luxeon Rebel at 1000mALuxeon Rebel at 1000mA

MCPCB Type-1MCPCB Type-1

MCPCB Type-24

MCPCB-1

MCPCB-2

Test was conducted by Quadica Developments Inc

22R5

LED on a SinkPADTM PCB running ~470C cooler than on the MCPCB-1 and 160C cooler than the MCPCB-2

Other Available Test Data

Nichia N219

Luxeon RebelLuxeon Rebel

Cree MTG

Osram Oslon SSLOsram Oslon SSL

Cree XML

Customize Your TestCustomize Your Test

23R5

Advantages of SinkPAD

Lower LED Junction TemperatureLower LED Junction Temperature

As a result:

1) O ti t LED t l j ti t t1) Option to run LED at lower junction temperature i.e Increase Life of the LED Fixture

2) Option to run LED at higher power / maintain temperature i.e. Get more lumens per LED

3) R d b f LED li h3) Reduce number of LEDs to get same light i.e. Reduces Fixture Cost

Industry Experts say:

24R5

“LED life doubles at every 10oC it runs cooler”Industry Experts say:

Highlights and Q&A

Magnitude Higher Thermal Transfer Rate Direct Thermal Path

Patent Pending

Direct Thermal Path 135 to 385W/m.k vs. 1 to 4 W/m.k LOWER JUNCTION TEMPERATURE

High Tg (Up to 225oC)

Multilayer Possible Without Increase In Thermal Resistance

Weight Saving Possibly thinner profile

Di t R l t f MCPCB M t l B k PCB & Al i PCB Direct Replacement for MCPCB, Metal Back PCB & Aluminum PCB

Most Economical Direct Thermal Path Solution Q&AQ

25R5

THANK YOUTHANK YOUFor more information contact

eng@sinkpad.comVisit us at www.sinkpad.com

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Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.