P. Pakhlov (ITEP ) presented by G.Pakhlova

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P. Pakhlov (ITEP) presented by G.Pakhlova EKLM status Reminder: EKLM general layout & past years activities Key challenge of this year: assembly and installation Future and current tasks: electronics, firmware, tests, software Summary B2GM @ KEK, 20 June, 2014

description

EKLM status. Reminder: EKLM general layout & past years activities Key challenge of this year: assembly and installation Future and current tasks: electronics, firmware, tests, software Summary. P. Pakhlov (ITEP ) presented by G.Pakhlova. B2GM @ KEK, 20 June, 2014. - PowerPoint PPT Presentation

Transcript of P. Pakhlov (ITEP ) presented by G.Pakhlova

Page 1: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

P. Pakhlov (ITEP)presented by G.Pakhlova

EKLM status

Reminder: EKLM general layout & past years activities

Key challenge of this year: assembly and installation

Future and current tasks: electronics, firmware, tests, software

Summary B2GM @ KEK, 20 June,

2014

Page 2: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

EKLM general layout

14 forward + 12 backward layers

2 backward outermost layers are filled with

shielding: not useful for physics, higher

background from backward side

104 sectors should be installed + 6 spare =

110 sectors to be assembled

The new system should fit the existing mechanical structure, including sector’s frame and

cover sheets

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Page 3: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

EKLM general layout

• Scintillator strips are produced by “Uniplast” (Vladimir, Russia); this vendor produced scintillator for HERA-B & LHCb’s ECAL; near sub detector T2K;• WLS fiber is Kuraray WLS Y-11(200)MSJ multi-clading 1.2mm diameter;• SiPMs: Hamamatsu’s MPPC S10362-11-050C, 1.3×1.3mm2; specially designed for T2K near detector; chosen as the most radiation hard among several vendors;

The base element is a scintillator strip; Scintillator light is collected by WLS fiber and transported to the photodetector: SiPM

SiPM matrix

• Minor thing: optical gel SUREL(St.Petersburg, Russia); connectors are produced by “Uniplast”

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Page 4: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

Scintillator modules mass

production

15 strips are glued to modules, convenient for transportation and assembly

production was carried out in ITEP for 1.5 years

August’12 – December’13WLS fiber is processed (cut, milled, mirrored, glued to connector) and then glued with optical gel to the strips groove

in total 16500 strips/ 1100 modules were produced20/06/2014 4/19

Page 5: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

Average light yield from near & far ends is 2 times larger than assumed for TDR:50 p.e. from near end (average over ~8000 long strips) vs 24 p.e. achieved at R&D for TDR Rejection threshold is 1.3 times larger than assumed TDR value

Strips quality

In total ~2% of produced strips were rejected.

Light yield in p.e.

# of strips long strips (>2m)

rejection threshold

short strips (<2m)

Improved light collection efficiency is a warranty of robustness of the system against radiation damage, high background rate and

of better physics performance.20/06/2014 5/19

Page 6: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

of the first half of 2014 was/is

The main task

assembly and installation

it is almost done!

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Page 7: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

Logistics

Scintillator modules; support net &

fixings shipped from ITEP

Frame & Al covers used from the old RPC system;

important stage was disassembly of RPC

Cables & connectors purchased by KEK;

crimped at assembly

Preamplifiers purchased by VPI; pig tail soldering

and tests at Wayne State U.

SiPMs purchased by

KEK

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Page 8: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

LogisticsShipping from ITEP: no big problems except for loss of one sector (sent 110 found at KEK 109)? If fail to find, one spare sector less.minor damages that are repaired at assembly:• several SiPM-fiber connectors become loose glued with epoxy;• few nodes of I-beam support net get unstuck after many moves from place to place glued with cold welding.

Shipping of preamplifiersWayne State U. did not deliver the required soldering & test rate solved with the kind help of KEK (Ushiroda & Sumisawa): • ½ is soldered at Wayne + ½ is soldered by a company, recruited by KEK; • test of preamplifiers during assembly by ITEP staff.Much bigger problem was discovered recently: because of 5% dead preamps channels and/or insufficient amount of order, preamplifiers for the last 12 sectors lost. The new batch of missing preamps have been ordered by Wayne SU in May, but they will be produced and shipped to KEK only by the end of July. This delays the completion of assembly and installation by 3 months interference with CDC group.

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Page 9: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

Preparing framesDeinstallation of forward/backward EKLM RPC modules was carried out in April’13/January’14

Dismounting RPC forward/backward was carried out in November’13/January’14Processing & preparing frames to reuse done by ITEP technicians November’13– May’14

new holes were drilled, old ones sealed in 112 frames+ 8 spare frames will be used to fix polyethylene (note: ×2 more effective than polystyrene) shield in 2 outermost backward layers20/06/2014 9/19

Page 10: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

Assembly

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Page 11: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

Assembly

By now produced: 90 (out of 110/109) sectors fully

assembled; + 12 sectors half-assembled (no

preamplifiers) will be finished in one week, to be resumed for one more

week in September

Started November’13, still ongoing.

20/06/2014 11/19

Page 12: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

Installation• 2 sectors were installed in

backward EKLM in May’13: test installation.

• 56 sectors were installed in forward EKLM in April’14: the company worked very efficient

– it took only ~ 1.5 week; and very carefully – only one outer connector was broken, immediately repaired.• 46 backward sectors to be

installed in fall campaign.TestsAfter installation test with oscilloscope that all channels are live and cosmics is seen at proper rate (>1 Hz at 20 p.e. threshold); No quantative tests of light yield is still possible.

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Page 13: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

Neutron background rate with conservative TDR estimate and with MC simulation (still underestimates neutron background) are roughly consistent, while the MC neutron radiation doze accumulated by SiPMs is ~100 times smaller than in TDR:

It was recognized recently (thanks to our COMET colleagues), that in MC simulation we have ignored the important Birks' law! We naively implied that ionization energy converts to scintillation light linearly independent of ionization source, while Birks' law predicts much smaller (factor of 5-7) light yield for neutron-induced (low energy proton) scintillation compared to MIP.

Hopefully, this solves the puzzle!

Conservative estimate (TDR):direct measurements of background at

KEKB tunnel & dose, scaled with luminosity

Present Monte Carlo simulation

Neutron background rate at 0.5 MIP threshold

measured: hottest 6Hz/cm2 @ L=1.5×1033/cm/s extrapolated: ~160kHz for the longest strip in the outermost layer @ L=8×1034/cm/s

~140 kHz for the most noisy strip

Doze, accumulated at SiPM after 10 years of operation

measured: 1.5mSv/week @ L=1.5×1033/cm/s extrapolated: ~40 Sv/10 years @ L=8×1034/cm/s

<< 1 Sv/10 years

The long-standing MC puzzle:

20/06/2014 13/19

Page 14: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

DAQ & cosmics tests Minimal firmware at DAQ boards is provided by Hawaii group, which allow to start the system: set HV, thresholds, read out to COPPER. However, to take full advantage of the created KLM (both EKLM and BKLM) system (maximum efficiency, optimal background suppression, robustness, use of the excellent time resolution and amplitude information) much more work on implementation of extra firmware is required:- calibration, adjustment of HV and thresholds, trigger, fit of

the signalPlan to start immediately after finish of backward EKLM installation. Need to involve experts from T.Shevchenko INR (Kiev, Ukraine), who are ready to work full time for this job + cooperation with VPI (D.Liventsev).

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Summary

20/06/2014 15/19

The important stage is almost finished!

After final installation, a hard work on commissioning is expected.

However, it is time to

many people, who made good job

Page 16: P.  Pakhlov (ITEP ) presented by  G.Pakhlova

for extremely effective organization of all logistics issues at KEK, (de)installation, disassembly and many-many other important contributions without which it would be impossible to work for our group

for training of all new ITEP assembly shifts, work on electronics and after-installation tests, coordination of work between ITEP-KEK-WayneSU-VPI-Hawaii

Sumisawa san

for their daily work on assembly &

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Dmitry Liventsev

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Ushiroda san

Leo Piilonen

David Cinabro20/06/2014 17/19

Gary Varner

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to ITEP engineers

who worked on R&D, construction, mass production…

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20/06/2014 19/19

to ITEP stuff &

David Besson

K.Belonozhenko, B.Bobchenko,Y.Kuznetsov, S.Mineev,O.Kachalina, Y.Novozhlov,E.Novikov, A.Semennikov,A.Frolov, S.Veselov

from MEPhI

T.Aushev, K.Chilikin,R.Chistov, M.Danilov,A.Drutskoy, P.Katrenko,R.Mizuk, G.Pakhlova,P.Pakhlov, E.Solovieva,I. Tikhomirov, T.Uglov