OVERVIEW OF ORAL PRESENTATION SESSIONS

Thursday, August 18, 2016

Parallel Sessions

Room A Room B Room C Room D Room E Room F Room G

Oral Session 1

(Session A-1)

Oral Session 2

(Session B-1)

Oral Session 3

(Session C-1)

Oral Session 4

(Session D-1)

Oral Session 5

(Session F-1)

Oral Session 6

(Session H-1)

Oral Session 7

(Session I-1)

Chair Wenqi Zhang Liangliang Li Fei Qin Qian Wang Fei Xiao Xiaobing Luo Jintang Shang

08:30 – 09:50

Keynote 01

Shan Gao

Keynote 02

Keith Best 003, 012, 023, 040 058, 087, 123, 129 031, 039,051, 082 170, 244, 282, 349

Keynote 03

Cheng Yang

008, 084, 124 091, 025, 359 135, 174, 203

09:50 – 10:50 Poster Session 1 & Coffee Break

Oral Session 8

(Session B-2)

Oral Session 9

(Session B-3)

Oral Session 10

(Session C-2)

Oral Session 11

(Session D-2)

Oral Session 12

(Session F-2)

Oral Session 13

(Session I-2)

Oral Session 14

(Session I-3)

Chair Ning-Cheng Lee Rong Sun Min Miao Lixi Wan Daoguo Yang Le Luo Longjian Xue

10:50 – 11:10

258, 273, 072, 076, 078, 093, 099, 377 045, 049, 064, 422 029, 245, 248, 326 090, 098, 120, 192 206, 208, 209, 210

Keynote 04

Miao Yu

11:10 – 12:10 220, 222, 240

12:10 – 13:30 Lunch: Western restaurant on the 3rd floor, Chinese restaurant on the 2nd floor

OVERVIEW OF ORAL PRESENTATION SESSIONS (Cont.)

Thursday, August 18, 2016

Parallel Sessions

Room A Room B Room C Room D Room E Room F Room G

Oral Session 15

(Session B-4)

Oral Session 16

(Session B-5)

Oral Session 17

(Session C-3)

Oral Session 18

(Session F-3)

Oral Session 19

(Session F-4)

Oral Session 20

(Session I-4& B-6)

Oral Session 21

(Session F-5)

Chair Dongyan Ding Ning Zhao Yan Zhang Hu He Chunqing Wang Chengqun Gui Wei Liu

13:30 – 14:50 114, 118, 130,

136

175, 218, 233,

260

131, 144, 159,

172

121, 156, 238,

264

265, 270, 277,

310 252, 369, 322, 109

317, 325, 363,

364

14:50 – 15:50 Poster Session 2 & Coffee Break

Oral Session 22

(Session A-2)

Oral Session 23

(Session C-4)

Oral Session 24

(Session C-5)

Oral Session 25

(Session E-1)

Oral Session 26

(Session A-3)

Oral Session 27

(Session E-2 & G)

Oral Session 28

(Session F-6)

Chair GS Kim Yong Liu Haibo Fan Liang Tang Miao Yu Chenxi Wang Hui Li

15:50 – 16:50 195, 215, 327 191, 226, 453 231, 267, 298

Keynote 05

Hugo Pristauz

Keynote 06

Santosh Kumar

Keynote 07

Tetsukazu Sugiya

Keynote 08

Andrew Tay

015, 306 455, 415 169, 330 366, 370

17:30 – 20:30 Dinner: Banquet hall on the 3rd floor

SPECIAL SESSION (Materials for Advanced Packaging)

Shenzhen Institutes of Advanced Technology (SIAT), Chinese Academy of Sciences

Tuesday, August 16, 2016 Room H

Schedule Title Reporter

13:30-13:50 Advanced Electronic Packaging Materials Chingping Wong,

Rong Sun

13:50-14:10 Underfill Technology for Fine Pitch Flip Chip Application Pengli zhu

14:10-14:30 Electrochemistry Technology for Fabrication of Thermal Conductors and Electrical

Interconnectors

Mattew M. F. Yuen,

Xianzhu Fu

14:30-14:50 Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through

Silicon Vias

Shi-Wei Ricky Lee,

Guoping Zhang

14:50-15:10 Development and Application of Polymer-based Nanocomposite Dielectrics Shuhui Yu

15:10-15:30 Enhanced Thermal Conductivity and Mechanical Properties of Epoxy Resin-Alumina-

Silicon Carbide Fibers Three-Phase Composites

Xiaoliang Zeng

Introduction of Advanced Electronic Packaging Materials Innovation Team of Guangdong Province

The Advanced Material Research Center (AMRC) of Shenzhen institutes of advanced technology, Chinese academy of sciences, was founded in

2006. The center is dedicated to developing advanced electronic packaging materials, both for fundamental research and industrial application. Over the

past ten years, AMRC has actively participated in or undertaken tens of national scientific and industrial programs, In view of long-term development

and relying on the good electronic information industry environment of Guangdong and Shenzhen, AMRC has established the advanced electronic

packaging materials as the main research direction. In 2012, AMRC established the Advanced Electronic Packaging Materials Innovation Team of

Guangdong province, with Ching-Ping Wong (C.P. Wong, member of the American academy of engineering and Foreign academy of engineering) as

the team leader, focusing on the development of key materials for the high density system-level packaging, such as Underfill, TIM, ACA, ACF, TSV

Insulating layer, temporary bonding adhesive, embedded capacitor, inductor, resister, high frequency PCB, Ag NWs and spherical SiO2 and other

inorganic nanomaterials and nanocomposites used in the advanced electronic packaging.

http://www.siat.ac.cn/jgsz/kyxt/jcs/yjdy/xjclzx/zxjj/

Introduction of Invited Session Keynotes Speakers

Dr. Shan Gao, GLOBALFOUNDRIES, USA

Shan Gao received Ph.D in Material Science from Technical University of Munich. He is

currently the Principal Member of Technical Staff (PMTS) in Packaging Technology & Integration,

GLOBALFOUNDRIES, responsible for technology development of Chip Packaging Interaction,

2.5D Silicon Interposer, High Density Fan-Out and OSAT management. He has 18 years’

experience in semiconductor and electronic packaging, including test chip design, wafer &

package process development, reliability evaluation and technology qualification. Before joining

GLOBALFOUNDRIES, he served various positions in industry and research institute, such as

technical manager in Interconnect & Advanced Packaging department, Institute of

Microelectronics, senior manager in packaging technology department, Samsung, etc. He has

published over 100 international Journal & Conference papers and filed/granted over 20 patents.

Dr. Keith Best, Rudolph Technologies Wilmington, MA, USA

Over the past 30 years, Keith Best has held a range of semiconductor processing and Applications

positions for both device manufacturing and capital equipment companies, of which 13 years were

with ASML. He is currently the Director of Applications Engineering at Rudolph Technologies

where he supports Rudolph Technologies’ “JetStep” Advanced Packaging Lithography stepper.

Keith holds a B.Sc. Honors Degree in Materials Science from the University of Greenwich, UK.

He has numerous publications and holds 16 US patents in the areas of Photolithography and

Process integration.

Dr. Cheng Yang, Graduate School at Shenzhen, Tsinghua University, China

Dr. Cheng Yang obtained his BS in Nanjing University and obtained PhD in Department of

Chemistry, the Hong Kong University of Science and Technology (HKUST) about synthesis and

functionalization of nanomaterials for multifunctional composites. Then he worked with Prof.

Matthew M F Yuen in Department of Mechanical Engineering (HKUST) as a postdoctal research

associate for electronic packaging materials. Dr. Yang also visited the School of Materials Science

and Engineering, Georgia Institute of Technology as a visiting research faculty member under the

supervision of Prof. Ching Ping Wong. In September 2011, Dr. Yang joined Tsinghua University

as an Associate Professor in the Division of Energy and Environment, Graduate School at

Shenzhen. During his academic career, he has published over 50 technical journals including

Nature Communications, Advanced Materials, Energy & Environmental Science, ACS Nano, Advanced Functional

Materials etc. He has 17 patents granted and is in charge of fundings over 10 million RMB.

Dr. Miao Yu, University of Maryland, USA

Dr. Miao Yu received her Ph.D. from the University of Maryland in 2002 and her B.S. and M.S.

degrees in Engineering Mechanics from Tsinghua University, Beijing, China. She is currently an

Associate Professor at the University of Maryland. Her research interests encompass optical

sensors and actuators, microsystems and nanosystems, wave matter/structure interactions,

plasmonics and nanophotonics, metamaterials, acoustic sensors, and smart materials and structures.

Prof. Yu has published 2 book chapters, 50 archival journal articles, 56 conference papers. Her

research work has also led to 6 awarded US patents, 2 provisional patent applications, and many

UMD invention disclosures. One of these patents was the basis for her receipt of the University of

Maryland’s 2002 Outstanding Invention of the Year award in the category of Physical Sciences and her two other inventions

were selected as one of the three finalists for the same award in 2010 and 2011.

The various awards and honors that Prof. Yu received include the Oak Ridge Associated Universities’ Ralph E. Powe Junior

Faculty Enhancement Award (2006), the U. S. National Science Foundation (NSF) CAREER Award (2007), and the U. S.

Air Force Office of Scientific Research (AFOSR) Young Investigator Program (YIP) Award (2007). She has also been

invited and provided international travel awards to participate in several NSF US-China Workshops on sensor technologies

and a U.S.-JAPAN Young Researchers Exchange Program on New Instrumentation for Nanoscale Structures. In 2012, she

was nominated and selected to attend the Frontiers of Engineering Symposium organized by the U.S. National Academy of

Engineering (NAE), and in 2015, she was invited by the U.S. NAE to attend the Beijing Global Grand C hallenges Summit,

which was sponsored by the Chinese Academy of Engineering, the U.S. NAE, and the U.K. Royal Academy of Engineering..

Dr. Hugo Pristauz, Besi Austria GmbH, Austria

Since begin of the millennium Dr. Hugo Pristauz has been working in equipment business for

emerging semiconductor packaging technologies.

After making his PhD in the field of control science at TU Graz in 1990 and starting his industrial

career in an automation company he entered semiconductor business by joining Datacon in 1999,

soon being assigned to a product manager position in order to manage the development and

marketing of the successful 8800 Flip Chip platform, followed by a VP R&D position for Datacon's

entire R&D activities.

After acquisition of Datacon by Besi Hugo Pristauz was assigned in VP position to emerging business responsibilities for

RFID Assembly (2005+), the entire Besi Flip Chip product line (2009+), and Besi Thermo Compression Bonding & Wafer

Level Fan-Out business (2014+).

Since begin of 2016 Hugo Pristauz is focusing on technology scouting and networking in order to support Besi's roadmap

alignment process for advanced die attach equipment, supervising equipment key technology developments while coaching

top flight R&D teams.

Santosh Kumar, Yole Developpement

Santosh Kumar is currently working as Senior Technology & Market Research Analyst at Yole

Développement. He is involved in the market, technology and strategic analysis of the

microelectronic assembly and packaging technologies.

He worked as senior R&D engineer at MK Electron Co. Ltd where he was engaged in the electronics

packaging materials development and technical marketing. His main interest areas are advanced

electronic packaging materials and technology including TSV and 3D packaging, modeling and

simulation, reliability and material characterization, wire bonding and novel solder materials and

process etc.

He received the bachelor and master degree in engineering from the Indian Institute of Technology (IIT), Roorkee and

University of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents.

He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics

packaging.

Tetsukazu Sugiya, DISCO Corp., Japan

Education

1989 Shibaura Institute of Technology, Tokyo Japan, Bachelor of Mechanical Engineering

Experience

1991 DISCO CORPORATION Japan, Overseas Technical Support Dept, Tokyo

1996 DISCO HI-TEC Singapore, Customer Engineering Dept, Singapore

1999 DISCO HI-TEC Singapore, CE/Application Dept, Singapore

2003 DISCO CORPORATION Japan, Overseas Technical Support Dept, Tokyo

2007 DISCO CORPORATION Japan, Technology Solutions Group (TSG), Global Sales Dept,

Tokyo

2012 DISCO CORPORATION Japan, Global Technology Solutions Group (GTS), Tokyo

Prof. Andrew Tay, Singapore University of Technology and Design, Singapore

Prof. Andrew Tay is currently a Senior Research Fellow at the Singapore University of Technology

and Design. Before this he was a Professor in the Department of MechanicalEngineering, National

University of Singapore. He obtained his B.E. (Hons I and University Medal) and PhD in

Mechanical Engineering from the University of New South Wales, Australia. His research interests

include electronics packaging (thermo-mechanical failures, delamination, effects of moisture, solder

joint reliability), thermal management of electronics and EV battery systems, andfracture mechanics.

To date Prof Tay has published more than 250 technical papers, 7keynote presentations at

international conferences, 9 invited lectures, 3 panel discussions, written 3 book chapters and co-

edited 4 conference proceedings and two special issues oftechnical journals. Dr Tay is the inaugural General Chair of the

1st Electronics Packaging TechnologyConference (EPTC) in 1997, which has now been established as the flagship

conferenceof the IEEE CPMT Society in the Asia-Pacific Region. He has served and is still servingin the International

Advisory Board and Organising committees of several regularinternational electronics packaging conferences such as DTIP,

ECTC, EMAP, EPTC, EuroSime, HDP, ICEPT, IEMT, IMPACT, InterPack, ITHERM and THERMINIC, listedin

alphabetical order. For his exceptional technical achievements, he was awarded the 2012 IEEE CPMTExceptional Technical

Achievement Award, and for his contributions to IEEE CPMTSociety Region 10, the 2012 IEEE CPMT Regional

Contributions Award. For hisoutstanding contributions in the application of engineering mechanics to electronicsand/or

photonics packaging, he was awarded the ASME EPPD Engineering MechanicsAward in 2004. He was also awarded an

IEEE Third Millennium Medal in 2000. He has been a member of ASME since 1993, and a Fellow since 2004. He has been

a Fellow ofthe Institution of Engineers (Singapore) since 2004, and a member of IEEE since 1990.

ORAL SESSIONS Note: Only the affiliation information of the first author is provided due to the space constraints.

Session 1: Advanced Packaging & System Integration

Date Thursday, August 18, 2016 Time 8:30AM~9:50AM Venue Room A Chair Wenqi Zhang

Keynote-01 8:30-8:50 High Density Fan-Out (HD-FO) Technology – Opportunities and Challenges Shan Gao

GLOBALFOUNDRIES, USA

008 8:50-9:10 Development of Multi-stack Dielectric Wafer

Bonding

Lan Peng, Soon-Wook Kim, Fumihiro Inoue, Teng

Wang, Alain Phommahaxay, Patrick Verdonck, Anne

Jourdain, Joeri De Vos, Erik Sleeckx, Herbert Struyf,

Andy Miller, Gerald Beyer, Eric Beyne, Mike Soules,

and Stefan Lutter IMEC, Heverlee, Belgium

084 9:10-9:30 Alumina Oxide Reinforced Phase Change Materials

with Enhanced Thermal Conductivity

Yaqiang Ji, Ying Yang, Kai Zhang, Matthew M.F.

Yuen, Xian-Zhu Fu, Rong Sun and Ching-Ping Wong

Shenzhen Institutes of Advanced Technology,

Chinese Academy of Sciences, China

124 9:30-9:50 Thermal Evaluation of Partially Molded 2.5D

Package with Pin Fin Heat Sink Cooling

Zhiheng,H.Y. Zhang, Z.Q. Wang and T. Y. Lin

Shanghai University of Engineering Science, China

Session2: Packaging Materials & Processes

Date Thursday, August 18, 2016 Time 8:30AM~9:50AM Venue Room B Chair Liangliang Li

Keynote-02 8:30-8:50 Advanced Packaging Lithography and Inspection solutions for next generation FOWLP-FOPLP processing Keith Best Rudolph Technologies Wilmington, MA, USA

091 8:50-9:10

Electrochemical Synthesis of Dendrite-like Cu

Catalysts for Electroless Deposition of Cu Circuits

Zhe Zhong, Jinqi Xie, Kai Zhang, Matthew M.F. Yuen,

Xianzhu Fu, Rong Sun and Ching Ping Wong

Shenzhen Institutes of Advanced Technology,

Chinese Academy of Sciences, China

025 9:10-9:30

Effect of the Moisture Absorption of Mold

Compound on the Reliability of Power Packages

during Stress Tests

Dandong Ge, Wenjie Shen, Zhao Yun and Xue Ming

Infineon Technologies Asia Pacific Pte Ltd,

Singapore

359 9:30-9:50

Utilizing CdSe/ZnS Core/Shell QDs to Improve the

Modulation Bandwidth of WLED for Visible Light

Communication

Xiangtian Xiao, Haodong Tang, Tianqi Zhang, Wei

Chen, Wanli Chen, Junjie Hao, Rui Wang and Kai

Wang

Southern University of Science and Technology

Session3: Packaging Design & Modeling Date Thursday, August 18, 2016 Time 8:30AM~9:50AM Venue Room C Chair Prof. Fei Qin

003 8:30-8:50 Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering Qiming Zhang, Jeffery C. C. Lo, and S. W. Ricky Lee, The Hong Kong University of Science & Technology, Hong Kong

012 8:50-9:10 Thermo-visco-plastic constitutive model for leadcontaining and lead-free solders subjected to monotonic and cyclic loadings Xu Long, Bingjie Chen, and Yao Yao Northwestern Polytechnical University, China

023 9:10-9:30 Numerical Simulation of Thermo-mechanical Behavior in High Power Diode Laser Arrays Yao Lu, Zhiqiang Nie, Pu Zhang, Zhenfu Wang, Lingling Xiong, Shuna Wang, Dihai Wu, and Xingsheng Liu State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, China

040 9:30-9:50 Thin and Large Die Assembly Pick Up Process Optimization by Dynamic Modeling Richard Qian and Yong Liu Assembly Process and Package Development Group, Fairchild Semiconductor (Suzhou) Co., Ltd., China

Session 4: Inter-connection Technologies Date Thursday, August 13, 2015 Time 8:30AM~9:50AM Venue Room D Chair Prof. Qian Wang

058 8:30-8:50 Synthesis and Characterization of Ultra-fine Bimetalllic Ag-Cu Nanoparticles as Die Attach Materials Xiaojian Liu, Chunqing Wang ,Zhen Zheng and Wei Liu State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology (HIT), China

087 8:50-9:10 The Study of the Growth Behavior of Cu6Sn5 at the Sn/Cu Interface during the Heating Preservation Chengrong Jiang, Bingfeng Guo, Haoran Ma, Anil Kunwar, Zhixian Meng and Haitao Ma Dalian University of Technology, China

123 9:10-9:30 Analysis of solder joint shape parameters on the stress and strain of the solder joint in the random vibration condition Hua Jianwei,Liang Ying,LI Tian-ming, Zhang Long and Huang Chunyue Guilin University of Electronic Technology, China

129 9:30-9:50 Advanced Flip Chip Package on Package Technology for Mobile Applications Ming-Che Hsieh Product and Technology Marketing, STATS ChipPAC Pte. Ltd., Singapore

Session 5: Quality & Reliability Date Thursday, August 18, 2016 Time 8:30AM~9:50AM Venue Room E Chair Fei Xiao

031 8:30-8:50 Influence of Low Temperature on Tensile Properties and Fracture Behavior of Sn3Ag0.5Cu Solder Alloy Ruyu Tian, Yanhong Tian State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, China

039 8:50-9:10 Influence of nano-particles on creep behaviors of Cu/Sn-0.3Ag-0.7Cu-xPOSS/Cu composite solder joints Yangduanrui Hu , Limin Ma , and Fu Guo Beijing University of Technology, China

051 9:10-9:30 Open Circuit Caused by Inner-layer Separation in Printed Circuit Board Xingjia Huang, Changping Ou, Xuanyu Huang, Bing Su and Weili Zhou Foxconn Technology Group, Shenzhen, China

082 9:30-9:50 Effects of nano-structured reinforcements on the recrystallization and damage mode of of Sn–3.0Ag–0.5Cu solder joints Penghao Gu , Jing Han , and Fu Guo Beijing University of Technology, China

Session 6: Solid State Lighting Packaging & Integration Date Thursday, August 18, 2016 Time 8:30AM~9:50AM Venue Room F Chair Xiaobing Luo

170 8:30-8:50 A Remote Phosphor Coating by Lens Wetting forPhosphor-Converted White Light-Emitting Diodes XingjianYu, Falong liu, Yupu Ma, Mengyu Huang, and Xiaobing Luo Huazhong University of Science and Technology, China

244 8:50-9:10 Experimental study of measuring LED’s temperatures via thermocouple Qi Chen, Run Hu, Jinyan Hu, Bin Xie, Xingjian Yu, and Xiaobing Luo Huazhong University of Science and Technology, China

282 9:10-9:30 The Application of the Silver Nano Particle Sintering Technique on the Chip Bonding for the Flip-chip andVertical Light Emitting Diodes Mian TAO, Yun-hui MEI, S. W. Ricky LEE, and Feng YUN The Hong Kong University of Science and Technology, Hong Kong

349 9:30-9:50 An a-IGZO TFT Pixel Circuit with Improved Current Mirror for Active Matrix Organic Light Emitting Diode Displays Lilin Liu, Kun Sun, Xiangying Zhang, Dongdong Teng, and Gang Wang Sun Yat-sen University, China

Session 7: Emerging Technologies Date Thursday, August 18, 2016 Time 8:30AM~9:30AM Venue Room G Chairs Jintang Shang

Keynote-03 8:30-8:50 Advanced Silver Paste Technology for High Density Interconnects Cheng Yang Graduate School at Shenzhen, Tsinghua university, China

135 8:50-9:10 Molecular modeling of the mechanical properties and electrical conductivity of modified carbon nanotube with hydroxyl under the tensile behavior Ning Yang, Xianping Chen, Dongjing Liu, Haisheng He, Daoguo Yang and Guoqi Zhang Guilin University of Electronic Technology, China

174 9:10-9:30 Electronic and work functions of silicane/fully hydrogenated h-BN and silicane/graphane nanosheets Qiuhua Liang,Junke Jiang, Xiang Sun, Xianping Chen and Xianping Chen Guilin University of Electronic Technology, China

203 9:30-9:50 A first-principle study of H2, CO, CH4, H2S and SO2 gas molecules on antimonene Ruishen Meng, Yiping Huang, Qun Yang and Xianping Chen Guilin University of Electronic Technology, China

Session 8: Packaging Materials & Processes Date Thursday, August 18, 2016 Time 10:50AM~12:10AM Venue Room A Chairs Ning-Cheng Lee

258 10:50-11:10 Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids Jie-Fei Zhu, Hong Jin, Min-Bo Zhou, and Xin-Ping

Zhang

South China University of Technology, China

273 11:10-11:30 10μm pitch Cu-Cu bonding interconnection for wafer level 3D integration Chongshen Song, Hengfu Li, Guangjian Feng,

Liqiang Cao, and Wenqi Zhang

National Center for Advanced Packaging Co. Ltd.,

Wuxi, China

072 11:30-11:50 Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient Ning Zhao, Yi Zhong, Mingliang Huang, Haitao Ma and Wei Dong Dalian University of Technology , China

076 11:50-12:10 Effect of Silver Nanoparticles Decoration on the Thermal Conductivity of Boron Nitride Nanosheets/Silicon Carbide Nanowires Bioinspired Composite Paper Yimin Yao, Xiaoliang Zeng, Rong Sun, Jian-bin Xu and Ching-ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences,China

Session 9: Packaging Materials & Processes Date Thursday, August 18, 2016 Time 10:50AM~12:10AM Venue Room B Chairs Rong Sun

078 10:50-11:10 A highly sensitive flexible capacitive pressure sensor based on micro-array dielectric layer and silver nanowires Xingtian Shuai, Pengli Zhu, Yougen Hu, Qian Guo, Haibo Su, Yankang Han, Rong Sun and Chingping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Science, China

093 11:10-11:30 Influence of Electric Current on the Grain Orientation of Cu-Sn Intermetallic Compounds inCu/Molten Sn/Cu Interconnection System Jiayun Feng, Baolei Liu, Yanhong Tian and Baoyou Zhang State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, China

099 11:30-11:50 Analysis of Lead-free Solder Paste Based on Performance Degradation Cui Li, Yongping Lei, Jian Lin, and Ye Tian Beijing University of Technology, China

377 11:50-12:10 Highly Efficient Chip Scale Package (CSP) LED Based on Surface Patterning Kai Wang, Tianqi Zhang, Haodong Tang, Zuoliang Wen and Shang Li Southern University of Science and Technology, China

Session 10: Packaging Design & Modeling Date Thursday, August 18, 2016 Time 10:50AM~12:10AM Venue Room C Chairs Min Miao

045 10:50-11:10 Modelling the Melting of Sn0.7Cu Solder Using the Enthalpy Method Anil Kunwar, Julien Givernaud, Haoran Ma, Zhixian Meng, Shengyan Shang, Yunpeng Wang, and Haitao Ma Dalian University of Technology, China

049 11:10-11:30 Thermal analysis and optimization of IGBT power electronic module Hongyu Tang, Huaiyu Ye, Xuejun Fan, and Guoqi Zhang Delft University of Technology, The Netherlands

064 11:30-11:50 Electromigration simulation of Cu pillar interconnect microstructure of 3D packaging Zhiyuan Leng, Ming Xiao, Man He, Weisheng Xia, and Bo Wang Huazhong University of Science and Technology, China

422 11:50-12:10 Server Platform Power Design Optimization using Switching Voltage Regulator Modeling Techniques Amarjoyt Singh and Qing Zhou Intel Corporation, USA

Session 11: Inter-connection Technologies Date Thursday, August 18, 2016 Time 10:50AM~12:10AM Venue Room D Chairs Lixi Wan

029 10:50-11:10 The Realization of Big Networking and Cloud Computing Dream from Contact Interconnect Methodology to Process Technology Dr. Paul Wang, David He, Goterry Mai, DF Chung and Don Kearns MiTAC International, Inc, Shunde, China

245 11:10-11:30 Combined Surface Activation Bonding for Cu/SiO2Hybrid Bonding for 3D Integration Ran He, Masahisa Fujino and Tadatomo Suga The University of Tokyo, Japan

248 11:30-11:50 A Novel Surface Humidity Controlled Bonder for Low-Temperature Wafer Bonding Chenxi Wang, Jikai Xu, Yanhong Tian, Chunqing Wang, and Tadatomo Suga State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, China

326 11:50-12:10 3D Interconnect technology based on low temperature copper nanoparticle sintering B. Zhang, Y.C.P. Carisey, A. Damian, R.H. Poelma, H.W. van Zeijl and G.Q. Zhang Delft University of Technology, The Netherlands

Session 12: Quality & Reliability Date Thursday, August 18, 2016 Time 10:50AM~11:50AM Venue Room E Chairs Daoguo Yang

090 10:50-11:10 Analysis of Photoluminescence Mechanisms and Thermal Quenching Effects for Multicolor PhosphorFilms Used in High Color Rendering White LEDs Mengni Zhang, , Jiajie Fan, Cheng Qian, Xuejun Fan, Aimin Ji and Guoqi Zhang Hohai University, China

098 11:10-11:30 Effects of temperature and humidity on the formation of solder bead and microstructure in Sn-58Bi Solder Joint Yang Yang , Xuewei Zhao , Limin Ma , Fuwen Zhang , Qiang Hu and Fu Guo Beijing University of Technology, China

120 11:30-11:50 Study of Package-on-Package Solder Joints under Random Vibration Load Based On Patran Long Zhang, Chun-yue Huang, Wei Huang,Tian-ming Li, and Jianwei Hua Guilin University of Electronic Technology, China

192 11:50-12:10 Failure mechanism study of power packages during MSL and temperature cycling test with finite element method Yongbo Yang and Dandong Ge Infineon Technologies Asia Pacific Pte Ltd, Singapore

Session 13: Emerging Technologies Date Thursday, August 18, 2016 Time 10:50AM~12:10AM Venue Room F Chairs Le Luo

206 10:50-11:10 Adsorption of CO2 and CO gas on impurity-decorated phosphorenes: A first-principles Qun Yang, Yiping Huang, Ruisheng Meng and Xianping Chen Guilin University of Electronic Technology, China

208 11:10-11:30 Tuning electronic properties of bilayer boron-phosphide by stacking order and electric field: a first principles investigation Chunjian Tan, Qiang Zhou and Xianping Chen Guilin University of Electronic Technology, China

209 11:30-11:50 The study of adsorption behavior of small molecules on stanene: A search of superior gas sensors Qiang Zhou, Yiping Huang, Chunjian Tan and Xianping Chen Guilin University of Electronic Technology, China

210 11:50-12:10 First-principles study of gas adsorptin on Indium Nitride monolayer as gas sensor applications Xiang Sun, Yiping Huang, Junke Jiang, Qiuhua Liang, Ruishen Meng, Chunjian Tan, Qun Yang and Xanping Chen Guilin University of Electronic Technology, China

Session 14: Emerging Technologies Date Thursday, August 18, 2016 Time 10:50AM~12:10AM Venue Room G Chairs Longjian Xue

Keynote-04 10:50-11:10 Multifunctional optical sensing: from nanophotonics to sensor networks Miao Yu University of Maryland, College Park, USA

220 11:10-11:30 Theoretical investigation of electric properties of the silicene / fully hydrogenated BN heterobilayer Liming Wang, Xiang Sun, Ruishen Meng, Chunjian Tan and Qun Yang and Xianping Chen Guilin University of Electronic Technology, China

222 11:30-11:50 Enhancement of H2S detection in impurity-doped grapheme Jiu Pang, Xiaosong Ma, Qun Yang, Ruishen Meng, Chunjian Tan, Xiang Sun and Xianping Chen Guilin University of Electronic Technology, China

240 11:50-12:10 Scalable Synthesis and Applications of Mono-dispersed Hierarchical Silver Micro-particles with Mesoporous Structure Rui Yang, Cheng Yang, Yubin Deng, Dang Wu, Yang Wang, Xiaoya Cui and Yingying Luo Graduate School at Shenzhen, Tsinghua University, China

Session 15: Packaging Materials & Processes Date Thursday, August 18, 2016 Time 13:30~ 14:50 Venue Room A Chairs Dongyan Ding

114 13:30-13:50 The Nonlinear Voltage-Current Characteristics of Three-phase SiC/CNTs/epoxy Composite Wang Jian , Yanbin Shen , Suibin Luo , Wenhu Yang, Shuhui Yu , Rong Sun, and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

118 13:50-14:10 Preparation of highly conductive adhesives by instiu incorporation of silver nanoparticles Yankang Han, Baotan Zhang, Pengli Zhu, Qianqian Liu, Yougen Hu, Rong Sun, and Chingping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

130 14:10-14:30 Enhanced Dielectric Property and Energy Densityof Polydopamine Encapsuled BaTiO3Nanofibers/PVDF Nanocomposites Hongchang Liu, Suibin Luo, Shuhui Yu, Shanjun Ding, Rong Sun and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

136 14:30-14:50 Study on the electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder balls Yan Qiu, Mingliang Huang and Aimin Wu Dalian University of Technology, China

Session 16: Packaging Materials & Processes Date Thursday, August 18, 2016 Time 13:30~ 14:50 Venue Room B Chairs Ning Zhao

175 13:30-13:50 Study on the Thermal Conductivity of Graphene/Si Interface Structure based on Molecular Dynamics Dongjing Liu, D.G. Yang, Ping Yang and Ning Yang Guilin University of Electronic Technology, China

218 13:50-14:10 The Synthesis of Cu-Ag Core-Shell Bimetallic nanoparticles for IC bonding Jiayue Wen, Yanhong Tian, Zhi Jiang and Chenxi Wang State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, China

233 14:10-14:30 Effect of As-Pinted Bondline Thickness on Assembling High Power Laser Diodes by Sintering of Nanosilver Paste Haidong Yan, Yunhui Mei, Xin Li, Hailong Li and Guo-Quan Lu Tianjin University, China

260 14:30-14:50 Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste joints Hong Jin, Jie-Fei Zhu, Min-Bo Zhou and Xin-Ping Zhang South China University of Technology, China

Session 17: Packaging Design & Modeling Date Thursday, August 18, 2016 Time 13:30~ 14:50 Venue Room C Chairs Yan Zhang

131 13:30-13:50 Thermal Behavior of Microchannel Cooled High

Power Diode Laser Arrays

Dihai Wu, Pu zhang, Zhiqiang Nie, Lingling Xiong,

Yunfei, Song, Qiwen Zhu, Yao Lu, Yifan Dang,

Xingsheng Liu, Dihai Wu, Yunfei Song, Qiwen Zhu,

and Yao Lu State Key Laboratory of Transient Optics and Photonics, Chinese Academy of Sciences, Xi'an, China

144 13:50-14:10 Compact Size and Low Profile IPD Diplexer Design Applied on Wireless Module of Mobile Phone Sheng-Chi Hsieh, Cheng-Yuan Kung, Teck Chong Lee, and Chi-Han Chen, Chen-Chao Wang and Yuan-Hsi Chou Corporate R&D, Advanced Semiconductor Engineering (ASE) Inc, Kaohsiung, Taiwan

159 14:10-14:30 Thermal Characterization of a Novel 3D Stacked Package Structure by CFD Simulation Cheng Chen, Delong Qiu, Fengze Hou, Fengman Liu, Meiying Su, Qidong Wang, Liqiang Cao, and Lixi Wan Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China

172 14:30-14:50 Simulation of droplet spreading process on heterogeneous striped surface by lattice Boltzmann method Mengyu Huang, Chao Yuan, Xingjian Yu, Ruikang Wu, and Xiaobing Luo Huazhong University of Science and Technology, China

Session 18: Quality & Reliability Date Thursday, August 18, 2016 Time 13:30~ 14:50 Venue Room D Chairs Hu He

121 13:30-13:50 Laser synchronous scanning IR imaging for chip bonding defects inspection HaiJun Jiang, and LI Chen Novelteq Ltd., China

156 13:50-14:10 Design of the Printed Circuit Board for board level drop impact base on the JEDEC standard Jian Gu, Yongping Lei, Jian Lin, Hanguang Fu, and Zhongwei Wu Beijing University of Technology, China

238 14:10-14:30 Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints Wang-Yun Li, Shan-Shan Cao, and Xin-Ping Zhang South China University of Technology, China

264 14:30-14:50

Analysis the Interface Delamination of Cu and EMC Adhesive Material in the Cutting Process of Electronic Chip Based on Cohesive Zone Modeling Yu Huiping, Hu Mingqing, Qin Fei, An Tong, Chen Pei, and Pi Bensong Beijing University of Technology, China

Session 19: Quality & Reliability Date Thursday, August 18, 2016 Time 13:30~ 14:50 Venue Room E Chairs Chunqing Wang

265 13:30-13:50 Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure Han Jiang, Shui-Bao Liang, Hui-Hui Yuwen, Xin-Ping Zhang South China University of Technology, China

270 13:50-14:10 Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging Jia-Qiang Huang, Min-Bo Zhou, and Xin-Ping Zhang South China University of Technology, China

277 14:10-14:30 Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads Wang-Yun Li, Shan-Shan Cao, and Xin-Ping Zhang South China University of Technology, China

310 14:30-14:50 TSV-Cu protrusion induced by thermal cycling test Chen Si, Qin Fei, Zhao Jingyi, and An Tong Beijing University of Technology, China

Session 20: Emerging Technologies & Packaging Materials & Processes Date Thursday, August 18, 2016 Time 13:30~ 14:50 Venue Room F Chairs Chengqun Gui

252 13:30-13:50 Electrical Simulation and Fabrication of High Q Spiral Inductors on Glass Substrate Using the Glass Reflow Process Hailiang Chen, Xiangmeng Jing and Jintang Shang Key Laboratory of MEMS of Ministry of Education, Southeast University, China

369 13:50-14:10 Conductive Property of Inkjet Printed Film by Reactive Silver Inks on PET Flexible Substrate Xingming Tang, Hongbo Xu, Ximing Liu and Hongyun Zhao Changchun University of Technology, China

322 14:10-14:30 Effect of the viscosity of organic carrier on the quality of laser-assisted glass frit bonding Yi Li, Yanyi Xiao, Wen Wang, Luqiao Yin and Jianhua Zhang Shanghai University, China

109 14:30-14:50 In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu soldering cooling stage Bingfeng Guo, jiangchengrong, Anil Kunwar, Ning Zhao and Haitao Ma Dalian university of technology, China

Session 21: Quality & Reliability Date Thursday, August 18, 2016 Time 13:30~ 14:50 Venue Room G Chairs Wei Liu

317 13:30-13:50 Instrument for water vaportransmission rate of thin-filmencapsulation in aging environment Sheng Li, Zhilin Zhang, and Jianhua Zhang Shanghai University, China

325 13:50-14:10 Analysis and solution of bump deformation failure in Flip chip process Wang Ning, Li Ying, Liqun Gu, Xiaoqing Li, Jianwei Zhou, and Jonghyun Chae Samsung Semiconductor (China) R&D CO., China

363 14:10-14:30 Integrated Circuit ESD Protection Structure Failure Analysis Based on TLP Technique Jiang Xie, Qian Shi, and Yue Gao China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China

364 14:30-14:50 PEM/OBIRCH in Failure Localization of Flip-chip

Zhe Sun， Xuanlong Chen， Daotan Lin China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China

Session 22: Advanced Packaging & System Integration Date Thursday, August 18, 2016 Time 15:50~16:50 Venue Room A Chairs GS Kim

195 15:50-16:10 Investigation of jet printing performance of lead-free solder paste Saipeng Li, Yanqing Wang, Jian Zhou and Feng Xue Southeast University, China

215 16:10-16:30 The study of Cu-Cu low temperature bonding using

formic acid treatment with/without Pt catalyst

Wenhua Yang, Yangting Lu, and Suga Tadatomo

Hefei University of Technology, China

327 16:30-16:50 Mechanism and process study for high

performance COB development

Haomin BAO, Peng Zhang,Yinglei Chen,Jiangtao liu

Jianwei Zhou, and Jonghyun Chae

Samsung Semiconductor (China) R&D CO.,LTD,

China

Session 23: Packaging Design & Modeling Date Thursday, August 18, 2016 Time 15:50~16:50 Venue Room B Chairs Yong Liu

191 15:50-16:10

A full chip scale numerical simulation method for

thermal management of 3D IC

Ningyu Wang, Yufeng Jin, Yudan Pi, and Wei Wang

Peking University, China

226 16:10-16:30

A simplification method of TSV interposer for

thermal analysis in 3D packages

Wenchao Tian and Hao Cui

Xidian University, China

453 16:30-16:50 Investigation of Cu Wire Crack under Thermal Cycling Test Haibo Fan, WW Chow, Kan Lee, Fei Wong, Xue ke, Haibin Chen, and Jingshen Wu BUSP Package Innovation, NXP Semiconductors HK, Hong Kong

Session 24: Packaging Design & Modeling

Date Thursday, August 18, 2016 Time 15:50~16:50 Venue Room C Chairs Haibo Fan

231 15:50-16:10 Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects Shui-Bao Liang, Chang-Bo Ke, Meng-Ying Tan, Min-Bo Zhou, and Xin-Ping Zhang South China University of Technology, China

267 16:10-16:30 Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient Shui-Bao Liang, Chang-Bo Ke, Min-Bo Zhou, and Xin-Ping Zhang South China University of Technology, China

298 16:30-16:50 Reliability Prediction for IGBT Solder Joints Using Clech Algorithm Hua Lu and Chris Bailey University of Greenwich, UK

Session 25: Advanced Manufacturing & Packaging Equipment, Microwave & Power Electronics Packaging Date Thursday, August 18, 2016 Time 15:50~16:50 Venue Room D Chairs Liang Tang

Keynote-05 15:50-16:10 Advanced Die Attach – A Response to the Needs of Advanced Packaging Hugo Pristauz Besi Austria GmbH, Austria

015 16:10-16:30

Fuzzy PID Control for Impact Force of High Speed

Wire Bonding Process

Jian Gao, Guanhao Dai, Yongjun Jiang, Xiaochu

Wang, Yun Chen, Hui Tang and Yunbo He

Guangdong University of Technology, China

306 16:30-16:50

Unlocking the full Potential of Lithography for

Advanced packaging

Jelle van der Voort, Gerrit van der Beek, Berend and

van der Grinten

Lietq BV, The Netherlands

Session 26: Advanced Packaging & System Integration Date Thursday, August 18, 2016 Time 15:50~16:50 Venue Room E Chairs Miao Yu

Keynote-06 15:50-16:10 Status & prospects of advanced semiconductor packaging in China Santosh Kumar Yole Developpement

455 16:10-16:30

Bioinspired fibrillar adhesives

Longjian Xue

Wuhan University, China

415 16:30-16:50 An Analytical Model for Capacitance of Silicon-

Insulator-Silicon Through-Silicon-Vias

Bohao Li, An'An Li, Miao Xiong, Jianxun Yang,

Zhiming Chen and Yingtao Ding

Beijing Institute of Technology, China

Session 27: Advanced Manufacturing & Packaging Equipment, Microwave & Power Electronics Packaging Date Thursday, August 18, 2016 Time 15:50~16:50 Venue Room F Chairs Chenxi Wang

Keynote-07 15:50-16:10 3 Core KKM Technology for Memory Device Assembly Process Tetsukazu Sugiya DISCO Corp., Japan

169 16:10-16:30 Thermal Management of Downhole Electronics Cooling in Oil & Gas Well Logging at High Temperature Yupu Ma, Bofeng Shang, Run Hu and Xiaobing Luo Huazhong University of Science and Technolog, China

330 16:30-16:50 Thermal modeling and analysis for a novel

packaging structure of CMOS image sensor

S. F. Han, D.G. Yang, M. Cai, D.J. Liu, and Y.Y. Nie

Guilin University of Electronic Technology, China

Session 28: Quality & Reliability

Date Thursday, August 18, 2016 Time 15:50~16:50 Venue Room G Chairs Hui Li

Keynote-08 15:50-16:10 Thermal Imaging Based on Thermoreflectance Addresses the Challenges for Thermal Analysis of Today’s Advanced Complex Devices Andrew Tray Singapore University of Technology and Design, Singapore

366 16:10-16:30

Influence of temperature on pumping rate and

crystalline grain of copper filler in TSV

Fei SU, Xiaoxu Pan, Pengfei Huang, Jin Chen,

Yufeng Jin Beihang University, China

370 16:30-16:50 Research on failure mechanism of the phosphors and sealants for white light emitting diode package Hailin Wu, Lin Zhou, Haimei Luo, Wenpeng Xiao, Minggao Cao,Yimin Hu, Gang Jing and Yan Liu Shenzhen University, China