2012 13th International

Conference on Electronic

Packaging Technology & High

Density Packaging

(ICEPT-HDP 2012)

Guilin, Guangxi, China

13 - 16 August 2012

Pages 834-1664

4 IEEE IEEE Catalog Number: CFP12S53-PRT

ISBN: 978-1-4673-1682-8

2/2

C-076 Optimization of Electronic Packaging Structure Taking into Account of Its Life Cycle EnergyConsumption and Environmental Pollution 834

Z P. Zhou, M. Cai, D. G Yang, W. B. Chen

C-077 Millimeter-wave Performance of Various Interconnections Used for Si-based IC Packaging

Technologies 837

Jie Citi, Qidong Wang, Guidotti.Daniel, Liqiang Cao, Lixi Wan

C-078 Molecular Dynamics Simulation of the Heat Transfer Coefficient at the Interface between

CNTs and Water in the Carbon Nano-Tubes Micro-channel Cooler 841

Min Huang, Gaoan Qi, Xiaojing Wang, Chunyang Zang, Bing Wu, Jia Wang

C-079 Thermal Design and Analysis of High Power LED with LTCC Packaging 845

Yang Hai, Daoguo Yang, Dejin Yan, Wanchun Tian

C-080The Heat Transfer Performance of the Carbon Nano-Tubes Micro-Channel Cooler in 3-D

Stacked Package 849

Gaoan Qi, Min Huang, Xiaojing Wang, Bing Wu, Chunyang Zang, Dianxiao Wang

C-081 Modeling of Delamination in IC Packages 854

Andrew A. 0. Tay

Session D: High Density Substrate & SMT

D-001 Investigation of Reflow Soldering under Nitrogen Atmosphere 861

XulongGui, Zongyang Zhong, LingXu, ShengLiu

D-002 On Reflow Soldering Process and Reflow Profile 866

Xulong Gui, Zongyang Zhong, Ling Xu, Sheng Liu

D-003 Dissolution Behavior of Cu UBM in BGA Structure Sn-3.0Ag-0.5Cu/Cu Joints during Liquid

Isothermal Aging at and above the Solder's Melting Temperature 872

Min-Bo Zhou, Jing-Bo Zeng, Xiao Ma, Xin-Ping Zhang

D-004 Impact of Soldering Terminal Solderability of Component and PCB on Solder Joint Interface

877

Yuming Wang, Beibei Wang, Jian Cai, Tianxi Wang

D-005 Study on the optimization and analysis of the Mixed Reflow soldering with lead and

lead-Ofree solder in the high density assembly 884

Huang Yinglei, Wu Zhaohua, Liu Zhengwei

D-007 Effects of IMi/Ag coating on the wettability of Sn-3Ag-0.5Cu alloy on Cu substrates at different

temperatures 890

Mali Zhao, Jun Shen, .lie Chen, Boyi Wu

D-008 Research of Reflow Soldering on Al-SiC Composite Material and Thick Film Ceramic

Substrates 896

Ningning Wang, Binbin Zhang, Rong An, Meng Yang

D-009 A highlight processing technology for SMT solder joint gray image 899

Liang Tianshou, Zhou Dejian, Liu Zhengwei

D-010 Effect of Sampling Rate on the Accuracy of Strain Gage Measurement during Printed Circuit

Board Functional Test 903

Hongbin Shi, Cuihua Tian, Rui Zhang, Daquan Yu, Toshitsugu Ueda

D-013 Research on Shear creep properties of SAC305 Solder Bumps in Ball Grid Array 909

Wenfei Zhang, BingAn, Wei Guo, Shen Chai, Yiping Wu

D-015 Compliant Pin Interconnect Challenging and Reliability after RoHS Exemption 914

David He, Yu Xiang, DF Chung, Dr. Paul Wang

Session E: Advanced Manufacturing Technologies & Packaging Equipment

E-001 Carrierless thin wafer handling for 3D integration 922

Zhicheng LV, Jiaojiao Yuan, Jing Fang, Liang Yan, Xuefang Wang, ShengLiu

E-003 TSV Interposer with Au-Au Diffusion Bonding Technology for Wafer Level Fabrication

926

Xiao Chen, Jiaotuo Ye, GaoweiXu, Le Lao

E-005 Ceramic Column Grid Array: A High-reliability Approach for Area Array Packaging 930

Yingzhito Huang, Xueming Jiang, PengrongLin, Yusheng Cao, Binhao Lian, Quanbin Yao

E-006 A new flux clean method of using Dl water to replace organic solvent 934

Tong Zhao, Ting Li, He Q.C, Hans Zhang, Li Xian Ma

E-007 Advanced Packaging Stepper for 300mm Wafer Process 936

Zhou Chang, Li Zhongyu, ZhangLei

E-008 Study of Factors Influencing Tin Whisker Growth 940

Jiaojiao Yuan, Xuefang Wang, Zhicheng Lv, Shuai Shi, Yuzhe Wang, Sheng Liua

E-010 Integrated Wafer Thinning Process with TSV Electroplating for 3D Stacking 945

Cao Li, Shengjun Zhou, Run Chen, Tao Peng, Xuefang Wang, Sheng Liu

E-011 Introducing FCA, a New Alloy for Power Systems on a Chip and Wafer Level Magnetic

Applications 949

Trifon Liakopoulos, Amrit Panda, Matt Wilkowski, AshrafLotfi.KFI Tan, Li Zhang, Chiming Lai, Dong Chen

E-012 Finite Element analysis of wire clamp for wire bonding 955

Dengke Fan, Fuliang Wang

E-013 A Comprehensive Analysis of the Thermal Cycling Reliability of Lead-Free Chip Scale

Package Assemblies with Various Reworkable Board-Level Polymeric Reinforcement

Strategies 959

Hongbin Shi, Cuihua Tian, Daquan Yu, and Toshitsugu Veda

E-015 On the precision synthesis of the bonder in flip-chip equipment 971

Dawei Zhang, Meifa Huang, Zhiyue Wang, Bing Kuang, Mengmeng Xiao

E-017 An improved mean filter algorithm based on gray-scale difference and its application in

X-ray detection system 975

Peng Wang, WeiwenLv, Wenfei Zhang, BingAn, Yiping Wu

E-018 Challenges and Feasibility of Copper Wire bonding for Non-hermetic Packaging 980

Jing-en Luan

E-019 A buffered distributed spray MOCVD reactor design 986

Shaolin Hit, Zhiyin Gan, Han Yan, Sheng Liu

E-022 A Thick Film Accelerometer based on LTCC-Technology 990

Shichao Guo, Min Miao, Runiii Fang, Duwei Hu, YufengJin

E-024 Fabrication of a glass microfluidic device integrated with ultrasonic resonators 993

Wenlin Kuai, Jiniang Shang, Wenlong Wei, Shunjin Qin, Tingling Wang, Jie Chen, Li Zhang, Lai CM

E-025 Thick Film Resistors on Alumina Substrate as Sensing Elements 997

Xiaojie Chen, Zongyang Zhang, Sheng Liu

E-026 The Challenge of Grinding Technology for TSV and BSI Device 1000

Liew Loy Seng

E-027 THz Filters Embedded in LTCC Multi-layer Substrate 1003

Xiaoqing Zhang, Min Miao, ZhensongLi, Yuexia Zhang, YanzhuLv, Yating Yao

E-028 Topology optimization of Swing-arm in LED Die Bonder 1006

Meifa Huang, Dawei Zhang, Zhiyue Wang, Weichuang Quan

E-029 Mechanism Design and Dynamic Simulation of Die Bonding Machines 1010

Zhanhm Cao, Xiaohong Wu, Jian Gao, Yongjun Jiang, andXin Chen

E-030 Optimal design of work stage mounting system of precision packaging equipment 1015

Hid Jing, Cong Li, Fuyim Liu, Bing Knang

E-031 Research on Thermal Field of Giant Magnetostrictive Jetting Dispenser 1019

Pengfei Dan, Can Zhou, Shijun Zhang, Guiling Deng

E-032 Design of the temperature control system for the fluid jet-dispenser 1024

HitiLi, Can Zhou, Shijun Zhang, Guiling Deng

E-033 A Primer to Applying Real Time Dispatching in Semiconductor Test Operations 1027

Ng Yuh Lin

E-034 Effects of Sulfide on Silver-Plated Lead Frame on Wire Bonding Quality 1030

KMZhang, F, Zong, M. Hit, D.H Ye, Q.CHe

E-035 Structural Optimization Design of Swing Arm Based on HyperWorks 1034

Bing Kuang, Zhaolin Liu, Xiaohua Wu

Session F: Quality & Reliability

F-002 Ceil Balancing Technology in Battery Packs 1038

Laura Yang, Eden W, M. Ma, Michael Pecht

F-003 Influence of Parameter Initialization on Battery Life Prediction for Online Applications... 1042

Yinjiao Xing, Eden W. M. Ma, K-L. Tsui, Michael Pecht

F-004 Investigation on Surface Contamination caused by human on Phase Shifter Chip 1047

Zhenzhen Rao, Shengxiang Bao, Jianhai Ye, Zhang Xiaowen, Wang Zuwen

F-005 Reliability and Failure Analysis of Lithium Ion Batteries for Electronic Systems 1051

Nick Williard, Wei He, Dr. Michael Osterman, Professor. Michael Pecht

F-006 Stress Monitoring in Flip Chip Packaging Process 1056

Chengjie Jiang, FeiXiao, Chuanguo Don, Heng Yang

F-007 The effect of Voids on Thermal Conductivity of Solder Joints 1061

HailongLi, Chunqing Wang, Meng Yang, Ningning Wang, RongAn, YanjunXu

F-008 A Novel Current Sensor Based on Dual Hall Chips 1065

Xingguo Cheng, Zongyang Zhang, Fuan Lie, Sheng Liu

F-009 The effects of thermal cycling on electromigration behaviors in lead-free solder joints

1068

Zuo Yong, Limin Ma, Lu Yue, Sihan Liu, Fu Guo

F-010 Microstructure and Mechanical Properties of Lead-free PV Ribbon 1072

Xuewei Wu, Dongyan Ding, Bai Han, Dali Mao

F-011 Failure Mechanism Diagnosis on Plastic Package Integrated Circuit Basing on Fault Tree

Analysis 1076

Yuan Chen, Xiaoqi He, Ping Lai

F-012 Effect of Grain Orientation on Electromigration Degradation in Lead-free Solder Joints.

1080

Yanhong Tian, Jingkai Qin, Xiaobin He, Chunqing Wang

F-013 A Global Supply Chain Collaboration to Synergize Technology Achievement for Green QFN

Qualification 1083

Jeffrey ChangBingLee, Graver Chang, Cherie Chen, ChengChih Chen ,Jandel Lin

F-014 Ant-Algorithm-Annealing-Algorithm-based Optimization Approach for MCM Interconnect

Test 1089

Chen Lei

F-015 MCM Interconnect Test Scheme based on Particle Swarm Optimization Algorithm 1093

Chen Lei

F-018 Reliability of Fine Pitch Wafer Level Packages 1097

Donghm Yang, Xiaotong Ye, Fei Xiao, Dong Chen, Li Zhang

F-019 Failure Analyse of the Welding Point in Flip-Chip BGA Packages in The Drop-Free 1102

Yuan Guozheng, Bai Chuang, Shu Xuefeng

F-020 Reliability experiment of high power cm-bar arrays 1106

Lu Guo-guang, Lei Zhi-feng, Huang Yun, En Yim-fei

F-021 Investigation of Palladium Coverage on Free Air Balls of Palladium-Coated Copper Wires

1110

Haonan Pit, Tawei Lo, Techun Wang, Jiaji Wang

F-022 Experimental and FEM Study of Hygro-Thermo Reliability of FCPBGA 1114

Li Weijia, Gong Yonghui, Su Fei

F-023 Solderability of Eco-friendly OSP Surface Finish 1120

Shijun Lu, Yeqing Tao, Dongyan Ding, Yu Hit

F-024 A Novel Type of Stacked Cylindrical PoP Package 1124

Li-ye Cheng, Ling-feng Shi, Cheng-shan Cai, Chen Meng, Xin-quan Lai

F-025 Thermal Fatigue Life Optimization of QFN Package Based on Taguchi Method 1128

WU Wei, QIN Fei, GAO Cha, ZHU Wenhiti, XIA Guofeng

F-027 Effects of Micro Stamping Process on Optical Performance of Lead Frame LED Module

1133

Tao Peng, Zhaohui Chen, Chuangang Ji.FeiWang, KaiWang, ShengLiu

F-029 Comprehensive Analysis for LED Airport Runway Centerline Lamp 1138

Fei Wang, Tao Peng, Chuangang Ji, XiaogangLiu, Xiang Gao, ShengLiu

F-030 Investigation on Electromigration Failure of Phase Shifter 1141

Zhenzhen Rao, ShengxiangBao, Xiaowen Zhang, Zinven Wang, Weiming Lai

F-031 Tin Whisker Growth on Bright Sn Films Supported by Lead-frame Alloy Substrates 1145

Ting Liu, Dongyan Ding, Yiqing Wang, Yu Hit, Tihua Gong, Klaus-Peter Galuschki

F-032 Reliability of Pb-free BGA solder joints under random vibration 1150

Fengjiang Wang, Dayun Tang, Huabing Wen, Mingf'ang Wu

F-033 Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics 1155

Hengyou Liao, FulongZhu, Wei Zhang, Youkai Chen.Shao Song, ShengLiu

F-034 Assembly Technology by Multi-pin > HDF of PCB electrical connectors in Aerospace

electronic products 1159

Binbin Zhang, Wei Zhang, Meng Yang, Yarong Chen

F-035 Warpage measurement of silicon wafer of various junction surface area 1164

Wei Zhang, Fulong Zhu, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu

F-036 Random Vibration Simulation and Analysis of PoP Solder Joints with Different Structure

Parameters 1168

Tang Haili, Wit Zhaohaa, Lid Zhengwei

F-037 Fracture Properties of Cu-EMC Interfaces at Harsh Conditions 1172

M.Sadeghinia, K. M. B. Jansen, L. J. Ernst, II. Pape

F-038 A Numerical Method on Thermal and Vapor Pressure Effects on Void Growth in Electronic

Packaging 1176

Yue Mei, Xiaoqing Zhang, Xiangxin Zeng

F-039 Investigation for the Response of PCB Assembly with Five POP Packages during Dropping

1180

Yu Peng, Fan Zend, Yao Xiaohit

F-040 Dimension Optimization of Through Silicon Via (TSV) through Simulation and Design of

Experiment (DOE) 1185

Xiang Gao, Run Chen, Cao Li, Sheng Liu

F-041 Failure Analysis of Electroplating on Sliver Termination in Multilayer Ceramic Capacitors

(MLCCs) 1190

Long Gui, Shengxiang Bao, Xiao-wen Zhang, Zuwen Wang, Chengshi Zhang, Guanghua Shi

F-042 Process Control in Plasma Decapsulation: Preventing Damage to the Copper Wire Bonds &

Controlled Removal of Si3N4 Passivation Layer 1194

J. Tang, J.B.J. Schelen, C.I.M. Beenakker

F-043 Relationship between crack propagation trends and grains in SnAgCu interconnects

1200

C.Q. Wang, Y. Zhong, J.F.J.M. Caers, X.J. Zhao, B.Li

F-044 Key Failure Modes of Solder Joints on ENIG PCBs and Root Cause Analysis 1205

Yao Bin, Zou Yabing

F-045 Isothermal Low Cycle Fatigue Behavior of Nano-Silver Sintered Single Lap Shear Joint

1209

Xin Li, Xu Chen, Guo-Qnan Lu

F-046 The Sub-Model Method for Analysis of BGA Joint Stress and Strain During Random

Vibration Loading 1216

Xie Haijun,Zhou Dejian,,Lia Zhengwei

F-047 Automated IP Quality Qualification for Efficient System-on-chip Design 1222

Li-wei Wang, Hong-wei Luo

F-048 Effect of reflow time on shear property of two-step electroplated Sn-3.5Ag solder bumps

1226

Qinghna Zhao, Jinglin Bi, Anmin Hu, Ming Li, Dali Mao

F-049 An Assessment Method of Electronic Packaging Reliability Based on Rough Set Theory

1230

Ronghong Cui, Yuling He, Wenjim Shu, Hua Ding, Hon Bo

F-050 Dimensional change in micro-scale solder joint induced by evolution of IMCs 1234

Zhiwen Chen, BingAn, Yiping Wu, Changqing Liu, Rob Parkin

F-052 Formation and growth of intermetallic compounds of Sn-2Ag-2.5Zn on Cu and Ni substrates

1240

Yvcheng Liu, Tingbi Luo, Anmin Hu, Shangyuan Li, Weizhen Wang, Ming Li

F-053 Three-Dimensional Finite Element Analysis of Mechanical and Fracture Behavior of

Micro-Scale BGA Structure Solder Joints Containing Cracks in the Intermetallic Compound

Layer 1244

Hong-Bo Qin, Xing-Ping Zhang

F-054 The Irradiation Effect of DC-DC Power Converter under X-ray 1250

HE Yujuan, LUO Hongwei

F-055 Non-destructive testing of through silicon vias by using X-ray microscopy 1254

XiangmengJing, Daquan Yu, Wei Wang, Guoqing Yu, Lixi Wan

F-057 Analysis of POP Solder Ball Thermal Cycling Fatigue Life Based on Stress Strain 1258

Chen Liu,Xinquan Lai, YuanmingXiao, Lingf'eng Shi, Jianguo Jiang

F-058 Reliability evaluation of GaN based light-emitting diodes under high-temperature stressing

1262

Meijuan Fu,, Luqiao Yin, Fei Weng, Lianqiao Yang, Jianhua Zhang

F-059 An Innovative Way to Improve the Reliability of Gold Wire in Lighting Emitting Diodes (LEDs)

1266

Run Chen, Xiang Gao, XiaogangLiu, Cao Li, ShengLiu

F-060 Failure Analysis of Assembly Defect with IR-OBIRCH from Backside 1271

Li Tian, Miao Wu, Chunlei Wu, Diwei Fan, Gaojie Wen, Dong Wang

F-061 Investigation on FBGA Block Warpage by Finite Element Simulation 1275

JinruiLI, Lin TAN, Qian WANG, Jian CAI, Guoiiang YU, Shuidi WANQXiyim CHENG

F-062 Leakage failure analysis of nickel-copper gas-proof material used in traveling-wave tube

1280

Chengshi Zhang, Shengxiang Bao, Xiaowen Zhang, Zuwen Wang, Peng Li, Long Giti

F-063 Research on BGA Solder Joint Two-dimensional Quality Information Extraction 1284

Zhao Hiiihuang, Wang Yaonan, Sun Yaqi

F-064 Research on SMT Solder Joint Image Segmentation 1287

Sun Yaqi, Liu Yu

F-066 The study of impacts on long-term storage reliability caused by IC packages and preventing

measurements 1290

Zhang Qian, Hit Kaibo

F-067 Effect of Ni-W Alloy Barrier Layer on Copper Pillar/Sn IMCs Evolution 1294

Chao Li, Anmin Hit, Ming Li, Jiangyan Sun

F-068 Loading Rate and Size Effect on the Fracture Behavior of BGA Structure

Cu/Sn-3.0Ag-0,5CuyCu Interconnects 1298

Xan-Ping Li, Hong-Bo Qin, Yun-Fei En, Jian-Min Xia, Xin-Ping Zhang

F-070 Microstructural Evolution and Mechanical Behavior of Line-type Ni/Sn3.0Ag0.5Cu/Ni

Interconnects with a Small Thickness during Isothermal Aging 1303

Jing-Bo Zeng, Guang-SuiXu, Min-Bo Zhou, Xiao Ma, Xin-Ping Zhang

F-072 Moisture diffusion and integrated stress analysis in LED module 1308

Gong Yu-bing, Xu Jia-bing

F-074 Study on the delamination between adhesive film and silicon in stacked-die packaging

1314

Yinxing Liao, Xiao Li, Jim Wang

F-078 Study on Interfacial Behavior and Shear Strength of Lead-free Micro-interconnect Bump after

SnPb Reballing 1317

Zhou Bin, Zhou Qing, En Yun-fei

F-079 Influences of the Initial Thickness of the Interfacial IMC Layer on Electromigration Behavior

of Cu^Sn/Cu Microscale Joints 1320

Wu Yite, Hong-Bo Qin, Min-Bo Zhou, Guang-SidXu, Shan-Shan Cao, Xiao Ma, Xin-Ping Zhang

F-080 Environmental reliability of nano-structured polymer-metal composite thermal interface

material 1326

Xiuzhen Lu, Mengke Zhitang, Lei Zhang, Lilei Yejohan Liu

F-081 Thermo-mechanical Behaviour Analysis of Micro-solder Joints by Finite Element Modelling

1329

X. Zha, C. Liu, V.V. Silberschmidt

F-082 Accelerated test and life evaluation method of microwave tube in short vacuum tube

1333

Fangfang Song, Yunfei En, Shajin Li, Xiao Hong, Xiao-bao Su, Shi-ji Yu

F-083 The Study of infrared radiation thermal imaging technology for temperature testing 1336

Fangfang Song, Xiaoqi He, Ping Lai, Ren wang

F-084 Extraction of Anand Model Parameters for Mixed Solder Material by Tensile Test 1340

Zhou Bin, Zhou Qing, Pan Kailin, Liu Ganggang

F-086 Degradation Detecting of Solder Joints by Time Domain Reflectometry Technology 1344

Yu-Dong Lu

F-088 Failure Localization and Mechanism Analysis in System-on-Chip (SOC) using Advanced

Failure Analysis Techniques 1348

Yuan Chen, Hid Chen, Xiaowen Zhang, Ping Lai

F-089 Study on Signal Transmission Performance of Microwave Multi-chip Modules Interconnect

Via Hole Structure 1352

WU Zhaohua

F-090 The Reliability Evaluation of the Bonding Wire in the DC/DC Power Under the Environment of

Humidity 1357

ZhangXiao Wen, He xiaoqi

F-091 Reliability of HTS and HH/HT Tests Performed in Chips and Flex Substrates Assembled By a

Thermosonic Flip-Chip Bonding Process 1360

Cheng-Li Chuang, Jong-NingAoh, Min-Yi Kang

F-094 Energy Density Estimation of Crack Initiation in Sn-Ag-Cu(Ni) Solder Bump by Nano-impact

1367

Z.MA, S.BELHENINI, DJOLY, F.CHALON, R.LEROY, N.RANGANATHANF.Qin.F.Doisseul

F-096 Electrochemical Migration and Electrochemical Corrosion Behaviors in 3wt.% NaCI Solution

of 64Sn-35Bi-1Ag Solder with In doping for Micro-nanoelectronic Packagings 1372

L. Hua, W. Dai, L. S. Duan, C. Y. Zhong

F-097 Statistical Analysis of the Impacts of Refinishing Process on the Reliability of

Microelectronics Components 1377

C. Y. Yin, C. Best, C. Bailey, S. Stoyanov, M. O. Alam

F-098 Equivalent moisture distribution calculation for fast moisture sensitivity level analysis

(MS LA) 1382

Xiaosong Ma, D.G.Yang, G.Q.Zhang

F-099 Decapsulation methods for Cu interconnection packages 1387

Xiaosong Ma, D.G.Yang, G.Q.Zhang

F-100 A Study of Ultrasonic Bonding Flip Chip Process and its Reliability for Low Temperature

Interconnection 1392

Yo-Han Song, Sang-woon Seo, Gu-Sung Kim

F-104 Failure mode of SAC305 lead-free solder joint under thermal stress 1395

Chao Huang, Daoguo Yang, Boyi Wu, Lili Liang, Yu Yang

F-106 Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under Current

Stressing 1399

Song Pan, Mingliang Huang, Ning Zhao, Shaoming Zhou, Zhijie Zhang

F-107 Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag

Based Solder Joints 1403

QiangZhou, Mingliang Huang, Ning Zhao, Zhijie Zhang

F-108 Abnormal phase segregation induced by void formation in Cu/Sn-58Bi/Cu solder joint during

current stressing 1407

Hongwen He, Guangchen Xu, Fu Guo

F-109 Research on LED Temperature Characteristic and Thermal Analysis at Low Temperatures

1411

Yu Guo, Kai-lin Pan, Guo-tao Ren.Shu-jing Chen.Fei Yuan

Session G: Solid State Lighting Packaging and Integration

G-002 Impact of Sn3.OAgO.5Cu Solder Powder Size on the Reliability of Solder Joints in High

Density LED Packages 1416

Xinxin Wang, Limin Ma, Ya Qi, Jianping Liu, Fu Guo, Li Liu

G-003 Design of One Novel LED Airport Runway Centerline Light Suitable for Various Applications

1421

Chuangang Ji, Mengxiong Zhao, Tao Peng, Fei Wang, Cao Li, Sheng Liu

G-004 Thermal characterization of high power LED array in Aluminum Base Copper Clad Laminate

package 1425

Chunjin Hang, JingmingFei, Hong Wang, Chunqing Wang

G-005 Development of a new die-attach process and related bonding tool for multi-chip LED

module 1429

Chunjin Hang, Hong Wang, Jingming Fei, Chunqing Wang

G-006 Research on eutectic bonding processes and interfacial damage features in high power LED

package 1432

W. Liu, P. Jin

G-007 Thermal Design of a LED Multi-chip Module for Automotive Headlights 1435

Qi Lin, Wang Chunqing, Tian Yanhong

G-008 Effects of Solder Layer on the Thermal Performance of LED Chip Array Package 1439

Xiaogang Liu, Run Chen, Fei Chen, Sheng Liu

G-010 Study on Mechanical Behavior and Interfacial Strength of YAG Phosphor-Filled Silicone

1443

Xing Chen, Simin Wang, Fei Chen, Huai Zheng, Sheng Liu

G-011 Phosphor Concentration in Silicone and Its Effect on the Mechanical and Interfacial

Properties of Phosphor-Filled Silicone 1447

Xing Chen, Simin Wang,, XiaogangLiu, ShengLiu

G-012 Comprehensive Studies on Interfacial Properties and Microstructures of Silicone Used in

LED Packaging 1451

Simin Wang, Xing Chen, Xiaogang Liu, Fei Chen, Bin Cao, ShengLiu

G-015 Robustness of Point Light Source Approximation in Lens Design for Light-Emitting Diode

Packages 1455

Run Hit, ZhiliZhao, ShengLiu, andXiaobingLuo

G-016 A Novel LED Un-symmetrical Lens for Road Lighting with Super Energy Saving 1459

Zhili Zhao, Ran Liu, Kai Wang, Fei Chen, Shang Wang, ShengLiu

G-018 Fabrication of YAG Glass Ceramic and Its Application for Light Emitting Diodes 1463

Liang Yang, Mingxiang Chen, Shan Yu, Zhicheng Lv, ShengLiu

G-019 Establishment of the Coarse Grained parameters for epoxy-copper Interfacial Separation

1467

Cell K. Y. Wong,, Stanley Y. Y. Leung, Rene II. Poelma, Kaspar M. B. Jansen, Cadmus C. A. Yuan, Willem D. van Driel,

Guoqi Zhang

G-021 A Method to Design Freeform Lens for Uniform Illumination in Direct-Lit LED Backlight with

High Distance-Height Ratio 1474

Run Hu, Huai Zheng, ChuangangJi, ShengLiu, XiaobingLuo

G-022 Optical Study of Phosphor Converted Light Emitting Diodes with Given Correlated Color

Temperatures 1479

Xing Fit, Huai Zheng, Sheng Liu, XiaobingLuo

G-023 Angular Color Uniformity Improvement for Phosphor-converted White Light-Emitting Diodes

by Optimizing Remote Coating Phosphor Geometry 1483

Huai Zheng, Xing Fit, Run Hu, ShengLiu andXiaobingLuo

G-024 Angular Color Uniformity Enhancement of Phosphor Converted White LEDs Integrated with

Compact Modified Freeform TIR Components 1487

ShuimingLi, Kai Wang, Fei Chen, ShuangZhao, ZhiliZhao, ShengLiu

G-026 Optical design of LED packaging for concentrated and uniform lighting 1491

Shuang Zhao, Kai Wang, Fei Chen, Sheng Liu

G-027 Reliability Assessment of LED Luminaires Based on Step-stress Accelerated Degradation

Test 1495

Rongbin Ren, Daoguo Yang, Miao Cai, Ming Gong

G-028 Analysis on the Failure Modes and Mechanisms of LED Packaging 1500

Liu Xin, Fang Wenxiao

G-030The Simulation Analysis of LED Luminaires for Indoor Lighting 1503

Wanchun Tian, Daoguo Yang, Miao Cai, Zhen Zhang, Ming Gong, Yu Yang

G-031The design of LED driving power based on Current-double synchronous rectifier ZVZVS

1508

XingXue, Weikang Chen, BaoqicmgLi

G-032 Rapid thermal cycling by eddy current inducted heating on optical property and

thermostability of high power LED 1512

Jibing Chen Wei Guo Yinong Liu Wenfei Zhang BingAn YipingWu

G-033 Study on Packaging Structure of High Power Multi-Chip LED 1516

Peng Huang, Kailin Pan, Shuangping Wang, Shujing Chen

G-034 A structure design in HP-LED chip for higher reliability 1521

Shuangping Wang, Kailin Pan, Peng Huang, Fei Yuan

G-035 Research on thermal shock test for the optical and electrical properties of white LEDs

1526

YinongLiu, Jibing Chen, Wei Guo, Wenfei Zhang, Yiping Wu, BingAn

G-036 Stress Analysis of LED Bulb under Thermal and Humid Environment 1530

Lili Liang, Daoguo Yang, Chao Huang, Fengze Hon, Hongyii Tang, Miao Cai, Zhen Zhang

G-040 Thermal analysis of phosphor in high brightness LED 1535

H. Ye, SauKoh, C.A.Yuan, G. Q. Zhang

G-041 Determination of Driving Current of RGB LEDs for White Light Illumination 1540

Huishan ZHAO, S. W. Ricky Lee

G-043 Reliability Assessment for LED Luminaires Based on Step-Stress Accelerated Life Test

1546

Ming Gong, Xiaosong Ma, Daoguo Yang, Miao Cai, Zheng Zhang, Rongbin Ren, Yu Yang

G-045 Thermal Analysis of High-Powered Devices Using Analytical and Experimental Methods

1550

J.H.L. Ling, A.A.O. TayandK.F. Choo

G-046 Influence of Die Attach Materials to Optical and Thermal Performance of High Power LEDs

1556

Pengzhi Lu, Hua Yang, Huaiwen Zheng, Bin Xue, Xiaolong Wang, Linlin Wang, XiaoYan Yi, Lixia Zhao, Junxi Wang,

Guohong Wang, Jinmin Li

G-047 An Effective Prediction Method for LED Lumen Maintenance 1560

H. B. Fan, X. P. Li, J. X. Shen, M. Chen

Session H: Emerging Technologies

H-001 Mechanism of Glass-Frit Fracture in MEMS Packaging 1564

Hu Guojun

H-003 Wet etching of vias for wafer level packaging of GaAs based image sensor 1569

Wang Shiiangfu, Han Mei, Xu Gaowei, Luo le

H-004 Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins

for Micro-Cooler 1573

Yan Zhang, Hui-feng Lv, Jing-yu Fan, Di Jiang, Johan Liu

H-005The effects of isothermal aging on sandwich structural of p- and n- TE/Ni/SBA/Cu

joints 1578

Li Shen, Fa Gno, Nan Zheng, Ran Zhao

H-006 A Steel Pressure Sensor Based on Micro-fused Glass Frit Technology 1582

Zongyang Zhang, Xinggiio Cheng, Xulong Gui, Xiaojie Chen, Sheng Liu

H-007 Microstructure Evolution of 1100 Al Alloy Multi-foils during Ultrasonic Additive

Manufacturing 1586

Hongjun Ji, Junzhao Wang, and Mingyu Li

H-009 A Novel Lens for High-luminance LED Direct Backlight 1590

ChuangangJi, MengxiongZhao, Run Hit, Tao Peng, Zong Qin and Sheng Liu

H-010 Sinter-Attach of High-Temperature Sensors for Deep-Drilling Monitoring 1594

Julian Kahler, Andrej Stranz, Erwin Peiner; andAndreas Waag

H-011 A study of electrical character of 3D high-density junction capacitor for SiP 1600

Huijuan Wang, Daquan Yu, Ran He, Liqiang Cao, Lixi Wan

H-012 Embedded Active Device Packaging Technology Based on Organic Substrate 1604

Xia Zhang, Jason Chan, Liqiang Cao, Xveping Guo, Yongjun Huo, Pinghita Bao, Linwen Kong, Lixi Wan

H-013 Mechanical Strength and Interface Characteristics of Glass-to-Glass Laser Bonding using

Glass Frit 1609

Zunmiao Chen, YunengLai, Lianqiao Yang, Jianhna Zhang

H-014 A combined fabrication methodology of the through wafer via for wl-package of GaAs image

sensors 1614

Jiaotuo Ye, Shiiangfu Wang, Gaowei Xu, Chunsheng Zhu, LeLuo

H-015 Molecular Dynamics Investigation on Temperature-dependent Thermal Expansion and

Elastic Properties of Gallium Nitride Nanorods 1617

Han Yan, Zhiyin Gan, Sheng Liu

H-016 Influence of Strains on the Optical Properties of Non-polar and Semi-polar Gallium Nitride

Based LEDs 1620

Han Yan.Zhiyin Gan, Sheng Liu

H-018 Microstructural evolution of Sn single grain microbumps for 3D-TSV high density solder

interconnection under thermal aging tests 1624

Xing Shen, Bo Wang, Wenfei Zhang, BingAn, Yiping Wu

H-019 A Nanostructure Patterned Heat Spreader for On-Chip Thermal Management of HigH-OPowerLEDs 1628

Zhen Sun, Xiaodan Chen, Huihe Qin

H-020 Direct robust active bonding between Al heat sink and Si substrate 1635

L. C. Tsao, S. Y. Chang, Meng-Syuan, Huang, C. S. Chen

H-021 Fabrication of Wafer-Level Spherical Rb Vapor Cells for Miniaturized Atomic Clocks by a

Chemical Foaming Process 1639

Wenlong Wei, Jintang Shang, Wenlin Kuai, Shunjin Qin, Tingling Wang, Jie Chen

H-022 Thermo-mechanical Design and Optimization of Micro Copper Pillar Bump for Electrical

Interconnection in 2.5D IC Integration 1642

Shunjin Qin, Jintang Shang, Hongyan Guo, Li Zhang, Lai CM

H-023 Preparation of VACNT TIM by a Novel Metallization and Chemical Bonding Process 1646

Tingling Wang, Jintang Shang, JingdongLiu

H-024 Electrical Characterization of Novel Material for High-density Capacitors 1655

Wenbin Chen, Miao Cai, Ming Gong, Bingbing Zhang, Yu Yang, Zhen Zhang, Kailin Pan, Daoguo Yang

H-025 Highly Accelerated Life Testing of LED Luminaries 1659

M. Cai, W. B Chen, L. L Liang, M, Gong, W.C Tian, H. Y, Tang, S. Koh, C. A Yuan, Z. Zhang, G. Q. Zhang, D. G Yang