Overview of iNEMI

David Godlewski, iNEMI

March 11, 2013

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Contents

iNEMI Overview & Membership

Technology Roadmap

Projects and Initiatives; Closed; Open; New

Summary

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About iNEMI

International Electronics Manufacturing Initiative (iNEMI) is an industry-led

consortium of around 107 global manufacturers, suppliers, industry

associations, government agencies and universities. A Non Profit Fully

Funded by Member Dues; All Funding is Returned to the Members in High

Value Programs and Services; In Operation Since 1994.

Visit us at www.inemi.org

5 Key Deliverables:

• Technology Roadmaps

• Collaborative Deployment

Projects

• Research Priorities Documents

• Proactive Forums

• Position Papers

3 Major Focus Areas:

• Miniaturization

• Environment

• Medical Electronics

Mission: Forecast and Accelerate improvements in the Electronics

Manufacturing Industry for a Sustainable Future.

3

Global Operations

• iNEMI is headquartered in Herndon, Virginia, USA.

• Opened an office in Shanghai and added a team member in Europe in 2007.

• Dr. Haley Fu is leading operations in Asia, based in Shanghai, China.

• Grace O’Malley is representing iNEMI in Europe from her base in Ireland.

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Unique Attributes of the iNEMI Consortia

• Strong Global Membership accompanied by a mission that

focuses on identifying global manufacturing challenges

• Delivery of a total industry set of priorities every two years:

– A Technical Plan that defines key collaborative

opportunities and gaps in the 1-5 year horizon

– A set of Research priorities for the 5-10 year horizon

• A proven methodology for effective pre competitive

collaboration.

• Ability to execute an integrated supply chain approach on

solving complex manufacturing and systems integration

issues.

• A growing reputation as a proactive leading organization in

the environment and sustainability

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Highlights of iNEMI 2012 • Added 14 new members in 2012 (Including UL Medical)

• The 2013 iNEMI Technology Roadmap available to members.

• 2013 Roadmap available to industry end of Q1 2013.

• Excellent progress in Miniaturization, Environmental and Medical areas of

focus; Many key new projects underway.

• 3 medical projects started in 2012

• Two medical initiatives underway

• Industry excitement in new projects such as UL certification, Counterfeit

Electronics, Packaging Equipment Standardization, Medical and more.

• 8 new project initiatives (1 medical) identified for 1H 2013.

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International Member Growth

Across The Total Supply Chain

Total Global Supply Chain Integration

70% Growth in past 3 years

The International Membership Incorporated Location; Number of Members

INEMI Member Business Type North

America Asia

Region Europe Totals

OEM 14 3 2 19

ODM/EMS (inc. pkg. & test services) 5 6 1 11

Suppliers (materials, software, services) 9 18 12 39

Equipment 8 0 2 10

Universities & Research Institutes 8 3 2 13

Organizations 11 1 2 14

Totals 55 31 21 107

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iNEMI Areas of “Critical Mass” • Leading OEMs &

Semiconductors

IBM HP

Dell Lenovo

Intel Microsoft

Delphi RIM

Cisco Juniper

TI Huawei

Alcatel Lucent

MSEI Med El

BSCI Cochlear

Packaging Firms

– STATS ChipPAC

– Amkor

– ASE Group

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Laminate/substrate suppliers

– Ibiden NGK/NTK

- Samsung Electro Mechanics

- Doosan Multek

– ITEQ Nanya

– Shengyi Sci. Tech.

– Endicott Interconnect Tech.

– Elec & Eltek

– Dyconex AT&S

Research Institutions

• MIT Fraunhofer

• SUNY Binghamton CALCE

• IMEC Peking U

• ASU ITRI

• RIT NIST

• Georgia Tech NCMS

• UC Berkeley Purdue

• Griffith University

ODM/EMS firms

– Wistron

– Celestica

– Sanmina SCI

– Plexus

– Flextronics

– IEC

– Valtronics

Equipment Firms

Agilent Micronic/Mydata

Akrometrix PVI Systems

Universal Speedline

Teradyne Corelis

Assembleon Hover Davis

Nordson

Chemical/Adhesives/Metals

- Dow -- Nippon

- Inventec - Heraeus

- Henkel - Hitachi Chem

- Indium - NAMICS

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Methodology

• We utilize our technology roadmap process to ID key

market trends and technology evolution

– Looking 10 years to the future

• From this information gathered we extract key gaps and

challenges faced by the electronics manufacturing

industry and supply chain

• We then use working groups and organized workshops

to further refine key opportunities for collaborative

projects

• We organize the projects, manage the process, and then

ensure results are delivered that meet member

expectations and needs.

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Why Organizations Participate in iNEMI

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• Opportunity to broaden your organization’s engagement in the

industry

• Better anticipate technology trends & inflexion points

• Collaborate with key players, industry experts, customers and

suppliers, globally – in all major markets

• Get access to learning and knowledge experts within iNEMI

members

• Help influence and create industry-standard solutions that lead to

competitive and best in class products and product attributes

• Help guide and benefit from industry innovation and funded

research

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Annual Participation Fees

Participating Members (For Profit)

Corporate Sales (USD) Membership Dues

$0-5M $5,000

$5-10M $10,000

$10-100M $15,000

$100M-1B $25,000

$1-10B $40,000

$10-15B $55,000

$15B+ $75,000

Affiliate Members (Not-For-Profit)

Category Membership Dues

University $5,000

RI/Org./Gov. Lab/R&D

Center $10,000

The 2013 iNEMI Roadmap; Process and Scope

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12 12

12

2011 Technology Working Groups (TWGs)

Organic PCB Board

Assembly Customer

RF Components &

Subsystems

Optoelectronics Large Area, Flexible Electronics

Energy Storage &

Conversion Systems

Modeling, Simulation,

and Design

Packaging

&

Component

Substrates

Semiconductor

Technology

Final

Assembly

Mass Storage (Magnetic & Optical)

Passive Components

Information

Management

Systems

Test, Inspection &

Measurement

Environmentally

Conscious

Electronics

Ceramic

Substrates

Thermal

Management

Connectors

MEMS/

Sensors

Red=Business Green=Engineering Purple=Manufacturing Blue=Component &

Subsystem

Solid State Illumination

Photovoltaics

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Roadmap Development

Product Emulator Groups TWGs

Medical Products

Automotive

Defense and Aerospace

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Product Sector Needs vs. Technology Evolution

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Office / Large Systems

Highend (e.g. netcom, server)

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Collaborative Projects

15 Jim Arnold 02/27/2012 Slide 15

SELECTION

DEFINITION

PLANNING (The Initiative Phase)

EXECUTION / REVIEW

CLOSURE

1

2

3

4

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The Project Process - 5 Steps

Limited to Committed iNEMI Members

Open for Industry input

------------------- iNEMI Technical Committee (TC) Approval Required for Execution

Project and Initiative Status

• 10 Projects Completed in 2012

• 11 New Projects Officially Launched in 2012

• 18 Projects as of 31 January 2013 – 19 when the DC-DC Power Module launches; Now in Sign Up

• 16 Initiatives Under Development

17 Jim Arnold 02/27/2012 Slide 17

11 New Projects Officially Launched in 2012

Board Assembly TIG

1. Counterfeit Components - Assessment Methodology and Metric Development

(1Q 2012)

2. Developing Manufacturing Strain Guidance of Pb-Free PCBAs (2Q 2012)

3. Packaging Equipment Convergence Requirements (4Q 2012)

4. PCBA Reliability Qualification (4Q 2012)

Medical TIG

5. Defining Reliability Requirements for Implantable Medical Devices (1Q 2012)

6. Qualification Methods for Portable Medical Products (1Q 2012)

7. Component Specifications for Medical Products (1Q 2012)

Test TIG

8. Structural Test of External Memory Devices – Testing DDR Memory (1Q 2012)

9. BIST "Use Case" Function Classification Project (4Q 2012)

Packaging TIG

10. Warpage Characteristics of Organic Packages (2Q 2012)

Organic PCB TIG

11. Improving UL Certification of Laminates and PCBs (2Q 2012)

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Existing iNEMI Projects

Project name Status Estimated

Completion Improving UL Certification of Laminates and PCBs Starting 2Q 2012 Mar-13

Developing Manufacturing Strain Guidance of Pb-Free PCBAs Starting 2Q 2012 Apr-13

Warpage Characteristics of Organic Packages Starting 2Q 2012 Apr-13

Defining Reliability Requirements for Implantable Medical Devices Started 1Q 2012 May-13

Component Specification for Medical Products Started 1Q 2012 Oct-13

Qualification Methods for Portable Medical Products Started 1Q 2012 Jun-13

Counterfeit Components Assessment Started 1Q 2012 Jun-13

The Harmonization of Environmental Data Management Started December 2011 Done

Structural Test of External Memory Devices – Testing DDR Memory Added new task (Original tasks complete 2Q 2012) Mar-13

Copper Wire Bonding Reliability - Phase 2 Reliability testing to take > 8 months Mar-13

Advanced Si-node Pb-free Underfill Reliability Phase 2 Sign up closed; Team kicks off this month Q2-14

Eco-Impact Evaluator for ICT Equipment – Phase3 Phase 3 In definition; Expect SOW in Q2 13 Jun-14

Pb-Free Early Failure - Phase 2 Reliability testing ongoing Feb-13

Creep Corrosion – Phase 4 Moved to Sign up on March 4th Q2 14

Connector Particle Thickness Ongoing – End of project estimated 4Q Done

Rare Earth Metals Assessment and Supply Chain Actions Ongoing Q3- 13

Wiring Density for Organic Packaging Substrates Summarizing survey output Done

Pb-Free Rework Optimization, Phase 3 (Reliability Evaluation) Reliability testing ongoing Feb-13

Characterization of Pb-Free Alloy Alternatives Reliability testing ongoing Jan-13

Halogen-Free (BFR) High-Reliability PCB Final testing and final report in progress July -13

Pb-Free Component & Board Finish Reliability Final report in progress Jun-13

19 Jim Arnold 02/27/2012 Slide 19

Initiatives Under Development

1. Boundary Scan Phase 3 Project Development – Bi-weekly meetings started in September 2012

2. Creep Corrosion Qualification Test Development – Bi-weekly meetings started in November 2012

3. Medical 03 - Supply Chain Support – Bi-weekly meetings being held

4. Medical 08 Medical Flex – Exploratory meeting held on 23 January 2013

5. Development of Cleanliness Specification for Lens-Based Optical Transceivers and Connectors – Project formation team met on 28 January 2013

6. MEMS University/Industry Collaboration – Initiative kick-off planning in process – Co-Chairs met; definition underway

7. Rare Earth Metals – Project re-engagement; white paper definition well underway

8. DC to DC High Efficiency Power Conversion – Approved by; Documents on Web Site; Project Open for Sign Up

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Summary

• The iNEMI strength in technology roadmap development creates

clarity of industry gaps and needs

• iNEMI membership and methodologies are very focused on

delivering results oriented collaborative R&D.

• We have growth in development projects, research projects, and in

membership

• Organizations that get excellent ROI from iNEMI membership

commit their resources to multiple collaborative R&D projects

• Opportunity to partner with key suppliers and technical peers

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www.inemi.org Email contacts:

Bill Bader

bill.bader@inemi.org

Bob Pfahl

bob.pfahl@inemi.org

Grace O’Malley - Europe

gomalley@inemi.org

Haley Fu - Asia

haley.fu@inemi.org