Overview

Established 1997

Revenue US$600M(2017)

Number of Employees 1,940(2017)

Business Areas System IC

Technology 90nm~0.35um

Capacity 116,000wfs/month(200mm)

History

Facilities

Fab1(Bucheon) Fab2(Sangwoo)

Bucheon

Sangwoo

55 60 64 67

45 52

52 52

2015 2016 2017 2018(P)

Fab1 Fab2

Capacity

(Unit: Kwfs/month)

Global Networks

2010s, Appearance of new technology and applications

with the wave of 4th industrial revolution

2016, The first statement about 4th industrial revolution

in Davos Forum

1970s, 3rd industrial revolution (Knowledge and information)

1990s, PC commercialization

Late 2000s, Smartphone commercialization

[IoT]

[AI]

[Big Data]

[Smart Factory]

[AR/ VR]

[Wearable] [3D printing]

[Drone]

[Robot]

[Smart Car]

[FinTech] [Music]

[Smartphone]

[Game] [Education]

[Movie]

[internet]

[Finance]

Knowledge and information society

with smartphone

Business Strategy Industry Environment

Hyper-connected and super intelligent

society in 4th industrial revolution

429

461 461 476

489

2017 2018 2019 2020 2021

61

66

71

78

84

2017 2018 2019 2020 2021

(Unit: $B)

(Source: IHS ‘18.1Q)

(Unit: $B)

Business Strategy Industry Environment

Technology

System Process

Experience • Various Technology Platform

• Competitive Power &

Sensor Technology

• Technology Innovation

• Full PDK Support

• Competitive Cycle Time

• Superior Quality Control System

• 20years of Foundry Experience

• Partnership with Customers

• Track Record of Success

• Improvement Processes

• Customer Relationship

Management Processes

Foundry Value Proposition

Key Process Portfolio

eFlash

High Voltage CMOS

Applications

AUDIO

TABLET

AUTOMOTIVE

WEARABLE SMARTPHONE DATA SERVER

DRONE

AR/ VR

TV

SECURITY AI SPEAKER

NOTEBOOK

IoT

Analog/ Power

Mobile Security Medical Industrial

PMIC Motor Driver IC Wireless Charger DC-DC Converter

eFlash Mixed-Signal

TSC MCU

UHD LDI OLED TDDI

Audio Codec High Precision ADC Fingerprint Sensor WLAN CMOS PA Microdisplay

CIS High Voltage

CMOS

LV (≤40V)

MV (≤45V)

HV (≤100V)

UHV (Non-Epi)

Development Planning

AN180(Non-Epi)

BD180LV(Gen2) BD180LVA(Gen3)

AN180LC BD180LV(Fab2)

BD180LVA(Fab2)

BD130LV(Gen1)

BD180LV(Gen4)

BD130LV(Gen2)

BD180MV

BD350

BD180X BD180XH BD130XH

UHV700 UHV700(Gen2)

BD180XH(Gen2)

BD180SOI

Technology Roadmap

0.18um

- Stitching

0.13/

0.11um

- Stitching

90nm

IL18SH X-ray, Line sensor

IL13SI

IL13SJ IL13SK

IL09SA

ToF : PPD (Mobile)

ToF : SPAD (ADAS)

Global Shutter

Development Planning

Technology Roadmap

0.18um

0.11um

0.11um

RF Front End

90nm

0.13um

eFlash

MS180

HP180 Low noise

MS18BC Low noise

MS18BD Low cost, Low noise

TS11SB Low noise

RF11SB Low noise

TS11SC Low noise/ULL

RF11SC(HRS)

MS18BE Low cost, Low noise

RF11SD & SE(HRS) RS13SA(SOI) RS13SA(SOI)

TS09SA Low noise

SE13SA TE13SB

Development Planning

Technology Roadmap

TV

IT

Mobile

LD350 LD160 LD150 LD130

LD180 LD160

LD110 LD110

LD160 LD110

SJ MOSFET(Gen2) 600V/650V/700V

SJ MOSFET(Gen3) 600V/650V

IGBT 1200V Automotive

Microphone(Gen4) Microphone(Gen1) Microphone(Gen2) Microphone(Gen3)

Micro Heater

Development Planning

Technology Roadmap

Partner Companies

Design Infra Application Specific IP

Reference Design Flow

Design Environment

YourFabTM Service

ShuttleChipTM Service

0.11um

0.11um

0.13um

0.15 ~ 0.18um

Tape-out start date

* The shuttle schedule might be changed or canceled if the minimum number of paid seat has not been filled. * Schedule for some ShuttleChip may change due to un-foreseen circumstances, so please contact your account manager for updated schedule. * DB check will be cleared within 7 days before tape-out.

Certifications