Outer BarrelHybrid Integrated

Circuit

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

OUTLINE

• OB Module assembly

• Ongoing activitiestools for:- modules pre-alignment and shipping- laser soldering test with 1 and 14 chips- pALPIDE_fs chip

• Summary

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014 2

• 50 µm thick• size 15 mm x 30 mm

FPC layer stack up Cover-sheet 25

µmCopper 50 µm

Copper 50 µmKapton 25 µm

First version of FPC

OB Module assembly: material

6 modules have been produced - 1 with carbon plate - 5 without carbon plate

210,6 mm

30

,1 m

m

Dummy FPC

• designed as in TDR1 to accommodate 7 x 2 chips• holes metalized• no coverlay at the bottom• produced by Nuova Eurotar

Dummy chip

3Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

C

1

2-5

4

AB

AB

3

4Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

OB Module assembly

A

Accuracy of chips x,y position: < 8 um (average)

OB Module assembly

2 modules already shipped to Cagliari

Front view

Back viewCarbon plate K13D2U 75gsm (≈ 40µ) Thickness 0,11-0,12mm Weight

1,22g

Modules with carbon plate

Chip: 15 mm x 30 mm300 um thick

Front view

Back view

Modules without carbon plate

5Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

• Time manufacturing: 2 hours + curing time

• Tools developed and assembly procedures: accuracy of chips x,y position < 5 um (average)

Production of 10 dummy modules (without carbon plate) for development of the stave assembly procedure is on going as scheduled:• 4 modules already shipped to Torino• 6 modules completed by the end of March: 64 dummy chips needed

Weight 4,4 g

6Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

OB Module assembly

the pick up tool must be used for all modules handling

operations

Ongoing activities: tools for modules prealignment and shipping

Next 6 modules will be shipped by end of

March

by Silvia

Module box

references holes for Module box

dummy module

Pins for module pre alignment

Conductive carrying case for

shipping half stave modules

12

34

56

7

Half stave modules

foam

Alignment

station

7Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

1

2

3 4

Ongoing activities: tools for laser soldering test

Daisy chain FPC in copper

Macor grid

Vacuum tool

Ball pick up tool

Preparation of two single chip assemblies with glue and adhesive tape in order to define the procedure for a fully equipped dummy modules to solder at CERN

Mechanical screwsfor chip-fpc alignment

8Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

Quartz window

1

3

2

4

Ongoing activities: tools for HIC laser

soldering test

1

3

2

4

9Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

Reference pins

The pre-fixed module is then placed on the tool for

the laser soldering interconnections

Ongoing activities: production of the new FPC

The production of the dummy FPCs for 14 chips was commissioned to Nuova Eurotar company.

M. Sacchetti

FPC elaborated on the layout design for the IB module

10Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

220,4 mm

30

,1 m

m

FPC layer stack up Cover-sheet 25

µmCopper 50 µm

Copper 50 µmKapton 25 µm

Ongoing activities: ball pick up tool for pALPIDE_fs chip

11Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

Third ball pick up tool designed

SUMMARY

• 6 modules have been produced: 2 to develop the jig to pick up the module and 4 for development of the stave assembly procedure. Next step is to produce 6 modules by the end of March.

• The modules prealigned will be shipped to Torino by mean an ad hoc tool which will be ready by the end of March.

• As soon as possible the solder test with 1 chip will be done.• The production of the dummy FPCs for 14 chips was

commissioned to Nuova Eurotar company.• The ball pick up tool for the pALPIDE chip will be ready by the

end of March.

12Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

Back slide

13

14

Nominal Measured

X 210,6 210,6030

Y 30,1 30,1270

L 180,6 180,6744

Distance (i) i = 1,…,6 30,1 30,116730,113130,115530,106930,107930,1145

Metalized hole diameter i = 1,…,7

0,21 0,26290,26590,26730,26610,26340,26460,2632

i1 i4 i5 i6

L

XY

i2 i3

i1

i1

CHIP 2CHIP 1

CHIP 8

CHIP 2CHIP 1

Measures in mm

1515

Module assembly procedure Gluing procedure to fix the FPC on the chips

Adhesive mask89

10 11

16

Module assembly procedure

Modules without carbon plate

Modules with carbon plate

FPCFPC 150 µm thickChip 50 µm thickCarbon plate 120 µm thickGlue: Ecobond 40 µm thick

Does the module plate help for handling and testing? 17