NVC-MDCS23M Datasheet - Sabre Adv€¦ · NVC-MDCS23M Datasheet V1.0 NovaComm Technologies...

NVC-MDCS23M Datasheet V1.0

NVC-MDCS23M Datasheet

– Bluetooth V4.0 Dual Mode USB HCI module

Innovative Communication in Wireless World

Version – V1.0

Issue Date –Aug 25, 2014

NovaComm Technologies Confidential


NovaComm Technologies Confidential of 16

Copyright © 2011-2014 NovaComm Technologies All rights reserved. NovaComm Technologies assumes no responsibility for any errors, which may appear in this manual. Furthermore, NovaComm Technologies reserves the right to alter the hardware, software, and/or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. The iNova ® and iNovaLE ® is registered trademark of NovaComm Technologies. The Bluetooth trademark is owned by the Bluetooth SIG Inc., USA, and is licensed to NovaComm Technologies. All other trademarks listed herein are owned by their respective owners.



Description: NVC-MDCS23M is a dual-mode Bluetooth 4.0 USB HCI module. It includes both Bluetooth and Bluetooth low energy and also EDR to 3Mbps. Common Bluetooth stacks such as BlueZ can run on the USB HCI interface of the module. It also has WLAN coexistence interface.

The module uses a 5V power input from a standard USB port. It integrates all RF components and the antenna as well.

Typical applications:

PC notebooks, netbooks and desktops

TV set-top boxes

USB Bluetooth dongles

Bluetooth designs requiring the USB interface and an HCI interface

Bluetooth low energy

Features: Dual-mode Bluetooth v4.0

8 dBm TX power/ -91dBm RX

sensitivity, real-time digitized RSSI

available on HCI interface

Full speed (12Mbps) USB 2.0 interface

SMT pads for easy and reliable PCB

mounting, internal chip antenna

18.45mmx9.4mmx2.0mm

RoHS compliant

Table 1: Ordering Information

Ordering Number Package Items in One Package Comments

NVC-MDCS23M Plastic tray 100PCS



Release Record

Version Release Date Comments

1.0 Aug 25, 2014 First release



Table of Contents

1. Pinout and Description....................................................................................................................................7

1.1. Pin Configuration.........................................................................................................................................7

2. Electrical Characteristics................................................................................................................................8

2.1. Absolute Maximum Rating.........................................................................................................................8

2.2. Recommended Operation Conditions......................................................................................................8

2.3. I/O Characteristics ......................................................................................................................................8

3. Physical Interfaces ...........................................................................................................................................9

3.1. Power Supply...............................................................................................................................................9

3.2. Internal Antenna ..........................................................................................................................................9

3.3. PIO ................................................................................................................................................................9

3.4. USB ...............................................................................................................................................................9

3.5. PCM ..............................................................................................................................................................9

3.6. SPI Program Interface..............................................................................................................................10

3.7. WLAN Coexistence Interface ..................................................................................................................10

4. Software Stacks ..............................................................................................................................................10

5. Reference Design............................................................................................................................................11

6. Layout and Soldering Considerations ......................................................................................................11

6.1. Soldering Recommendations ..................................................................................................................11

6.2. Layout Guidelines .....................................................................................................................................12

7. Physical Dimensions .....................................................................................................................................14

8. Package .............................................................................................................................................................15

9. Contact Information .......................................................................................................................................16

List of Tables

TABLE 1: ORDERING INFORMATION ..............................................................................................................................3 TABLE 2: ABSOLUTE MAXIMUM RATING........................................................................................................................8 TABLE 3: RECOMMENDED OPERATION CONDITIONS ....................................................................................................8 TABLE 4: DIGITAL I/O CHARACTERISTICS .....................................................................................................................8 TABLE 5: ESD PROTECTION .........................................................................................................................................9

List of Figures

FIGURE 1: PINOUT OF NVC-MDCS23M......................................................................................................................7



FIGURE 2: SOFTWARE STACK .....................................................................................................................................11 FIGURE 3: REFERENCE DESIGN..................................................................................................................................11 FIGURE 4: PLACEMENT OF THE MODULE ON A MAIN BOARD .....................................................................................13 FIGURE 5: PHYSICAL DIMENSIONS AND RECOMMENDED FOOTPRINT (UNIT: MM, DEVIATION: 0.02MM)..................14 FIGURE 6: NVC-MDCS23M PACKAGE......................................................................................................................15



1. Pinout and Description

1.1. Pin Configuration

Figure 1: Pinout of NVC-MDCS23M

Pin Symbol I/O Type Description

1 GND Ground Ground

2 PIO0 Bidirectional, tristate, with weak internal pull-down

Programmable input/output line

3 SPI_MISO/PCM_OUT

Output, tristate, with weak internal pull-down

SPI data output/PCM synchronous data output/programmable input or output line

4 SPI_MOSI/

PCM_IN Input, tristate, with weak

internal pull-down SPI data input/PCM synchronous data input/programmable input or output line



6 SPI_PCM_

SEL Input with weak internal pull-

down High to switch to the SPI, low to switch to

PCM/PIO.

7 GND Ground Ground

8 GND Ground Ground

9 USB_DP Bidirectional USB data plus with selectable internal

1.5kΩ pull-up resistor

10 USB_DN Bidirectional USB data minus



11 VDD_+5V 5V power input Input to internal regulator. Can be connect



13 SPI_CLK/PCM_CLK

Bidirectional, tristate, with weak internal pull-down

SPI clock/PCM synchronous data clock/programmable input or output line

14 SPI_CSB/PCM_SYNC

Bidirectional, tristate, with weak internal pull-down

SPI chip select/PCM synchronous data sync/programmable input or output line

2. Electrical Characteristics

2.1. Absolute Maximum Rating

Table 2: Absolute Maximum Rating

2.2. Recommended Operation Conditions

Table 3: Recommended Operation Conditions

Operating Condition Min Typical Max Unit Operating Temperature Range -30 -- +70 °C

VDD_+5V 4.25 -- +5.75 V

I/O supply voltage 1.2 3.3V +3.7 V

2.3. I/O Characteristics

Table 4: Digital I/O Characteristics

Input Voltage Levels Min Typical Max Unit

VIL input logic level low -0.4 - 0.4 V

VIH input logic level high 0.7 x VDD - VDD + 0.4 V

Output Voltage Levels Min Typical Max Unit

VOL output logic level low, lOL = 4.0mA - - 0.4 V

VOH output logic level high, lOH = -4.0mA 0.75 x VDD - -- V

Input and Tri-state Current Min Typical Max Unit

Strong pull-up -150 -40 -10 μA

Strong pull-down 10 40 150 μA

Rating Min Max Unit Storage Temperature -40 +85 °C

VDD_+5V 3.0 5.75 V

I/O supply voltage -0.4 +3.7 V



Weak pull-up -5.0 -1.0 -0.33 μA

Weak pull-down 0.33 1.0 5.0 μA

CI Input Capacitance 1.0 - 5.0 pF

Table 5: ESD Protection

Condition Note Max Rating

Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114

ESD_HAND_HBM 2000V (all pins)

Machine Model Contact Discharge per JEDEC EIA/JESD22-A115

ESD_HAND_MM 200V (all pins)

Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101

ESD_HAND_CDM 500V (all pins)

3. Physical Interfaces

3.1. Power Supply

The module integrates internal regulators so simply feed a 5V power to the module.

3.2. Internal Antenna

The module integrates an on-board chip antenna so there’s no need to use antenna on customer’s PCB. Simply pay attention to leave enough clearance for the antenna.

3.3. PIO

7 PIOs are provided (4 are multiplexed with SPI/PCM interface). They are powered by internal 3.3V power which is generated from VDD_+5V.

PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down.

Note:

At reset all PIO lines are inputs with weak pull-downs.

The function of PIO lines are firmware guild-specific.

3.4. USB

This is a full-speed (12Mbps) USB interface for communicating with other compatible digital devices. The USB interface acts as a USB peripheral, responding to requests from a master host controller.

3.5. PCM

The audio pulse code modulation (PCM) interface supports continuous transmission and reception of PCM encoded audio data over Bluetooth.



Hardware on NVC-MDCS23M allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any one time.

NVC-MDCS23M can operate as the PCM interface master generating PCM_SYNC and PCM_CLK or as a PCM interface slave accepting externally generated PCM_SYNC and PCM_CLK.

NVC-MDCS23M is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments.

It supports 13-bit or 16-bit linear, 8-bit u-law or A-law companded sample formats and can receive and transmit on any selection of three of the first four slots following PCM_SYNC.

3.6. SPI Program Interface

The SPI Debug interface is chosen when SPI_PCM_SEL is high. The interface is used to program the module in manufacture. And it is recommended to place test points or header on PCB for this interface and SPI_PCM_SEL signal to have firmware update capability.

3.7. WLAN Coexistence Interface

Dedicated hardware is provided to implement a variety of WLAN coexistence schemes. The modules supports,

Channel skipping AFH

Priority signaling

Channel signaling

Host passing of channel instructions

And it supports the following WLAN coexistence schemes:

Unity-3

Unity-3e

Unity+

For more information please contact with Novacomm’s technique support.

4. Software Stacks

Figure 2 shows an example software implementation. The internal processor runs the Bluetooth stack up to the HCI. The host processor must provide all upper layers including the application.



Figure 2: Software Stack

5. Reference Design

Figure 3: Reference Design

6. Layout and Soldering Considerations

6.1. Soldering Recommendations

NVC-MDCS23M is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB,



heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.

NovaComm Technologies will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide.

Refer to technical documentations of particular solder paste for profile configurations

Avoid using more than one flow.

Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150 m stencil thickness is recommended.　

Aperture size of the stencil should be 1:1 with the pad size.

A low residue, “no clean” solder paste should be used due to low mounted height of the component.

6.2. Layout Guidelines

It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated max 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an unintentional resonator. Use GND vias all around the PCB edges. Figure 4 illustrates recommended PCB design around the antenna of NVC-MDCS23M when the module is placed at the edge of a PCB.

Do not place copper on the top layer under the module, as shown in Figure 4. The module has vias on the area shown, which can cause short circuit if there is copper underneath. Any metal placed closer than 20 mm in any direction from the antenna changes the matching properties and thus will considerably deteriorate the RF performance of the module.



Figure 4: Placement of the Module on a Main Board



7. Physical Dimensions

Figure 5: Physical Dimensions and Recommended Footprint (Unit: mm, Deviation: 0.02mm)



8. Package

Figure 6: NVC-MDCS23M Package



For each plastic tray it contains 100PCS module. There’re five plastic trays in one aluminum bag.

9. Contact Information

Sales: [email protected]

Technical support: [email protected]

Orders: [email protected]

Phone: +86 21 60453799

Fax: +86 21 60453796

Street address: 902A, #560 Shengxia Rd., ZJ Inno Park, Shanghai 201203, China

mailto:[email protected]



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