Novel Packaging Concepts for Power Electronic Solutions€¦ · Inverter Trends & Technology Rainer...
Transcript of Novel Packaging Concepts for Power Electronic Solutions€¦ · Inverter Trends & Technology Rainer...
www.ats.net
Novel Packaging Concepts for Power Electronic Solutions
2nd Wangener Automotive Symposium: Inverter Trends & Technology
Rainer Frauwallner, Teamleader Application Analysis
07.11.2019
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 1
Agenda
▪ AT&S at a Glance
▪ State of the Art Power Packaging
▪ ECP® - The Embedding Technology
▪ Use Case: GaN-based Half-Bridge Module
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 2
AT&S – A World Leading High-tech PCB & IC Substrates Company
* For CY 2018 Source: Prismark
** For AT&S FY 2018/19
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 3
Market Segments & Product Applications served by AT&S
Computer, Communication,
Consumer
Smartphones, Tablets, Wearables, Ultrabooks,
Solid State Drives, Microserver
Industrial
Machine-2-Machine Communication,
Robots, Industrial Computer,
X2X Communication
Automotive
Advanced Driver Assistance Systems,
Emergency-Call, X2X Communication,
Powertrain Electrification
Medical
Patient Monitoring, Hearing Aids,
Pacemaker, Neurostimulation, Drug
Delivery, Prosthesis
IC substrates
High Performance Computer, Microserver
Segment Mobile Devices & Substrates Segment Automotive, Industrial, Medical
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 4
Global Footprint Ensures Proximity to Supply Chain & CostEfficiency
974* 404* 1,241* 2,369* 4,461* 289*
Shanghai China
AnsanKorea
ChongqingChina
Leoben, HeadquartersAustria
FehringAustria
NanjangudIndia
AT&S plant & sales office
AT&S sales office
AT&S Headquarters
*Staff, Average, FTE, FY 2018/19; 73 employees in other locations
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 5
Agenda
▪ AT&S at a Glance
▪ State of the Art Power Packaging
▪ ECP® - The Embedding Technology
▪ Use Case: GaN-based Half-Bridge Module
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 6
Discrete vs. Module?… a technology tradeoff for power applications
Inverter
Power
Frequency
Cost
▪ Electrical isolation▪ Different configurations
▪ Design flexibility▪ Reduced stray inductance▪ Standardization
*Source: Infineon
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 7
Discrete vs. Module?… a technology tradeoff for power applications
Inverter
Power
Frequency
Cost
*Source: Infineon, YOLE Développement
▪ Electrical isolation▪ Different configurations
▪ Design flexibility▪ Reduced stray inductance▪ Standardization
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 8
Discrete + Module = Small-size ModulesMerging advantages of technologies
Infineon HybridPACK™ DSC S2 Danfoss Half-bridge IGBT Module
▪ High design flexibility▪ Low thermal resistance▪ Low inductance▪ Increased reliability
… what‘s next?*Source: Infineon, Danfoss
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 9
Agenda
▪ AT&S at a Glance
▪ State of the Art Power Packaging
▪ ECP® - The Embedding Technology
▪ Use Case: GaN-based Half-Bridge Module
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 10
What is ECP®?AT&S ECP®: Embedded Component Packaging
ECP® uses the free space in an organic, laminate substrate (Printed Circuit Board) for active and/or passive component integration
Components are embedded in the core of the PCB and connected by copper plated micro
vias to the surrounding metal layers
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 11
From Concept to Mass-productionEmbedding technology development and industrialization
1970First concepts for passive
component embedding introduced.
2000First step of AT&S into embedded
components. Research and
development on printed resistors and
capacitors inside the PCB.
2006First silicon bare die
followed by an IC
integrated. 2004Embedding of discrete
capacitors and
resistors in an organic
laminate substrate.
AT&S is part of various
development projects.
2012AT&S starts serial production of
ECP® products at the plant in
Leoben.
2010Industrialization of the AT&S
embedding technology ECP®
within the project “HERMES”.
Several product demonstrators
manufactured.
2018Second generation embedding
technology „Center Core ECP®“
qualified for mass production.
2016Project “empower” successfully
finished with prototypes for
electromobility.
2020New power concepts in
development:
▪ Lower Rth
▪ High current
▪ High voltages
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 12
CCE: Center Core EmbeddingManufacturing process flow
Core manufacturing Lamination Structuring
• Core preparation• Cavity cutting• Carrier lamination• Component assembly
• Soft lamination• Carrier removal• Final lamination
• Laser drilling • Mechanical drilling • Plating and structuring• Testing
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 13
Key Requirements ComponentsLine-up for production facilities in Hinterberg (AT) and Shanghai (CN)
Feature Passive components Active components
AT&S location Hinterberg1 Shanghai Hinterberg1 Shanghai
Type Resistor, Capacitor Resistor, Capacitor Bare DIE Bare silicon DIE with
RDL layer
Size 0201,0402 01005,0201,0402 max 8x8mm max 8x8mm
Thickness 60-300µm 100-330µm 60-300µm 100-330µm
Pad surface only Copper only Copper only Copper only Copper
Copper thickness min. 6µm min. 6µm min. 6µm min. 6µm
Pad diameter min. 200um min. 130um min. 200um min. 110µm
Thickness tolerance ±10µm ±15µm ±10µm ±15µm
Packing method T&R T&R T&R,Wafer T&R
1) The location Hinterberg, Austria, is dedicated to embedding of power components due to capabilities for via filling and thick copper.
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 14
ELECTRICALPERFORMANCE
EMI SHIELDING
SYSTEM COSTREDUCTION
THERMAL PERFORMANCE
MECHANICALPERFORMANCE
MINIATURIZATIONMODULARIZATION
Advantages of CCE in a NutshellEnabling technology for next gen applications
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 15
Advantages of CCE in a NutshellEnabling technology for next gen applications
Electrical Thermal Mechanical
Stan
dar
dEm
bed
din
g
Performance
Tech
no
logy
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 16
Agenda
▪ AT&S at a Glance
▪ State of the Art Power Packaging
▪ ECP® - The Embedding Technology
▪ Use Case: GaN-based Half-Bridge Module
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 17
Use Case: 650V GaN-based Half-Bridge ModuleCombining GaN and Embedding in one package
Yoda is half bridge module including 650VGaN-HEMT power transistors, bootstrapcircuit, driver for high- and low side as wellas a thermal measurement device packed inone laminate based device. Switchingfrequencies of up to 1 MHz.
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 18
Use Case: 650V GaN-based Half-Bridge Module
Comparison between AT&S ECP® SMT package and embedded bare die transistor power modules show outstanding performance differences.
Combining GaN and Embedding in one package
VS.
Standard Embedding
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 19
Use Case: 650V GaN-based Half-Bridge ModuleCombining GaN and Embedding in one package
AT&S paper available on request
Stan
dar
d S
MT
Loop area: 12,4 mm²Loop resistance: 2,2 mΩ
Loop area: 7,74 mm²Loop resistance: 1,3 m Ω
Emb
edd
ed
Module thickness: 0,75 mm
Module thickness: 1,3 mm Ringing voltage: 17,5V
Ringing voltage: < 1V
Module losses
Temperature
Output power
Thermal conductivity @ 4 W losses
1385 W
47,5 °C
8,8 W
16,6 W/K
Module losses
Temperature
Output power 1385 W
42 °C
5,4 W
13,6 W/K
Build up Commutation loop Double pulse test Performance
Thermal conductivity @ 4 W losses
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 20
Challenges & OutlookProviding sophisticated technologies for future inverter solutions
▪ Reduction of loop & gate inductance
▪ Decrease of Rth,j-a
▪ Electric isolation die to heatsink
▪ Reliability (JESD22 → AEC-Q101 → AQG 324)
▪ Material development FR4
▪ Enhanced embedding of WBG devices
▪ Integration of thick copper
▪ Alternative heat sink attachment
▪ Improved double sided cooling
▪ Heterogenous integration of driver + transistor + passives
▪ System solutions: control + power
… quote of YOLE Développement in their latest „Status of the Power Module Packaging Industry 2019“ report
„The only thing we know for sure is that ED (embedded die) technology has a bright future.“
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 21
Contact
Rainer Frauwallner
Contact details
Teamleader Application Analysis / Team Leader Test Development
AT&S Austria Technologie und Systemtechnik Aktiengesellschaft
Fabriksgasse 13, 8700 Leoben
Austria
Tel.: +43 3842 200 5412
Mob.: +43 676 8955 5412
Email: [email protected]
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 22
www.ats.net
AT & S Austria Technologie &Systemtechnik Aktiengesellschaft
(Headquarters)Fabriksgasse 13,
8700 Leoben, AustriaTel.: + 43 3842 200-0
AT&S – First choice for advanced applications
Novel Packaging Concepts Power Electronics / R. Frauwallner / Wangen, Germany / 07.11.2019 23
This presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria, or one of its affiliatedcompanies (“AT&S”), and the contents are proprietary to AT&S and for information only.
AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein, and no reliancemay be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You are expressly cautioned not to place unduereliance on this information.
This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘s expectations andassumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actual developments, results, performance or eventsmay vary significantly from the statements contained explicitly or implicitly herein.
Neither AT&S, nor any affiliated company, or any of their directors, officers, employees, advisors or agents accept any responsibility or liability (for negligence or otherwise) for any losswhatsoever out of the use of or otherwise in connection with this presentation. AT&S undertakes no obligation to update or revise any forward-looking statements, whether as a resultof changed assumptions or expectations, new information or future events.
This presentation does not constitute a recommendation, an offer or invitation, or solicitation of an offer, to subscribe for or purchase any securities, and neither this presentation noranything contained herein shall form the basis of any contract or commitment whatsoever. This presentation does not constitute any financial analysis or financial research and may notbe construed to be or form part of a prospectus. This presentation is not directed at, or intended for distribution to or use by, any person or entity that is a citizen or resident or locatedin any locality, state, country or other jurisdiction where such distribution, publication, availability or use would be contrary to law or regulation or which would require any registrationor licensing within such jurisdiction.
Disclaimer