New Product Commercialization
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Transcript of New Product Commercialization
New Product New Product Commercialization Commercialization
John GlenningJohn Glenning
July 23, 2009July 23, 2009
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time
• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed Experiments)
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time
• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed Experiments)
• Cp & Cpk will identify the accuracy & precision problems
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
1. Identify and resolve fundamental problems
2. Repeatability Studies for both product and process measurement systems
3. Identify and resolve processing problems: Capability Analysis Study
• Cp and Cpk by location for all product specification
• Identify accuracy and precision problems
Accurate but not precise Precise but not accurate
• Precision Problems: Excessive variability with incoming material, processing conditions and equipment conditions in space and time
• Accuracy Problems: 1 or 2 processing conditions are not at the optimum (Designed Experiments)
• Cp & Cpk will identify the accuracy & precision problems
• Precision problems must be solved before accuracy problems
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
• Correlate process conditions to interim product conditions
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
• Correlate process conditions to interim product conditions
• This identify the process adjustments to be made
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
• Correlate process conditions to interim product conditions
• This identify the process adjustments to be made
• Correlate incoming material conditions to final product conditions
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
4. Consistently meet product specifications
5. Optimize the manufacturing process using Designed Experiment
• Resolution IV Experiment
• Optimized Conditions
• SPC
• Measure interim product conditions mid-stream
• Correlate interim product conditions to final product conditions
• These are the mid-stream measurements that identify that a process adjustment is required
• Correlate process conditions to interim product conditions
• This identify the process adjustments to be made
• Correlate incoming material conditions to final product conditions
• Incoming material specifications
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
• High Yields
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
• High Yields
• Eliminate Mass Inspection
• Buckbee-Mears: 70% of the manufacturing costs occurred after the product was made
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
6. Develop High Capability
• Cp & Cpk
• Cp = (USL – LSL)/6σ
• Cpk = lesser of (USL - µ)/3σ and (µ- LSL)/3σ
• Cp & Cpk < 1.00: Process is “Not Capable”
• Cp & Cpk ≥ 1.00 for features at all locations: Process is “Capable”
• Cp & Cpk ≥ 2.00 for features at all locations: Elimination of mass inspection
• Cp & Cpk ≥ 3.00 for features at all locations: World Class Manufacturer
• High Yields
• Eliminate Mass Inspection
• Buckbee-Mears: 70% of the manufacturing costs occurred after the product was made
• IBM: “It cost 10 times more to solve problems in manufacturing than in development and it cost 10 times more to solve problems in development than in R & D”
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
• WIP
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
• WIP
• Identify trends early
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechProcess Development Overview:
7. Qualify the manufacturing process
• Four Level Qualification Process (IBM, HTI, GE, Motorola, Intel…)
• Stress the manufacturing line
• More product is made in a shorter period of time to higher standards
• Identify high volume manufacturing problems early
8. Transfer the process into manufacturing
9. Continuous Improvement by constantly tracking:
• Product Quality (Cp & Cpk)
• Cycle Time
• Equipment Up-time
• Manufacturing Costs
• WIP
• Identify trends early
• Maintain high quality and low costs
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
• Time stamp product when run in each process
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
• Time stamp product when run in each process
• Measure product mid-stream
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTechManufacturing Philosophy:
• Hold your suppliers to meet your material specifications in space & time
• Track & identify incoming material lots to your product
• Retain samples of incoming material for future analysis
• Capture time-stamped processing data in a database
• Time stamp product when run in each process
• Measure product mid-stream
• Continuously track key product parameters to reduce variability, identify
problems and trends early
• Capability
• Cost
• Cycle Time
• Equipment Up-time
• WIP
John Glenning’s Presentation to John Glenning’s Presentation to GrafTechGrafTech
End of Presentation