Nanoimprint II. NIL Technology sells stamps for nanoimprint lithography (NIL) and provides imprint...
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Transcript of Nanoimprint II. NIL Technology sells stamps for nanoimprint lithography (NIL) and provides imprint...
Nanoimprint II
NIL Technology sells stamps for nanoimprint lithography (NIL) and provides imprint services. Stamps made in Siliocn, Quartz, and Nickel are offered. Large area homogeneous imprints are ensured with NIL Technology stamps by a patent pending stamp technology. The stamps are produced with customer defined stamp patterns.•Large area homogeneous imprints (patent pending) •Standard stamp structures down to 20 nm •Minimum stamp structure size below 20 nm •Up to 200 mm wafer stamps •Stamp materials: Silicon, Quartz, and Nickel NIL technology stamps can be used in many different applications such as (but not limited to): Consistent energy, e.g. solar cells and fuel cells, Batteries, Micro and nano fluidics, Light emitting diodes and lasers; Life science, e.g. controlled cell behaviour surfaces and lab-on-a-chip systems; Optics, e.g. gratings, integrated optical devices, SERS substrates, and anti reflective structures; Radio frequency (RF) components •Data storage, e.g. optical media, magnetic media, and holograms; Security, e.g. holograms; CPU’s and memory. Interested partners are invited to join collaborations with NIL Technology on developing products benefiting from nanostructures and NIL.
Limitations of NIL
Feather Depth Variation for Complex Patterns
Combined Nanoimprint and Photolithography
Residual Resist Removal in CNP
Eliminates Residual-removal by O2 RIE
Step and Flash Imprint Lithography
Solvent Assisted ImprintSolvent vapor treatment
Solvent Assisted Imprint
Room Temperature Imprint
Room Temperature Imprint
Room Temperature Imprint
Room Temperature Imprint
Pattern Uniformity Control
Comparison
Conclusions
• Use of free volume contraction and plastic deformation
• Room temperature processing• No mold surface treatment• Step and repeat• Multiple imprinting• Suitability for OLEDs and OTFTs• A high pressure (30~100 bars)
Low Pressure Imprinting
• Use of a flexible film mold
• Conformal contact of protruding parts of the mold with the underlying substrate
• Sequential, not parallel, imprinting of pattern features (stiff mold; all the pattern on the surface to penetrate into polymer)
Low-Pressure Hot Imprinting
Poly (urethane acrylate) molds
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Low-pressure room temperature imprinting
Conclusions for Low-Pressure Room Temperature Imprinting
• Requirements:• Low pressure (2~3 bars)• Low temperature (room T)• Step-and-repeat• Easy and clean de-molding• Variable fill factor• Easy mold replication• Multilayer alignment
Other Non-Conventional Methods
1. By capillary force Capillary Force Lithography (CFL) Soft molding2. By dewetting force Anisotropic dewetting Selective dewetting3. By self-organization Self-organized CFL Self-organized buckling
Capillary Force Lithography: Concept
Kinetics of CFL (I)
Conclusions
• Use of thermal capillary• Good pattern fidelity• Direct exposure of substrate surface• No application of pressure• Minimum feature size down to ~ 100 nm• When pattern size gets smaller than 100
nm, the max aspect ratio of the gap attainable is less than 0.25 (may be broken during detachment of mold).
Soft Molding: Conclusions
• Use of solutal capillarity
• Inexpensive method
• Three-dimensional patterning
• Large-area patterning (~ 4 inch wafer)
• No fidelity problem
• Direct pattern transfer to a substrate
Patterning by Dewetting – Historical Background
Anisotropic and Selective Dewtting
• Anisotropic spinodal dewetting as a route to self-assembly of patterned surfaces A. M. Higgins & R. A. L. Jones Nature 404, 476 - 478 (2000).
Anisotropic Dewetting: Theory
Anisotropic Dewetting: Conclusions
• Dewetting of thin polymer films
• Anisotropic dewetting by mold confimement
• Block vs Fingering pattern
• Formation of ordered polymer pattern
• Reduced wavelength due to confinement
Selective Dewetting: Concept
Selective Dewetting: Result
Selective Dewetting: Conclusions
• Selective Dewetting by Mold Nucleation
• General purpose patterning by selective dewetting
• Pattern size control by dewetting time
• Controllability to the level of 10 nm scale
Patterning by Self-Organization
• Self-organized polymeric microstructure (SOM)
• Self-organized patterns by anisotropic buckling
Historical Background
• Use of chemical forces such as self-assembled monolayers (SAM)
• Control of chemical or structural properties, chemical sensing, catalysis, etc.
• Ordering on a nanometer scale
• Difficulty in large-area applications
• Use of physical driving forces such as capillarity
• Control of microstructures of surfaces, ex) patterning, photonic crystals, microreactor, etc.
• Ordering on a micrometer scale
• No difficulty in large-area applications
Self-Organized Microstructure: Concept