Nano-Electronics S. Mohajerzadeh University of Tehran.
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Transcript of Nano-Electronics S. Mohajerzadeh University of Tehran.
Nano-Electronics
S. Mohajerzadeh
University of Tehran
Lithography, nano-technology
Lithography is transferring a desired pattern from a “mask” onto a processed substrate.
Lithography remains essentially the same for micro and nano-electronics.
Standard Photolithography
Photolithography
apply resist
mask alignment/exposure
develop
etching
resist removal
Lithography approaches
Contact mode, mask sits on the resist-coated sample, best resolution is achieved.
“d” is the resist thickness and “g” is the gap between the sample and mask (proximity mode).
In projection mode (most used for nano-lithography), numerical aperture of the lens plays a crucial role.
Contact Proximity Projection
MFS = (d.)1/2 ~ MFS = ((d+g).)1/2 ~ MFS = 0.61 /NA ~
Resolution limits
Masks
nH
nL
Materials: Mo/Si
Layer thickness ~ 3nm
Low thermal expansion material
Multilayer stack
Buffer layer
Absorber layer
(Ru, SiO2, etc)
(TaN, Cr, W, etc)Reflective mask
Reflective Optics
Nanometric levels
Various lithography sources
UV sources
Mercury high pressure lamps, strong peaks at 436, 405 and 365nm Nothing below 300nm, Plasma torch, Extreme UVs, at 10nm Transparency of the various glasses drops at lower wavelengths. Quartz or fused silica can be used for deep UV illuminations
Extended UV lithography
No transmission lens
Reflection condensing, mirrors
Reticle, reflecting metals
High resolution
Deep UV source
lens
Pulsed LaserSource
Laser produce plasma
Gas nozzle
E-beam writers
Electrons form a beam to hit the surface on the desired area.
Thermionic sources, field emission sources, (W or LaB6)
Brightness, W: 104 A/cm2, LaB6: 105, field emission 107
Electron Trajectories
Resolution is limited by the spot size, and the exposed area Backscattered electrons can expose unwanted regions Proximity effect, the shape of pattern affects the resolution
E-beam lithography
Underetching results in the reduction of the pattern resolution. Sharp vertical patterns are obtained by high energy electron beam
writing.
Possible parallel processing
Scattering limited projection e-beam lithography (SCALPEL) Use of scattering layer (Au, W) to stop the electrons in the undesired
regions,
E-beam writers
JBX-3030MV seriesElectron Beam Lithography System
• Design rule: 100 to 70 nm • Accelerating voltage: 50 kV • Electron gun emitter: LaB6single crystal• Workpiece dimension: up to 178 mm square • Field stitching accuracy: ± 9 nm • Overlay accuracy: ± 12 nm
X-ray lithography
X-ray beam has a wavelength of the order of 1Ǻ, suitable for high resolution lithography.
Adsorption is a problem with the mask. Shadow masks or thin membranes are used. No lens is available for X-ray. Long pipes are used to form a coherent beam.
SiC 1m, T=57%
Au 300-500nm, T=14%
ب
الف
AFM lithography
The AFM tip is used to deliver liquid (resist) onto the surface of sample.
Nano-metric resolution is achieved by this “true writing” approach.
Mirkin group NWU
e.g. mercaptohexadecanoic acid on atomically-flat gold surface
Resolution improvement
Phase shift masks
Phase shift leads to diffraction on the image side. Phase shift is suitable only when two windows are
placed close together.
Dark field microscopy
Illuminating the object at glancing incidence, to ensure the main reflecting beam does not enter the microscope
Surface irregularities are highlighted and features as small as 10nm high are detected.
Dust particles of the order of 100nm are observed.
Phase Objects
A pure phase object has no contrast and we cannot see it. A glass with a step on it will be seen as a flat surface. Phase object changes the phase of the light and our eyes can
see the variations in the intensity and not the phase. Zernike proposed the phase contrast microscopy and received
a Nobel prize for this invention.
Phase contrast scheme
The idea of phase retarding plate causes contrast on the image plane.
Light passes the phase object and after passing through the lens, the zero-order diffraction faces the phase
retarding plate and on the image plane we see contrast.
Phase shift
Instead of plate, a phase shifting ring is used.
Phase contrast microscopy
Only first and second order diffracted beams are considered. Other directions cannot reach the lens and are not
important. The parallel diffraction beams forms new beams in diverging
directions. On the transform (focal) plane, small dots are formed
corresponding to various diffraction beams. Without a phase shift object, contrast is not formed and no
clear image is formed on the image plane. A phase retarding/advancing plate yields a
constructive/destructive interference and hence a true image is formed.
Simple explanation!
If E0, E+1 and E-1 are amplitudes of zero, +1 and -1 diffracted beams and assuming a plane wave nature for these light beams,
E(x,y,z,t)=Aexp(j(kxx + kyy + kzz –ωt) + Φ) For zero order, kx=ky=0, kz=2π/λ and E0(x,y,0)=Aexp(j(Φ –ωt)) At z=0 plane, E+1(x)=ε exp(j(kxx–ωt)) and E-1(x)=ε exp(j(-kxx–ωt)) So, finally, Etot(x) = E0 + E+1 + E-1 and I(x) = Etot Etot* And I(x)= A2 + 2 ε2 + E0 E*+1 + E0E+1* + E0E-1* + E0E-1* + E+1E-1* +
E+1*E-1 Eventually!!, I(x)= A2 + 2 ε2 + 4A ε[cos Φ cos (kxx)] + 2 ε2 cos(2kxx) By ignoring the last term, I(x)= A2 + 2 ε2 + 4A ε[cos Φ cos (kxx)] I(x)= A2 + 2 ε2 + 4Aε2[cos Φ cos (kxx)], Playing with (cos Φ) can cause a contrast image to occur on the
image plane. Say Φ=0, π,… in normal case, Φ =π/2 or ..
Wollaston prism, made of a material with two anisotropic charactersitics such as Calcite.
The light which is polarized, when traveling in the direction parallel with the optical axis, has a speed different with the perpendicular case, so phases are different. (higher index of refraction in one direction)
Normaski prism produces two images of an object, one for each polarization with a small relative displacement.
For the case of DIC resolution is less than optical resolution.
Differential interference contrast
Nano-imprint