Information Society Technologies Micro - and Nano- electronics in FP6 call 1

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Information Society Information Society Technologies Technologies Micro Micro - and Nano- - and Nano- electronics electronics in FP6 call 1 in FP6 call 1 Georg Kelm European Commission DG Information Society Unit C1 : Micro-, nano- and opto-electronics components [email protected] [email protected]

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Information Society Technologies Micro - and Nano- electronics in FP6 call 1. Georg Kelm European Commission DG Information Society Unit C1 : Micro-, nano- and opto-electronics components [email protected]. Presentation Outline. Framework Programme 6 : IST - PowerPoint PPT Presentation

Transcript of Information Society Technologies Micro - and Nano- electronics in FP6 call 1

Page 1: Information Society Technologies Micro - and Nano- electronics in FP6 call 1

Information Society TechnologiesInformation Society TechnologiesMicroMicro - and Nano- electronics- and Nano- electronics

in FP6 call 1in FP6 call 1

Georg Kelm

European Commission

DG Information Society

Unit C1 : Micro-, nano- and opto-electronics components

[email protected]@cec.eu.int

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Framework Programme 6 : IST

Micro- and Nano-electronics in FP6 call 1

Presentation OutlinePresentation Outline

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Commission proposal “Specific Programmes” Commission proposal “Specific Programmes” (May 2001)(May 2001)

I N T E G R A T I N G E U R O P E A N R E S E A R C H

P R I O R I T Y T H E M A T I C A R E A S A N T I C I P A T I N G S / T N E E D S

R e s e a r c h fo r p o l ic ys u p p o r t

F ro n t ie r r e s e a r c h ,u n e x p e c te dd e v e lo p m e n ts

S p e c i f ic S M E a c t iv i t i e s

S p e c i f ic in te r n a t io n a l c o o p e r a t io n a c t iv i t i e s

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J R C a c t iv i t i e s

S T R U C T U R I N G T H E E R AS T R E N G T H E N I N G T H E

F O U N D A T I O N S O F E R A

R e s e a r c ha n din n o v a t io n

H u m a nre s o u rc e s &m o b i l i ty

R e s e a r c hin f r a s t ru c tu r e s

S c ie n c e a n ds o c ie ty

C o o rd in a t io no f r e s e a r c ha c t iv i t i e s

D e v e lo p m e n to f r e s e a r c h /in n o v a t io np o l ic ie s

Budgets for the Specific ProgrammesBudgets for the Specific Programmes

Integrating & strengtheningIntegrating & strengthening– Genomics Genomics 2,255 2,255

BB€– ISTIST 3,625 B3,625 B€– Nanotechnologies, int.. Nanotechnologies, int.. 1,300 B1,300 B€– Aeronautics and spaceAeronautics and space 1,075 B1,075 B€– Food safetyFood safety 0,685 0,685

BB€– Sustainable developmentSustainable development 2,120 B2,120 B€– Citizens in knowledge Citizens in knowledge 0,225 0,225

BB€– Anticipation of S&T needsAnticipation of S&T needs

• SMEsSMEs0,430 B0,430 B€

• Specific InCoSpecific InCo 0,315 B0,315 B€• Anticipating needsAnticipating needs 0,555 B0,555 B€

– Reinforcing ERA basisReinforcing ERA basis 0,320 0,320 BB€

Structuring ERAStructuring ERA– Research and InnovationResearch and Innovation 0,290 B0,290 B€– Human resourcesHuman resources 1,580 B1,580 B€– Research InfrastructuresResearch Infrastructures 0,655 B0,655 B€– Science/SocietyScience/Society 0,080 B0,080 B€

Joint Research CentreJoint Research Centre 0,760 B0,760 B€

12,905 B€

2,605 B€

16, 270 B€ 760 B€

Euratom: 1,230 B€

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‘anywhere, anytime, any service, for all’core technologies & “pull-through” applications

Components & microsytems

Knowledge & interface technologies 

Communication, computing & software technologies

- - mobile: beyond 3G- broadband access- networked audio- visual systems

- - software & services development- embedded systems

- [post-]CMOS- optical, opto-el., photonics

- - micro & nano systems- displays

- - semantic-based knowledge- cross-media content

- - multi-modal interfaces

Applied IST research for major societal and economic challenges

- - dependability & security

- - eHealth- eInclusion- eSafety of transport- environmental risk mgmt- learning & culture

- - networked organisations- services for mobile user- service & product engineering

- - GRID-based systems & complex pb solving

- cognitive systems

IST Strategic ObjectivesIST Strategic Objectives

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Reinforce leadership where Europe has demonstrated strengths, e.g.

– mobile communications and services, broadband communications– micro-, opto-electronics & µsystems, – networked audiovisual systems... – Security and dependability,…

Seize new opportunities that arise from the ‘AmI’ vision and address weaknesses / threats critical for its realisation, e.g.

– multimodal interfaces, semantic-based knowledge handling,.. – embedded systems, integration of sensing & actuating devices, ... – Knowledge and computing GRIDs

Defining the Strategic Objectives (1)Defining the Strategic Objectives (1)

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Defining the Strategic Objectives (2)Defining the Strategic Objectives (2)

Continued support to leading / challenging applications, responding to emerging needs, e.g.

– eHealth, eInclusion, eLearning and culture, – Entertainment and leisure content– business support tools, networked organisations,...

Support to research at the frontier of knowledge– FET open – FET proactive– Cognitive science

Support to infrastructure development– Research networking test beds– Open development platforms– IST for safety in transport, risk management,..

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Time Table for calls 2003-2004Time Table for calls 2003-2004

Call 1– opened 17 December 2002,

– closing 24 April 2003 at 17:00

Call 2– opening 15 June 2003

– closing 15 October 2003

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FP6: Six instruments for “Priority Areas”FP6: Six instruments for “Priority Areas”

Integrated ProjectsIntegrated Projects– Objective drivenObjective driven

Networks of ExcellenceNetworks of Excellence– Exploratory researchExploratory research

Article 169Article 169– Member states initiativeMember states initiative

Specific Targeted Research ProjectsSpecific Targeted Research Projects– Address specific issuesAddress specific issues

Co-ordination actionsCo-ordination actions

Support ActionsSupport Actions No longer available ….. No longer available …..

- Individual Take-up Actions- Individual Take-up Actions- SME Exploratory Awards- SME Exploratory Awards

New instrumentsNew instruments

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Framework Programme 6 : IST

Micro- and Nano-electronics in FP6 call 1

Presentation OutlinePresentation Outline

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Expressions of Interest Expressions of Interest

161 EoIs in Micro-, Nano- and Opto-electronics (analysis see http://www.cordis.lu/ist/ka4/mel/future.htm)

05

1015202530354045

Opto µElectronicsTechnology Design

IPNoE

µElectronics

Technology34%

Design18%

Opto48%

52%

Topics : devices CMOS limits SoC

components compound semic. (IP re-use,

material alternative devices RF, MS)

(+ applicat.) lithography low power

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IST Workprogramme 2003-2004IST Workprogramme 2003-2004

Pushing CMOS, Preparing post-CMOS

Micro & nano systems

Broadband access for all

Mobile & wireless systems beyond 3G

Towards a global dependability& security framework

Multimodal interfaces

Semantic-based knowledge systems

Networked AV systems& home platforms

Networked businesses & governments

eSafety of road & air transports

eHealth

eLearning & access to cultural heritage

Call 1

Advanced displays

Optical, opto-electronic & photonicfunctional components

Open development platforms for software & services

Cognitive systems

Embedded systems

Applications & services for the mobile user & worker

Cross-media content for leisure & entertainment

GRID-based systems for solving complex problems

Improving risk management

eInclusion

Products & services engineering 2010

FET

Call 2

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International Technology Roadmap for SemiconductorsInternational Technology Roadmap for Semiconductors

FP6 IST

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International Technology Roadmap for SemiconductorsInternational Technology Roadmap for Semiconductors

FP6 IST

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Topics for WP 2003-2004 (call 1)Topics for WP 2003-2004 (call 1)

Pushing the limits of CMOS and preparing for post-CMOS Pushing the limits of CMOS and preparing for post-CMOS Prepare for electronic components of 2010 and beyondPrepare for electronic components of 2010 and beyondFocus on: Focus on: Technology (down to 5nm)Technology (down to 5nm)

– nano CMOS : nano CMOS : integration of integration of advanced and non-CMOS devices, on-chip wiringadvanced and non-CMOS devices, on-chip wiring

– high frequency : high frequency : facilitating ultra high facilitating ultra high frequency and power applicationsfrequency and power applications silicon-based or silicon-based or compound semiconductors including packagingcompound semiconductors including packaging

– lithography : lithography : pushing the limits of pushing the limits of lithography (including maskless)lithography (including maskless)

– alternative technologies and devices for post-CMOS:alternative technologies and devices for post-CMOS:emerging nanoelectronics technologies for future applicationsemerging nanoelectronics technologies for future applications

– IPs may include equipment assessment activitiesIPs may include equipment assessment activities

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ITRS’99

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IC Design “Productivity Gap”IC Design “Productivity Gap”

IC ProductionIC Production

Design productivityDesign productivity

Grand Challenge = Multiply productivity by 10Grand Challenge = Multiply productivity by 10

EscalatingEscalating Design Costs Design Costs ! !

Skill Shortage !Skill Shortage !

1,600my

Can we design what we can produce?Can we design what we can produce?

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Topics for WP 2003-2004 (call 1)Topics for WP 2003-2004 (call 1)Pushing the limits of CMOS and preparing for post-CMOS Pushing the limits of CMOS and preparing for post-CMOS Improve Improve

design productivity by a factor of 10 by 2010design productivity by a factor of 10 by 2010 Focus on:Focus on:Design : reliable 1 Design : reliable 1

billion gate systemsbillion gate systems – system level : system level : novel approaches to design better novel approaches to design better

and fasterand faster improve system performance / improve system performance / reliability, specify / verify at system reliability, specify / verify at system level, stimulate IP re-use, enhance level, stimulate IP re-use, enhance flexibility / reconfigurability, flexibility / reconfigurability, optimize power consumptionoptimize power consumption

– improve the use of large systems (redundancy), improve testabilityimprove the use of large systems (redundancy), improve testability– specific design challenges : specific design challenges : mixed-signal, low power, RF, mixed-signal, low power, RF,

packagingpackaging– support change from board electronics to system-on-chip : support change from board electronics to system-on-chip :

develop, demonstrate and standardize architectures, develop, demonstrate and standardize architectures, design productivitydesign productivity

– complement with education and training in designcomplement with education and training in design

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Websites for informationWebsites for informationGeneral FP6 Site: (Legal texts etc). http://europa.eu.int/comm/research/fp6/index_en.htmlhttp://europa.eu.int/comm/research/fp6/index_en.html

Instrument fiches: http://europa.eu.int/comm/research/fp6/networks-ip.htmlhttp://europa.eu.int/comm/research/fp6/networks-ip.html

Contracts: http://europa.eu.int/comm/research/fp6/working-groups/model-contract/http://europa.eu.int/comm/research/fp6/working-groups/model-contract/

index_en.htmlindex_en.html

Expressions of Interests: http://www.cordis.lu/fp6/eoi-instruments/home.htmlhttp://www.cordis.lu/fp6/eoi-instruments/home.html

Micro-, nano- and opto-electronics components (Unit C1): http://www.cordis.lu/ist/ka4/mel/index.htmlhttp://www.cordis.lu/ist/ka4/mel/index.html

KEEP YOURSELF UPDATEDKEEP YOURSELF UPDATED [email protected]@cec.eu.int