Nanium Overview

NANIUM S.A. - 2013 - Confidential

NANIUM’s historical background

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NANIUM is an independent company in the semiconductor market, providing contract Assembly and Engineering Services for WLP, Assembly & Test.

1996 1999 2006 2010

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Portuguese

State

41,06% 41,06% 17,88%

Shareholder Structure

NANIUM S.A. - 2013 - Confidential

A world-class facility in Europe

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● A state-of-the-art facility located in Portugal,

near Porto, with > $1B cumulated investment.

NANIUM S.A. - 2013 - Confidential

Labs & Engineering

Electrical Characterization

Material Analysis

Qualification

Reliability

Failure Analysis

WLP 300mm

Lithography

Sputtering (PVD)

Electro-Plating

Wet Etching

Furnace

Wafer Molding

Wafer Thinning

Ball Dropping

Component Assembly

Grinding

Dicing

Die Attach

SMT for Modules

Wire Bonding

Pick, Flip & Place

Molding

Plating

Trim & Form

Marking

Singulation

ComponentSystem Test

BurnIn Test During BI

Final Test Parametric and

Functional

Modules Test Application Test

Inspection Systems

Logistic & Shipping

Packing (Trays, Tape & Reel)

Preconditioning

Drop Shipping Distribution

A world-class facility for die / wafer / module level assembly, test & packaging.

Fully certified ISO/TS 16949, ISO 9001, ISO 14001 and OHSAS 18001.

Ball Dropping

NANIUM Infrastructure Overview One-Stop-Service for Customer / Turnkey Solutions

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Wafer Probe

Probe Test

Parametric Wafer Test

Laser Fusing Repair

NANIUM S.A. - 2013 - Confidential 5

World Class Wafer Level Equipment

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APPLICATIONS

WLCSP product’s application includes:

Mobile and Consumer Products - Handsets

Wireless Connectivity including Bluetooth, WLAN, FM radio, GPS, A-GPS

Analog and other ICs like MEMS and Sensors

WLCSP

Spheron® Plated Cu Redistribution technology

licensed by Flip Chip International’s (FCI)

Wafer Level Packaging (WLP) Fan-In WLP up to 300 mm

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More than 300 million units shipped

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eWLB

Fan-out technology licensed by Infineon/Intel

NANIUM S.A. - 2013 - Confidential 8

Packaging, Assembly & Test services Multi Chip Packages (MCP) / Micromodules

● NANIUM also has extensive volume manufacturing experience of multi-chip memory

packages, combining Wafer-level RDL techniques (redistribution) with multiple die stacking

in a package.

● NANIUM’s large technology portfolio combined with its strong engineering know-how and

experience enable new innovative MCP/SiP configurations (stacked, side-by-side, MEMS,

Sensors, cPV, HB-LED Packages)

SiP / MCM

Complex MCP Micromodules / Chip on board COB MEMS & Sensor packages

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WLP – The Top Ten OSAT WLP Assemblers

Market Researcher „New Venture

Research“ ranks NANIUM as Nr.3

in the „World Top Ten OSAT

WLP Assemblers“ by

units produced.

Source: „Chip Scale Review“

March-April 2013

1. Amkor Technology

2. FlipChip International

3. NANIUM

4. STATS ChipPAC

5. ASE

6. Hana Micron

7. SPIL

8. Unisem

9. UTAC

10. J-Devices

NANIUM S.A. - 2013 - Confidential

2010 – 2020 FO-WLP Market evolution

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FOWLP Revenues

NANIUM S.A. - 2013 - Confidential

Safe and secure environment IP protection, highest safety standards

High Quality 16 years of experience, qualified at major OEM/ IDM’s

High Volume / Cost effective manufacturing competitive with Asian OSAT’s

High Flexibility / Complexity / Leadership

experienced in new product development & industrialization

Complete engineering service offer

highly qualified and experienced engineers

World-class facilities & equipment

NANIUM’s differentiated value proposition

Thank you for

your attention

NANIUM S.A. Avenida 1 ̊ de Maio 801

4485-629 Vila do Conde

Portugal