Multidisciplinary simulation of mechatronic components …Mori, 1969] Context ... Main actors...

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Complex Systems Design & Management 2010 1 Multidisciplinary simulation of mechatronic components in severe environments Jérémy Lefèvre 1 , Sébastien Charles 2 , Magali Bosch 1 , Benoît Eynard 1 and Manuel Henner 3 1: Université de Technologie de Compiègne 2: Université de Versailles Saint-Quentin 3: Valeo Systèmes Thermiques Complex Systems Design & Management 2010 Contact: [email protected]

Transcript of Multidisciplinary simulation of mechatronic components …Mori, 1969] Context ... Main actors...

Page 1: Multidisciplinary simulation of mechatronic components …Mori, 1969] Context ... Main actors Complex Systems Design & Management 2010 5. ... Computer-Aided Design & Applications,

Complex Systems Design & Management 2010 1

Multidisciplinary simulation of

mechatronic components in severe

environments

Jérémy Lefèvre1, Sébastien Charles2, Magali Bosch1, Benoît Eynard1 and

Manuel Henner3

1: Université de Technologie de Compiègne

2: Université de Versailles Saint-Quentin

3: Valeo Systèmes Thermiques

Complex Systems Design & Management 2010

Contact: [email protected]

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Complex Systems Design & Management 2010 2

Table of contents

1. Context1. EXPAMTION: a Mov’eo and System@tic project2. Problem statement

2. Lack of integration between mechatronic simulation and PLM

3. Proposed solution for integration1. Architecture2. Used tools

4. Conclusion and future works

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Complex Systems Design & Management 2010 3

Table of contents

1. Context1. EXPAMTION: a Mov’eo and System@tic project2. Problem statement

2. Lack of integration between mechatronic simulation and PLM

3. Proposed solution for integration1. Architecture2. Used tools

4. Conclusion and future works

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• First time used in Japan 1969

– Mechanics

– Electronics

– Control

– ICT

[Choley, 2009]

[Mori, 1969]

Context

• 4 levels for system integration

Complex Systems Design & Management 2010 4

Mechatronics

Separated Joined Included Merged

Maximum integration

4 fields merged

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Universities

SimulationISVs

Context: EXPAMTION : Expérimentation d’une

infrastructure de simulation Partagée par tous les

Acteurs de la chaîne Mécatronique de

concepTION

EXPAMTION : Experimentation of a simulation

infrastructure shared by all actors of the

mechatronic design chain

Main actors

Complex Systems Design & Management 2010 5

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Context: EXPAMTIONMain project targets:

• Experiment a collaborative design methodology with ALL

actors of the supply chain using:

– Existing simulation software from the market

– Expertise, human resources, equipment, and software from all actors

to solve problems

• Meet major technical challenges in the automotive

mechatronic design process:

– Innovate in the design process

– Produce results unreachable with current non-collaborative design

process

Complex Systems Design & Management 2010 6

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Context: EXPAMTION

Project structure: 7 Work Packages

Actor of

project

Field of

study

Complex Systems Design & Management 2010 7

WP1: Project Management

WP2: Major challenges

WP3: Software and Environment

WP4: Experimentation support

WP5: Optimization and codes adaptation

WP6: Training

WP7: Business Model

Mechanics

Rheologics

Aeroacoustics

Thermomechanics

Vibroacoustics

Application

The major challenges: multidisciplinary issues

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Context: EXPAMTION

Collaborative simulation

platform

Unifying of computing

resources

Managing of secured rights

Simplifying licenses

management

Coupling simulation codes

Development time reduced for mechatronic products

Issues of the project

Complex Systems Design & Management 2010 8

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Complex Systems Design & Management 2010 9

Table of contents

1. Context1. EXPAMTION: a Mov’eo and System@tic project2. Problem statement

2. Lack of integration between mechatronic simulation and PLM

3. Proposed solution for integration1. Architecture2. Used tools

4. Conclusion and future works

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Context: problem statementMechatronic case study

Objectives: optimization of:

• Reliability

• Compliance of electronic characteristics

• Electrical performance

• Heat dissipation

• Environment interaction

How can we ensure that the card complies

with the specifications ?

Proposal: Multidisciplinary simulation

Complex Systems Design & Management 2010 10

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Multidisciplinary

simulation

Context: problem statementMechatronic case study: approach

Define electronic simulation

needs

Study dimension ?

Simulation processing

Results analysis and

synthesis

Complex Systems Design & Management 2010 11

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Multidisciplinary

simulation

Context: problem statementMechatronic case study: approach

Define electronic simulation

needs

Study dimension ?

Simulation processing

Results analysis and

synthesis

Complex Systems Design & Management 2010 12

Requirements

• Operating at 120C at steady state

• Transient state analysis

• Critical temperature of 145C

• Etc.

Input data

• Electrical conductivity

• Thermal conductivity

• Nature of the components

• Etc.

Environment

• Infinite temperature

• Humidity

• Cooling

• Fluid characteristics

• Etc.

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Complex Systems Design & Management 2010 13

Table of contents

1. Context1. EXPAMTION: a Mov’eo and System@tic project2. Problem statement

2. Lack of integration between mechatronic simulation and PLM

3. Proposed solution for integration1. Architecture2. Used tools

4. Conclusion and future works

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Enterprise solution for Knowledge Management of

Product Lifecycle

Strategic approach involving numerous digital tools

A new paradigm for a more effective products along their

life cycle

[Ameri & Dutta, 2005]

[CIMdata, 2002]

[Stark, 2004]

Some definitions of PLM concept:

Product Lifecycle ManagementPreliminary

designIndustrialization UsingLogisticManufacturing

Detail

design

End of

life

Proposed solution for integration: used tools

Complex Systems Design & Management 2010 14

Simulation Lifecycle Management:

PLM for simulation

• Collaborative work

• Data sharing and management

• Business software integration

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Lack of integration between mechatronics and PLM

Know how

aspect

Technical

aspect

CurrentlyNo PLM link

1 or 2 physics

IdeallyPLM linked (SLM)

3 and more physics

Mechanics

Electronics

Mechanics

Electronics

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Complex Systems Design & Management 2010 16

Table of contents

1. Context1. EXPAMTION: a Mov’eo and System@tic project2. Problem statement

2. Lack of integration between mechatronic simulation and PLM

3. Proposed solution for integration1. Architecture2. Used tools

4. Conclusion and future works

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Proposed solution for integration: architectureIn the context of multidisciplinary analysis:

• The lack of interoperability between different

simulation software slows products development

Proposal:

PLM interoperability

based on standards

Coupling

Simulation 1

Simulation 2Simulation

3

DB

Simulation nodes

Complex Systems Design & Management 2010 17

[Charles, 2005]

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Complex Systems Design & Management 2010 18

Table of contents

1. Context1. EXPAMTION: a Mov’eo and System@tic project2. Problem statement

2. Lack of integration between mechatronic simulation and PLM

3. Proposed solution for integration1. Architecture2. Used tools

4. Conclusion and future works

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Proposed solution for integration: used tools

Complex Systems Design & Management 2010 19

System

modeling

and

meshing

Simulation:

•Fluid (CFD)

•Thermoelectric

Simulation

interoperability

Data

exchangesPLM / SLM

•Modelica

•Altair HyperMesh

•SysML

•Ansys Fluent

•Intes Permas

•MpCCI code

coupling

•STEP (APxxx)

neutral format

•PLCS (STEP

AP239)

Needs

Tools

Integration in mechatronic approach

[Casella, 2009]

[Fritzson, 2006]

[Charles, 2005]

[Penas, 2009]

[Fraunhofer, 2009]

[Kadima, 2009]

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Proposed solution for integration: architecture

Modeling

Modelica

HyperMesh

Simulation

Permas

MpCCI

Fluent

1D, 2D and 3D electronic card simulations

•Mechatronic

modeling

•Multidisciplinary

analysis

•Interoperability

0D / 1D

•3D Analysis

•Optimization

Define electronic simulation

needs

Study dimension ?

Simulation processing

Results analysis and

synthesis

Complex Systems Design & Management 2010 20

3D

MpCCI architecture

Remeshing:

Loopback:

Code A

Code B

1 2 3

Iteration

A B

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Proposed solution for integration: architectureStandard for the Exchange of Product model data

: Application Protocols

Integrated resources for mechatronic

design

Me

ch

an

ics

:

AP

20

3 a

nd

AP

21

4

Ele

ctro

nic

s:

AP

21

0 a

nd

AP

211

Life

cyc

le m

an

ag

em

en

t:

AP

23

9

Syste

m E

ng

ineerin

g T

oo

ls:

AP

23

3

Define electronic simulation

needs

Study dimension ?

Simulation processing

Results analysis and

synthesis

Complex Systems Design & Management 2010 21

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Complex Systems Design & Management 2010 22

Table of contents

1. Context1. EXPAMTION: a Mov’eo and System@tic project2. Problem statement

2. Lack of integration between mechatronic simulation and PLM

3. Proposed solution for integration1. Architecture2. Used tools

4. Conclusion and future works

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Simple

case

Whole

caseCase study Proposal

study

State of the art Application on

Valeo GMV cardValidation on complex

mechatronic product

Conclusion and future works

2010 20122011 2013

Integration of EXPAMTION and O2M methodologies for developing a

generic approach from requirements engineering to multidisciplinary

simulation dedicated to complex mechatronics systems

Complex Systems Design & Management 2010 23

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Questions

Thanks for your attention

For more information: http://www.itt-mecatronique.fr

Jérémy LEFÈVRE

[email protected]

Complex Systems Design & Management 2010 24

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References[Mori, 1969]: Mori T.: Company Yaskawa. Japan (1969).

[Choley, 2009]: Choley J.Y.: La mécanique et l’électronique deviennent mécatronique. Conférence Formation

Mécatronique Innovaxiom, Supméca, Paris (2009).

[Penas, 2009]: Penas O.: De la nécessité d’un outil PLM pour la mécatronique. Conférence Formation

Mécatronique Innovaxiom, Supméca, Paris (2009).

[Casella, 2009]: Casella F., Franke R., Olsson H., Otter M. and Sielemann M.: Modelica Language specification.

Version 3.1 (2009).

[Fritzson, 2006]: Fritzson P.: Principles of Object-oriented modeling and simulation with Modelica 2.1. IEEE, ISBN:

9780471471639 (2006).

[Fraunhofer SCAI, 2009]: Fraunhofer SCAI: MpCCI Manual. Version 4.0 (2009).

[Kobryn, 2004]: Kobryn C.: UML 3.0 and the future of modeling. 24 February 2004, Springer-Verlag (2004).

[Paredis, 2009]: Paredis C.: Model-Based Systems Engineering: Research Overview. UTC, Compiègne (2009).

[Kadima, 2009]: Kadima H.: SysML et simulation du comportement dynamique continu de systèmes complexes.

Conférence Formation Mécatronique Innovaxiom, Supméca, Paris (2009).

[Charles, 2005]: Charles S.: Integrated management of CAD and FEA data – towards a link between mechanical

design and structural analysis, Thesis, Université de technology de Troyes, Troyes (2005).

[Ameri & Dutta, 2005]: Ameri F. and Dutta D.: Product Lifecycle Management: Closing the Knowledge Loops.

Computer-Aided Design & Applications, Vol. 2, No. 5 (2005).

[CIMdata, 2007]: CIMdata: Eurostep’s Share-A-space: Product Lifecycle Collaboration through Information

Integration. Michigan, USA (2007).

[CIMdata, 2002]: CIMdata: Product lifecycle management. C Inc - CIMdata Report. Michigan, USA (2002).

[Stark, 2004]: Stark J.: Product Lifecycle Management: 21st Century Paradigm for Product Realisation. Springer

London Ltd, ISBN-13: 978-1852338107 (2004).

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