Modelo de Diagrama PCB Infrared

8/10/2019 Modelo de Diagrama PCB Infrared

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INFRARED DATA COMMUNICATION

VISHAY SEMI CONDUCTORS

Notes:1. To navigate: a) Click on the Vishay logo on any datasheet to go to the Contents

page for that section. Click on the Vishay logo on any Contentspage to go to the main Table of Contents page.b) Click on the products within the Table of Contents to go directlyto the datasheet.

c) Use the scroll or page up/page down functions. d) Use the Adobe Acrobat page function in the browser bar.

2. To search the text of the catalog use the Adobe

Acrobat

searcfunction.

VS E-DB2802-0610

INTERACTIVE V I S H A Y I N T E R T E C H N O L O G Y , I N C .

data book

Discrete Semiconductors and Passive ComponentsOne of the Worlds Largest Manufacturers of


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V I S H AY I N T E R T E C H N O L O G Y, I N C .

w w w. v i s h a y . c o m

D A T A B

O OK

INFR ARED DATA COMMUN ICATION

VI SHAY SEMICONDUCTORS

Tr a n s c e i v e r s

E n c o d e r s / D e c o d e r s
http://www.vishay.com/http://www.vishay.com/


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PASSIVE COMPONENTS

SEMICONDUCTORS

P R O D U C T

L I S T I N G S

RECTIFIERS

Schottky (single, dual) Standard, Fast, and Ultra-Fast Recovery

(single, dual) Bridge Superectifier

Sinterglass Avalanche Diodes

SMALL-SIGNAL DIODES

Schottky and Switching (single, dual) Tuner/Capacitance (single, dual) Bandswitching PIN

ZENER AND SUPPRESSOR DIODES

Zener (single, dual) TVS (TRANS Z ORB , Automotive, ESD, Arrays)

MOSFETs

Power MOSFETs JFETs

RF TRANSISTORS

Bipolar Transistors (AF and RF) Dual Gate MOSFETs MOSMICs

OPTOELECTRONICS

IR Emitters and Detectors,and IR Receiver Modules

Optocouplers and Solid-State Relays Optical Sensors LEDs and 7-Segment Displays Infrared Data Transceiver Modules Custom Products

ICs

Power ICs Analog Switches DC/DC Converters RF Transceivers

ICs for Optoelectronics

RESISTIVE PRODUCTS

Foil Resistors Film Resistors Metal Film Resistors Thin Film Resistors Thick Film Resistors Metal Oxide Film Resistors Carbon Film Resistors Wirewound Resistors Power Metal Strip Resistors Chip Fuses Variable Resistors Cermet Variable Resistors Wirewound Variable Resistors Conductive Plastic Variable Resistors Networks/Arrays Non-linear Resistors NTC Thermistors PTC Thermistors Varistors

MAGNETICS

Inductors Transformers

CAPACITORS

Tantalum Capacitors Molded Chip Tantalum Capacitors Coated Chip Tantalum Capacitors Solid Through-Hole Tantalum Capacitors Wet Tantalum Capacitors Ceramic Capacitors Multilayer Chip Capacitors Disc Capacitors Film Capacitors Power Capacitors Heavy-Current Capacitors Aluminum Capacitors Silicon RF Capacitors

STRAIN GAGE TRANSDUCERS AND STRESS ANALYSIS SYSTEMS

PhotoStress Strain GagesLoad Cells

Force Transducers Instruments Weighing Systems


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IR Transceivers

Databook

Vishay Semiconductor GmbHP.O.B. 3535,

D-74025 HeilbronnGermany

Telephone: + 49 (0)7131 67 2831Fax number: + 49 (0)7131 67 2423

www.vishay.com


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NOTICESpecifications of the products displayed herein are subject to change without notice. VishayIntertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors orinaccuracies.

Information contained herein is intended to provide a product description only. No license, express orimplied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Exceptas provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liabilitywhatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay productsincluding liability or warranties relating to fitness for a particular purpose, merchantability, or infringementof any patent, copyright, or other intellectual property right.

The products shown herein are not designed for use in medical, life-saving, or life-sustainingapplications. Customers using or selling these products for use in such applications do so at their ownrisk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.

OZONE DEPLETING SUBSTANCES POLICY STATEMENT

It is the policy of Vishay Semiconductor GmbH to

1. Meet all present and future national and international statutory requirements.2. Regularly and continuously improve the performance of our products, processes, distribution and

operating systems with respect to their impact on the health and safety of our employees and thepublic, as well as their impact on the environment.

It is particular concern to control or eliminate releases of those substances into the atmosphere whichare known as ozone depleting substances (ODSs).

The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use ofODSs and forbid their use within the next ten years. Various national and international initiatives arepressing for an earlier ban on these substances.

Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminatethe use of ODSs listed in the following documents.

1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendmentsrespectively

2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by theEnvironmental Protection Agency (EPA) in the USA

3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances)respectively.

Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozonedepleting substances and do not contain such substances.


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Table of ContentsVishay Semiconductors

www.vishay.com3

Alphanumeric Index .............................................................................................................................................. 4

Selection Guide ...................................................................................................................................................... 5

General Information

Infrared Data Communication According to IrDA

Standard, Part 1: Physical Layer............................................ 8Infrared Data Communication According to IrDA Standard, Part 2: Protocol...................................................... 21Symbols and Terminology..................................................................................................................................... 31Data Sheet Structure............................................................................................................................................. 41Taping, Labeling, Storage, Packing and Marking.................................................................................................. 42Environmental Health and Safety Policy ............................................................................................................... 52Surface Mount Assembly Instructions ................................................................................................................... 53Window Size in Housings...................................................................................................................................... 58Sources for Accessories and Testing.................................................................................................................... 60Ambient Light and Electromagnetic Interference .................................................................................................. 66Eye Safety of Diode Emitters ................................................................................................................................ 68Remote Control with IrDA Transceivers.............................................................................................................. 69Interface Circuits ................................................................................................................................................... 80Reference Layouts and Circuit Diagrams.............................................................................................................. 87Quality and Reliability............................................................................................................................................ 96

SIRTFBS4650 ............................................................................................................................................................. 120TFBS4652 ............................................................................................................................................................. 131TFBS4710 ............................................................................................................................................................. 142TFBS4711 ............................................................................................................................................................. 151TFDU4100............................................................................................................................................................. 160TFDU4101............................................................................................................................................................. 171TFDU4202............................................................................................................................................................. 185TFDU4203............................................................................................................................................................. 194TFDU4300............................................................................................................................................................. 204

MIRTFBS5700 ............................................................................................................................................................. 218TFBS5711 ............................................................................................................................................................. 230TFDU5307............................................................................................................................................................. 242

FIRTFBS6711 ............................................................................................................................................................. 258TFBS6712 ............................................................................................................................................................. 270TFDU6102............................................................................................................................................................. 282TFDU6103............................................................................................................................................................. 295TFDU6300............................................................................................................................................................. 308TFDU6301............................................................................................................................................................. 321TFBS6614 ............................................................................................................................................................. 334

FIR with RC ReceiverTFDU7100............................................................................................................................................................. 346

VFIRTFDU8108............................................................................................................................................................. 360

Emitter/Detector PairTFDU2201............................................................................................................................................................. 384

EndecTOIM4232 ............................................................................................................................................................. 392


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Alphanumeric IndexVishay Semiconductors

www.vishay.com4

TFBS4650.............................................................................................................................................................. 120

TFBS4652.............................................................................................................................................................. 131

TFBS4710.............................................................................................................................................................. 142

TFBS4711.............................................................................................................................................................. 151TFBS5700.............................................................................................................................................................. 218

TFBS5711.............................................................................................................................................................. 230

TFBS6614.............................................................................................................................................................. 334

TFBS6711.............................................................................................................................................................. 258

TFBS6712.............................................................................................................................................................. 270

TFDU2201 ............................................................................................................................................................. 384

TFDU4100 ............................................................................................................................................................. 160

TFDU4101 ............................................................................................................................................................. 171

TFDU4202 ............................................................................................................................................................. 185

TFDU4203 ............................................................................................................................................................. 194

TFDU4300 ............................................................................................................................................................. 204

TFDU5307 ............................................................................................................................................................. 242

TFDU6102 ............................................................................................................................................................. 282

TFDU6103 ............................................................................................................................................................. 295

TFDU6300 ............................................................................................................................................................. 308

TFDU6301 ............................................................................................................................................................. 321

TFDU7100 ............................................................................................................................................................. 346

TFDU8108.............................................................................................................................................................. 360

TOIM4232.............................................................................................................................................................. 392


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Vishay Semiconductors

www.vishay.com6


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ContentsInfrared Data CommunicationAccording to IrDA Standard,Part 1: Physical Layer.............. 8

Infrared Data CommunicationAccording to IrDA Standard,Part 2: Protocol ........................21

Symbols and Terminology........ 31

Data Sheet Structure ............... 41

Taping, Labeling, Storage,Packing and Marking ............... 42

Environmental Health andSafety Information.................... 52

Surface Mount AssemblyInstructions .............................. 53

Window Size in Housings ........ 58

Sources for Accessories andTesting ..................................... 60

Ambient Light andElectromagnetic

Interference.............................. 66Eye Safety of DiodeEmitters.................................... 68

Remote Control with IrDA Transceivers ............................ 69

Interface Circuits...................... 80

Reference Layouts and CircuitDiagrams ................................. 87

Quality and Reliabilty ............... 96

General

Information


11/408www.vishay.com8

Document number: 82513Rev. 1.4, 20-Sep-06

IRDC, Part 1: Physical LayerVishay Semiconductors

Infrared Data Communication According to IrDA Standard

Part 1: Physical Layer

What is IrDA?IrDA is the abbreviation for the Infra red Data Associ-ation, a non-profit organization for setting standardsin IR serial computer connections. The following is anoriginal excerpt from the IrDA Web site(http://www.irda.org).

Executive SummaryIrDA was established in 1993 to set and support hard-ware and software standards which create infraredcommunications links. The Association's charter is to

create an interoperable, low-cost, low-power, half-duplex, serial data interconnection standard that sup-ports a walk-up, point-to-point user model that isadaptable to a wide range of applications anddevices. IrDA standards support a broad range ofcomputing, communications, and consumer devices.International in scope, IrDA is a non-profit corporationheadquartered in Walnut Creek, California, and led bya Board of Directors which represents voting mem-bership worldwide. As a leading high technology stan-dards association, IrDA is committed to developingand promoting infrared standards for the hardware,software, systems, components, peripherals, commu-nications, and consumer markets.

Industry OverviewInfrared (IR) communications is based on technologywhich is similar to the remote control devices such asTV and entertainment remote controls used in mosthomes today. IR offers a convenient, inexpensive andreliable way to connect computer and peripheraldevices without the use of cables. IrDA connectivity isbeing incorporated into most notebook PCs to bringthe most cost-effective and easy to use support avail-

able for wireless technologies.There are few US, European or other internationalregulatory constraints.Manufacturers can ship IrDA-enabled products glo-bally without any constraints, and IrDA functionaldevices can be used by international travellers wher-ever they are, and interference problems are minimal.Standards for IR communications have been devel-oped by IrDA. In September 1993, IrDA determinedthe basis for the IrDA SIR Data Link Standards. InJune 1994, IrDA published the IrDA standards which

includes Serial Infrared (SIR) Link specification, LinkAccess Protocol (IrLAP) specification, and Link Man-agement Protocol (IrLMP) specification. IrDAreleased extensions to SIR standard including4 Mbit/s in October 1995. The IrDA Standard Specifi-cation has been expanded to include high speedextensions of 1.152 Mbit/s and 4.0 Mbit/s. This exten-sion will require an add-in card to retrofit existing PCswith high speed IR, and a synchronous communica-tions controller or equivalent.In 1995, several market leaders announced orreleased products with IR features based on IrDAstandards. These products include components,adapters, printers, PCs, PDAs, notebook computers,LAN access, and software applications. In November1995, the Microsoft Corporation announced it hadadded support for IrDA connectivity to the MicrosoftWindows 95 operating system, enabling low-costwireless connectivity between Windows 95 basedPCs and peripheral devices.IrDA's interoperable infrared serial data link featureslow power consumption with data speeds up to4 Mbit/s, allowing a cordless 'walk-up-to' data transferin a simple, yet compelling way. Applications are inboth consumer and commercial markets with a uni-versal data connection relevant in the use of dockingand input units, printers, telephones, desktop/ laptopPCs, network nodes, ATMs, and handheld mobilepeers (PDA meets PDA). Yesterdays systems withIR capabilities such as Newton, Omnibook, Wizardand Zoomer are not easily compatible with each otheror other complementary devices. IrDA is the responsein which many segments of the industry have commit-ted themselves to realizing the opportunity of a gen-eral standard providing data links which are non-

interfering and interoperable.

The IrDA - StandardThe current IrDA physical layer standard is version1.4 and includes all changes and add-ons up to VFIRwith 16 Mbit/s. Version 1.4 replaced version 1.3 whichis obsolete as are all former versions from 1.0 to 1.2.Referring to these versions currently can describeonly historical steps of the IrDA - development.


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IRDC, Part 1: Physical Layer



www.vishay.com9

How IrDA Transmission WorksThe transmission in an IrDA-compatible mode (some-times called SIR for serial IR) uses, in the simplestcase, the RS232 port, a built-in standard of all com-patible PCs. With a simple interface, shortening the

bit length to a maximum of 3/16 of its original lengthfor power-saving requirements, an infrared emittingdiode is driven to transmit an optical signal to thereceiver.This type of transmission covers the data range up to115.2 kbit/s which is the maximum data rate sup-ported by standard UARTs (see figure 1). The mini-mum demand for transmission speed for IrDA is only9600 bit/s. All transmissions must be started at thisfrequency to enable compatibility. Higher speeds area matter of negotiation of the ports after establishingthe links.

Higher speeds require special interfaces which oper-ate at 1.152 Mbit/s and use a similar pulse-shorteningprocess as in the RS232-related mode, but with apulse reduction to 1/4 of the original pulse length. Thefastest data rate supported by IrDA is 4.0 Mbit/s (oftencalled FIR), operating with 125-ns pulses in a 4-PPM(PPM = P ulse- P osition Modulation) mode. The typicalinterfaces for the various modes are shown in figure2. In the following chapter "IrDA Standard - PhysicalLayer", the definitions of the IrDA standard are given.Optical output power and receiver sensitivity are setto a level where a point-and-shoot activity ( 15 ) issufficient for point-to-point communication, but pre-vents the pollution of the ambient by straying need-less power. Transmission over a distance of at least1 m is ensured. The detector front end receives thetransmitted signal, re-shapes the signal and feeds itto the port. The system works in a half-duplex modethat allows only one transmission direction to beactive at any given time.For frequencies up to 115.2 kbit/s, the minimum out-put intensity is defined with 40 mW/sr. For higherspeeds, a higher output intensity of 100 W/sr mini-mum is used. The sensitivity thresholds are40 mW/m 2 and 100 mW/m 2 for SIR and FIR respec-tively.The wavelength chosen for the standard is between850 nm and 900 nm.An additional IrDA standard was generated in 1997(voted Feb. 1998) for Control applications, the so-called IrControl standard.This standard is using the IEC1603-1 sub carrier fre-quency allocation with a carrier at 1500 kHz. Thetransmission capacity is 72 kbit/s. This system hasstill some compatibility problems with the SIR/FIR

IrDA Standard. One of the disadvantages is that thedetector circuitry is different from the other, base-band system. Therefore, integrating both into oneapplication is expensive. Using IrControl and SIR/FIR

in one application would imply that two IR hardwarechannels must be built-in. The Very Fast IR (VFIR,min. 16 Mbit/s transfer rate over more than 1 m)established in 1999.

What do I need to enableIrDA Transmission?The simplest way of optical interfacing in the SIRmode is shown in figure 1. For pulse shaping andrecovery, the Vishay Semiconductors deviceTOIM4232 is recommended. The front end includingtransmitter and receiver should be realized for exam-

ple by the integrated transceiver module TFDU4100or other devices of the 4000 series. The TFDU4100can also be directly connected to Super I/Os.A transimpedance amplifier is used in the receiver forinput amplification. Its output signal is fed to the com-parator input, whose reference level is adjusted toefficiently suppress noise and interferences from theambient.Additionally, the digital pulse-shaping circuit must beinserted for shortening the pulse to be emitted to1.6 s (i.e., 3/16 of the bit length at 115 kbit/s) andpulse recovery of the detected signal to comply with

the IrDA standard. Only the active low bits (0) aretransmitted.For the high-speed mode, the TFDU6102 or otherdevices from the 6000 series are recommended to beoperated with e.g NSCs or SMCs IrDA-compatibleSuper I/O circuits. Circuit proposals for the variousmodes can be found in our application section. Ablock diagram is shown in Figure 2.





The IrDA standard documentation can be found onthe IrDA web site http://www.irda.org. The documentswhich are public and can be downloaded are shownon the next page.The physical layer is responsible for the definition ofhardware transceivers for the data transmission. Thephysical layer is therefore discussed in the followingchapters which define the properties of the front enddevices manufactured by Vishay Semiconductors.

Figure 1. Block diagram of one end of the overall SIR link

Pulse shaping

Pulse recovery

TOIM4232

Transmitter

Receiver

4000 seriestransceiver

IR output

UART16550/ RS232

IR input17255

Figure 2. Block diagram of one end of the link for signaling rates up to 4.0 Mbit/s

Up to 115.2 kbit/s Output driverand IRED

Detectorand receiver

IR transceivermodule

IR output

I/O

4.0 Mbit/s

1.152 Mbit/s0.576 Mbit/s

Active outputinterface

IR output

Active inputinterface

17256


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IrDA-Standard - Physical Layer

SpecificationIn SIR mode, the data is represented by optical pulsesbetween 1.6 s and 3/16 of the bit length of theRS232 data pulse in SIR mode. Pulse-length reduc-tion is also applied in the higher frequency modes.The limits of the standards are shown in tables 1 and3. The optical radiant intensity and detector sensitivityare adjusted to guarantee a point-to-point transmis-sion in a cone of 15 over a distance of at least 1 m.The radiant intensity and the sensitivity of the frontend can be increased to ensure a transmission over3 m (see figure 3). Data from the optical interfacestandard are documented in tables 2 to 4.

Media Interface SpecificationOverall LinksThere are two different sets of transmitter/ receiverspecifications. The first, referred to as Standard, is fora link which operates from 0 to at least 1 meter. Thesecond, referred to as the Low Power Option, has ashorter operating range, and is only defined up to115.2 kbit/s. There are three possible links (see Table1 below): Low Power Option to Low Power Option,Standard to Low Power Option; Standard to Stan-dard. The distance is measured between the opticalreference surfaces.The Bit Error Ratio (BER) shall

be no greater than 10-8

. The link shall operate andmeet the BER specification over its range.

Signaling Rate and Pulse Duration: An IrDA serialinfrared interface must operate at 9.6 kbit/s. Addi-tional allowable rates listed below are optional. Sig-naling rate and pulse duration specifications areshown in table 2.For all signaling rates up to and including 115.2 kbit/sthe minimum pulse duration is the same (the specifi-cation allows both a 3/16 of bit duration pulse and aminimum pulse duration for the 115.2 kbit/s signal(1.63 s minus the 0.22 s tolerance). The maximumpulse duration is 3/16 of the bit duration, plus thegreater of the tolerance of 2.5 % of the bit duration, or0.60 s.For 0.576 Mbit/s and 1.152 Mbit/s, the maximum andminimum pulse durations are the nominal 25 % of thebit duration plus 5 % (tolerance) and minus 8 % (tol-erance) of the bit duration.For 4.0 Mbit/s, the maximum and minimum singlepulse durations are the nominal 25 % of the symbolduration plus and minus a tolerance of 2 % of thesymbol duration. For 4.0 Mbit/s, the maximum andminimum double pulse durations are 50 % of the sym-bol plus and minus a tolerance of 2 % of the symbolduration. Double pulses may occur whenever twoadjacent chips require a pulse.The link must meet the BER specification over the linklength range and meet the optical pulse constraints.

Low Power -Low Power

Standard -Low Power

Standard -Standard

Link Distance Lower Limit, meters 0 0 0Minimum Link Distance Upper Limit, meters 0.2 0.3 1.0

Table 1: Link Distance Specifications


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www.vishay.com13

*) RZI = Return to Zero Inverted

StopBit

StartBit

Data Bit s

IR Frame

IR Frame

Stop

Bit

Start

Bit

Data Bits

UART Frame

UART Frame

Pulse Width = 3/16 Bit TimeBit T ime

0 1 0 1 0 0 1 1 0 1

0 1 0 1 0 0 11 1 0

17257

Signaling Rate Modulation Rate Tolerance% of Rate

Pulse DurationMinimum

Pulse DurationNominal

Pulse DurationMaximal

2.4 kbit/s RZI*) 0.87 1.41 s 78.13 s 88.55 s9.6 kbit/s

RZI*) 0.87 1.41 s 19.53 s 22.13 s

19.2 kbit/s RZI*) 0.87 1.41 s 9.77 s 11.07 s38.4 kbit/s RZI*) 0.87 1.41 s 4.88 s 5.96 s57.6 kbit/s RZI*) 0.87 1.41 s 3.26 s 4.34 s115.2 kbit/s RZI*) 0.87 1.41 s 1.63 s 2.23 s0.576 Mbit/s RZI*) 0.1 295.2 ns 434.0 ns 520.8 ns1.152 Mbit/s RZI*) 0.1 147.6 ns 217.0 ns 260.4 ns4.0 Mbit/sSingle pulseDouble pulse

4 PPM4 PPM

0.010.01

115.0 ns240.0 ns

125.0 ns250.0 ns

135.0 ns260.0 ns

16 Mbit/s HHH (1.13) 0.01 38.3 ns 41.7 ns 45.0 nsTable 2: Signaling rate and pulse-duration specification





4.0 Mbit/s

17258

1.6 s or 3 /16

1/4 Bit cell

NRZ

115.2 kbit/s

RZ I - IR

0.576 Mbit/s1.152 Mbit/s

Data Bit Pair(DBD)

4PPM Data Symbol(DD)1000010000100001

00011011

chip 1 chip 2 chip 3 chip 4

Ct = 125 ns

Dt = 500 ns

One completeSymbol

17259


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www.vishay.com15

HHH (1,13) Modulation Code for the 16-Mbit/s VFIR StandardThe HHH (1, 13) modulation code has the followingsalient features: Code Rate:

2/3 ,

Maximal Duty Cycle:1/3 (~ 33 %) ,

Average Duty Cycle:~ 26 % ,

Minimal Duty Cycle:1/12 (~ 8.3 %) ,

Run-Length Constraints:(d, k) = (1, 13) ,

Longest Run of '10' s:yyy'000'101'010'101'000'yyy ,

Chip Rate at Data Rate 16 Mbit/s:24 Mchips/s ,

System Clock at Data Rate 16 Mbit/s:N 12 MHz (where N 4).

The HHH(1,13) code is a Run Length Limited (RLL)code that provides both power efficiency and band-width efficiency at the high data rate. The signalingrate of the code is 24 Mchips/s allowing a rise and fall

time of 19 ns. LED on time is further improved by hav-ing a 26 % average duty cycle for random data. Thelower duty cycle is achieved by scrambling the incom-ing data stream. The run length constraints(d, k) = (1, 13) ensure an inactive chip after eachactive chip, i.e. only single-chip-width pulses occur.This feature allows a source or a receiver to exhibit along tail property. To take full advantage of the d = 1feature of HHH(1, 13) in strong signal conditions,clock and data recovery circuitry should be designedto ignore the level of the chip following an active chipand assume these chips are inactive. The 13 inHHH(1, 13) denominates that the maximum numberof chips without a signal is 13. That limits the lowercutoff frequency of the system and optimizes thresh-old trigger stability in receiver designs. The modula-tion code is enhanced with simple frame-synchronized scrambler/descrambler mechanisms asdefined and described in the IrDA IrPhy 1.4 standard.While such a scheme does not eliminate worst-caseduty cycle signal patterns in all specific cases, theprobabilities of their occurrence are reduced signifi-cantly on average. This leads to a better "eye" open-ing and reduced jitter in the recovered signal streamfor typical payload data.





Active Output InterfaceThe active output interface (IRLED) emits an infraredsignal. Key parameters for this interface, defined byIrDA physical layer specification are shown in table 3.A complete specification is available from IrDA.

*)For a given transmitter implementation, the IEC 60825-1 AEL Class 1 limit may be less than this.

See section 2.4 above and Appendix A.

Tolerance Field of Angular EmissionThe optical radiant intensity is limited to a maximumof 500 mW/sr and an angle of 30 to enable theindependent operation of more than one system in aroom. In figure 3, the tolerance field of an infrared

transmitter's emission is shown. A typical far fieldcharacteristic of a transmitter is also shown in thisfigure.

Specification Data Rates Type Minimum MaximumPeak wavelength, p, m All Both 0.85 0.90Maximum intensity in angular range, mW/sr All Std - 500 *)

Low Power - 500 *)

Minimum intensity in angular range, mW/sr

115.2 kbit/s and below Std 40 -Low Power 3.6 -

Above 115.2 kbit/s Std 100 -Low Power 9 -

Half angle, degrees All Both 15 30Signaling rate (also called clock accuracy) All Both See table 2 See table 2Rise time t r ,10 % to 90 %,fall time t f , 90 % to 10 %, ns

115.2 kbit/s and belowBoth

- 600115.2 kbit/s to 4.0 Mbit/s - 40

16 Mbit/s - 19Pulse duration All Both See table 2 See table 2Optical overshoot, % All Both - 25Edge Jitter, % of nominal pulse duration 115.2 kbit/s and below Both - 6.5Edge Jitter, relative to reference clock, % of nominal duration 0.576 and 1.152 Mbit/s Both - 2.9Edge Jitter % of nominal chip duration 4.0 Mbit/s Both - 4.0

16.0 Mbit/s Std - 4.0

Table 3: Active output specification

Figure 3. Tolerance field of angular emission

0

50

100

150

200

250

300

350

400

450

500

- 90 - 75 - 60 - 45 - 30 - 15 0 15 30 45 60 75 90

R a d i a n t i n t e n s i t y ( m W / s r )

SIR(V)FIR

IrDA tolerance field

Typical characteristic

Angle of emission ()

550

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www.vishay.com17

Active Input InterfaceWhen a infrared optical signal impinges on the activeinput interface (PIN photodiode), the signal isdetected, conditioned by the receiver circuitry, andtransmitted to the IR receive decoder.

Active Input SpecificationThe following five specifications form a set which canbe measured concurrently:- Maximum irradiance in angular range, mW/m 2

- Minimum irradiance in angular range, mW/m 2

- Half-angle, degrees- Bit Error Ratio, (BER)- Receiver Latency Allowance, msThese measurements require an optical power

source and means to measure angles and BERs.Since the optical power source must provide thespecified characteristics of the Active Output, calibra-tion and control of this source can use the sameequipment as that required to measure the intensityand timing characteristics. BER measurementsrequire some method to determine errors in thereceived and decoded signal. The latency testrequires exercise of the node's transmitter to condi-tion the receiver.Definitions of the reference point etc., are the same asfor the Active Output Interface optical power mea-surements except that the test head is now an opticalpower source with the in-band characteristics (peakwavelength, rise and fall times, pulse duration, signal-ing rate and jitter) of the Active Output Interface. Theoptical power source must also be able to provide themaximum power levels listed in the Active OutputSpecifications. It is expected that the minimum levelscan be attained by appropriately spacing the opticalsource from the reference point.

Figure 4 illustrates the region over which the OpticalHigh State is defined. The receiver is operatedthroughout this region and BER measurements aremade to verify the maximum and minimum require-ments. The ambient conditions of A.1 (page 20) applyduring BER tests; BER measurements can be donewith worst case signal patterns. Unless otherwiseknown, the test signal pattern should include maxi-mum length sequences of "1"s (no light) to test noise

and ambient, and maximum length sequences of "0"s(light) to test for latency and other overload condi-tions.Latency is tested at the Minimum Irradiance in angu-lar Range conditions. The receiver is conditioned bythe exercise of its associated transmitter. For rates upto and including 1.152 Mbit/s, the conditioning signalshould include maximum length sequences of "0"s(light) permitted for this equipment. For 4.0 Mbit/s4 PPM operation, various data strings should beused; the latency may be pattern dependent. Thereceiver is operated with the minimum irradiance lev-els and BER measurements are made after the spec-ified latency period for this equipment to verifyirradiance, half angle, BER and latency requirements.The minimum allowable intensity value is indicated by"minimum" in figure 5, since the actual specified valueis dependent upon the data rate, SIR or FIR.

Specification Data Rates Type Minimum MaximumMaximum irradiance in angular range, mW/m 2 All Both - 500

Minimum irradiance in angular range, mW/m 2115.2 kbit/s and below Low Power 9.0 -

Std 4.0 -

Above 115.2 kbit/s Low Power 22.5 -

Std 10.0 -

Half angle, degrees All Both 15 -

Receiver latency allowance, ms4.0 kbit/s and below Std - 10

Low Power - 0.5

16.0 Mbit/s Both - 0.10

Table 4: Active input specification





Low Power Standard and Full Range OperationThe message that a Low Power device must be aspecial design is often propagated, but is incorrect.Full standard devices can be operated easily withreduced IRED drive current to fulfill the low power

specification. However, devices specially designedfor Low Power applications with low profile packageare not able to cover the full standard because of lim-ited efficiency and little drive current capability.

Figure 4. Optical High State Acceptable Range

- 30 - 15

Irradiance (or Incidence) (W/m 2 )

5 kW/m 2(Vertical axis is not drawn to scale)

Undefined Region

Undefined Region Optical

High

State

Angle (Degrees)

minimum

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Transmission DistanceFrom figure 5, the transmission distance as a functionof the sensitivity (necessary irradiance on the detec-tor) can be read. For example: Sensitivity given as aminimum irradiance on the detector of 40 mW/m 2,

combined with an intensity of 40 mW/sr, results in atransmission distance of 1 m. A combination of adetector with a minimum irradiance of 10 mW/m 2 andan emitter with 250 mW/sr can transmit over almost

five meters. Vishay Semiconductor transceivers workwell with standard remote control receivers and cantherefore be operated as remote control transmitters.The physical layer properties of the devices aredefined under ambient conditions listed in an appen-dix which has been reprinted in the following chap-ters.

Figure 5. IrDA and Remote Control maximum transmission distance. For Remote Controlreceivers operating with IrDA transmitters a sensitivity of 0.7 mW/m 2 can be assumed.

10 7

0.01 0.1 1 10 100

10 6

10 5

10 4

10 3

10 2

10 1

10 0

10-1

10 -2

Distance (m )

Ie = 5 00 mW/sr

Ie = 240 mW/sr

Ie = 100 mW/sr

Ie = 4 0 mW/sr

IrDA FIR Standard specified sensitivity

Remote Control, guarantee d sensitivityIrDA SIR Standard specified sensitivity

Remote Control , typical sensitivity

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I r r a

d i a n c e

( m W / m ) 2





Appendix A. Test MethodsNote - A.1 is Normative unless otherwise noted. Therest of Appendix A and all of Appendix B are Informa-tive, not Normative {i.e. it does not contain require-ments, but is for information only}. Examples of

measurement test circuits and calibration are pro-vided in IrDA Serial Infrared Physical Layer Measure-ment Guidelines.

A.1. Background Light and Electromagnetic FieldThere are four ambient interference conditions inwhich the receiver is to operate correctly. The condi-tions are to be applied separately: Electromagnetic field: 3 V/m maximum (Refer to

IEC 61000-4-3. test level 2 for details) (Fordevices that intend to connect with or operate inthe vicinity of a mobile phone or pager, a field of30 V/m with frequency ranges from 800 MHz to690 MHz and 1.4 GHz to 2.0 GHz including 80 %amplitude modulation with a 1 kHz sine wave isrecommended. Refer to IEC 61000-4-3 test level 4for details. The 30 V/m condition is a recommen-dation; 3 V/m is the normative condition.)

Sunlight: 10 kilolux maximum at the optical portThis is simulated with an IR source having a peakwavelength within the range 850 nm to 900 nmand a spectral width less than 50 nm biased to pro-vide 490 W/cm 2 (with no modulation) at the opti-cal port. The light source faces the optical port.This simulates sunlight within the IrDA spectralrange. The effect of longer wavelength radiation iscovered by the incandescent condition.

Incandescent Lighting: 1000 lux maximum. Thisis produced with general service, tungsten fila-ment, gas-filled, inside-frosted lamps in the60 Watt to 150 Watt range to generate 1000 luxover the horizontal surface on which the equip-ment under test rests. The light sources are abovethe test area. The source is expected to have a fil-ament temperature in the 2700 to 3050 degreesKelvin range and a spectral peak in the 850 nm to1050 nm range.

Fluorescent Lighting: 1000 lux maximum This issimulated with an IR source having a peak wave-length within the range 850 nm to 900 nm and aspectral width of less than 50 nm biased and mod-ulated to provide an optical square wave signal(0 W/cm 2 minimum and 0.3 W/cm 2 peak ampli-tude with 10 % to 90 % rise and fall times less thanor equal to 100 ns) over the horizontal surface onwhich the equipment under test rests. The lightsources are above the test area. The frequency ofthe optical signal is swept over the frequencyrange from 20 kHz to 200 kHz. Due to the variety

of fluorescent lamps and the range of IR emis-sions, this condition is not expected to cover all cir-cumstances. It will provide a common basis forIrDA operation.


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Infrared Data Communication According the IrDA Standard

Part 2: ProtocolIrDA Protocol Stack

The IrDA protocol stack provides hardware and soft-ware architecture guidelines for designing an IrDAcompliant system. Figure 1 shows the different layersin the stack. As a minimum, compliance to IrPHYS,IrLAP, and IrLMP is required. Optional sections of theprotocol include the Higher Speed Extensions(1.15 and 4 Mbit/s), IrCOMM, TinyTP & PnP.

IrDA Link Access Protocol (IrLAP)IrLAP, is derived from an existing asynchronous datacommunications standard (an adaptation of HDLC). Itprovides guidelines for link access in which the soft-ware searches for other machines to connect to (sniff-ing), recognizes other machines (discovery), resolvesaddressing conflicts, initiates connection and informa-tion exchange, and manages disconnection. Duringdata transfer, IrLAP is responsible for providing reli-able error detection, retransmission, and flow control.

While the discovery and address conflict resolutionprocedures are somewhat unique to IrLAP, the linkinitialization/ shutdown, connection startup, discon-nection and information transfer procedures allresemble similar operations in HDLC protocols andare adapted to the IrDA serial infrared environment.A link operates essentially as follows:A device (primary) will want to connect to anotherdevice (either by automatic detection via the discov-ery and sniffing capability of IrLAP, or via direct userrequest). A data link involves at least one primary

(commanding) station and one or more secondary(responding) stations, whose roles IrLAP has theresponsibility of managing. The primary station hasresponsibility for the data link. All transmissions overa data link go to or from the primary station and canbe point-to-point or point-to-multi-point. There isalways one and only one primary station while allother stations must be secondary stations.After obeying the media access rules the primary willsend connection request information at 9600 bit/s tothe other device, this data will include informationsuch as its address and its other capabilities such asdata rate, etc. The responding device will assume thesecondary role and, after obeying the media accessrules, return information that contains its address andcapabilities. The primary and secondary will thenchange the data rate and other link parameters to thecommon set defined by the capabilities described inthe information transfer. The primary will then senddata to the secondary confirming the link data rateand capabilities. The two devices are now connectedand the data is transferred between primary and sec-ondary under the complete control of the primary.Rules are defined which ensure that the secondaryand primary are both able to efficiently transfer data.Any station that is capable can contend to play the pri-mary station role. The role of primary is determineddynamically when the link connection is establishedand continues until the connection is closed (theexception is that there is a method provided for a pri-mary and secondary on a point to point link toexchange roles without closing the connection).

Figure 1. IrDA Protocol Stack17265

Figure 2. IrLAP Operation Procedures

Sniff- Open

Address

Address ConflictResolution

Connect InformationTransfer

Disconnect

Reset

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IrDA Flow Control Mechanism (Tiny TP)Whilst IrLAP provides a flow-control mechanismbetween peer IrLAP entities, the introduction of multi-plexed channels above IrLAP by IrLMP LM-MUXintroduces a problem. Reliance on IrLAP to provide

flow-control for a multiplexed channel can result indead-locks if the consumption of data from one multi-plexed channel is dependent on data flowing in anadjacent multiplexed channel. Conversely, if inbounddata on a multiplexed channel cannot be consumedand the underlying IrLAP connection cannot be flowcontrolled off due to the possibility of deadlock,inbound data (freshly arrived or buffered) must be dis-carded in the event of buffer exhaustion. Sadly thisreduces the reliable delivery service provided byIrLAP to a best effort delivery service provided byIrLMP LM-MUX (when multiple multiplexed channelsare in operation).There are at least two possible solu-tions for restoring a reliable delivery service aboveIrLMP LM-MUX. Provide a per application stream flow-control

mechanism above LM-MUX between peer appli-cation entities. This ensures that there is alwayssufficient buffer space available to accommodatein-bound application data.

Provide a per application stream retransmissionmechanism above LM-MUX that recovers from theloss of data that arises if inbound bufferingbecome exhausted.

The Tiny TP protocol provides: Independently flow controlled transport connec-

tions Segmentation and re-assembly

IrDA Serial & Parallel Port Emulation(IrCOMM)IrCOMM defines the emulation of Serial and Parallelports over the IrLMP/IrLAP protocol stack. The moti-vation for IrCOMM comes from the many printing andcommunication applications which use standard com-munication APIs to talk to other devices via serial andparallel ports. By making IrDA protocols accessiblevia these APIs, many existing applications includingprinting can run over an IrDA infrared link withoutchange. This intent to support so-called legacy appli-cations is the basis for IrCOMM. New applications areencouraged to take better advantage of IrDA proto-cols by using their capabilities directly.Emulating COMM ports raises a number of questions,

starting with what kinds of ports will be emulated.IrCOMM emulates RS-232 (EIA/TIA-232-E) serialports, and Centronics parallel ports like those foundon most personal computers. The four service types

used to emulate these ports are the core of this spec-ification. Before discussing service types, however,there are some basic differences between wired andIrDA communications to consider.Wired communications methods can send streamsof information in both directions at once, becausethere are multiple wires (some to send data on, someto receive data from). With infrared, there is the equiv-alent of only one wire (the IR path through the air).This has the following implications: IrDA protocols send packets one way at a time.If a

device tried to send data and listen for data at the

same time, it would "hear" itself and not the deviceit wants to communicate with. The way IrDAdevices achieve two way communications is totake turns, also known as "turning the link around".This happens at least every 500 ms, and can bemade more frequent as necessary. This latencymakes it impossible to perfectly emulate the wiredCOMM environment - very timing sensitive opera-tions will be disrupted.Fortunately, many commu-nication tasks are not so sensitive, and cantherefore use IrCOMM.

All of the information carried on multiple wiresmust be carried on the single IR "wire". This isaccomplished by subdividing the packets into dataand control parts. In this way a logical data chan-nel and control channel are created, and the vari-ous wires can be emulated.

On a different level, IrCOMM is intended for legacyapplications, applications that know about serial orparallel ports but know nothing about IrDA protocols.IrDA protocols, however, have very different proce-dures and APIs from wired COMMs. Suppose, forexample, a word processing application wants to printvia IR using IrDA protocols, an application must first"discover" the printer (locate a printer in IR-space),then check the printer s IAS to find informationneeded to connect. Since the word processing appli-cation (a legacy application) knows nothing aboutthis, IrCOMM maps these operations into normalCOMM operations so that it is completely transparent.For the purposes of IrCOMM a complete communica-tion path involves two applications running on differ-ent devices (the communication endpoints) witha communication segment between them. The


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municate information about the state of otherleads (e.g., RTS/CTS), software flow control set-tings, and the like. A service which employs 3-Wireraw must be able to do without that information.The link is merely a raw channel for the movementof data.

This service can be used to emulate both serialand parallel ports. This may seem counterintui-tive (who has ever heard of a 3-Wire parallelport?), but if you remove the non-data circuits(which 3-Wire raw does not emulate), serial andparallel are equivalent, i.e., just streams of data.

IrLPT is an IrDA service in use on commercially avail-able printing devices. It is equivalent to 3-Wire raw infunctionality, but is slightly different in how it uses theIAS.3-Wire - Like 3-Wire raw, the name of this service

comes from the minimum three RS-232 circuitsrequired for full duplex communications. Like 3-Wireraw, it is intended for both serial and parallel ports.However, there are the following important differ-ences to be noted: 3-Wire service class makes use of Tiny TP flow

control, so that it may coexist with other connec-tions that employ higher level (not IrLAP) flow con-trol (including other cooked IrCOMM connections).It is not limited like 3-Wire raw to a single IrLMPconnection.

3-Wire service class supports a control channel for

sending information like data format. The controlchannel mechanism is described in the chaptertitled Frame Formats and the Control Channel.

Because of the need for flow control and the useof the control channel, the 3-Wire service typeuses a more elaborate frame format.

9-Wire - The name of this service class comes fromthe notion of emulating the 9 circuits of anRS-232 interface which are part of a standard IBMcompatible PC. Unlike the previous services it is trueto its name;9-Wire emulates serial ports only. Three of the circuits

are the same as described in the 3-Wire serviceclasses. The other six are listed below.

Some attributes of this service are listed below. Like 3-Wire, it uses the Tiny TP flow control mech-

anism. It also uses the same control channelmechanism for sending information like data for-mat.

The control channel is used to send the states ofthe other RS-232 leads as they change.Centronics - This service is intended to emulate thefunction of a standard Centronics interface. This ser-vice is for parallel ports only. Some attributes of thisservice are listed below. It uses the Tiny TP flow control mechanism. It uses the same control channel mechanism used

in 3-Wire to send the status/changes of the addi-tional circuits.

IrDA Object Exchange Protocol (IrOBEX)One of the most basic and desirable uses of the IrDAinfrared communication protocols is simply to send anarbitrary "thing", or data object, from one device toanother, and to make it easy for both applicationdevelopers and users to do so. We refer to this asobject exchange (uncapitalized), and it is the subjectof the protocol IrOBEX (for IrDA Object Exchange,OBEX for short). OBEX is a compact, efficient, binaryprotocol that enables a wide range of devices toexchange data in a simple and spontaneous manner.OBEX is being defined by members of the InfraredData Association to interconnect the full range of

devices that support IrDA protocols. It is not, how-ever, limited to use in an IrDA environment.OBEX performs a function similar to HTTP, a majorprotocol underlying the World Wide Web. However,OBEX works for the many very useful devices thatcannot afford the substantial resources required foran HTTP server, and it also targets devices with dif-ferent usage models from the Web. OBEX is enoughlike HTTP to serve as a compact final hop to a device"not quite" on the Web.A major use of OBEX is a "Squirt" or "Slurp" applica-tion, allowing rapid and ubiquitous communications

among portable devices or in dynamic environments.For instance, a laptop user squirts a file to anotherlaptop or PDA; an industrial computer slurps statusand diagnostic information from a piece of factoryfloor machinery; a digital camera squirts its picturesinto a film development kiosk, or if lost can be queried(slurped) for the electronic business card of its owner.However, OBEX is not limited to quick connect-trans-fer-disconnect scenarios - it also allows sessions inwhich transfers take place over a period of time, main-taining the connection even when it is idle.

CCITT Signal Description105 Request to Send (RTS)106 Clear to Send (CTS)107 Data Set Ready (DSR)108 Data terminal Ready (DTR)109 Data Channel received line signal detector (RLSD), aka

Carrier Detect (CD)125 Calling indicator, aka ring Indicator (RI)




IRDC, Part 2: ProtocolVishay Semiconductors

PCs, pagers, PDAs, phones, auto-tellers, informationkiosks, calculators, data collection devices, watches,home electronics, industrial machinery, medicalinstruments, automobiles, pizza ovens, and officeequipment are all candidates for using OBEX. To sup-port this wide variety of platforms, OBEX is designedto transfer flexibly defined "objects"; for example,files, diagnostic information, electronic businesscards, bank account balances, electrocardiogramstrips, or itemized receipts at the grocery store."Object" has no lofty technical meaning here; it isintended to convey flexibility in what information canbe transferred. OBEX can also be used for Commandand Control functions directives to TVs, VCRs, over-head projectors, computers and machinery.OBEX consists of two major parts: a model for repre-senting objects (and information that describes theobjects), and a session protocol to provide a structurefor the "conversation" between devices.OBEX is designed to fulfill the following major goals:

Application friendly - provide the key tools for rapiddevelopment of applications

Compact - minimum strain on resources of smalldevices

Cross platform

Flexible data handling, including data typing andsupport for standardized types - this will allow sim-pler devices for the user through more intelligenthandling of data inside.

Maps easily into Internet data transfer protocols Extensible - provides growth path to future needs

like security, compression, and other extendedfeatures without burdening more constrainedimplementations.

Debuggable

IrDA Infrared Transfer Picture (IrTran-P)IrTran-P (Infrared Transfer Picture) is an image com-munication scheme for a digital camera based on theInfrared Communication Standard specification cre-ated by IrDA. The IrTran-P specification should gen-

erally be used together with the IrDA standardspecifications.IrTran-P is placed on the upper layer of IrSIR, IrLAP,IrLMP, TinyTP and IrCOMM which is already estab-lished as IrDA standard specifications. SCEP (SimpleCommand Execute Protocol) and a bFTP (Binary FileTransfer Protocol) are necessary for exchanging animage between devices and mutually exchangingproperties of the devices. An image format (file) calledUPF (Uni Picture Format) is exchanged on such anentity (UPF is the image format out of the category ofIrDA, and can be found in the appendix of the IrTran-P specification). IrTran-P is a generic name given toall of these components.

SCEP establishes a session on IrCOMM and pro-vides a transparent session which notifies an upperlayer of a command. The procedure of SCEP is devel-oped by a lower layer making use of an advantagethat an IrDA protocol is "error free", as a high speedsession layer matching the IrDA protocol.As is apparent from its name, bFTP provides a ser-

vice for transferring a binary file. The bFTP assumesa virtual file system together with a communicationprotocol. The bFTP has an aspect which enables it tobe easily implemented, because it assumes such asimple file system that will allow "a binary file to bestored with its name".Moreover, bFTP is characterized by a query functionwhich allows it to query functions and properties of adevice and the image format available in the theme ofthis section, i.e., the image transfer. This query func-tion simplifies the user interface of a digital camera,

Figure 3. OBEX in the IrDA architecture

Various Transports(TinyTP, Connectionless)

The wide world of applicationsDefault OBEXapplications

OBEX protocol

IAS Services

IrLMP LM-MUX

IrLAP17269

IrDA SIR 1.0 (115.2kbit/s) / SIR 1.1 (4.0Mbit/s)

UPF (Uni Picture Format)

SCEP (Simple Command Execute Protocol)(connection management, segmentation & reassemple)

bFTB (binary File Transfer Protocol)(Command Definition)

IrCOMM(RS232Cemulation)

IrLMP-IAS(Information Acces Service)

Tiny TP(flow control for a multiplexed channel)

IrMP-MUX (Link Management Protocol)

IrLAP (Link Acces Protocol)

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and allows the most suitable data of an image to betransferred between the digital cameras or printersfacing each other. In addition, this function makes itpossible for the user to transfer, communicate or printsuitable image data regardless of the difference inplatform or model just by "selecting a photograph tobe sent and pushing a transmission button".As mentioned earlier, UPF is the standard of animage format not included in the category of the IrDAstandard. The IrDA standards were originally pro-vided for defining and standardizing a protocol in con-nection with infrared communications. Therefore, it isout of the scope to define the contents of an imagetransfer. However, in order to ensure mutual connec-tivity as an application of a digital camera, it isrequired to decide an image format so that image datasent via infrared communication is reliably repro-duced. Therefore, in advocating IrTran-P as a stan-dard to IrDA, the specific contents of an image formatof IrTran-P are defined and described in an appendix.UPF is an image file format based on the JPEG baseline. JFIF, which is a JPEG file, makes an image ofvarious color forms available and employs a high levelof compression scheme. For this reason, JFIF may beregarded as the industry standard of an image file for-mat today. Since JPEG is a format enabling a varietyof color forms, a compromise is required to someextent in order to realize the standard at a low cost, forexample adopting only a part of the format as thestandard. In UPF, among the formats included in the

base line of JPEG, the format which allows thedevices at least to reliably display and mutually trans-fer an image is defined as an indispensable one, andothers are regarded as an option. For more details,please refer to the sections of UPF in the later part ofthis document.It is characteristic of a digital camera that all the dataaccompanying a photograph taken by a digital cam-era, such as a photo-taking date/time and the orienta-tion (direction) of an image and other additional data,cannot be covered by the data within the JPEG for-mat. In view of such a background, UPF is designed

so that data is separated and stored on its ownheader arranged in the file without changing theimage data scheme of JPEG Base Line at all. In addi-tion, the header has expendability and allows a ven-dor-unique function to be added thereto. This makesit possible to separate the data necessary for a digitalvideo camera from the data necessary for display andexpansion of an image. This is advantageous in thatthe existing JPEG techniques can be used wherethey stand and do not have to be changed. In a com-pact device like a digital camera, when using existing

hardware or software, e.g. in the case where an algo-rithm of JPEG compression/expansion or the like isperformed by hardware or is fixedly used as firmware, it is undesirable to change JPEG itself.As a further advanced step, UPF is designed so that

additional data on an ambiguous point within the dataof JPEG scheme is arranged in the header part. Theadditional data includes factors such as white level,black level and color-difference signal, necessary forreproducing an image with correct brightness andcolor.Although the format of a digital camera is being exam-ined by various organizations, a conclusive decisionhas not yet been made. In most cases, an arrange-ment such as a new addition of a tag to JPEG or thelike has been proposed. However, it will take a longtime to reach a conclusion satisfactory to all the com-panies concerned. The approach of making the bestuse of an existing standard, wherein the data neces-sary for a digital camera is separated and added so asto assure expendability, is more realistic than theapproach of waiting for a new standard to be definedand finalized.Though UPF is defined as an appendix, it is indis-pensable in order that the IrTran-P standard is able tosupport an image format of a UPF scheme. In IrTran-P, a sender starts an operation which transfers pic-ture data from a digital camera. Operation by User

With the use of "selection of a specific picture" anda "transmission button" the user puts the digitalcamera of the sender into a transmission state.It is assumed that the device of a receiver isalways in a receiving state or put info a picturedata receiving state by a "reception button".

Establishment of Session by SCEPThe digital camera of the sender carries out a dis-covery procedure using IrDA protocols and per-forms a connection for the physical to IrCOMMlayers of IrDA protocols in accordance with IrDAprotocols. When an IrDA transmission path isestablished, SCEP makes a "session establish-ment request" from the sender to the receiver of adigital camera, printer or PC. If the receiver isimplemented with SCEP, it must make a responseof either "session established" or "session estab-lishment rejected".

Query Operation by bFTP (Query function)When a session by SCEP is established, the digi-tal camera of the sender issues a Query request inorder to recognize the picture processing func-tions of the receiver. The information mutually





exchanged by the Query request includes thetransmittable / receivable picture size, the picturecompression format and the basic picture size ofthe device. Since this information is exchangedbefore transfer of picture data, the picture data canbe transferred in "the most reasonable format"between devices of different platforms.In IrTran-P, a "mandatory format" is definedamong the picture data formats of both sides,whereby a picture can be reliably exchangedbetween devices of different grades or manufac-turers.Furthermore, the power supply condition of thedevice, the receivable data capacity etc. should bequeried. This makes it possible to deal with theapplications of a portable system.

Transfer of Picture Data by bFTPTransfer of picture data is started once the mostappropriate picture format for both the sender andthe receiver has been determined by Query.SCEP performs the data transfer at a high trans-mission rate by making use of IrDA protocols. Afterthe file transfer is completed, next picture datamay be subsequently transmitted, or a sessionmay be disconnected by SCEP. (Accordingly,even a simple model can transmit more than onepicture in succession.)

Completion of Session by SCEPWhen the picture transfer has been completed, thedigital camera of the sender disconnects a session

by SCEP. Thereafter, a disconnection request isissued for IrCOMM and lower layers of IrDA proto-cols and the picture transfer operation has beencompleted.

IR Mobile Communication Standard(IrMC)The IrDA IrMC specification defines the rules for utili-zation of IR in wireless communications equipment,e.g., in mobile handsets, PDAs, PCs, notebook com-puters and pagers.The IrMC specification enables IrMC Objectexchange between a variety of applications. Forinstance, the IrMC specification enables easyexchange of: business cards between Phone Book Applications text messages between Messaging Applications calendar and todo items between Calendar Appli-

cations short notes between Note applications

The IrMC Call Control specification enables call con-trol of mobile handsets. The IrMC Audio Specificationenables real time audio transmission respectively.These two specifications are for communicationbetween a handset and PC or a handset and car cra-dle.

Data TransmissionThe IrMC framework uses the existing IrDA specifica-tions as much as possible. IrDA connection-orientedservices are used as is, and the connectionless ser-vice (Ultra) is further defined to be applicable to IrMCdevices.

Physical Layer ConsiderationsBecause the power consumption requirements of theIrMC devices are very critical, a low power option forthese devices has been specified already in theIrPHY version 1.2. This specification defines a lighterphysical layer and allows up to ten times savings inthe LED drive current. It should be noted that thisspecification, which only expects the Specificationsfor IR Mobile Communications (IrMC) Version 1.1IrMC devices to be capable of 20 cm link distancefrom IrMC device to IrMC device and 30 cm from IrMCdevice to a standard IrDA device, is optional and theoriginal IrDA-SIR values may be used in all IrMCdevice implementations. Despite the shorter commu-nication range of some IrMC devices, all devices mustclearly be compatible with the IrDA-SIR in the shortrange.

Devices supporting IrCOMM communications withpersonal computers should realize that the RF inter-ference shielding of PCs may be imperfect.For Mobile Communication applications standardtransceivers, fulfilling the IrDA physical layer specifi-cation can be applied. However, especially in mobilephone application the demand for a high EMI immu-nity must be considered. Vishay Semiconductors sup-plies devices suited for these applications.


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IR Financial Messaging (IrFM)The IrFM profiles have been developed to enable adigital payment system which will cut transactioncosts for the merchant and the financial institutions,cut charge-back fees to merchants through the elec-

tronic warehousing of transaction receipts, and pro-vide a simpler method of financial transaction trackingto individuals for personal and business use. In sim-ple words: IR enabled devices as mobile phones orPDAs will include the credit card information and thetransaction will be done over the air by Infrared beam-ing.IrFM provides a quick and seamless way for users ofinfrared enabled portable devices, such as PDAs andmobile phones, to pay for services and merchandiseby beaming their "soft" credit cards, debit cards,checks, cash, or other financial instruments to a pointof sale device (POS), ATM, vending machine or othercompatible payment terminal. The IrFM Profilesdefine the minimum technical requirements needed toimplement the use cases described. Potential devicesimplementing these Profiles include pagers, PDAsand mobile phones communicating with POS termi-nals, vending machines, ATMs and other existingPOS devices enabled with infrared adapters, or newdevices with IrDA capability built in.IrFM is compatible with the Ir Physical Layer standardand any physical layer compliant hardware trans-ceiver will support IrFM.Early adopters of this new financial messaging sce-nario will include the many millions of users of IrDAenabled PDA's and mobile phones; paying for mealsat restaurants and fast food outlets, buying gas at thepump, making purchases at all types of stores, goingto the movies, using public transportation systemsand a host of other applications made possible by theelectronic wallet concept.The manual card swipe/card reader interactionbetween the consumer's physical card and the pointof sale terminal is replaced by the consumers hand-held device and an IR-enabled point of sale terminal.After the transaction has been "beamed", the back-end processing of the transaction is treated as if theprocess had occurred by card swipe. No backendprocessing changes are required.

IrSimple TM - Simple Connect StandardIrSimple (Acronym: IrSC), is one of the latest addi-tions to the upper layer protocols, it does not replacebut enhances most of the other application based pro-tocols by providing a more efficient mechanism to

transfer specific object data formats such as graphicfiles that are typically associated with small portabledevices maintaining the lowest usage of memory.Frequent scenarios are the transmission of picturesbetween mobile phones as well as from mobiles to TVsets. This protocol also relies on the binding Accessand Management protocols.Because it must maintain a degree of integrity withother applications protocol that would also allow it tohandle standard bidirectional transmission of smalldata files, it makes use of a sequence manager pro-tocol IrSMC for the segmentation and reassembly offrames (flow control), primarily between the applica-tion protocols and the link management protocolIrLMP. Unlike with other robust and complex datatransfer protocols, IrSC is specifically aimed at visual(graphical data transfers). It is not mandatory for thereceiving station to maintain a bidirectional linkbecause successful transmission of data is visuallyackknowledged.The Infrared Data Association (IrDA) announced theavailability of the IrSimple Protocol and Profile Speci-fications under the brand name SimpleShot TM. Sim-ple Shot enables mobile devices like Camera Phonesto wireless transmit digital images to similarly enabledTelevisions, Monitors, Projectors and Photo Kiosks.SimpleShot frees the billions of digital images trappedin Camera Phones and PDAs, allowing them to beviewed on large screens or quickly printed. The IrDASpecial Interesting Group (SIG) developed and per-fected SimpleShot for fast, wireless communicationbetween mobile devices and digital home appliances.





AppendixList of Terms and Abbreviations:

IrDA Infrared Data AssociationIrLAP IrDA Link Access ProtocolIrLMP IrDALink Management Protocol

IrPHY IrDA Physical LayerIrTRAN-P IrDA Transfer PictureIrCOMM IrDA "Serial & Parallel Port Emulation over Ir"IrOBEX IrDA Object Exchange ProtocolTiny TP a Flow control mechanism for use with IrLMPLM-MUX IrLMP MultiplexerLM-IAS IrLMP Information Access ServiceSCEP Simple Command Execute ProtocolBFTP binary File Transfer ProtocolUPF Uni Picture FormatSIR Serial InfraredFIR Fast InfraredIrMC IrDA Mobile CommunicationIrFM IrDA Financial MessagingIrSC IrSimple (TM), SimpleShot (TM)


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Symbols and Terminology

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Symbols and TerminologyA anode

Anode terminalA ampere

SI unit of electrical currentA radiant sensitive areaThat area which is radiant sensitive for a speci-fied range

a distanceE.g. a distance between the emitter (source)and the detector

B baseBase terminal

BER Bit Error Ratebit/s data rate or signaling rate

1000 bit/s = 1 kbit/s, 10 6 bit/s = 1 Mbit/sC capacitance

Unit: F (farad) = C/VC coulomb

C = A sC cathode , cathode terminalC collector , collector terminalC degree Celsius

Celsius temperature, symbol t , and is definedby the quantity equation t = T - T 0.The unit of Celsius temperature is the degreeCelsius, symbol C. The numerical value of a

Celsius temperature t expressed in degreesCelsius is given by t / C = T / K 273.15It follows from the definition of t that the degreeCelsius is equal in magnitude to the kelvin,which in turn implies that the numerical value ofa given temperature difference or temperatureinterval whose value is expressed in the unitdegree Celsius (C) is equal to the numericalvalue of the same difference or interval whenits value is expressed in the unit kelvin (K)

cd candelaSI unit of luminous intensity. The candela is theluminous intensity, in a given direction, of asource that emits monochromatic radiation offrequency 540 x 1012 hertz and that has a radi-ant intensity in that direction of1/683 watt per steradian. (16 th General Confer-ence of Weights and Measures, 1979)1 cd = 1 lm sr -1

C D diode capacitanceTotal capacitance effective between the diodeterminals due to case, junction and parasiticcapacitances

C j junction capacitanceCapacitance due to a pn junction of a diode,decreases with increasing reverse voltage

d apparent (or virtual) source size(of an emitter)The measured diameter of an optical sourceused to calculate the eye safety laser class ofthe source. See IEC60825-1 andEN ISO 11146-1

E emitterEmitter terminal (phototransistor)

E A illumination at standard illuminant AAccording to DIN 5033 and IEC 306-1, illumi-nation emitted from a tungsten filament lampwith a color temperature T f = 2855.6 K, which

is equivalent to standard illuminant AUnit: lx (Lux) or klxE A amb ambient illumination at standard illuminant Aecho - off

Unprecise term to describe the behavior of theoutput of IrDA transceivers during transmis-sion. "echo off" means that by blocking thereceiver the output Rxd is quiet during trans-mission

echo - onUnprecise term to describe the behavior of theoutput of IrDA transceivers during transmis-

sion. "echo on" means that the receiver out-put Rxd is active but often undefined duringtransmission. For correct data reception aftertransmission the receiver channel must becleared during the latency period

E e , E irradiance (at a point of a surface)Quotient of the radiant flux d e incident on anelement of the surface containing the point, bythe area d A of that element. Equivalent defini-tion. Integral, taken over the hemisphere visiblefrom the given point, of the expressionLe cos d , where Le is the radiance at the

given point in the various directions of the inci-dent elementary beams of solid angle d , and is the angle between any of these beams andthe normal to the surface at the given point

Unit: W m -2

E v, E illuminance (at a point of a surface)Quotient of the luminous flux d v incident on

E ed ed A

--------- Le cos d 2 sr

= =




Symbols and TerminologyVishay Semiconductors

an element of the surface containing the point,by the area d A of that element.Equivalent defnition. Integral, taken over thehemisphere visible from the given point, of theexpression Lv cos d , where Lv is the lumi-nance at the given point in the various direc-tions of the incident elementary beams of solidangle d , and is the angle between any ofthese beams and the normal to the surface atthe given point

Unit: lx = lm m -2

F faradUnit: F = C/V

f frequencyUnit: s -1 , Hz (Hertz)

f c, f cd cut-off frequency detector devicesThe frequency at which, for constant signalmodulation depth of the input radiant power,the demodulated signal power has decreasedto of its low frequency value. Example: Theincident radiation generates a photocurrent ora photo voltage 0.707 times the value of radia-tion at f = 1 kHz(3 dB signal drop, other references may occuras e.g. 6 dB or 10 dB)

f s

switching frequencyFIR Fast Infrared , as SIR, data rate 4 Mbit/sI a light current

General: Current which flows through a devicedue to irradiation/illumination

I B base currentI BM base peak currentI C collector currentI ca collector light current

Collector current under irradiationCollector current which flows at a specified illu-mination/irradiation

I CEO collector dark current, with open baseCollector-emitter dark currentFor radiant sensitive devices with open baseand without illumination/radiation(E = 0)

I CM repetitive peak collector currentidle Mode of operation where the device (e.g. a

transceiver) is fully operational and expectingto receive a signal for operation e.g in case ofa transceiver waiting to receive an optical input

or to send an optical output as response to anapplied electrical signal

I e , I radiant intensity (of a source, in a givendirection)Quotient of the radiant flux d e leaving the

source and propagated in the element of solidangle d containing the given direction, by theelement of solid angleI e = d e /d Unit: W sr -1

Note: The radiant intensity I e of emitters is typ-ically measured with an angle < 0.01 sr onmechanical axis or off-axis in the maximum ofthe irradiation pattern

I F continuous forward currentThe current flowing through a diode in the for-ward direction

I FAV

average (mean) forward currentI FM peak forward currentI FSM surge forward currentI k short-circuit current

That value of the current which flows when aphotovoltaic cell or a photodiode is short cir-cuited ( R L


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Symbols and Terminology



www.vishay.com33

IrPHY version 1.0SIR IrDA data communication specificationcovering data rates from 2.4 kbit/s to115.2 kbit/s and a guaranteed operating rangemore than one meter in a cone of 15

IrPHY version 1.1MIR and FIR were implemented in the IrDA

standard with the version 1.1, replacing version1.0

IrPHY version 1.2Added the SIR Low Power Standard to theIrDA standard, replacing version 1.1.The SIR Low Power Standard describes a cur-rent saving implementation with reduced range(min. 20 cm to other Low Power Devices andmin. 30 cm to full range devices).

IrPHY version 1.3extended the Low Power Option to the higherbit rates of MIR and FIR replacing version 1.2.

IrPHY version 1.4VFIR was added, replacing version 1.3

I SB quiescent currentI SD supply current in dark ambientI SH supply current in bright ambientI v, I luminous intensity (of a source, in a given

direction)Quotient of the luminous flux d v leaving thesource and propagated in the element of solidangle d containing the given direction, by the

element of solid angleI e = d v /dUnit: cd sr -1

Note: The luminous intensity I v of emitters istypically measured with an angle < 0.01 sr onmechanical axis or off-axis in the maximum ofthe irradiation pattern

K luminous efficacy of radiationQuotient of the luminous flux v by the corre-sponding radiant flux e :K = v / eUnit: lm W -1

Note: When applied to monochromatic radia-tions, the maximum value of K ( ) is denoted bythe symbol K mK m = 683 lm W

-1 for m = 540 1012 Hz

( m 555 nm) for photopic vision.K' m = 1700 lm W

-1 for 'm 507 nm forscotopic vision. For other wavelengths:K ( ) = K m V ( ) and K' ( ) = K' m V' ( )

K kelvinSI unit of thermodynamic temperature, is thefraction 1/273.15 of the thermodynamic tem-

perature of the triple point of water (13th CGPM(1967), Resolution 4). The unit kelvin and itssymbol K should be used to express an intervalor a difference of temperature.Note: In addition to the thermodynamic temper-ature (symbol T ), expressed in kelvins, use isalso made of Celsius temperature (symbol t )defined by the equation t = T -T 0, whereT 0 = 273.15 K by definition. To express Celsiustemperature, the unit "degree Celsius", whichis equal to the unit "kelvin" is used; in this case,"degree Celsius" is a special name used inplace of "kelvin". An interval or difference ofCelsius temperature can, however, beexpressed in kelvins as well as in degrees Cel-sius

Latencyreceiver latency allowance (in ms or s) isthe maximum time after a node ceases trans-mitting before the nodes receiving recovers itsspecified sensitivity

LED and IREDLight Emitting DiodeLED: Solid state device embodying a p-n junc-tion, emitting optical radiation when excited byan electric current. The term LED is correctonly for visible radiation, because light isdefined as visible radiation (see Radiation andLight). For infrared emitting diodes the termIRED is the correct term. Nevertheless it is

common but not correct to use "LED" also forIREDs

Le ; L radiance (in a given direction, at a given pointof a real or imaginary surface)Quantity defined by the formula

,

where d e is the radiant flux transmitted by anelementary beam passing through the givenpoint and propagating in the solid angle d containing the given direction; d A is the area of

a section of that beam containing the givenpoint; is the angle between the normal to thatsection and the direction of the beamUnit: W m -2 sr -1

lm lumenUnit for luminous flux

lx luxUnit for illuminance

m meterSI unit of length

Led v

d A cos d ---------------------------------=



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Modelo de Diagrama PCB Infrared

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