Mitsubishi J1- Series 650V High-Power Modules for Automotive · White/blue LED • Packaging: 3D...

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The power module device market will post a 10.2% compound annual growth rate (CAGR) over the next five years. This will impact the power module packaging market, which will see a 9.5% CAGR and reach a value of almost $1.8B. Power modules have come a long way since the early stages of car electrification, and now play a key role in power modulation through all EV/HEVs, from inverters to bi-directional converters. Packaging these modules has become critical due to several technical aspects: moulding, high-temperature die attach, TIM, and connections. Power modules must combine good thermal and electrical efficiency, while maintaining a low mass and volume. Also, to remain competitive in an open market, power module makers must deliver high reliability while remaining cost-efficient. With its new J1-series, Mitsubishi proposes a power module family with voltages in the range of 650V - 1200V, and with a new direct cooling system for automotive applications. Mitsubishi’s modules are extra compact, with direct -cooling substrate 6-in-1 package and pin fin. The modules also integrate the latest Mitsubishi IGBT with Gen7 CSTBT techno- -logy and the latest RFC diodes. System Plus Consulting presents a technology and cost analysis of two J1- series power modules with 650V and 600A/1000A, respectively: the CT600CJ1A060 and the CT1000CJ1B060. This report also provides insights into these modules’ structure, technical choices, design, processes, supply chain position, and cost. Also included in this report is an analysis of the packaging, IGBT, and diode die, along with a cost analysis for all devices. Moreover, we supply a full comparison between the latest generations of Mitsubishi IGBT and diode. Lastly, we compare this module with the technical choices found in Infineon’s HybridPACK drive and Tesla’s SiC Power module molded with ST SiC MOSFET. COMPLETE TEARDOWN WITH Detailed photos Precise measurements Materials analysis Manufacturing process flow Supply chain evaluation Manufacturing cost analysis Estimated sales price Comparison with Infineon’s HybridPACK Drive and Tesla’s SiC Module The first power module with 7 th -gen CSTBT IGBT and an innovative integrated substrate. REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT Title: Mitsubishi J1- Series 650V High- Power Modules for Automotive Pages: 185 Date: October 2018 Format: PDF & Excel file Price: EUR 4,990 Mitsubishi J1- Series 650V High-Power Modules for Automotive IC – LED – RF – MEMS – IMAGING PACKAGING – SYSTEM – POWER - DISPLAY

Transcript of Mitsubishi J1- Series 650V High-Power Modules for Automotive · White/blue LED • Packaging: 3D...

Page 1: Mitsubishi J1- Series 650V High-Power Modules for Automotive · White/blue LED • Packaging: 3D Packaging - Embedded - SIP - WLP • Integrated Circuits: IPD – Memories –PMIC

The power module device market will

post a 10.2% compound annual growth

rate (CAGR) over the next five years. This

will impact the power module packaging

market, which will see a 9.5% CAGR and

reach a value of almost $1.8B.

Power modules have come a long way

since the early stages of car

electrification, and now play a key role in

power modulation through all EV/HEVs,

from inverters to bi-directional

converters. Packaging these modules has

become critical due to several technical

aspects: moulding, high-temperature die

attach, TIM, and connections.

Power modules must combine good

thermal and electrical efficiency, while

maintaining a low mass and volume. Also,

to remain competitive in an open market,

power module makers must deliver high

reliability while remaining cost-efficient.

With its new J1-series, Mitsubishi

proposes a power module family with

voltages in the range of 650V - 1200V,

and with a new direct cooling system for

automotive applications. Mitsubishi’s

modules are extra compact, with direct-cooling substrate 6-in-1 package and pinfin. The modules also integrate the latest Mitsubishi IGBT with Gen7 CSTBT techno--logy and the latest RFC diodes.

System Plus Consulting presents a

technology and cost analysis of two J1-

series power modules with 650V and

600A/1000A, respectively: the

CT600CJ1A060 and the CT1000CJ1B060.

This report also provides insights into

these modules’ structure, technical

choices, design, processes, supply chain

position, and cost.

Also included in this report is an analysis

of the packaging, IGBT, and diode die,

along with a cost analysis for all devices.

Moreover, we supply a full comparison

between the latest generations of

Mitsubishi IGBT and diode. Lastly, we

compare this module with the technical

choices found in Infineon’s HybridPACK

drive and Tesla’s SiC Power module

molded with ST SiC MOSFET.

COMPLETE TEARDOWN WITH

• Detailed photos

• Precise measurements

• Materials analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated sales price

• Comparison with Infineon’s HybridPACK Drive and Tesla’s SiC Module

The first power module with 7th-gen CSTBT IGBT and an innovativeintegrated substrate.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Title: Mitsubishi J1-Series 650V High-Power Modules for Automotive

Pages: 185

Date: October 2018

Format: PDF & Excel file

Price: EUR 4,990

Mitsubishi J1- Series 650V High-Power Modules for Automotive

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY

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TABLE OF CONTENTS

Overview/Introduction

• Executive Summary

• Reverse Costing Methodology

Company Profile

• Mitsubishi

• Product Portofolio

Physical Analysis

• Synthesis of the Physical Analysis

• CT600CJ1A060 & CT1000CJ1B060

Package analysis

o Package opening

o Package cross-section

IGBT die

o IGBT die view and dimensions

o IGBT die process

o IGBT die cross-section

o 6th-Gen vs. 7th-Gen CSTBT

Diode die

o Diode die view and dimensions

o Diode die process

o Diode die cross-section

o Standard vs. RFC diode

Manufacturing Process

• IGBT Front-End Process and Fabrication Unit

• Diode Die Front-End Process and Fabrication Unit

• Final Test and Packaging Fabrication Unit

AUTHORS

Cost Analysis

• Synthesis of the Cost Analysis

• Yields Explanation & Hypotheses

• CT600CJ1A060 & CT1000CJ1B060

IGBT die

o IGBT front-end cost

o IGBT die probe test, thinning and dicing

o IGBT wafer cost

o IGBT die cost

Diode die

o Diode front-end cost

o Diode die probe test, thinning and dicing

o Diode wafer cost

o Diode die cost

Complete Module

o Packaging cost

o Final test cost

o Component cost

Price Analysis

• Estimated Sales Price

Comparison

• Comparison with Infineon’s HybridpackDrive and Tesla’s SiC module

MITSUBISHI J1- SERIES 650V HIGH-POWER MODULES FOR AUTOMOTIVE

RELATED REPORTS

Tesla Model 3 Inverter with SiCPower Module from STMicroelectronicsThe first SiC power module in commercialized electric vehicles.June 2017 - EUR 3,490*

1200V Silicon IGBT vs SiCMOSFET Comparison 2018Technology and cost analysis of thirteen silicon IGBTs and eight SiC MOSFETs from eight different manufacturers shows their potential.September 2018 - EUR 4,990*

Infineon FS820R08A6P2B HybridPACK Drive IGBT ModuleThe newest HybridPACK Drive power module from Infineon with EDT2 IGBT technology.June 2017 - EUR 3,490*

Elena holds a Master in Nano-technologies and aPhD in Power Electronics.

Elena Barbarini is in charge ofcosting analyses for MEMS, ICand Power Semiconductors.She has a deep knowledge ofElectronics R&D and Manu-facturing environment.

Véronique Le Troadec hasjoined System Plus Consultingas a laboratory engineer.Coming from Atmel Nantes,she has extensive knowledge infailure analysis of components

and in deprocessing of integrated circuits.

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COSTING TOOLS

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Process-BasedCosting Tools

ParametricCosting Tools

WHAT IS A REVERSE COSTING®?

Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.

IC Price+

MEMS CoSim+

MEMS Price+

Power CoSim+

Power Price+

LED CoSim+

3D PackageCoSim+

DisplayPrice+

PCBPrice+

SYSCost+

CONTACTS

Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 [email protected]

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Mavis WANGGreater China+886 979 336 [email protected]

ABOUT SYSTEM PLUS CONSULTING

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Power Price+Parametric costing tool used to evaluate themanufacturing cost of devices using few processrelated inputs.

Our analysis is performed with our costing tools Power CoSim+ and Power Price+.

System Plus Consulting offers powerful costing tools to evaluate any Power Electronics process or device,

the production cost and selling price. All these tools are on sale under corporate license.

Power CoSim+Cost simulation tool to evaluate the cost of anyPower Electronics process or device: from singlechip to complex structures.

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ORDER FORMPlease process my order for “Mitsubishi J1- Series 650V High-Power Modules for Automotive” Reverse Costing® – Structure, Process & Cost Report Ref: SP18408

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REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTMITSUBISHI J1- SERIES 650V HIGH-POWER MODULES FOR AUTOMOTIVE

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Page 5: Mitsubishi J1- Series 650V High-Power Modules for Automotive · White/blue LED • Packaging: 3D Packaging - Embedded - SIP - WLP • Integrated Circuits: IPD – Memories –PMIC

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