MicroTCA Power Module - Boston...

MicroTCA Power Module

User’s Guide 92-000025-000

Preliminary Release Rev .52

CorEdge Networks Power Module User’s Guide

Power Module Users Guide Rev .52 10-04-2006 Last Changed: 10/4/2006 2:32:00 PM

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Copyright © 2003-2006, CorEdge Networks.

All rights reserved.

CorEdge Networks, 50 Commonwealth Ave. Suite 504, Boston, MA 02116 USA

THIS DOCUMENT IS PROVIDED IN CONNECTION WITH A PRODUCT OR PRODUCTS FURNISHED UNDER LICENSE BY COREDGE NETWORKS. THIS DOCUMENT AND THE INFORMATION IN THIS DOCUMENT MAY ONLY BE USED IN ACCORDANCE WITH THE TERMS AND CONDITIONS OF THE LICENSE. EXCEPT AS PERMITTED BY SUCH LICENSE, NO PART OF THIS DOCUMENT MAY BE REPRODUCED, STORED IN A RETRIEVAL SYSTEM, PHOTOCOPIED OR TRANSMITTED, IN ANY FORM OR BY ANY MEANS, ELECTRONIC, MECHANICAL, RECORDING, OR OTHERWISE, WITHOUT THE PRIOR WRITTEN PERMISSION OF COREDGE NETWORKS.

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CorEdge Networks and the CorEdge logo are trademarks of CorEdge Networks.



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Revision History

REVISION DATE DESCRIPTION ENGINEER

.41 8/30/2006 Initial Draft

.50 9/01/2006 Preliminary Release

.51 9/01/2006 Modified Voltage Threshold table value

.52 10/04/2006 Fixed Fig 3



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Table of Contents

Introduction.............................................................................................................................. 6 1.1 CorEdge Company Information ....................................................................................................................... 6 1.2 Contact Information.......................................................................................................................................... 6 1.3 References....................................................................................................................................................... 7

2 Overview of MicroTCA ......................................................................................................... 8 2.1 MicroTCA Platform........................................................................................................................................... 8

2.1.1 Backplane and Chassis ...............................................................................................................................................9 2.1.2 AMC ............................................................................................................................................................................9 2.1.3 Power Modules..........................................................................................................................................................10 2.1.4 Cooling Units .............................................................................................................................................................10 2.1.5 MCH ..........................................................................................................................................................................10

3 CorEdge Power Module Feature Summary ...................................................................... 10

4 CorEdge Power Module Overview .................................................................................... 11 4.1 Power Module Functional Description ........................................................................................................... 11 4.2 Power Module Connectors............................................................................................................................. 13 4.3 LED Indicators ............................................................................................................................................... 13

4.3.1 Blue LED ...................................................................................................................................................................13 4.4 Power Module JTAG...................................................................................................................................... 14

5 Installation........................................................................................................................... 14 5.1 Installation Instructions .................................................................................................................................. 14 5.2 Installation Sequence..................................................................................................................................... 14 5.3 Removal Sequence........................................................................................................................................ 15

6 Carrier IPM Controller (IPMC) ............................................................................................ 15 6.1 Enhanced Carrier IPM-C functions ................................................................................................................ 15 6.2 Power Channel Control.................................................................................................................................. 16 6.3 Watchdog Timer............................................................................................................................................. 17 6.4 Local Sensors ................................................................................................................................................ 17

6.4.1 Input Supply Voltages ...............................................................................................................................................17 6.4.2 Internal Supply Voltages............................................................................................................................................18 6.4.3 Hot Swap Micro Switch..............................................................................................................................................18 6.4.4 Temperature Sensors................................................................................................................................................18

7 Specifications ..................................................................................................................... 19 7.1 Hardware Specification .................................................................................................................................. 19 7.2 Operating and Storage Environment Specifications...................................................................................... 19

8 Power Module Output Connector Assignments .............................................................. 20 List of Figures

Figure 1 – MicroTCA High Level Overview ............................................................................................................... 8 Figure 2 – MicroTCA Management Infrastructure ..................................................................................................... 9 Figure 3 - Power Module Side View ........................................................................................................................ 10 Figure 4 - Power Module Block Diagram................................................................................................................. 12 Figure 5 - Power Module Front Panel...................................................................................................................... 13 Figure 6 – Blue LED sequence................................................................................................................................ 14



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List of Tables

Table 1 – LED Definitions........................................................................................................................................ 13 Table 2 – Hardware Specifications.......................................................................................................................... 19 Table 3 – Operating and Storage Specifications..................................................................................................... 20 Table 4 – Power Module Output Connector Pinouts ............................................................................................... 22



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Introduction This user’s guide describes the installation and use of CorEdge Networks’ Power Module in MicroTCA Systems. The Power Module is an intelligent Field Replaceable Unit that controls the power entry, conversion, monitoring, and distribution of power within MicroTCA/AMC Systems.

1.1 CorEdge Company Information CorEdge Networks, headquartered in Boston, MA, with offices in Fremont, CA, River Edge, NJ and Minneapolis, MN, is a developer of intellectual property and products focused on next-generation networking applications for telecommunications, data center, and high-performance computing markets.

1.2 Contact Information This section provides contact information for sales, technical support and consulting services.

Sales: [email protected]

Technical Support: [email protected]

Product Information: [email protected]

This product has been developed and is fully supported by CorEdge Networks, Inc. Contact Technical Support for help and information. See your maintenance agreement for details on your level of technical support. Please include the following information: • Caller’s name, phone number, and e-mail address • Customer (i.e., Company) Name • Specific product component for which support is requested (e.g., schematics) The customer’s cooperation with providing this information will assist CorEdge support staff in routing the support request or comments to the appropriate individual and will allow CorEdge to track the discussion and provide timely follow-up as needed.

1.3 Acronyms, Definitions Acronyms and definitions used in this document are listed below.

AMC Advanced Mezzanine Card

ATCA Advanced Telecom Computing Architecture

EMMC Enhanced Module Management Controller

JTAG Joint Test Action Group

IPMC Intelligent Platform Management Controller

IPMB Intelligent Platform Management Bus

MCH MicroTCA Carrier Hub

MCMC MicroTCA Carrier Management Controller

MMC Module Management Controller

NEBS Network Equipment Building Systems (Telecordia)

PM Power Module



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RoHS Restriction of Hazardous Substances

SDR Sensor Data Records

VDC Volts, Direct Current

1.4 References

[1] PICMG® 3.0 R2.0 AdvancedTCA Base Specification, as amended by ECN 3.0-2.0-001 and ECN 3.0-2.0-002

[2] PICMG® MicroTCA RC1.0 Micro Telecommunications Computing Architecture Base Specification

[3] PICMG® AMC.0 R1.0 Advanced Mezzanine Card Base Specification

[4] ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, January 1, 2001

[5] ANSI/TIA/EIA-899-2002: Electrical Characteristics of Multipoint-Low- Voltage Differential Signaling (M-LVDS) Interface Circuits for Multipoint Data Storage, March 1, 2002

[6] IPMI – Intelligent Platform Management Bus Communications Protocol Specification V1.0 Document Revision 1.0, November 15, 1999 Copyright © 1998, 1999 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved.

[7] IPMI – Intelligent Platform Management Interface Specification, v1.5. Document Revision 1.1, February 20, 2002. Copyright © 2004 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved.

[8] IPMI – Intelligent Platform Management Interface Specification Second Generation, v2.0. Document Revision 1.0, February 12, 2004. Copyright © 1999,2000, 2001, 2002 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved.

[9] IPMI – Platform Event Trap Format Specification V1.0 Document Revision 1.0, December 7, 1998 Copyright © 1998, Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved.

[10] IPMI – Platform Management FRU Information Storage Definition, V1.0 Document Revision 1.1, September 27, 1999 Copyright © 1998, 1999 Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation. All rights reserved.

[11] IPMI – Wired for Management Baseline, Version 2.0.

[12] CorEdge Global Specification 12G02897W18 – Controlled and Reportable Material Disclosure

[13] CorEdge Printed Circuit Board Design for Manufacturability Guidelines DOI-4.1.7.6

[14] ECCG - In Circuit Test (ICT) Design for Test (DFT) Guidelines Revision A, Draft dated 01-31-2005

[15] MCG Design for Boundary Scan Test Guideline Rev 1.0 dated February 05, 2004

[16] Telcordia GR-1089-CORE, Electromagnetic Compatibility and Electrical Safety Generic Criteria for Network Telecommunication Equipment

[17] Telcordia GR-63-CORE NEBS Requirements: Physical Protection

[18] IEC 60950-1 Information Technology Equipment-Safety, Second Edition 2005-12, IEC (International Electrotechnical Commission)

[19] 32002L0095 Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment, Official Journal L 037, 13/02/2003 P. 0019 – 0023



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2 Overview of MicroTCA MicroTCA is an industry open-standard that is currently under development through the PCI Industrial Computer Manufacturer’s Group (PICMG). The standard is aimed at defining a platform infrastructure for Advanced Mezzanine Card (AMC) modules for use in Telecom and other embedded markets. MicroTCA platforms provide smaller form-factor and lower-entry cost options over existing platform solutions.

Figure 1 – MicroTCA High Level Overview

2.1 MicroTCA Platform Figure-1 shows a block diagram of the MicroTCA platform with interconnection between MCHs, Power Modules, Cooling Units (CUs) and AMCs. The overview of MicroTCA management infrastructure is shown in Figure-2 below. For MicroTCA platform, each of these functional blocks is briefly described in the following sections.



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Figure 2 – MicroTCA Management Infrastructure

2.1.1 Backplane and Chassis The backplane and chassis provide the physical and mechanical infrastructure to support the other MicroTCA platform elements.

2.1.2 AMC The AMC modules provide application-specific processing and I/O capability to the MicroTCA platform. Modules plug into the MicroTCA system backplane and receive power and cooling from the MicroTCA platform.

Interconnect between modules is provided by the system fabric interface (shown in green of Figure-1). PICMG standards currently define PCI-Express, Advanced Switching, Ethernet, Serial Rapid I/O, and SATA fabrics for AMCs. PICMG standards also define clocking, power, and management requirements for these modules.



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2.1.3 Power Modules One or more power modules supply power to each of the elements within the MicroTCA platform. The power distribution topology is radial – separate power rails are routed to each AMC, MCH, and Cooling Unit. In addition, each MicroTCA element receives both management power (3.3V for IPMI support), and “Payload Power” (12V to be regulated for non-IPMI circuitry).

The power modules and the MCH work together to manage the power supplied to each AMC module. The power supply modules provide IPMI interfaces (IPMB-0) to communicate with the MCH module(s).

2.1.4 Cooling Units One or more cooling units provide cooling capability to the MicroTCA platform. Power is supplied to the Cooling Units from the system Power Modules. Fans are controlled and managed over an IPMB interface (IPMB-0) by the MCH(s).

2.1.5 MCH The MCH provides management and control of shelf level resources (Cooling Units, Cooling Unit power, clocking, JTAG test), and module level resources (AMC modules, AMC module power). The MCH interfaces with the Cooling Units and Power Modules through a dedicated IPMB bus (IPMB-0). Another IPMB bus (IPMB-L) connects the MCHs and the AMC modules.

MCH modules may operate in redundant (active-standby), or non-redundant configurations. In redundant configurations, MCH modules provide a dual-star network platform-level network with the ability to seamlessly fail-over MCH functionality without loss of service.

3 CorEdge Power Module Feature Summary Figure 3 shows a side view of the Power Module

Figure 3 - Power Module Side View



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The -48V Power Module key features are:

• Single Width / Full Height Form Factor

• Max Payload Power Output: 396W: 33A @ +12V

• Non-redundant mode only

• Power conversion to +3.3V for Management power and +12V DC for Payload power

• Manages dual -48V DC power inputs

• Wide Input Voltage Range: 36V to 75V DC

• Status LEDs

• Face Plate Hot Swap switch control latch

• Hold-up Capacitor and EMI Filtering support

• MicroTCA Power Module Output Interface to MicroTCA Backplane (includes JTAG)

• CorEdge Power Module Enhanced Module Mgmt Controller (EMMC)

o Intelligent Platform Management Interface (IPMI) v1.5 support

o Communicates with MicroTCA Carrier Hub using IPMI over IPMB-0

o Controls Management and Payload Power Output (includes programmable power output current limiting)

o Manages current sense and current limiting functions

o Local Watchdog Timer support

o Monitors local Voltage, Current and Temperature sensors

4 CorEdge Power Module Overview

4.1 Power Module Functional Description

The Power Module (PM) is a front accessible MicroTCA module that controls the entry, conversion and distribution of power to other modules in a MicroTCA shelf. The PM connects to -48V/-60V DC supplies typical in telecommunication installations through dual -48/60V inputs and converts to +12V DC Payload Power and +3.3V Management Power. The PM distributes independent +12 V DC Payload Power for up to twelve AMCs, up to two MCHs and up to two Cooling Units. The PM supports AMCs that operate in the range of 10-14VDC. A holdover capacitor provides protection against momentary shorts on the input power. The PM interfaces with the MCH Carrier Manager for monitoring and operational control. See Figure 4 for a Block diagram of Power Module. The Enhanced Module Management Controller (EMMC) communicates with a Micro TCA Carrier Hub (MCH) in the shelf via the IPMB-0 bus. The PM interfaces with the Carrier Manager to permit monitoring of the internal module status and operation of the power distribution control elements. The Carrier Manager manages power for the MicroTCA Carrier via a set of power management commands implemented by the EMMC.

The PM provides the capability to ride through certain input power disturbances typical in carrier installations. A holdup capacitor stores energy which is then used to provide continuous operation during any input voltage transients. For the 396W non-regulated supply a holdup time of 8.7ms is provided. The MicroTCA Carrier power management process can be divided into two stages: early power and normal power. The early power stage starts from the moment the external power is applied to the PM; and it ends when the MCH takes over power management. During the early power stage, the PM operates in autonomous mode



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for certain Power Channels. The autonomous mode automatically provides Management Power, asserts ENABLE#, and provides Payload Power to the Cooling Units and to MCH(s) that are present. After the MCH(s) are powered-up and fully initialized, the Carrier Manager is elected and power management enters the normal stage. In the normal stage, the Carrier Manger takes control and the PMs do not autonomously enable power to any modules. First, the Carrier Manager reads power information from the Carrier FRU Information and all the Modules. Based upon the FRU Information data and the PM status, the Carrier Manager determines PM roles for each Power Channel and the maximum available Payload Power from each PM. In normal mode, the Carrier Manager sends a “PM Heartbeat” command to the PM. If it fails to send this the PM will revert to autonomous mode. However, the PM will continue to supply channel power if this occurs.

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Figure 4 - Power Module Block Diagram



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4.2 Power Module Connectors Figure 5 shows the faceplate with the input power connector and its pin locations.

Figure 5 - Power Module Front Panel

4.3 LED Indicators

LED color LED indicates …

Green PM operating normally when LED blinking

Amber Currently unsupported.

Red Input power feed failure or a major malfunction. The status output signal PM_OK# is negated.

Blue Hot Swap status. See sequence in following Section

Table 1 – LED Definitions

4.3.1 Blue LED The Power Module supports the ATCA FRU required Blue LED. The LEDs are controlled by the IPMC controller. The state of the Blue LED during insertion and extraction is shown in Figure 6.

Green LED

Red LED

Blue LED

Amber LED

Return -48V

Latch

Currently Unused



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Figure 6 – Blue LED sequence

4.4 Power Module JTAG In MicroTCA platforms, an optional JTAG Switch Module (JSM) supports serial scan testing of complete MicroTCA Shelves, as well as their individual elements and it supports field upgrades. This testing is most often carried out during manufacturing tests in a factory setting, but MicroTCA also supports the use of these JTAG test capabilities in active systems in the field. JSM functions may be located in special slots on the backplane, or integrated into other Modules.

The CorEdge Power Module provides a JTAG slave interface accordance with the MicroTCA Spec, Ref [2] and the AMC Spec, Ref [3]. The JTAG interface enables a PM to be tested by an external JTAG test tool or by a CorEdge MCH which can act as JTAG master.

There are five JTAG signals defined on the Power Module Output Connector, TDI, TDO, TCK, TRST# and TMS. The connector pin assignments are defined in Section 7.

The components on the Power Module that the JTAG signals interface with are the Flash and FPGA, within the EMMC.

5 Installation

5.1 Installation Instructions Please use the system in a static controlled environment:

The Power Modules are installed in dedicated slots. Up to four PM slots are available in MicroTCA systems. As with all electronic equipment, the installer should follow good ESD prevention practices and install in a static controlled environment. Figure 5 shows the front view of the power module. The Power Module will operate with only one input power connector connected.

5.2 Installation Sequence Insert the PM into the target slot’s card guides.

Slide the PM into the slot until the mating PM and backplane connectors are fully seated.

Attach one or both –48V/60V DC power cables to their respective connectors and drive their retention screws to hold the cables to the Face Plate.

Push the latch handle into the Face Plate to lock the module into the slot.



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5.3 Removal Sequence Pull out the latch handle on the PM. This signals the EMMC to disable Payload power & Management

power. The Blue LED (see Section Blue LED) will begin blinking as shutdown occurs. When the Blue LED stays on it is safe to extract the PM.

Unscrew the power cable connectors’ retention screws.

Disconnect both –48V DC power cables. Caution: Failure to disconnect power cables before removing the card could result in shock or damage to the module.

Pull on the latch handle to disconnect the PM from the backplane connector and slide the PM out of the slot.

6 Carrier IPM Controller (IPMC) The Power Module uses the EMMC Micro Controller to receive commands from the Carried Manager through the IPMB bus.

6.1 Enhanced Carrier IPM-C functions The IPMI software supports platform-specific and behavior-specific functions, including:

Startup/shutdown

• Initialize-Initialize the IPMB subsystem, register I2C interface functions, etc.

• Shutdown-Shutdown the IPMB subsystem.

Messaging

• Request-Send an IPMI request message.

• Response-Send an IPMI response message.

• Poll-Poll for an IPMB message and process it according to the type of message it is.

• Ticker-Increment the clock tick count of messages in internal tables, process time-outs, and retries.

• IPMI Device “Global” Commands

• Event Commands

• FRU Inventory Device Commands

• FRU Control

• FRU Activation Policy Commands

• Set FRU Activation

• Get FRU LED Properties

• FRU LED State Commands

• Get Device Locator Record ID

• Get Address Info



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• Get LED Color Capabilities

• Get PICMG Properties

• IPMB Commands

• Power Level Commands

• Compute Power Properties

Actions

• Register a callback function-Register a callback function to invoke when a particular IPMB message is received.

FRU Data Support includes:

• Common Area

• Internal User Area

• Chassis Info Area

• Board Info Area

• Product Info Area

• Carrier Activation and Current Management Record

6.2 Power Channel Control The Power Module is controlled through the IPMI interface on the MCH module.

• Power Channel Control

• Get Power Channel Status

• PM Reset

• Get PM Status

• PM Heartbeat

Table 3.28 in the MicroTCA spec, Ref [2], provides details of Power Channel Control Command and the values of the commands listed below.

• Assert Enable

• Deassert Enable

• Enable Management Power

• Disable Management Power

• Enable Payload

• Disable Payload



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6.3 Watchdog Timer The watchdog timer is strobed by the EMMC. If it is not strobed it will reset the EMMC causing the IMPB-0 interface to be reset. This reset will not affect either Payload or Management power or the state of any of the Power Channels.

6.4 Local Sensors Sensors provide voltage and temperature monitoring functions for the components that reside on the Power Module. All the sensors provide Sensor Data Records, SDRs that provide information about the sensor type, locations, event generation and access information.

The PM supports the following sensor device commands for the sensors outlined below.

• Get device SDR info

• Get device SDR

• Reserve device SDR

• Get sensor reading

• Get/Set sensor thresholds

• Get/Set sensor hysteresis

• Get/Set sensor event enable

The EMMC monitors the follow nodes:

• Primary and secondary –48V DC input supply voltages

• The 12V Bulk Payload and 3.9V Bulk Management voltages

• Internal supply voltages

• Output load current with programmable over-current limiting for each channel

• Temperature Sensors

6.4.1 Input Supply Voltages The Power Module provides a voltage sensor and SDR for for each power input.

Input voltage sensors on the PM generate events to upper level management software that can trigger event processing and gracefully shut down the system when the input feed voltage is approaching its operational limits. The upper level management software can then send an emergency power down “Chassis Control” command to tell the PM to shut down until the input voltage reaches acceptable levels. Note that this command will shut down power to the MCH and the CU, as well as other Modules in the MicroTCA Carrier.

Due to the fact that the “Set Power Restore Policy” and “Chassis Control” commands do not contain FRU Device IDs, explicit message bridging is used by the MicroTCA aware management software to send these commands to the PMs.

Once voltages return to acceptable levels, the PM restarts according to normal procedure. PMs attempt to send events prior to removing power. The time required for the event to propagate to an event receiver and be stored is implementation-defined. In the normal case, the lower critical event is sent with plenty of time prior to the non-recoverable event, thus allowing upper-level management software time to notice the condition of the input power.

The following table shows the thresholds and actions taken:



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Voltage Thresholds Default -48V/-60V Settings

Action if Threshold Exceeded

Max Voltage (critical threshold) -72V Send Evt; Payload & Mgmt turned off

Max Warning Voltage (non-critical threshold) -68V Send Evt

Min Voltage (non-critical threshold) -44V Send Evt

Min Warning Voltage (critical threshold) -40.5V Send Evt; Payload & Mgmt turned off

6.4.2 Internal Supply Voltages Internal supply voltages are monitored and reported to the Carrier Manager. Sixteen channels of payload current and sixteen channels of management current are monitored. The status of each channel is provided to the Carrier Manager in response to the Get Power Channel Status Command. In addition, internally used voltages of 17V, Bulk12V, 5V, 3.3V Management voltage, 2.5V and 1.2V are monitored.

The EMMC implements a Power Channel Notification sensor, and reports to the Carrier Manager any state changes of any Power Channel. The details of this sensor are described in Table 3- 30, “Power Channel Notification event message” in Ref [2].

6.4.3 Hot Swap Micro Switch The Hot Swap feature of the Power Module is implemented using the latch and a micro-switch. The micro-switch position can be read by the IPMC controller and provides Open/Closed change status to the IPMC controller. The controller provides this status to the Carrier Manager which maintains a hot swap state machine for control of field replaceable units, FRUs.

6.4.4 Temperature Sensors Two temperature sensors are monitored. One monitors DC-DC Converter Brick temperature. The second monitors inlet air temperature. Each sensor provides an SDR to describe the sensor. The following table identifies the thresholds settings. The EMMC sends a temperature event message to the Carrier Manager when it determines a threshold has been exceeded.

Temperature Threshold Converter Brick Inlet Air Temp

Max Operating Temp (upper critical threshold) +115 C +45 C

Warning Operating Temp (upper non-critical threshold) +100 C +40 C

Min Operating Temp (lower critical threshold) -40 C -5 C

Warning Operating Temp (lower non-critical threshold) -5 C +5 C



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7 Specifications

7.1 Hardware Specification

PARAMETER VALUE FORM FACTOR 172.5mm x 73.5mm x 28.95mm (Single Width/Full Height)

POWER INPUT (396W OUTPUT RATING)

~416 Watts (8.7 amps at 48VDC) Input Power

MANAGEMENT POWER CHANNELS (16)

Up to 225 mA per channel (Total of 2A available for Mgmt Power) (Current limit set by Software; FailSafe limit set by hardware to 450mA)

PAYLOAD POWER CHANNELS (16) 380W Total Power Available to Payload (up to max of 9.6A on a ch) (Current limit for each channel selected in software)

SIGNAL INPUTS & OUTPUTS 3.3V logic inputs

POWER SUPPLY MONITORING All onboard voltages monitored: BULK-12V, 3.3V, 5V, 2.5V, 1.2V, MOSFET Bias (17V)

TEMPERATURE MONITORING 2 temperature monitoring Brick temperature and Inlet Air temperature

MODULE WEIGHT TBD

HOLD UP TIME 396W PM: 8.7ms hold up time

Table 2 – Hardware Specifications

7.2 Operating and Storage Environment Specifications The Power Module has been designed to meet Thermal & Operating Environments as specified in following table from the MicroTCA spec in Ref [2].



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Table 3 – Operating and Storage Specifications

8 Power Module Output Connector Assignments Power Module output connector pin assignments from the MicroTCA specification [2] are provided below.



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Table 4 – Power Module Output Connector Pinouts

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