Microelectronics at IN2P3...Not reinventing the wheel Accumulate know-how Building bllocks = an...
Transcript of Microelectronics at IN2P3...Not reinventing the wheel Accumulate know-how Building bllocks = an...
C. de La Taille Technical Director IN2P3
Microelectronics at IN2P3
31 may 2013 CdLT HEPIC13 conference
IN2P3, an institute in CNRS
• CNRS :
– Under the authority of the ministry for higher education and research
– 11 500 researchers, 14 200 ITA
– 3 G€ annual budget
– 1 200 laboratories
– 10 thematic institutes, including 2 national institutes : IN2P3 and INSU
• IN2P3 :
– 2 400 CNRS staff, researchers, engineers and technicians; 600 university and other staff
– Running budget from CNRS : 40 M€
– 24 laboratories and platforms
– 40 large international projects
• Similar (but independent) organization for CEA and CEA/IRFU
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Répartition des 3058,2 ETP de l'IN2P3
(source : ISIS 2009)
550,9
747,2
526,9
658,0
272,2
302,9
I - Physique des particules et
neutrinos
II - Physique nucléaire et
hadronique
III - Astroparticules
IV - Interdisciplinaire
V - Développemenbts
technologiques
VI - Moyens communs et
management
31 may 2013 CdLT HEPIC13 conference
IN2P3 missions
• Promote and federate research in nuclear physics, particle physics, astroparticle physics
• Coordinate the programs in the name of CNRS and Universities, in partnership with CEA
• Explore
– Particle physics
– Nuclear and Hadronic physics
– Astroparticules and Neutrinos
– Nuclear energy and waste management
– Research and Development of Accelerators
– Instrumentation (new)
– Computing grids
• Bring its competence
– to other scientific domains
– to contribute solving societal problems
• Participate to the formation of students (University, grandes écoles)
• Help the companies benefit from its expertise
LHC - © Cern
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Instrumentation
• R&D instrumentation
– Photodetectors (PM, SiPM, MCCP…)
– Gaseous detectors (RPCs, Micromegas, TPCs…)
– Semiconductor detectors (Ge, Si, MAPS…)
– Cryogenic detectors (bolometers, LAr…)
– Radiodetection (MHz, GHz…)
– Microelectronics (ASICs)
– DAQ (NARVAL, FASTER, xTCA, …)
– R&D mechanics (cooling, composites…)
• R&D organization
– Transversal thematic networks
– Target next generation experiments
– Centralized funding
• « Microelectronics poles »
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Microelectronics at IN2P3
16+1 labs : 60 designers
A huge potential…
…but scattered in 15 labs
National coordination in 2005
Labo
Designers
/Test/CAD
Perma-
nents Contact
GANIL 1 1 P Vallerand
Subatech 2 1 D Charrier
APC 3 2 Ch Olivetto
CENBG 2 2 J-L Pedroza
LPC Caen 2 2 P Laborie
LPNHE 4 3 P Lebbolo
LAL 4 4 D Breton
LAPP 4 4 J Prast
LPSC 5 5 Ch Vescovi
CPPM 9 6 A Calzas
MICRHAU IPNL
LPC Clermont
13 6
7
10 5
5
H Mathez
L Royer
OMEGA LLR
IPNO
LAL_OMEGA
16 1
3
12
11 0
3
8
R Cornat
E Wanlin
G Martin-Chassard
IPHC 23 16 Ch Hu
TOTAL 88 67
LDEF-IRFU 11 9 E Delagnes
UK R&D
@RAL
NL R&D
@NIKHEF
µE pour HEP
@CERN
Universités
INFN +
Univ
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Micro-Electronics Network (2005)
• Goals :
– Facilitate collaboration and exchanges between labs
– Share knowledge and expertise
– Foster a « community belonging »
– Increase visibility of in2p3 in µelec
• Strengths
– Common Cadence tools, managed at national level
– Few selected technologies (130 nm, SiGe 350 nm) : sharing of expertise
– Annual meeting, good community knowledge
• Weaknesses
– Many subcritical groups re-inventing the charge preamp
– Human resources managed at local level
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An
TD
C 3
50
ps
DLL
32
@ 6
25
ps
Slow Control
Transmission LVDS, 8b/10b
Zero Suppress Clustering
DLL 32 195 ps
PLL 400MHz
Dig
TD
C 1
2.5
ns
Temps PLL, DLL, TDC
FEAFS Cms
Si Strips Tracker
SUZE STAR/EUDET Pixel sensor
8b/10b 160MHz
I2C
JTAG
DLL 32 195 ps
Converters DAC
Régulateurs Band Gap
Mémoires Analogiques Numériques
Amplis de charge shapers
14 bits DAC 15 MS/s 20 mW
FP CSA Dyn 104, Rate 10kHz
CSA Dyn 103 Rate 100 kHz
Cryogenic 2°K 128x7 bits Memory
14 bits DAC 5 MS/s 7 mW
12 bits DAC 5 MS/s 5 mW
16x32 Dice latch Memory
CSA 1.2-10fC CCT 10ns 200µw
10 GS/s An Memory
BG 0.18µm
Reg 3,3v
100mA 4% LR
Reg 3,3v 10mA 10% LR
SCATS SuperB
FEAST SNEMO
IMOTEP IMABIO
PARISROC PM2
Mimosa26 EUDET ULTIMATE
STAR
ASIC64 MIMAC
FEI4 ATLAS
SQMUX128 QUBIC
NECTAR CTA
MICROROC CALICE
HARDROC CALICE
AGET ACTAR
LONAMOS AERA
Synergie 4: Briques de Base (3)
commercial IPs Building Blocs
Obsolescence of technologies Proven solutions
Architecture: SoC Detailed design
Finalize full circuits Validate prototypes
Never identical Duplicate
Accumulate know-how Not reinventing the wheel
Building bllocks = an oxymoron
•Bonn • LVDS/SLVS pads
• PLL
• Gigabit driver
•AGH • LVDS/SLVS pads
• PLL
Common work on 65nm CMOS : proposal for IP blocks from WP3 groups
•INFN • Discriminator
• Charge injection circuits for Front-End calibration
• n-bit D/A Converter (current steering topology)
• I/O PADs (LVDS2CMOS, CMOS2LVDS)
• Technology characterisation,
•IN2P3 • Bandgap - Service serial link (LPNHE)
• OTA - Preamp (pixels LAPP)
• DAC (LAL) - SPI serial interface
• ADC (LAL,(LPSC], LAPP) - I2C (IPNL/LAPP)
• Monitoring ADC (CPPM) - JTAG controller (LAPP)
• Temp. sensor (CPPM) - I/O cells
• Generic amplifier (CPPM) - PLLs (TOT, pixels, LAL,
LAPP) AIDA WP3 Annual Meeting – DESY – March 29, 2012 31 may 2013 CdLT HEPIC13 conference
To be renewed/shared/documented…
CdLT HEPIC13 conference
Examples of chips at IN2P3
• MAPS sensors at IPHC (Strasbourg)
• ROC chips at OMEGA (Orsay)
• Chips at MICHRAU (Lyon-Clermont)
HARDROC2 SPIROC2 MAROC3 SPACIROC SKIROC2 MICROROC1
PARISROC2
OMEGAPIX
MIMOSTAR
Chip dimension: ~2 cm²
MIMOSA26 Pixel array: 576x1152
Chip dimension: ~ 3 cm² MIMOTEL
M18 LUSIPHER
8 LARZIC FEAFS (IC) CHOCAPIC FATALIC SICASIC HOCTASIC 31 may 2013
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1
0
Network transverse to instrumentation D
-Gaz
eux
Ph
otD
C
ryo
gén
ie
Sem
iCo
n
Cold CCD ASPIC LSST
LarTPC LARZIC T2K
Bolomètres SQMUX128 QUBIC
Bolomètres CRYOxx (Irfu) IXO/ATENA
Si PIN Diode SKIROC eCal Calice
PMT Mx SPACIROC Jem-Euso
SiPM SPIROC AHCal Calice
PMT Mx MAROC ATLAS
PMT PARISROC PMm2
Si PIN Diode CALORIC
PMT HOCTASIC
PMT SCATS (timing)
SuperB
PMT MAPPRA64 POLAR
PMT Mx IMOTEPAD64
Biomed
CPS ALICE MFT
PIXSIC
Biomed
CPS Mimosa2 ALICE ITS
HPS FEI3 ATLAS
HPS FEI4 ATLAS
HPS XPAD Biomed
CPS PHASE STAR/FOCAL
CPS Mimosa26 EUDET/CBM
CPS LUCIPHER Biomed
3DIC Pixels TSV/Stacked CAIRN OMEGAPIX FE_TC4 ILC /ATLAS
SiStrip SICASIC Biomed
SiStrip FP CSA
S3
CPS Mimosa 32 ALICE ITS
HPS FEI5 SATLAS
CPS ULTIMATE STAR
CPS Mimosa 31 ILC
PMT NECTAR(Irfu)
CTA
Rad
iod
etct
ion
Antenne LONAMOS AERA
RPC/µMegas HARDROC Calice
µMegas MIcroROC eCal Calice
µMegas ASIC64 MiMac
TPC AGET(Irfu) TPC2-BX
µMegas Idfx-LXe(Irfu
/Sub) Biomed
Drift Chamber FEAST (timing)
SNemo
Gaz Sensor CHOCAPIC Transfert
µMegas Dream(Irfu)
CLAS12
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MAPS: A Long Term R&D
STAR 2012 Solenoidal Tracker at RHIC
EUDET 2006/2010
Beam Telescope
Spinoff: Interdisciplinary Applications, biomedical, space …
Main objective: ILC, with staggered performances MAPS applied to other experiments with intermediate requirements
ILC >2020
Internatinal Linear Collider
CBM 2017 Compressed Baryonic Matter
EUDET (R&D for ILC, EU project)
STAR (Heavy Ion physics)
CBM (Heavy Ion physics)
ILC (Particle physics)
HadronPhysics2 (generic R&D, EU
project)
AIDA (generic R&D, EU project)
FIRST (Hadron therapy)
ALICE/LHC (Heavy Ion physics)
EIC (Hadronic physics)
CLIC (Particle physics)
SuperB (Particle physics)
…
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Foundries for HEP
• A solid know how in 350nm
– 350nm AMS SiGe, CMOS, CMOS epi, CMOS Hres epi
– 350nm XFAB CMOS, CMOS epi, CMOS Hres epi
• An investment in 130nm with CERN
– IBM (CERN)
– Global Foundries, Tezzaron 3DIC
• Now at a turning point
– 65nm TSMC (CERN)
– 180nm TOWER (CPS CERN)
– 180nm AMS, XFAB SOI HV
• Higher costs call for a better organization
– More training
– More concentration
– Better concertation with international efforts
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« Microelectronics poles »
DAQASIC
Chip ID register 8 bits
gain
Trigger discri Output
Wilkinson ADC
Discri output
gain
Trigger discri Output
Wilkinson ADC
Discri output
..…
OR36
EndRamp (Discri ADC
Wilkinson)
36
36
36
TM (Discri trigger)
ValGain (low gain or
high Gain)
ExtSigmaTM (OR36)
Channel 1
Channel 0
ValDimGray 12 bits
…
Acquisition
readout
Conversion
ADC
+
Ecriture
RAM
RAM
FlagTDC
ValDimGray
12
8
ChipID
Hit channel register 16 x 36 x 1 bits
TDC rampStartRampTDC
BCID 16 x 8 bits
ADC rampStartrampb
(wilkinson
ramp)
16
16ValidHoldAnalogb
RazRangN
16ReadMesureb
Rstb
Clk40MHz
SlowClock
StartAcqt
StartConvDAQb
StartReadOut
NoTrig
RamFull
TransmitOn
OutSerie
EndReadOut
Chipsat
DAQASIC
Chip ID register 8 bits
gain
Trigger discri Output
Wilkinson ADC
Discri output
gain
Trigger discri Output
Wilkinson ADC
Discri output
gain
Trigger discri Output
Wilkinson ADC
Discri output
gain
Trigger discri Output
Wilkinson ADC
Discri output
..…
OR36
EndRamp (Discri ADC
Wilkinson)
36
36
36
TM (Discri trigger)
ValGain (low gain or
high Gain)
ExtSigmaTM (OR36)
Channel 1
Channel 0
ValDimGray 12 bits
…
Acquisition
readout
Conversion
ADC
+
Ecriture
RAM
Conversion
ADC
+
Ecriture
RAM
RAMRAM
FlagTDC
ValDimGray
12
8
ChipID
Hit channel register 16 x 36 x 1 bits
TDC rampStartRampTDC
BCID 16 x 8 bits
ADC rampStartrampb
(wilkinson
ramp)
16
16ValidHoldAnalogb
RazRangN
16ReadMesureb
Rstb
Clk40MHz
SlowClock
StartAcqt
StartConvDAQb
StartReadOut
NoTrig
RamFull
TransmitOn
OutSerie
EndReadOut
Chipsat• Motivation :
– Continuous increase of chip complexity (SoC, 3D…)
– Minimize interface problems
– Reduce development times
• Importance of critical mass
– Daily contacts and discussions between designers
– Sharing of well proven blocks
– Cross fertilization of different projects
• Creation of poles with critical mass (~10 persons)
– Orsay (OMEGA)
– Clermont-Lyon (MICHRAU)
– Strasbourg (IPHC)
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OMEGA group
• Mutualized ASIC design team formerly hosted at Orsay
• Specialized in low power, low noise, high speed design (SiGe)
• Very high level of integration : System on Chip (SoC)
• Design for calorimetry, astrophysics, medical imaging…
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HARDROC2
SPIROC2
MAROC3
SPACIROC
SKIROC2
MICROROC1
PARISROC2
CdLT seminar at KEK 15
PMm² for large area photodetection
• Photomultiplier Array Integrated in SiGe Read-Out Chip
– Replace large PMTs (20’’) by arrays of 16 smaller ones (12’’) , PMm2 project
– Smart photodetector
– 16 independent channels
– Auto-trigger at 1/3 p.e.
– Charge (300 pe) and time (1ns) measurement (10-12 bits)
– Water tight, common high voltage for PMTs
– Data driven : « One wire out » for DATA and power supplies
Evolution
• Creation of a national lab : OMEGA “Organization for Micro-
Electronics desiGn and Applicatiions” (2013)
– Difficulties with the hosting lab (LAL)
– Local management with national commitments, managing priorities
– Team had to be preserved
– Becomes an independant lab
• Hosted at Ecole Polytechnique : « 3 axes »
– Research : close to IN2P3 labs (LLR, LAL, IPNO…)
– Teaching: « electrical engineering », spatial
– Industry: startup Weeroc, : Astrium, Siemens…
• Missions :
– Design ASICs for IN2P3 physics experiments
– Participate to teaching and technology trransfer
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+ National ASIC lab
Conclusion
• An active micro-electronics network
– Common Cadence tools, common technologies
– Sharing of expertise (to some limits)
– Sharing of building blocks (to some limits…)
– Thematic schools => community building
– National coordination (IN2P3)
• A few large groups (“poles”)
– Michrau, Omega, Saclay, Strasbourg
– Critical mass ~10 people
• Open issues / material for discussion
– Specialized groups vs collaborative design
– Propietary dsign vs sharing building blocks
– Technology transfer vs academic collaborations
– Versatility vs dedicated design
– Measurements and Integration
31 may 2013 CdLT HEPIC13 conference 18
Backup slides
31 may 2013 CdLT HEPIC13 conference 1
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HARDROC2 for RPC readout
• HARDROC2: 64 channels (RPC DHCAL)
– preamp + shaper+ 3 discris (semi digital readout)
– Auto trigger on 10fC up to 20 pC
– 5 0.5 Kbytes memories to store 127 events
– Full power pulsing => 7.5 µW/ch
– Fully integrated ILC sequential readout
– 10 000 chips produced to equip 400 000 ch
– SDHCAL technological proto with 40 layers (5760 HR2 chips) built in 2010-2011.
• Successful TB in 2012 : 40 layers with Power Pulsing mode
@IPNL
Cosmic hadronic shower
Blue : 150 fC
Green : 2 pC
Red : 18 pC
X
Z Y
Z
X
Y
CdLT seminar at KEK 20
CdLT seminar at KEK 21
SPIROC
Pedestal
50fC
injected
36-channel S-curves: trigger efficiency
versus threshold (1 LSB = 2 mV)
Qinj (fC)
50 fC
50 % Trigger efficiency point vs Qinj
Trigger at 50fC matched
(1/3 photon-electron at 106)
MIP response in DESY
6 GeV electron testbeam
©M. Reinecke (DESY)
SiPM SPECTRUM with Autotrigger
linearity using the auto gain mode
and internal ADC
CdLT HEPIC13 conference 22
Backup slides •