MCP1703A - 250 mA, 16V, Low Quiescent Current LDO Regulator - … · DS00792, Microchip Technology...

MCP1703A250 mA, 16V, Low Quiescent Current LDO Regulator

Features:• Reduced Ground Current During Dropout• Faster Startup Time• 2.0 µA Typical Quiescent Current• Input Operating Voltage Range: 2.7V to16.0V• 250 mA Output Current for Output Voltages ≥ 2.5V• 200 mA Output Current for Output Voltages < 2.5V• Low Dropout Voltage, 625 mV Typical @ 250 mA

for VR = 2.8V• 0.4% Typical Output Voltage Tolerance• Standard Output Voltage Options:

- 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V

• Output Voltage Range: 1.2V to 5.5V in 0.1V Increments (50 mV increments available upon request)

• Stable with 1.0 µF to 22 µF Ceramic Output Capacitance

• Short-Circuit Protection• Overtemperature Protection

Applications:• Battery-Powered Devices• Battery-Powered Alarm Circuits• Smoke Detectors• CO2 Detectors• Pagers and Cellular Phones• Smart Battery Packs• Low Quiescent Current Voltage Reference• PDAs• Digital Cameras• Microcontroller Power• Solar-Powered Instruments• Consumer Products

Related Literature:• AN765, “Using Microchip’s Micropower LDOs”,

DS00765, Microchip Technology Inc., 2007• AN766, “Pin-Compatible CMOS Upgrades to

Bipolar LDOs”, DS00766, Microchip Technology Inc., 2003

• AN792, “A Method to Determine How Much Power a SOT23 Can Dissipate in an Application”, DS00792, Microchip Technology Inc., 2001

Description:The MCP1703A is an improved version of theMCP1703 low dropout (LDO) voltage regulator that candeliver up to 250 mA of current while consuming only2.0 µA of quiescent current (typical). The inputoperating range is specified from 2.7V to 16.0V, makingit an ideal choice for two to six primary cell battery-powered applications, 9V alkaline and one or two cellLi-Ion-powered applications.

The MCP1703A is capable of delivering 250 mA withonly 625 mV (typical) of input to output voltagedifferential (VOUT = 2.8V). The output voltage toleranceof the MCP1703A is typically ±0.4% at +25°C and ±3%maximum over the operating junction temperaturerange of -40°C to +125°C. Line regulation is ±0.1%typical at +25°C.

Output voltages available for the MCP1703A rangefrom 1.2V to 5.5V. The LDO output is stable when usingonly 1 µF of output capacitance. Ceramic, tantalum, oraluminum electrolytic capacitors can all be used forinput and output. Overcurrent limit and overtemperatureshutdown provide a robust solution for any application.Package options include the SOT-223-3, SOT-23A,2x3 DFN-8, and SOT-89-3.

Package Types

1

3

2

VIN

GND VOUT

1 2 3

VINGND VOUT

SOT-23A

SOT-89VIN

1 2 3

SOT-223

GNDVIN VOUT

NCNC

GND

NCNC

1234

8765 NC

VOUT

EP9

* Includes Exposed Thermal Pad (EP); see Table 3-1.

VIN

2x3 DFN*

© 2012 Microchip Technology Inc. DS25122A-page 1

MCP1703A
Functional Block Diagrams
Typical Application Circuits

+-

VIN VOUT

GND

+VIN

Error Amplifier

VoltageReference

OvercurrentOvertemperature

MCP1703A

VIN

CIN1 µF Ceramic

COUT1 µF Ceramic

VOUT

VIN

3.3V

IOUT50 mA

VIN

VOUT

9VBattery

+

GND

MCP1703A

DS25122A-page 2 © 2012 Microchip Technology Inc.

MCP1703A

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †VDD..................................................................................+18VAll inputs and outputs w.r.t. .............(VSS-0.3V) to (VIN+0.3V)Peak Output Current ...................................................500 mAStorage temperature .....................................-65°C to +150°CMaximum Junction Temperature................................. +150°CESD protection on all pins (HBM;MM)............... ≥ 4 kV; ≥ 400V

† Notice: Stresses above those listed under “MaximumRatings” may cause permanent damage to the device. This isa stress rating only and functional operation of the device atthose or any other conditions above those indicated in theoperational listings of this specification is not implied.Exposure to maximum rating conditions for extended periodsmay affect device reliability.

DC CHARACTERISTICSElectrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, ILOAD = 1 mA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C.

Parameters Symbol Min Typ Max Units Conditions

Input / Output CharacteristicsInput Operating Voltage VIN 2.7 — 16.0 V Note 1Input Quiescent Current Iq — 2.0 5 µA IL = 0 mAMaximum Output Current IOUT_mA 250 — — mA For VR ≥ 2.5V

50 100 — mA For VR < 2.5V, VIN ≥ 2.7V100 130 — mA For VR < 2.5V, VIN ≥ 2.95V150 200 — mA For VR < 2.5V, VIN ≥ 3.2V200 230 — mA For VR < 2.5V, VIN ≥ 3.45V

Output Short Circuit Current IOUT_SC — 400 — mA VIN = VIN(MIN) (Note 1), VOUT = GND,Current (average current) measured 10 ms after short is applied.

Output Voltage Regulation VOUT VR-3.0% VR±0.4% VR+3.0% V Note 2VR-2.0% VR±0.4% VR+2.0% VVR-1.0% VR±0.4% VR+1.0% V 1% Custom

VOUT Temperature Coefficient TCVOUT — 65 — ppm/°C Note 3Line Regulation DVOUT/

(VOUTxΔVIN)-0.3 ±0.1 +0.3 %/V (VOUT(MAX) + VDROPOUT(MAX)) ≤ VIN

≤ 16V, Note 1Load Regulation ΔVOUT/VOUT -2.5 ±1.0 +2.5 % IL = 1.0 mA to 250 mA for VR ≥ 2.5V

IL = 1.0 mA to 200 mA for VR < 2.5VVIN = 3.65V, Note 4

Note 1: The minimum VIN must meet two conditions: VIN ≥ 2.7V and VIN ≥ (VOUT(MAX) + VDROPOUT(MAX)).2: VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.

The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or ViIN = 2.7V (whichever is greater); IOUT = 100 µA.3: TCVOUT = (VOUT-HIGH - VOUT-LOW) x 106/(VR x ΔTemperature), VOUT-HIGH = highest voltage measured over the

temperature range. VOUT-LOW = lowest voltage measured over the temperature range.4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

voltage due to heating effects are determined using thermal regulation specification TCVOUT.5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured

value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., TA, TJ, qJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability.

7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambi-ent temperature is not significant.


MCP1703A

Dropout VoltageNote 1, Note 5

VDROPOUT — 330 650 mV IL = 250 mA, VR = 5.0V— 525 725 mV IL = 250 mA, 3.3V ≤ VR < 5.0V— 625 975 mV IL = 250 mA, 2.8V ≤ VR < 3.3V— 750 1100 mV IL = 250 mA, 2.5V ≤ VR < 2.8V— — — mV VR < 2.5V, See Maximum Output

Current ParameterOutput Delay Time TDELAY — 600 — µs VIN = 0V to 6V, VOUT = 90% VR,

RL = 50Ω resistiveOutput Noise eN — 0.3 µV/(Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1 µFPower Supply Ripple Rejection Ratio

PSRR — 35 — dB f = 100 Hz, COUT = 1 µF, IL = 10 mA, VINAC = 200 mV pk-pk, CIN = 0 µF, VR = 5.0V

Thermal Shutdown Protection TSD — 150 — °C

TEMPERATURE SPECIFICATIONS(1)

Parameters Sym Min Typ Max Units Conditions

Temperature RangesOperating Junction Temperature Range TJ -40 — +125 °C Steady StateMaximum Junction Temperature TJ — — +150 °C TransientStorage Temperature Range TA -65 — +150 °CThermal Package Resistance (Note 2)Thermal Resistance, 3LD SOT-223 θJA

θJC

——

6215

—— °C/W EIA/JEDEC JESD51-7

FR-4 0.063 4-Layer BoardThermal Resistance, 3LD SOT-23A θJA

θJC

——

336110


FR-4 0.063 4-Layer BoardThermal Resistance, 3LD SOT-89 θJA

θJC

——

18052


FR-4 0.063 4-Layer BoardThermal Resistance, 8LD 2x3 DFN θJA

θJC

——

7013.4


FR-4 0.063 4-Layer BoardNote 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability.

2: Thermal Resistance values are subject to change. Please visit the Microchip web site for the latest packaging information.

DC CHARACTERISTICS (CONTINUED)Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1, ILOAD = 1 mA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C.

Parameters Symbol Min Typ Max Units Conditions

Note 1: The minimum VIN must meet two conditions: VIN ≥ 2.7V and VIN ≥ (VOUT(MAX) + VDROPOUT(MAX)).2: VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.

The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or ViIN = 2.7V (whichever is greater); IOUT = 100 µA.3: TCVOUT = (VOUT-HIGH - VOUT-LOW) x 106/(VR x ΔTemperature), VOUT-HIGH = highest voltage measured over the

temperature range. VOUT-LOW = lowest voltage measured over the temperature range.4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

voltage due to heating effects are determined using thermal regulation specification TCVOUT.5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured

value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., TA, TJ, qJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability.

7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambi-ent temperature is not significant.


MCP1703A

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 1 mA, TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.Note: Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junctiontemperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.

FIGURE 2-1: Quiescent Current vs. Input Voltage.



FIGURE 2-4: Ground Current vs. Load Current.

FIGURE 2-5: Ground Current vs. Load Current.

FIGURE 2-6: Quiescent Current vs. Junction Temperature.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed hereinare not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0.00

1.00

2.00

3.00

4.00

5.00

2 4 6 8 10 12 14 16

Qui

esce

nt C

urre

nt (µ

A)

Input Voltage (V)

VOUT = 1.2VIOUT = 0 µA

+25°C

+130°C

-45°C

0°C

+90°C

0.00

1.00

2.00

3.00

4.00

5.00

6.00

2 4 6 8 10 12 14 16

Qui

esce

nt C

urre

nt (µ

A)

Input Voltage (V)


+90°C

+130°C

- 45°C

0°C

+90°C

1

2

3

4

5

6

7

6 8 10 12 14 16

Qui

esce

nt C

urre

nt (µ

A)

Input Voltage (V)


0°C

+130°C

- 45°C+25°C

+90°C

0

10

20

30

40

50

60

0 40 80 120 160 200

GN

D C

urre

nt (µ

A)

Load Current (mA)

VOUT = 1.2VVIN = 2.7V

0

10

20

30

40

50

60

0 50 100 150 200 250

GN

D C

urre

nt (µ

A)

Load Current (mA)



0.0

0.5

1.0

1.5

2.0

2.5

3.0

-45 -20 5 30 55 80 105 130

Qui

esce

nt C

urre

nt (µ

A)

Junction Temperature (°C)

IOUT = 0 mA





MCP1703A
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 1 mA, TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
FIGURE 2-7: Output Voltage vs. Input Voltage.



FIGURE 2-10: Output Voltage vs. Load Current.



1.18

1.19

1.20

1.21

1.22

1.23

1.24

2 4 6 8 10 12 14 16 18

Out

put V

olta

ge (V

)

Input Voltage (V)

VOUT = 1.2VILOAD = 1 mA

+25°C

+130°C

-45°C0°C

+90°C

2.44

2.46

2.48

2.50

2.52

2.54

2.56

2.58

2 4 6 8 10 12 14 16 18

Out

put V

olta

ge (V

)

Input Voltage (V)


+25°C

+130°C

-45°C0°C

+90°C

4.88

4.92

4.96

5.00

5.04

5.08

5.12

5.16

6 8 10 12 14 16 18

Out

put V

olta

ge (V

)

Input Voltage (V)


+25°C

+130°C

-45°C

0°C

+90°C

1.161.171.181.191.201.211.221.231.24

0 20 40 60 80 100 120 140 160 180 200

Out

put V

olta

ge (V

)

Load Current (mA)

VIN = 3.0VVOUT = 1.2V

+25°C

+130°C

-45°C 0°C

+90°C

2.462.472.482.492.502.512.522.532.54

0 50 100 150 200 250

Out

put V

olta

ge (V

)

Load Current (mA)

VIN = 3.5VVOUT = 2.5V

+25°C

+130°C

-45°C0°C

+90°C

4.92

4.94

4.96

4.98

5.00

5.02

5.04

5.06

0 50 100 150 200 250

Out

put V

olta

ge (V

)

Load Current (mA)

VIN = 6VVOUT = 5.0V

+25°C

+130°C

-45°C 0°C

+90°C


MCP1703A
FIGURE 2-13: Dropout Voltage vs. Load Current.



FIGURE 2-16: Dynamic Line Response.

FIGURE 2-17: Dynamic Line Response.

FIGURE 2-18: Short Circuit Current vs. Input Voltage.

0.00

0.50

1.00

1.50

2.00

2.50

3.00

0 25 50 75 100 125 150 175 200 225 250

Dro

pout

Vol

tage

(V)

Load Current (mA)

VOUT = 1.2V

0°C, +25°C, +90°C, +130°C

- 45°C

- 45°C, 0°C

0.000.100.200.300.400.500.600.700.800.901.00

0 25 50 75 100 125 150 175 200 225 250

Dro

pout

Vol

tage

(V)

Load Current (mA)

VOUT = 2.5V

+25°C

+130°C

0°C- 45°C

+90°C

0.000.050.100.150.200.250.300.350.400.450.50

0 25 50 75 100 125 150 175 200 225 250

Dro

pout

Vol

tage

(V)

Load Current (mA)

VOUT = 5.0V

+25°C

+130°C

0°C

- 45°C

+90°C

-400

-200

0

200

400

600

0

1

2

3

4

5

0 500 1000 1500 2000 2500

Out

put V

olta

ge (m

Vac)

Inpu

t Vol

tage

(V)

Time (µS)

VOUT = 2.5VIOUT = 10 mA

VIN

VOUT(AC)

-600

-400

-200

0

200

400

0

1

2

3

4

5

0 500 1000 1500 2000 2500

Out

put V

olta

ge (m

Vac)

Inpu

t Vol

tage

(V)

Time (µS)


VIN

VOUT(AC)

0100200300400500600700800

0 2 4 6 8 10 12 14 16 18

Shor

t Circ

uit C

urre

nt (m

A)

Input Voltage (V)

VOUT = 2.5VROUT < 0.1Ω


MCP1703A
FIGURE 2-19: Load Regulation vs. Temperature.



FIGURE 2-22: Line Regulation vs. Temperature.



-1.00-0.80-0.60-0.40-0.200.000.200.400.600.801.00

-45 -20 5 30 55 80 105 130

Load

Reg

ulat

ion

(%)

Temperature (°C)

VOUT = 1.2VIOUT = 1 mA to 200 mA

VIN = 8VVIN = 14V

VIN = 3.45VVIN = 5V

-1.60-1.40-1.20-1.00-0.80-0.60-0.40-0.200.000.200.400.60

-45 -20 5 30 55 80 105 130

Load

Reg

ulat

ion

(%)

Temperature (°C)

VOUT = 2.5VIOUT = 1 mA to 250 mA

VIN = 5V

VIN = 14VVIN = 10V

VIN = 3.65V

-1.20-1.00-0.80-0.60-0.40-0.200.000.200.400.600.80

-45 -20 5 30 55 80 105 130

Load

Reg

ulat

ion

(%)

Temperature (°C)

VOUT = 5.0VIOUT = 1 to 250 mA

VIN = 6V

VIN = 14VVIN = 12V

VIN = 8V

VIN = 16V

0.00

0.04

0.08

0.12

0.16

0.20

-45 -20 5 30 55 80 105 130

Line

Reg

ulat

ion

(%/V

)

Temperature (°C)

VIN = 3.45 to 16.0VVOUT = 1.2V

1 mA

100 mA

0 mA

200 mA250 mA

0.00

0.04

0.08

0.12

0.16

0.20

0.24

-45 -20 5 30 55 80 105 130

Line

Reg

ulat

ion

(%/V

)

Temperature (°C)

VOUT = 2.5VVIN = 3.5V to 16V

100 mA

0 mA

250 mA

0.04

0.08

0.12

0.16

0.20

0.24

-45 -20 5 30 55 80 105 130

Line

Reg

ulat

ion

(%/V

)

Temperature (°C)

VOUT = 5.0VVIN = 6.0V to 16.0V

200 mA

100 mA

0 mA

250 mA


MCP1703A
FIGURE 2-25: PSRR vs. Frequency.




FIGURE 2-29: Output Noise vs. Frequency.

FIGURE 2-30: Power Up Timing.

-90-80-70-60-50-40-30-20-10

0

0.01 0.1 1 10 100 1000

PSR

R (d

B)

Frequency (kHz)

VR = 1.2VVIN = 2.9VVINAC = 200 mV p-pCIN = 0 μFIOUT = 10 mA

-90-80-70-60-50-40-30-20-10

0

0.01 0.1 1 10 100 1000

PSR

R (d

B)

Frequency (kHz)


-90-80-70-60-50-40-30-20-10

0

0.01 0.1 1 10 100 1000

PSR

R (d

B)

Frequency (KHz)


-90-80-70-60-50-40-30-20-10

0

0.01 0.1 1 10 100 1000

PSR

R (d

B)

Frequency (KHz)


10.00VR = 5 0V VIN = 6 0V IOUT = 50 mA

z)

VR = 5.0V, VIN = 6.0VVR = 2.8V, VIN = 3.8VVR = 1.2V, VIN = 2.7V

1.00

µV/�

Hz

0.10N

oise

(µN

0.010.01 0.10 1.00 10.00 100.00 1000.00

Frequency (kHz)

8V = 2 5V R = 25�

67 VR = 2.5V, RLOAD = 25�

VIN = 0V to 5.3V StepVIN

45

ts (V

)

23Vo

lt

012

VOUT

00 200 400 600 800 1000

Time (µS)Time (µS)


MCP1703A
FIGURE 2-31: Dynamic Load Response.

FIGURE 2-32: Dynamic Load Response.

FIGURE 2-33: Ground Current vs. Input Voltage.

FIGURE 2-34: Ground Current vs. Input Voltage.


FIGURE 2-36: Dropout Current vs. Input Voltage.

0

5

10

15

20

25

30

-1500

-1000

-500

0

500

1000

1500

0 500 1000 1500 2000 2500

Out

put V

olta

ge (m

V)

Time (µs)

VOUT = 2.5VStep 100µ to 100 mA

100 mA

100 µA

VOUT (ac)

0

5

10

15

20

25

30

-1500

-1000

-500

0

500

1000

1500

0 500 1000 1500 2000 2500

Out

put V

olta

ge (m

V)

Time (µs)

VOUT = 2.5VStep 1 mA to 200 mA

1 mA

200 mA

VOUT (ac)

0

4

8

12

16

20

024681012141618

Gro

und

Cur

rent

(µA

)

Input Voltage (V)


0

4

8

12

16

20

024681012141618

Gro

und

Cur

rent

(µA

)

Input Voltage (V)


0

1

2

3

4

5

6

0123456

Out

put V

olta

ge (V

)

Input Voltage (V)

IOUT = 1 mAVOUT = 5V

VOUT = 3.3V

0

2

4

6

8

10

0123456

Dro

pout

Cur

rent

(µA

)

Input Voltage (V)

IOUT = 1 mAVOUT = 5V

VOUT = 3.3V


MCP1703A

3.0 PIN DESCRIPTIONSThe descriptions of the pins are listed in Table 3-1.

3.1 Ground Terminal (GND)Regulator ground. Tie GND to the negative side of theoutput and the negative side of the input capacitor.Only the LDO bias current (2.0 µA typical) flows out ofthis pin; there is no high current. The LDO outputregulation is referenced to this pin. Minimize voltagedrops between this pin and the negative side of theload.

3.2 Regulated Output Voltage (VOUT)Connect VOUT to the positive side of the load and thepositive terminal of the output capacitor. The positiveside of the output capacitor should be physicallylocated as close to the LDO VOUT pin as is practical.The current flowing out of this pin is equal to the DCload current.

3.3 Unregulated Input Voltage (VIN)Connect VIN to the input unregulated source voltage.Like all low dropout linear regulators, low sourceimpedance is necessary for the stable operation of theLDO. The amount of capacitance required to ensurelow source impedance will depend on the proximity ofthe input source capacitors or battery type. For mostapplications, 1 µF of capacitance will ensure stableoperation of the LDO circuit. For applications that haveload currents below 100 mA, the input capacitancerequirement can be lowered. The type of capacitorused can be ceramic, tantalum, or aluminumelectrolytic. The low ESR characteristics of the ceramicwill yield better noise and PSRR performance athigh-frequency.

3.4 Exposed Thermal Pad (EP)There is an internal electrical connection between theExposed Thermal Pad (EP) and the VSS pin; they mustbe connected to the same potential on the PrintedCircuit Board (PCB).

TABLE 3-1: MCP1703A PIN FUNCTION TABLE2x3 DFN SOT-223 SOT-23A SOT-89 Name Function

4 2,Tab 1 1 GND Ground Terminal1 3 2 3 VOUT Regulated Voltage Output8 1 3 2,Tab VIN Unregulated Supply Voltage

2, 3, 5, 6, 7 — — — NC No Connection9 — — — EP Exposed Thermal Pad (EP); must be

connected to VSS


MCP1703A

4.0 DETAILED DESCRIPTION

4.1 Output RegulationA portion of the LDO output voltage is fed back to theinternal error amplifier and compared with the precisioninternal band gap reference. The error amplifier outputwill adjust the amount of current that flows through theP-Channel pass transistor, thus regulating the outputvoltage to the desired value. Any changes in inputvoltage or output current will cause the error amplifierto respond and adjust the output voltage to the targetvoltage (refer to Figure 4-1).

4.2 OvercurrentThe MCP1703A internal circuitry monitors the amountof current flowing through the P-Channel pass transis-tor. In the event of a short-circuit or excessive outputcurrent, the MCP1703A will turn off the P-Channeldevice for a short period, after which the LDO willattempt to restart. If the excessive current remains, thecycle will repeat itself.

4.3 OvertemperatureThe internal power dissipation within the LDO is afunction of input-to-output voltage differential and loadcurrent. If the power dissipation within the LDO isexcessive, the internal junction temperature will riseabove the typical shutdown threshold of 150°C. At thatpoint, the LDO will shut down and begin to cool to thetypical turn-on junction temperature of 130°C. If thepower dissipation is low enough, the device willcontinue to cool and operate normally. If the powerdissipation remains high, the thermal shutdownprotection circuitry will again turn off the LDO,protecting it from catastrophic failure.

FIGURE 4-1: Block Diagram.

+-

VIN VOUT

GND

+VIN

Error Amplifier

VoltageReference

OvercurrentOvertemperature

MCP1703A


MCP1703A

5.0 FUNCTIONAL DESCRIPTIONThe MCP1703A CMOS low dropout linear regulator isintended for applications that need the lowest currentconsumption while maintaining output voltageregulation. The operating continuous load range of theMCP1703A is from 0 mA to 250 mA (VR ≥ 2.5V). Theinput operating voltage range is from 2.7V to 16.0V,making it capable of operating from two or morealkaline cells or single and multiple Li-Ion cell batteries.

5.1 InputThe input of the MCP1703A is connected to the sourceof the P-Channel PMOS pass transistor. As with allLDO circuits, a relatively low source impedance (10Ω)is needed to prevent the input impedance from causingthe LDO to become unstable. The size and type of thecapacitor needed depends heavily on the input sourcetype (battery, power supply) and the output currentrange of the application. For most applications (up to100 mA), a 1 µF ceramic capacitor will be sufficient toensure circuit stability. Larger values can be used toimprove circuit AC performance. The capacitance ofthe input capacitor should be equal to or greater thanthe capacitance of the selected output capacitor toensure energy is available to keep the output capacitorcharged during dynamic load changes.

5.2 OutputThe maximum rated continuous output current for theMCP1703A is 250 mA (VR ≥ 2.5V). For applicationswhere VR < 2.5V, the maximum output current is200 mA.

A minimum output capacitance of 1.0 µF is required forsmall signal stability in applications that have up to250 mA output current capability. The capacitor typecan be ceramic, tantalum, or aluminum electrolytic. TheEquivalent Series Resistance (ESR) range on theoutput capacitor can range from 0Ω to 2.0Ω.

The output capacitor range for ceramic capacitors is1 µF to 22 µF. Higher output capacitance values maybe used for tantalum and electrolytic capacitors. Higheroutput capacitor values pull the pole of the LDOtransfer function inward that results in higher phaseshifts which in turn cause a lower crossover frequency.The circuit designer should verify the stability byapplying line step and load step testing to their systemwhen using capacitance values greater than 22 µF.

5.3 Output Rise TimeWhen powering up the internal reference output, thetypical output rise time of 600 µs is controlled toprevent overshoot of the output voltage.


MCP1703A

6.0 APPLICATION CIRCUITS AND ISSUES

6.1 Typical ApplicationThe MCP1703A is most commonly used as a voltageregulator. Its low quiescent current and low dropoutvoltage make it ideal for many battery-poweredapplications.

FIGURE 6-1: Typical Application Circuit.

6.1.1 APPLICATION INPUT CONDITIONS

6.2 Power Calculations

6.2.1 POWER DISSIPATIONThe internal power dissipation of the MCP1703A is afunction of input voltage, output voltage and outputcurrent. The power dissipation, as a result of thequiescent current draw, is so low, it is insignificant(2.0 µA x VIN). The following equation can be used tocalculate the internal power dissipation of the LDO.

EQUATION 6-1:

The maximum continuous operating junctiontemperature specified for the MCP1703A is +125°C. Toestimate the internal junction temperature of theMCP1703A, the total internal power dissipation ismultiplied by the thermal resistance from junction toambient (RθJA). The thermal resistance from junctionto ambient for the SOT-23A pin package is estimated at336°C/W.

EQUATION 6-2:

The maximum power dissipation capability for apackage can be calculated given the junction-to-ambient thermal resistance and the maximum ambienttemperature for the application. The following equationcan be used to determine the package maximuminternal power dissipation.

EQUATION 6-3:

EQUATION 6-4:

EQUATION 6-5:

Package Type = SOT-23AInput Voltage Range = 2.7V to 4.8V

VIN maximum = 4.8VVOUT typical = 1.8V

IOUT = 50 mA maximum

GND

VOUT

VIN CIN1 µF Ceramic

COUT1 µF Ceramic

VOUT

VIN2.7V to 4.8V

1.8V

IOUT50 mA

MCP1703A

PLDO VIN MAX( ) VOUT MIN( )–( ) IOUT MAX( )×=

Where:

PLDO = LDO Pass device internal power dissipation

VIN(MAX) = Maximum input voltageVOUT(MIN) = LDO minimum output voltage

TJ MAX( ) PTOTAL RθJA× TAMAX+=

Where:

TJ(MAX) = Maximum continuous junction temperature

PTOTAL = Total device power dissipationRθJA = Thermal resistance from

junction-to-ambientTAMAX = Maximum ambient temperature

PD MAX( )TJ MAX( ) TA MAX( )–( )

RθJA---------------------------------------------------=

Where:

PD(MAX) = Maximum device power dissipationTJ(MAX) = Maximum continuous junction

temperatureTA(MAX) = Maximum ambient temperature

RθJA = Thermal resistance from junction-to-ambient

TJ RISE( ) PD MAX( ) RθJA×=

Where:

TJ(RISE) = Rise in device junction temperature over the ambient temperature

PTOTAL = Maximum device power dissipationRθJA = Thermal resistance from junction to

ambient

TJ TJ RISE( ) TA+=Where:

TJ = Junction temperatureTJ(RISE) = Rise in device junction temperature

over the ambient temperatureTA = Ambient temperature


MCP1703A
6.3 Voltage RegulatorInternal power dissipation, junction temperature rise,junction temperature and maximum power dissipationare calculated in the following example. The powerdissipation, as a result of ground current, is smallenough to be neglected.
6.3.1 POWER DISSIPATION EXAMPLE

Device Junction Temperature RiseThe internal junction temperature rise is a function ofinternal power dissipation and the thermal resistancefrom junction to ambient for the application. Thethermal resistance from junction to ambient (RθJA) isderived from an EIA/JEDEC standard for measuringthermal resistance for small surface mount packages.The EIA/JEDEC specification is JESD51-7, “HighEffective Thermal Conductivity Test Board for LeadedSurface Mount Packages”. The standard describes thetest method and board specifications for measuring thethermal resistance from junction to ambient. The actualthermal resistance for a particular application can varydepending on many factors, such as copper area andthickness. Refer to AN792, “A Method to DetermineHow Much Power a SOT23 Can Dissipate in anApplication” (DS00792), for more information regardingthis subject.

Junction Temperature EstimateTo estimate the internal junction temperature, thecalculated temperature rise is added to the ambient oroffset temperature. For this example, the worst-casejunction temperature is estimated below.

Maximum Package Power Dissipation at +40°CAmbient Temperature Assuming Minimal CopperUsage.

6.4 Voltage ReferenceThe MCP1703A can be used not only as a regulator,but also as a low quiescent current voltage reference.In many microcontroller applications, the initialaccuracy of the reference can be calibrated usingproduction test equipment or by using a ratiomeasurement. When the initial accuracy is calibrated,the thermal stability and line regulation tolerance arethe only errors introduced by the MCP1703A LDO. Thelow-cost, low quiescent current and small ceramicoutput capacitor are all advantages when using theMCP1703A as a voltage reference.

FIGURE 6-2: Using the MCP1703A as a Voltage Reference.

PackagePackage Type: SOT-23A

Input Voltage: VIN = 2.7V to 4.8V

LDO Output Voltages and CurrentsVOUT = 1.8VIOUT = 50 mA

Maximum Ambient TemperatureTA(MAX) = +40°C

Internal Power DissipationInternal Power dissipation is the product of the LDO output current times the voltage across the LDO(VIN to VOUT).

PLDO(MAX) = (VIN(MAX) - VOUT(MIN)) x IOUT(MAX)PLDO = (4.8V - (0.97 x 1.8V)) x 50 mAPLDO = 152.7 milli-Watts

TJ(RISE) = PTOTAL x RθJATJRISE = 152.7 milli-Watts x 336.0°C/WattTJRISE = 51.3°C

TJ = TJRISE + TA(MAX)TJ = 91.3°C

SOT-23A (336.0°C/Watt = RθJA)PD(MAX) = (+125°C - 40°C) / 336°C/WPD(MAX) = 253 milli-Watts

SOT-89 (153.3°C/Watt = RθJA)PD(MAX) = (+125°C - 40°C) / 153.3°C/WPD(MAX) = 0.554 Watts

SOT-223 (62.9°C/Watt = RθJA)PD(MAX) = (+125°C - 40°C) / 62.9°C/WPD(MAX) = 1.35 Watts

PIC®

GND

VINCIN1 µF COUT

1 µF

Bridge Sensor

VOUT VREF

ADO AD1

Ratio Metric Reference

2 µA Bias MicrocontrollerMCP1703A


MCP1703A
6.5 Pulsed Load ApplicationsFor some applications, there are pulsed load currentevents that may exceed the specified 250 mAmaximum specification of the MCP1703A. The internalcurrent limit of the MCP1703A will prevent high peakload demands from causing non-recoverable damage.The 250 mA rating is a maximum average continuousrating. As long as the average current does not exceed250 mA, pulsed higher load currents can be applied tothe MCP1703A. The typical current limit for theMCP1703A is 500 mA (TA = +25°C).

MCP1703A

7.0 PACKAGING INFORMATION

7.1 Package Marking Information

Legend: XX...X Customer-specific informationY Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn)* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line, thus limiting the number of availablecharacters for customer-specific information.

3e

3e

3-Pin SOT-23A Example:

3-Lead SOT-89 Example:

JG25

Standard Options for SOT-23A

Symbol Voltage* Symbol Voltage*JGNN 1.2 JJNN 3.0JMNN 1.5 JKNN 3.3JFNN 1.8 JPNN 4.0JHNN 2.5 JLNN 5.0JNNN 2.8 — —

* Custom output voltages available upon request. Contact your local Microchip sales office for more information.

Standard Options for SOT-89

Symbol Voltage* Symbol Voltage*PA 1.2 PC 3.0PF 1.5 PD 3.3MZ 1.8 PH 4.0PB 2.5 PE 5.0PG 2.8 — —


PA1211256

3-Lead SOT-223 Example:Standard Options for SOT-223

Symbol Voltage* Symbol Voltage*12 1.2 30 3.015 1.5 33 3.318 1.8 40 4.025 2.5 50 5.028 2.8 — —

Custom33 3.3 — —


1703A12E1211

256

ALQ21125

8-Lead DFN (2 x 3) Example:Standard Options for 8-Lead DFN (2 x 3)

Symbol Voltage* Symbol Voltage*ALQ 1.2 ALV 3.0ALR 1.5 ALW 3.3ALS 1.8 ALX 4.0ALT 2.5 ALY 5.0ALU 2.8 — —



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MCP1703A

APPENDIX A: REVISION HISTORY

Revision A (March 2012)• Original Release of this Document.


MCP1703A

PRODUCT IDENTIFICATION SYSTEMTo order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device: MCP1703A: 250 mA, 16V Low Quiescent Current LDO

Tape and Reel: T = Tape and Reel

Output Voltage*: 12 = 1.2V “Standard”15 = 1.5V “Standard”18 = 1.8V “Standard”25 = 2.5V “Standard”28 = 2.8V “Standard”30 = 3.0V “Standard”33 = 3.3V “Standard”40 = 4.0V “Standard”50 = 5.0V “Standard”*Contact factory for other output voltage options.

Extra Feature Code: 0 = Fixed

Tolerance: 1 = 1.0% (Custom)

2 = 2.0% (Standard)

Temperature: E = -40°C to +125°C (Extended)

Package Type: CB = Plastic Small Outline Transistor (SOT-23A), 3-leadDB = Plastic Small Outline Transistor (SOT-223), 3-leadMB = Plastic Small Outline Transistor (SOT-89), 3-leadMC = Plastic Dual Flat, No Lead Package (DFN) -

2x3x0.9mm, 8-lead.

PART NO. XXX

Output FeatureCode

DeviceVoltage

X

Tolerance

X/

Temp.

XX

Package

X-

Tapeand Reel

Examples:a) MCP1703AT-1202E/XX: Tape and Reel,

1.2V Low Quiescent LDO,Extended Temperature

b) MCP1703AT-1502E/XX: Tape and Reel,1.5V Low Quiescent LDO,Extended Temperature

c) MCP1703AT-1802E/XX: Tape and Reel,1.8V Low Quiescent LDO,Extended Temperature

d) MCP1703AT-2502E/XX: Tape and Reel,2.5V Low Quiescent LDO,Extended Temperature

e) MCP1703AT-2802E/XX: Tape and Reel,2.8V Low Quiescent LDO,Extended Temperature

f) MCP1703AT-3002E/XX: Tape and Reel,3.0V Low Quiescent LDO,Extended Temperature

g) MCP1703AT-3302E/XX: Tape and Reel,3.3V Low Quiescent LDO,Extended Temperature

h) MCP1703AT-4002E/XX: Tape and Reel,4.0V Low Quiescent LDO,Extended Temperature

i) MCP1703AT-5002E/XX: Tape and Reel,5.0V Low Quiescent LDO,Extended Temperature

XX = CB for 3LD SOT-23A package= DB for 3LD SOT-223 package= MB for 3LD SOT-89 package= MC for 8LD DFN package.

Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

© 2012 Microchip Technology Inc.

QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV

== ISO/TS 16949 ==

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

© 2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-62076-139-7

DS25122A-page 29

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.


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MCP1703A - 250 mA, 16V, Low Quiescent Current LDO Regulator - … · DS00792, Microchip Technology...

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