Maximizing IC Performance A High Efficiency Wireless Power …€¦ · Isleep Sleep mode input...

MT5815

Maximizing IC Performance A High Efficiency Wireless Power Transmitter

Email: [email protected] www.maxictech.com Rev 0.6 Tel: 86-10-62662828 Copyright © 2017 Maxic Technology Corporation

1 DESCRIPTION

The MT5815 is a System on Chip (SoC) for

magnetic induction based wireless power

transmitter solutions. It is fully compliant with the

latest Wireless Power Consortium (WPC) Qi

v1.2.4 specification, with support of both

Baseline Power Profile (BPP) and Extended

Power Profile (EPP).

The MT5815 provides powerful, flexible, feature

rich yet compact wireless power transmitter

solutions. It integrates everything except power

MOSFET’s and a few passive components.

These include high voltage Buck, LDO’s, three

pairs of N-MOSFET’s drivers (to support two

coils applications), multiple channels of unique

Analog Front End (AFE) for ASK demodulation,

FOD and Q factor detection, powerful and unique

DSP for demodulation and FOD, generic 12 bit

ADC and DAC, current sensing and Over

Voltage, Over Current and Under Voltage

Protection (OVP, OCP, UVP), oscillators and PLL

with support of external crystal for high accuracy

clock and extremely low power deep sleep mode,

plenty of channels of PWM for individual control

of each power MOSFET’s for flexible dead time

control and phase shift generation, power

adaptor interface detection and control with

support of QC 2.0/3.0, USB PD, SCP, FCP and

AFC, etc. As the control and configuration center

as well as data processor, MT5815 integrates an

ARM Cortex M0 processor with a spacious

64KByte eFlash memory and 4KByte SRAM, as

well as various serial interfaces (I2C, UART,

GPIO’s, etc.), offering powerful processing

capabilities and customized features. With a

single MT5815, one can implement any single

coil or dual coil transmitters defined in WPC

specification; by adding one tiny companion

driver chip (MT5812), one can implement a 4 coil

transmitter or two independent transmitters.

2 FEATURES

Wide input voltage, ranging from 3.5V to

20V, and up to 40W of power transfer

Compliant with latest WPC Qi specification

v1.2.4 and beyond, supporting proprietary

protocols.

Embedded 32-bit ARM M0 processor with

64KB eFlash and 4 KB SRAM

Supports fast charging power adaptors of

different protocols, including USB PD,

QC2.0/3.0, FCP and SCP, and AFC

Integrated three pairs of N-MOSFET drivers

for single and dual coil applications

Integrated Buck convertor and LDO’s for

internal power supplies

Integrated current sensing function for

current measurement and current mode

demodulation

Multiple channels of AFE+DSP for ASK

demodulation in voltage and current modes

Low operating current and extremely low

standby current in deep sleeping mode

Internal 32K and 60M oscillators and PLL

with support of external crystal for Apple

mode fixed frequency operation

Supports SWD, I2C, UART and JLink

Interface with plenty of GPIO’s

Dual VDD_IO pins for flexible I/O levels

Over-voltage/current/temperature protection

Input under voltage detection and lockout

function

Available in 6mm x 6mm QFN48 package

3 APPLICATIONS

WPC compliant wireless power transmitters

for smart phones and wearable devices

Medical, home appliance and industrial

applications

Car and other vehicle accessories

Other wireless power applications

mailto:[email protected]

http://www.maxictech.com/

MT5815



4 TYPICAL APPLICATION CIRCUIT

Single Coil Application

MT5815

VIN_SNSISH ISL

DEMOD1 DEMOD0

SW_B

GND

VDD5V

LDO3P3

ISNS_O

GPIO

BST1

DRV1H

SW1

DRV1L

BST2

DRV2H

SW2

DRV2L

BST3

DRV3H

SW3

DRV3L

Coil

Functional Modules (including Indicator LED,

Buzzer, Sensing, Protections, etc.)

PGATE

OCP_

VREF

GND

VIN-

VIN+

VIN

GPIO-E0/XIN XOUT

Optional

LDO1P5

GPIO

Fast Charging Adapter Interface (including USB

PD, QC2.0/3.0, FCP, SCP, etc.)

GND

Optional

VIN5V



MT5815



5 PIN CONFIGURATIONS AND FUNCTION

5.1 Pin Configurations

1VIN5V

2GPIOA0

3GPIOA1

4

5GPIOA4

6GPIOA6

7LDO1P5

8GND

9

10XOUT

11GPIOA7

12VDDIOA

GPIO-E0/XIN

MT5815YYWWXX

XXXX

36 GND

35 BST1

34 DRV1H

33 SW1

32 DRV1L

31 BST3

30 DRV3H

29 SW3

28

27 BST2

26 DRV2H

25 SW2

DRV3L

48

ISH

47

ISL

46

ISN

S_O

45

DE

MO

D1

44

DE

MO

D0

43

OC

P_V

RE

F

42

LD

O3P

3

41

VD

D5V

40

39

PG

ATE

38

VIN

37

SW

_B

VIN

_S

NS

GPIOA3

GND



MT5815



5.2 Pin Functions

Pin Name Pin No. Type Default

Function Description

VIN5V 1 PWR VIN5V +5V input voltage pin, connect 4.7uF capacitor.

VDD5V 41 PWR VDD5V BUCK converter’s output, 100mA souring capability, connect 10uF and

0.1uF capacitor to GND.

LDO1P5 7 PWR LDO1P5 Internal 1.5V LDO’s output, connect 1uF capacitor to GND.

VDDIOA 12 PWR VDDIOA Power supply for GPIO group A, connect 1.8V/3.3V/5V power, and

connect 1uF capacitor to GND.

VDDIOB 13 PWR VDDIOB Power supply for GPIO group B, connect 1.8V/3.3V/5V power, and

connect 1uF capacitor to GND.

VIN 38 PWR VIN Power Supply Input.

LDO3P3 42 PWR LDO3P3 Internal 3.3V LDO’s output, connect 1uF capacitor to GND.

GPIOA0 2 I/O CCID Can be configured as GPIO/TRXD/CCID/FCP/DAC/ADC1

GPIOA1 3 I/O DM Can be configured as GPIO/SWCK/SDA/TXD/DM/FCP/DAC/ADC2

GPIOA3 4 I/O DP Can be configured as GPIO/SWDIO/SCL/TRXD/DP/DAC/ADC4

GPIOA4 5 I/O Vin_sns Can be configured as GPIO/SCL2/TRXD2/ADC5

GPIOA6 6 I/O ISNS_O Can be configured as GPIO/SDA2/TXD2/ADC7

GPIOA7 11 I/O Vbrg_sns Can be configured as GPIO/SDA2/TXD2/ADC9

GPIOB0 14 I/O SCL Can be configured as GPIO/SCL3/TRXD3/PWM/ADC12

GPIOB1 15 I/O SDA Can be configured as GPIO/SDA3/TXD3/PWM/ADC13

GPIOB2 16 I/O Vcoil_sns Can be configured as GPIO/SCS/PWM/ADC14

GPIOB3 17 I/O OTP Can be configured as GPIO/MOSI/SCL3/ADC15

GPIOB4 18 I/O Buzzer Can be configured as GPIO/SCP/PWM/ADC16

GPIOB5 19 I/O Q_factor Can be configured as GPIO/MISO/SDA3/ADC17

GPIOB8 20 I/O GPIO Can be configured as GPIO/PWM

GPIOB6 21 I/O LED1 Can be configured as GPIO/LED/SCS/PWM

GPIOB7 22 I/O LED2 Can be configured as GPIO/LED/SCP/PWM

GPIOC0 23 I/O GPIO GPIO

GPIO-E0/XIN 9 I/O XIN Clock input pin, can be configured as external XTAL OSC(8~24MHz)

/GPIO

XOUT 10 I/O XOUT Clock output pin, can be configured as external XTAL OSC(8~24MHz)

/GPIO

DRV2L 24 PWM DRV2L Output-Drive pin for low side power MOSFET in the 2nd switch pair.

SW2 25 PWM SW2 Switching node in the 2nd switch pair.

DRV2H 26 PWM DRV2H Output-Drive pin for high side power MOSFET in the 2nd switch pair.

BST2 27 ANA BST2 Bootstrap cap in the 2nd switch pair, connect 10nF capacitor to SW2.

DRV3L 28 PWM DRV3L Output-Drive pin for low side power MOSFET in the 3rd switch pair.



MT5815



Pin Name Pin No. Type Default

Function Description

SW3 29 PWM SW3 Switching node in the 3rd switch pair.

DRV3H 30 PWM DRV3H Output-Drive pin for high side power MOSFET in the 3rd switch pair.

BST3 31 ANA BST3 Bootstrap cap in the 3rd switch pair, connect 10nF capacitor to SW3.

DRV1L 32 PWM DRV1L Output-Drive pin for low side power MOSFET in the 1st switch pair.

SW1 33 PWM SW1 Switching node in the 1st switch pair.

DRV1H 34 PWM DRV1H Output-Drive pin for high side power MOSFET in the 1st switch pair.

BST1 35 ANA BST1 Bootstrap cap in the 1st switch pair, connect 10nF capacitor to SW1.

SW_B 37 ANA SW_B Switching node of internal BUCK converter.

PGATE 39 ANA PGATE Gate control signal for external Over Voltage Protection P-MOSFET.

VIN_SNS 40 ANA VIN_SNS Input Voltage Sense.

OCP_VREF 43 ANA OCP_VREF Setting coil current OCP triggering threshold.

DEMOD0 44 ANA DEMOD0 Demodulation channel 0 input pin.

DEMOD1 45 ANA DEMOD1 Demodulation channel 1 input pin.

ISNS_O 46 ANA ISNS_O Input current sense voltage output.

ISL 47 ANA ISL Negative input of current sense

ISH 48 ANA ISH Positive input of current sense

GND 8, 36, GND GND GND Power Ground.



MT5815



6. SPECIFICATIONS

6.1 Absolute Maximum Ratings

VIN_SNS, PGATE 30V

VIN, SW_B, SW1, SW2, SW3 24V

BST1, DRV1H SW1+6V

BST2, DRV2H SW2+6V

BST3, DRV3H SW3+6V

VDD5V, VIN5V, VDDIOA, VDDIOB, GPIO_groupA, GPIO_groupB,

GPIOC0, GPIO-E0/XIN, XOUT, DRV1L, DRV2L, DRV3L,

OCP_VREF, DEMOD0, DEMOD1, ISNS_O

6V

LDO3P3 3.9V

LDO1P5 1.8V

ISL, ISH, GND ±0.3V

Storage Temperature -55°C to 150°C

Operating Junction Temperature Range, TJ -40°C to 125°C

Maximum Soldering Temperature (Reflow, Pb-Free, soldering, 10s) 260°C

6.2 ESD Ratings

Test Model Pins Ratings

HBM All pins ±2000V

CDM All pins ±500V

6.3 Recommended Operating Conditions

Operating Voltage (Vin) 3.5V ~ 20V

Operating Current (Iin) 0 ~ 2A

Operating Temperature (Environment) -40°C ~ 85°C

6.4 Thermal Information (Package Thermal Data)

Junction to ambient (RθJA) 36°C/W

Notes:

(1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only and functional operation of the device at these or any other conditions beyond

those indicated under “Recommended Operating Conditions” is not implied. Exposure to

absolute–maximum–rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.

(3) ESD testing is performed according to the respective JESD22 JEDEC standard. 6.1 Absolute Maximum

Ratings.



MT5815



6.5 Electrical Characteristics

(Test conditions: VIN=5.5V, TA=25°C unless otherwise stated.)

Symbol Parameter Conditions Min Typ Max Unit

Power Supply

Vin Input power supply 3.5 5 20 V

UVLO Under voltage lockout 2.5 V

UVLO_HYS Under Voltage Lockout

Hysteresis 0.3 V

Idc DC operation input current TBD mA

Iq Quiescent input current 1 mA

Isleep Sleep mode input current TBD uA

LDO

LDO3P3_Vout Output voltage Cout=1uF; VIN=5V

3.25 3.3 3.35 V

LDO3P3_Iout Load current 150 mA

LDO1P5 1.5V LDO Regulator Cout=1uF; VIN=5V 1.42 1.5 1.57 V

BUCK Convertor

Vout Output voltage Cout=10uF; L=4.7uH

4.95 5 5.05 V

Iout Load current 100 mA

Current Sense Programming Ability

Vsns_offset Current sense output offset

programming step

ISL=ISH,

Measure ISNS_O PIN

1.6/1.2/

0.9/0.6 V

Gain Current sense gain

programming step

20/30/40/

50

DEMOD

Vdem_cm

Demodulation input

common mode voltage

programming step

Programmable.

Default=0.6V

0.6/0.9

/1.2 V

ADC

Vin_adc ADC input range 0~2.4 V

N_adc Number of bits of ADC 12 bit

N_ch Number of input channels 16 N

DNL ±1 LSB

S_adc ADC sampling rate 100 KSPS

DAC

Vdac DAC output range 0~2.4 V

N_dac Number of bits of DAC 10 bit

S_dac DAC code update speed 2 MSPS

CLOCK

F_osc32k Low speed oscillator 32 KHz

F_osc60M 60M oscillator 60 MHz



MT5815



Symbol Parameter Conditions Min Typ Max Unit

MOSFET Drivers

Tl_on_off Low-side Gate Driver Rise

and Fall Times

CLOAD= 3nF; 10% to

90%, 90% to 10% 50 ns

Th_on_off High-side Gate Driver Rise

and Fall Times

CLOAD= 3nF; 10% to

90%, 90% to 10% 50 ns

GPIO

VIH Input high voltage 0.7*

VDDIO V

VIL Input low voltage

0.3*

VDDIO V

VOH Output high voltage I=8mA 0.8*

VDDIO V

VOL Output low voltage I=8mA

0.2*

VDDIO V

I_lkg leakage current 1 uA

DP and DM

VDPsrc Voltage source on DP 0.6 V

VDP3p3 3.3V source on DP 3.3 V

IDPsrc DP current source 10 uA

IDPsink DP sink current 100 uA

IDMsink DM sink current 100 uA

RDMdown DM pull down resistor 20 KΩ

IDPlkg DP leakage current DP/DM open 1 uA

IDMlkg DM leakage current DP/DM open 1 uA

Thermal Shut Down

T_thermal_r Thermal shut down rising

threshold

140 °C

T_thermal_f Thermal shut down falling

threshold

120 °C



MT5815



6.6 Typical Operating Characteristics

The following performance characteristics were taken using MT5815 wireless power transmitter and

MT5715 wireless power receiver at TA=25°C, unless otherwise noted.

404550556065707580859095

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5

Effi

cie

ncy

(%)

Output Current(A)

Efficiency vs. Output LoadTest Condition: Vin=5.5V, Vout=5V

404550556065707580859095

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5

Effi

cie

ncy

(%)

Output Current(A)

Efficiency vs. Output LoadTest Condition: Vin=9V, Vout=9V

404550556065707580859095

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5

Effi

cie

ncy

(%)

Output Current(A)


404550556065707580859095

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5

Effi

cie

ncy

(%)

Output Current(A)


404550556065707580859095

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5

Effi

cie

ncy

(%)

Output Current(A)


404550556065707580859095

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5

Effi

cie

ncy

(%)

Output Current(A)




MT5815



7 DETAILED DESCRIPTIONS

7.1 Overview

MT5815 is an SoC for wireless power transmitter solutions. It integrates all major functional blocks

of any WPC single coil or dual coil, BPP or EPP transmitters. These include DC to AC inverter

block (clock oscillator, PLL, PWM generators, MOSFET drivers), communication block (ASK

demodulation AFE and DSP, FSK modulation and 8 MHz to 24 MHz crystal support (for accurate

operating and modulated frequencies), fast charging power adaptor detection and control block

(Quick Charge 2.0/3.0, USB Power Deliver, FCP and SCP, AFC and other proprietary protocols),

internal power supply block (high input voltage buck and analog, I/O and core LDO’s), Q factor

detection and FOD block, miscellaneous function block (band gap and bias, temperature sensing,

ADC, DAC, current sensing, low frequency oscillator, CRC, encryption, etc.), exceptional condition

protection block (input over voltage protection, input over current protection, input under voltage

protection, coil over current protection, over temperature protection, etc.), serial interface block

(UART, I2C master and slave, SWD, JLink, GPIO’s), and an embedded processor block (32 bit

ARM Cortex M0, 64Kbyte eFlash, 4Kbyte SRAM, fully programmable operating clock, AHB and

APB, DMA’s and peripherals, advanced timers and watchdog timers, etc.). With the abundant

hardware functional blocks and the powerful M0 and the spacious eFlash memory, we allow our

customers to implement differentiated functions and features on their own, based on the basic

building blocks and libraries provided by us. MT5815 represents the state of art wireless power

transmitter SoC solution and set an industry bench mark for high integration, rich feature set,

extraordinary performance, extreme flexibility and low cost.



MT5815



7.2 Functional Block Diagram

MT5815

MOSDriver

OVPLDO 1.5V

12bit ADC

PLL

I/O Interface

10bit DAC

HV BUCK

Low Side Current Sense

ISNS_O

60M OSC

Demodulation

BST1

DRV1H

SW1

DRV1L

BST3

DRV3H

SW3

DRV3L

BST2

DRV2H

SW2

DRV2L

Biasing

ISLISH

DEMOD0

DEMOD1

GPIO-E0/XIN

XOUT

LDO1P5 VIN VIN_SNS PGATE

GPIO

(LED, Buzzer, etc.)VDDIOA VDDIOB

VDD5V

LDO 3.3V

USB PD, QC 2.0/3.0 Sensing

LDO3P3

GPIO(ADC)

1.5V

3.3V

GND

GND

SW_B

GPIO

(USB PD, FCP,

SCP, QC2.0/3.0)

OCP_VREF

GPIO(DAC)32K OSC

FOD & Q Factor Detection

Core

PWM Generator and FSK Modulator

VIN5V



MT5815



7.3 Theory of Operation



MT5815



8 APPLICATIONS AND IMPLEMENTIONS

8.1 Reference schematic

8.2 BOM

# Reference Value Description Footprint Quantity

1 C6, C23, C9, C15 10uF/16V CAP.CERAM.SMD,±10%,X7

R

0805 4

2 C11 4.7uF/10V CAP.CERAM.SMD,±10%,X7

R

0603 1

3 C2, C26, C28, C20 1uF/10V CAP.CERAM.SMD,±10%,X7

R

0402 4

4 C10, C16, C36, C37, C24, C7, C14 0.1uF/16V CAP.CERAM.SMD,±10%,X7

R

0402 7

5 C13, C17, C18, C21 100nF/50V CAP.CERAM.SMD,±10%,NP

O

1206 4

6 C12, C27, C31, C32, C8 22nF/16V CAP.CERAM.SMD,±10%,X7

R

0402 5

7 C19, C25 10nF/16V CAP.CERAM.SMD,±10%,X7

R

0402 2

8 C32, C33, C35, C39 6.8nF/10V CAP.CERAM.SMD,±10%,X7

R

0402 4

9 C34 3.3nF/10V CAP.CERAM.SMD,±10%,X7

R

0402 1

10 C1 100PF/10V CAP.CERAM.SMD,±10%,X7

R

0402 1

11 R8 20mΩ RES.SMD ±1% 1/4W 1206 1

12 R1, R2 4.7Ω RES.SMD ±5%,1/16W 0402 2

13 R3, R5, R9, R13, R23 10Ω RES.SMD ±5%, 1/16W 0402 5

Qfact

Q5AO3406

C32

22nF C35

6.8nF

LED1GREEN

LE

D2

Vin_sns

Vin

C36

0.1uF

VDD3P3SWCLKSWDIO

1234

J1

D1

BAV21WS

C21100nF

C6

10uF

C7

0.1uF

C12

22nF

C23

10uF

C24

0.1uF

C27

22nF

C18100nF

C17100nF

C13100nF

Vin

Vin

DRV3H

SW3

DRV3L

DRV2H

SW2

DRV2L

LE

D1

LE

D2

Vin_sns

Qfa

ct

SWDIO

SWCLK

SC

L

OT

P

SD

A

CC1ID

DM

DP

GPA4

GPA6

Buzz

er

DRV2H

SW3

SW2

BST1

DRV1H

DRV1L

BST3

DRV3H

DRV3L

BST2

SW1

DR

V2L

VD

D5V

4.7uH

L1

LD

O3P3

ISH

ISL

Vco

il_sn

s

GPA0

GPA1

GPA3

GPA7

LDO1P5

GP

B0

GP

B1

GP

B2

GP

B3

GP

B4

GP

B5

GP

B6

GP

B7L

DO

3P3

Vin5V1

GPIOA02

GPIOA13

GPIOA34

GPIOA45

GPIOA66

LDO1P57

GND8

GPIO-EO/XIN9

XOUT10

GPIOA711

VDDIOA12

VD

DIO

B13

GPIO

B0

14

GPIO

B1

15

GPIO

B2

16

GPIO

B3

17

GPIO

B4

18

GPIO

B5

19

GPIO

B8

20

GPIO

B6

21

GPIO

B7

22

GPIO

C0

23

DR

V2L

24

SW225

DRV2H26

BST227

DRV3L28

SW329

DRV3H30

BST331

DRV1L32

SW133

DRV1H34

BST135

GND36S

W_B

37

VIN

38

PG

AT

E39

VIN

_SN

S40

VD

D5V

41

LD

O3P3

42

OC

P_V

RE

F43

DE

MO

D0

44

DE

MO

D1

45

ISN

S0

46

ISL

47

ISH

48

MT5815-QFN48

U1

C281uF

C26

1uF

C20 1uF

C100.1uF

C910uF

C11 4.7uF

VDD5V

20mohm

R8

10

R3

10

R5

10

R9

10

R13

Vin

PG

AT

E

C2

1uF

4.7

R1

4.7

R2

C8

22nF

C1

100pF

VD

D5V

C1910nF

C2510nF

5.1KR26

VDD5V

51K_1%R17

5.1K_1%

R28

OTP

LD

O3P3

C37

0.1uF

10KR18

Vco

il

C39

6.8nF

499KR16

20KR27

Vcoil_sns10R23

SW2

5.1K

R22

200KR24

Vcoil

5.1RR15

ISN

S_O

C31

22nF

ISNS_O

T

Vin

Vin

T

GND_Vin

T

GND_pwr

T

GND_sig

T

SW3

SW

3

T

SW2

SW

2

Vcoil_ac

T

Demod0

Dem

od0

T

ISNS_O

ISN

S_O

T

Demod1

Dem

od1

T

OTP

OT

P

T

Vcoil_sns

Vco

il_sn

s

VDD5V

Type C or Micro USB input circurt

MT5815 Peripheral Circuit

OC

P_V

RE

F

OCP_VREF

LD

O3P3

10KR19

NCR30

Full-bridge Resonant Circuit

Demodulation FilteringSensing Circuit

Test Points

LN

LP

Q2B

VS3622DE

Q2A

VS3622DE

Q1B

VS3622DE

Q1A

VS3622DE

Demod1 Demod0

Dem

od0

Dem

od1

t? RT1

DMDPID

VBUSD-D+ID

VSS

6

USBUSB

C16

0.1

uF

X116M

C1112pF

C1212pF

R42M

option

C343.3nF

GNDSSRXP2SSRXN2VBUSSBU1DN1DP1CC1VBUSSSTXN1SSTXP1GND GND

SSTXP2SSTXN2

VBUSCC2DP2DN2

SBU2VBUS

SSRXN1SSRXP1

GND

TYPEC

5.1KR35

VinCC1 CC1

Vin

DMDP

DMDP

VinVin

Vin

C14

0.1uF

C15

10uF

Vin

10K

R22C33

6.8nF

000RR6000RR7

SCLSDA

GP

B8

GP

C0



MT5815



# Reference Value Description Footprint Quantity

14 R15 5.1Ω RES.SMD ±5% 1/8W 0805 1

15 R22, R28, R26, R35 5.1K RES.SMD ±1% 1/16W 0402 4

16 R18, R19, R22 10K RES.SMD ±5% 1/16W 0402 3

17 R27 20K RES.SMD ±5% 1/16W 0402 1

18 R17 51K RES.SMD ±1% 1/16W 0402 1

19 R24 200K RES.SMD ±5% 1/16W 0402 1

20 R16 499K RES.SMD ±1% 1/16W 0402 1

21 L1 4.7uH IDC.SMD ±10% 100mA 0603 1

22 D1 BAV21WS Diode.SMD 250V,250mA SOT-323 1

23 LED1 LED GREEN SOD-523 1

24 Q1, Q2, VS3622DE Dual FET

Rdson=14mΩ@Vgs=4.5V DFN33 2

25 Q5 AO3406 Vds=30V, ID=3.6A SOT-23-SM

T

1

26 Micro USB or Type C USB 1

27 U1 MT5815 QFN48-4M

M

1

Total 60



MT5815



9 DETAILED PACKAGING INFORMATIONS

QFN48 Package Outline and Dimensions

SYMBOL MILLIMETER

MIN NOM MAX

A 0.70 0.75 0.80

A1 - 0.02 0.05

b 0.15 0.20 0.25

c 0.18 0.20 0.23

D 5.90 6.00 6.10

D2 4.10 4.20 4.30

e 0.40BSC

Ne 4.40BSC

Nd 4.40BSC

E 5.90 6.00 6.102.7

E2 4.10 4.20 4.30

L 0.35 0.40 0.45

b1 0.69 0.79

h 0.30 0.35 0.40



MT5815



10 ORDERING INFORMATION

Part No. Package

Type Package Information

Package

Quantity

Ambient

Temperature Chip Mark

MT5815Q QFN48 6 x 6 mm QFN48 3000 -40°C~+85°C

MT5815

YYWWXX

XXXX

11 REVISION HISTORY

Revision Date Description

0.5 2018-12-17 Initial release.

Important Notice

Maxic Technology Corporation (Maxic) reserve the right to make correction, modifications,

enhancements, improvements and other changes to its products and services at any time and to

discontinue any product or service without notice. Customers should obtain the latest relevant

information before placing orders and should verify that such information is current and complete.

All products are sold subject to Maxic’s terms and conditions of sale supplied at the time of order

acknowledgement.

Reproduction, copying, transferring, reprinting this paper without Maxic’s written permission is

prohibited.

Maxic assumes no liability for applications assistance or the design of customers’ products. Maxic

warrants the performance of its products to the specifications applicable at the time of sale.

Customers are responsible for their products and applications using Maxic components. To

minimize the risks associated with customers’ products and applications, customers should

provide adequate design and operating safeguards.



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