Maual de Servicio Tv Lg 32lf15r-Ma
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Transcript of Maual de Servicio Tv Lg 32lf15r-Ma
LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP81A
MODEL : 32LF15R 32LF15R-MA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL41394480 (0904-REV00)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING ........................................................................... 13
BLOCK DIAGRAM.................................................................................. 18
EXPLODED VIEW .................................................................................. 19
SVC. SHEET ...............................................................................................
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1. Application rangeThis specification is applied to LP81A chassis.
2. Requirement for TestEach part is tested as below without special appointment.
(1) Temperature : 25 ± 5°C(77 ± 9°F), CST : 40 ± 5°C(2) Humidity : 65% ± 10%(3) Power : Standard input voltage (100-240V~, 50/60Hz)
* Standard Voltage of each products is marked by models.(4) Specification and performance of each parts are followed
each drawing and specif ication by part number inaccordance with BOM.
(5) The receiver must be operated for about 20 minutes priorto the adjustment.
3. Test method(1) Performance : LGE TV test method followed(2) Demanded other specification
Safety : CE, IEC SpecificationEMC : CE, IEC
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(LCD Module)Item Specification Measurement Result Remark
Display Screen Device 26” wide Color Display Module Resolution:1366X768
32” wide Color Display Module Resolution:1366X768
Aspect Ratio 16:9
LCD Module 26” TFT WXGA LCD 26” HD MAKER : LGD
32” TFT WXGA LCD 32” HD MAKER : LGD
Operating Environment 1) Temp. : 0 ~ 40 deg LGE SPEC
2) Humidity : 0 ~ 85%
Storage Environment 1) Temp. : -20 ~ 60 deg
2) Humidity : 0 ~ 85 %
Input Voltage AC100-240V~, 50/60Hz
Power Consumption Power on (Blue) : LF15R Volume: 1/8 volume of sound distortion point
≤ 110W 26” HD
≤ 160W 32” HD
St-By (Red) ≤ 1.0 W
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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5. Model Specification(NON EU)Remark
China(DK) Australia(BG)
VHF/UHF C1~C62 C1~C75
CATV S1~S41 S2~S44
Rear
Rear, Audio Out (8Ω) for commercial china
Rear
L/R Input
Specification
NON EU, CHINA
PAL SECAM B/G/D/K, PAL I/II, NTSC-M
BAND PAL NTSC
VHF/UHF E2~C69 2~78
CATV S1~S47 1~71
Upper Heterodyne
PAL, SECAM, NTSC
PAL, SECAM, NTSC
Y/Cb/Cr, Y/ Pb/Pr
HDMI-DTV, Only PCM MODE
Component (1EA), AV (1EA)
Item
Market
Broadcasting system
Available Channel
Receiving system
Video Input (1EA)
AV Output (1EA)
Component Input (1EA)
HDMI Input (1EA)
Audio Input (2EA)
Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed
720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
720*480 31.47 59.94 27.000 SDTV 480P
720*480 31.50 60.00 27.027 SDTV 480P
720*576 31.25 50.00 27.000 SDTV 576P 50Hz
1280*720 44.96 59.94 74.176 HDTV 720P
1280*720 45.00 60.00 74.250 HDTV 720P
1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
1920*1080 33.72 59.94 74.176 HDTV 1080I
1920*1080 33.75 60.00 74.25 HDTV 1080I
1920*1080 56.25 50 148.5 HDTV 1080P
1920*1080 67.432 59.94 148.350 HDTV 1080P
1920*1080 67.5 60.00 148.5 HDTV 1080P
6. Component Video Input (Y, PB, PR)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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Resolution H-freq.(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark
720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out but display
720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
720*480 31.47 59.94 27 SDTV 480P
720*480 31.5 60 27.027 SDTV 480P
720*576 31.25 50 27 SDTV 576P
1280*720 44.96 59.94 74.176 HDTV 720P
1280*720 45 60 74.25 HDTV 720P
1280*720 37.5 50 74.25 HDTV 720P
1920*1080 28.125 50 74.25 HDTV 1080I
1920*1080 33.72 59.94 74.176 HDTV 1080I
1920*1080 33.75 60 74.25 HDTV 1080I
1920*1080 56.25 50 148.5 HDTV 1080P
1920*1080 67.432 59.94 148.350 HDTV 1080P
1920*1080 67.5 60.00 148.5 HDTV 1080P
1920*1080 27 24 74.25 HDTV 1080P
1920*1080 33.75 30 74.25 HDTV 1080P
7. HDMI input (DTV)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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ADJUSTMENT INSTRUCTION
1. Application RangeThis spec. sheet is applied all of the 26/32” LCD TV, LP81Achassis (HURRICANE 5) by manufacturing LG TV Plant allover the world.
2. Specification1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of
25±5°C of temperature and 65±10% of relative humidity ifthere is no specific designation.
4) The input voltage of the receiver must keep 100-220V,50/60Hz.
5) The receiver must be operated for about 5 minutes prior to theadjustment when module is in the circumstance of over 15º.In case of keeping module is in the circumstance of 0°C, itshould be placed in the circumstance of above 15ºC for 2hours.In case of keeping module is in the circumstance of below -20ºC, it should be placed in the circumstance of above15ºC for 3 hours.
3. PCB assembly adjustment method3.1. Mstar Main S/W program download
(1) Preliminary steps1) Download method 1 (PCB Assy)
- HD
2) Connect the download jig to D-sub jack
(2) Download steps1) Execute ‘ISP Tool’ program in PC, then a main window
will be opened
2) Click the connect button and confirm “Dialog Box”.
3) Click the Config button and Change speedE2PROM Device setting : over the 350Khz
4) Read and write bin fileClick “(1)Read” tab, and then load downloadfile(XXXX.bin) by clicking “Read”.
5) Click “Auto(2)” tab and set as below6) click “Run(3)”.7) After downloading, check “OK(4)” message.
Double click
(1)
f i l ex x x .bin
f i l ex x x .bin
(4) .......... OK
)(3
(2)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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3.2. Auto color balance(ADC)-Component(1) Method of Auto Component Color Balance
1) Convert to Component in Input-source2) Input the Component (Which has 720p@60Hz 100%
Color Bar YPbPr signal into Component.(MSPG-925F Model: 217/ Pattern: 65)
3) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)0x00 0x02 instruction
(2) Confirmation1) We confirm whether “0xF3 (offset), 0xF4 (gain)” address
of EEPROM “0xBC” is “0xAA” or not.2) If “0xF3”, “0xF4” address of EEPROM “0xBC” isn’t
“0xAA”, we adjust once more.3) We can confirm the ADC values from “0x06~0x0B”
addresses in a page “0xBC”.* Manual ADC process using Service Remocon. After
enter Service Mode by pushing “ADJ” key, execute“Auto-RGB” by pushing “_” key at “Auto-RGB”.
3.3. TOOL Option, Area Option(1) Profile : Must be changed the option value because being
different with some setting value depend on module maker,inch and market.
(2) Equipment : adjustment remote control.(3) Adjustment method
The input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)* Refer to Job Expression of each main chassis ass’y(EBTxxxxxxxx) for Option value
* Before PCBA check, you have to change the Tool option, Areaoption and have to AC off/on. (Plug out and in)
* After Tool Option/ Area Option change, you have to AC power off.* Never push the IN-STOP KEY after completing the function
inspection.
3.4. Check SW Version(1) Method
1) Push In-start key on Adjust remote-control.2) Check “Main V3.xx”
4. EDID (The Extended Display Identification Data )
/DDC (Display Data Channel) download* Caution
Use the proper signal cable for EDID Download
4.1. EDID DOWNLOAD* Caution:
- Never connect HDMI & D-SUB Cable at the same time.- Use the proper cables below for EDID Writing
* EDID Data
<HDMI 1 : 256bytes>The data is same without Physical address
-> Physical address(F) : HDMI 1 -> 10
- Detail EDID Options are below (A, B, C, D, E, F) A. Product ID
B. Serial No: Controlled on production lineC. Month, Year: Controlled on production line:
ex) Monthly: ‘09 ‘09Year: ‘2007 -> ‘11’
D. Model Name(Hex):
E. Checksum: Changeable by total EDID data
Item
Manufacturer ID
Version
Revision
Condition
GSM
Digital : 1
Digital :3
Data
1E6D
01
03
For HDMI EDID
Model name Model Name(HEX)
LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Model Product ID
Name Dec Hex EDID table
HD 4018(A) 9CF5 F59C
4018(D) 9CF6 F69C
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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4.2. HDCP SETTING(High-Bandwidth Digital Contents Protection)* Before HDCP Download, you have to Set the Configuration
that CMD delay.-> Configuration -> Option-> I2C delay(Write Byte : 0.5 ms,Read Byte : 0.5ms, Read CMD Byte : 0.5ms)
* Change the DDC -> After Write Data delay Time 20ms ,alsoChange the After Send Read Command delay Time 20ms.
* Check the Communication Clock -> 45KHz.
(1) Connect D-sub Signal Cable to D-Sub Jack(2) Input HDCP key with HDCP-key- in-program(3) HDCP Key value is stored on EEPROM(AT24C64) which
is From “0x80” addresses of 0xA0 page(4) AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925(5) HDCP Key value is different among the sets.
4.3. Adjustment of White Balance- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to C0 and decrease the others.- Adjustment mode : Two modes - Cool and Warm
(Medium data is automatically calibrated by the Cool data)
* Required Equipment1) Remote controller for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product (ch:9)3) Auto W/B adjustment instrument(only for Auto adjustment)
(1) Connecting diagram of equipment for measuring (ForAutomatic Adjustment
1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time
heat-run mode when pushing the power on by poweronly key
- Maintain the DDC adjustment mode with samecondition of Heat-run (Maintain after AC off/on in statusof Heat-run pattern display)
2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by
off/on in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and
release DDC adjust mode
3) Enter the adjust mode of white balance- Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 200cd/m2≥ in the cool mode (For LCD)
4.4. Adjustment of White Balance(for Manual adjustment)
(1) Adjustment mode : Two modes (Cool and Warm)(Medium data is automatically calibrated by the Cool data)
(2) Color analyzer(CA100+, CA210) should be used in thecalibrated ch by CS-1000(LCD : CH9, PDP : CH10)
(3) Operate the zero-calibration of the CA100+ or CA-210,then stick sensor to the module when adjusting.
(4) For manual adjustment, it is also possible by the followingsequence.1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push “Exit” key.3) Change to the AV mode by remote control.(Push front-
AV or Input key)4) Input external pattern(85% white pattern)5) Push the ADJ key two times (entering White Balance
mode)6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C.
7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.8) Adjust two modes (Cool and Warm)
(Fix the one of R/G/B and change the others)9) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.
* CASEFirst adjust the coordinate far away from the target value(x, y).(1) x, y > target
1) Decrease the R, G. (2) x, y < target
1) First decrease the B gain, 2) Decrease the one of the others.
(3) x > target, y < target1) First decrease B, so make y a little more than the target.2) Adjust x value by decreasing the R
(4) x < target, y > target1) First decrease B, so make x a little more than the target.2) Adjust x value by decreasing the G
- Standard color coordinate and temperature when using theCA100+ or CA210 equipment
To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1XD : Manual – XD Contrast : Off, XD Colour : Off(If you miss the upper condition, the coordinates of W/B canbe lower than the spec.)
Mode Color coordinate Temp ∆uv
X Y
Cool 0.276±0.002 0.283±0.002 11,000K 0.000
Warm 0.313±0.002 0.329±0.002 6,500K 0.003
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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** DDC Command set **
5. DDC command protocol5.1. Signal TABLE
5.2. E2PROM Data Write(1) Signal TABLE
LEN : 84h+BytesCMD : E8hADH : E2PROM Slave Address (A0,A2,A4,A6), Not 00h
(Reserved by BufferToEEPROM)ADL : E2PROM Sub Address(00~FF)Data : Write dataDelay : 20ms
(2) Command Set
* Purpose1) EDID write : 16-byte by 16-byte, 8 order (128-byte)
write(TO “00 – 7F” of “EEPROM).2) FOS Default write : 14-mode data write
(SyncFlags, HPeriodH, HPeriodL, VtotalH, VtotalL,SrcHTotalH, SrcHTotalL, SrcHStartH, SrcHStartL,SrcVStartH, SrcVStartL, HsyncPhase).
3) Random Data write : write the appointment Address ofE2PROM.
(3) E2PROM Data Read1) Signal TABLE
2) COMMAND SET
* Purpose : To read(84h) the appointment Address of E2PROMby 128(80h)-byte
Adjustment
Aging On/Off
Input select
R GAIN
G GAIN
B GAIN
R GAIN
G GAIN
B GAIN
R GAIN
G GAIN
B GAIN
CSM mode
AUTO ADC
EEPROM Read
EEPROMWrite
CMD(HEX)
F3
F4
16
18
1A
16
18
1A
16
18
1A
F2
F1
E7
E8
ADR
00
00
00
01
02
00
00
00
00
VALUE
FF/00
00 - C0
00 - C0
00 - C0
00 - C0
00 - C0
00 - C0
00 - C0
00 - C0
00 - C0
00
01
02
0, 1, 2
00
data
detail
FF : ON / OO : OFF
0x10 : TV
0x20 : AV1
0x21 : AV2
0x40 : Component1
GAIN adjustment
CSM COOL
GAIN adjustment
CSM NORMAL
GAIN adjustment
CSM WARM
COOL
NORMAL
WARM
0: Offset adjustment
1: Gain adjustment
2: Offset and Gain adjustment
EEPROM read
EEPROM write
Delay 20m
VAL
EEPROM WRITE E8h 94 16-Byte Write
(84+n)h n-byte Write
Adjustment contents CMD(hex) LEN Details
128 Bytes
Delay 150ms
EEPROM READ E7 A0 0 0-Page 0~7F Read
80 0-Page 80~FF Read
A2 0 1-Page 0~7F Read
80 1-Page 80~FF Read
A4 0 2-Page 0~7F Read
80 2-Page 80~FF Read
A6 0 3-Page 0~7F Read
80 3-Page 80~FF Read
Adjustment contents CMD(hex) ADH(hex) ADL(hex) Details
- 13 - LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
TROUBLESHOOTING
AV
in
Com
p in
RG
B in
(D/L
)
AV
out
CV
BS
IN
LIN
E O
UT
LIN
E IN
LIN
E_M
UT
E
RF
(Tun
er)
DIS
PLA
Y M
OD
ULE
HD
MI
TM
DS
351P
AG
HD
MI M
UX
DD
R M
EM
SE
RIA
LF
LAS
H
Mst
arR
omeo
LGE
6891
CD
NT
P30
00A
Dig
ital
Aud
io A
MP
MA
IN N
VM
MC
74H
C40
66A
udio
SW
LM32
4X
4 A
MP
ED
ID N
VM
DD
C/H
DP
/CE
C
TM
DS
(HD
MI i
n)P
AR
T_I
2C
SW
_RE
SE
T
I2S
OU
T
LVD
S
TM
DS
(HD
MI i
n) DD
C/H
PD
[HD
MI M
UX
, dire
ct J
AC
K to
MA
IN IC
]
DD
C
AU
DIO
_SW
LIN
E IN
LIN
E IN
Y/P
b/P
r IN
DS
UB
_DD
C
x0.5
5
LIN
E_M
UT
E
LIN
E O
UT
CV
BS
OU
Tx4
x0.5
5LI
NE
IN
CV
BS
INS
IF IN
TU
NE
R_I
2C
PA
RT
_I2C
HD
MI_
SE
L
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 14 -
1. No power(1) Symptom
1) It is not discharged minutely from module.2) Light does not come into the front LED.
(2) Check process
Plug in the power cord.No
Yes
Is the power cordplugged in?
Connect the cable to SC100No
Yes
Are the line filter andPSU connected?
Replace the fuse.No
Yes
Is the fuse of PSUnormal? (F101)
Connect a cable P1100.
After all cables connect is removed to PSU, theAC voltage marking is authorized on manual.When ST-BY 5V is not operated. replace PSU.
No
Yes
Is it connectedthat PSU and P1100
in Main B/D?
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
2. No Raster(1) Symptom
1) No OSD and image occur at screen. 2) It maintains the condition where the front LED is green.
(2) Check process
3. Unusual display from RF mode
Check the LCD Module
Replace thePower board.
Doesminute discharge
at Module?
Is the inverter/ VaVs on?
Is output the normalityLow/High voltage exceptStand-by 5V?
Yes
No No
Is the link cablenormal?
Yes
Is the IC801’soutput normal?
Reconnect Panel line cable.(HD : P403)
No
Replace the VSC.No
Yes
Check the power.
Isvideo output of the
Tuner normal? (CheckTU500_Pin13)
Is theinput voltage
normal?(CheckPin3)
Is the I2C communication normal?(Check Pin9, Pin10)
Yes
No Yes
Is the LVDSCable connected?
well
Yes
Change the IC(IC801)
Cable inserts well.No
No
Check the Tuner.
No
Block A
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 16 -
4. Unusual display from rear AV mode.
Yes
Is video input ofthe A/V Jack normal?
(Check R8044)Check the input source.
Same as Block A.
No
5. Unusual display from component 2 model
Yes
Is videoinput of the ComponentJack normal? (Check
R8030/32/33)
Check the input source.
Change IC801.
No
- 17 - LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Set on speakerin menu.
Download theEDID data.
Check the signal afterIC600 refer to circuitdiagram.
No No
No
Check the Tuner In/Out.No
No
Check the Speakercable.
No
Replace IC600.No
Replace IC801.No
Yes
Yes
All input(mode)is no sound.
Only HDMI isno sound.
Is the speakercable normal?
Is the speakeron it menu?
Yes
Only AV/COM2/PCinput is no sound.
Is the output ofIC600 normal?
Yes
Yes
Only RF is no sound.
Yes
Is IC801 operatednormality?
Yes
Replace IC601.
Replace Main B/D.
NoIs IC601 operated
normality?
Yes
6. No Sound(1) Symptom
1) LED is green2) Screen display but sound is not output.
(2) Check process
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 18 -
RF
(TU
50
0)
RG
B(S
VC
On
ly)
(JK
10
4)
TM
DS
/DD
C/H
PD
_SIN
KH
DM
I_S
EL
/HD
MI_
IIC
LG
E6
89
1D
D(I
C8
01
)L
GE
68
91
DD
(IC
80
1)
HD
MI
(DT
V O
nly
)(J
K3
01
)
TM
DS
M
ux
TM
DS
/DD
C/H
PD
_S/W
AV
IN
(JK
20
0)
MN
T_O
UT
(JK
20
0)
LC
D(L
VD
S)
(P4
03
)
LC
D(L
VD
S)
(P4
03
)
TX
CO
[0:4
] /
TX
CE
[0:4
] /
TX
CL
KO
/ T
XC
LK
E
NT
P3
00
0D
igit
al A
MP
(IC
60
0)
NT
P3
00
0D
igit
al A
MP
(IC
60
0)
CO
MP
IN
(JK
10
1)
IIC
_DS
UB
CV
BS
_VIN
CO
MP
Y/P
b/P
r
TV
_MA
IN/M
AIN
_SIF
SIF
AM
_AU
DIO
CO
MP
_LR
MN
T_L
R_O
UT
SP
K 2
CH
/SP
K_H
OT
EL S
WIT
CH
DU
AL
FE
T
SW
ITC
H
DU
AL
FE
T
LV
DS
_PW
R_1
2V
/RL
_ON
+1
2V
24
C6
4E
EP
RO
M DD
C
HD
MI_
5V
_DE
T(H
PD
)/H
PD
_MS
T
CV
BS
_L/R
IN
MN
T_V
OU
T(A
MP
: G
AIN
X 4
)/M
UT
E_L
INE
AM
PG
AIN
X 4
(IC
60
1)
24
C6
4E
EP
RO
MD
DC
IIC
_S
YS
SE
CA
M_L
DD
R(I
C9
00
)D
DR
(IC
90
0)
MA
DR
[0:1
1]
MD
AT
A[
0:1
5]
SW
_RE
SE
T /
IIC
_PA
RT
I2S
MU
TE
_MA
IN /
AC
_DE
TA
MP
_MU
TE
_HO
TE
L
PS
U(P
11
00
)P
SU
(P1
10
0)
RL
_ON
/SE
LE
CT
/D
IMM
ING
/SY
NC
MN
T_5
V/A
C_D
ET
/SC
_RS
T
MX
25
L1
60
5S
F-R
OM
(16
M)
(IC
80
3)
MX
25
L1
60
5S
F-R
OM
(16
M)
(IC
80
3)
SP
I_C
Z/C
LK
SP
I_D
AU
DIO
_R
(IC
30
0)
(IC
30
2)
(IC
80
2)
BLOCK DIAGRAM
- 19 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
300
200
510
500
120
122
400
800
801
802
804
803
530
540
521
821
805
550
910
900
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
A2
LV1
A10
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
0.1u
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C113
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22
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C112
4
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C112
6
33
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1%R1
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4
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100u
F16V
C110
9
PANE
L_ON
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T_M
ST
22
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F16V
C1
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0
10
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C1
11
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0.1u
FC1
139
+12V
0 READ
Y
R118
8
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MM
ING
DIS
P_EN
P_16
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ETS
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2333
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10
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AD
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VC1
128
0.1
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C1
11
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11
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R1
10
2
1.6K
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2.2u
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V
C111
6
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T_M
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0.1u
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KR
11
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ING
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pF
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ON
14GN
D
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4GN
D
18AC
D
13GN
D
8GN
D
3GN
D
17E
rror
out
125V
7GN
D
216
V
16AG
ND
115V
612
V
116
V
20In
vert
er O
N
15GN
D
105V
512
V
21A
.Dim
22PW
M D
im
23Se
lect
24SY
NC
MB
R230L
SF
T1G
30V
D1
10
0
5.6KR1107
18K
R110
633
KR1
140
33K
R114
1
2.2K
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22.
2KR1
154
2.2K
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3
33
0
1%
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4
USB
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11
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2012
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LE
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lock
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ER
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ST
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R1
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ITC
H V
CC
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l t
o 2
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e
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ER
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2V
SW
IT
CH
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1.8
V
20m
A
SW
ITC
H 5
V->
DD
R 2
.5V
MA
X 1
A
MA
X 1
A
MA
X 1
A
R2
R1
R1
R1
R2R
2
V0
= 0
.8(R
1+
R2
) /
R2
*A
pp
lied
to
SIF
,HD
MI,
AD
C,M
PL
L,A
UD
*3
.3V
_N
TP
,TW
99
10
,ET
C.
*N
TP
.US
B,T
W9910
*12V
AU
DIO
and P
AN
EL
*S
HA
RP
32" :
DC
DIM
MIN
G
R1
12
2S
ha
rp
52
"
AU
OX
4.7
K
OR
11
97
CM
O 3
2/4
2/4
7
O
O
CM
O 5
7"
XX
C1
11
4X
R1
12
7
XX
OO
the
Re
st(
w/C
MO
26
")
O
O
X
4.7
K
4.7
K
0.4
7u
F
X
0.4
7u
F
0.4
7u
F
X
R1
18
3
O
OXO
R1
15
5
O XX X
XXX
R1
18
5
O
R1
10
3
O OX
R1
18
6
O XXX XX X
R1
18
7
O XX
X X X
O X X OOR
11
04
*P
AN
EL
OP
TIO
N
XS
ha
rp
32
"X
XX
XX
OX
XX
X
20
08
/0
1/0
8
SCHEMATIC DIAGRAM
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
SCL_
Part
0.1u
FC1
011
51A
R100
1
75R100
0
0.1uF C1006
+1.8
V_A
VD
0.1uF C1009
1MR1
005
+3.3
V
PIP_
V
0.1u
FC1
000
51AR1
000
+1.8
V
+1.8
V_A
VD
+1.8
V_A
VD
+1.8
V_A
VD
0.01uF C1012
DE
C_
65
6[0
-7]
DEC_
656_
CLK
TW
9910D
AN
A2-G
R
IC1
00
0
1V
DD
E_1
2S
CL
K
3S
DA
T
4P
DN
5R
ST
B
6T
MO
DE
7N
C_1
8A
VD
_1
9Y
MU
X3
10
YM
UX
2
11
YG
ND
12
YM
UX
1
13 YMUX0
14 AVS_1
15 CIN0
16 AVD_2
17 AVS_2
18 NC_2
19 VSS_1
20 VS
21 HS
22 MPOUT
23 CLKX2
24 VSSE_1
25
VD
DE
_22
6V
D[1
5]
27
VD
[14
]2
8V
D[1
3]
29
VD
[12
]3
0V
D[1
1]
31
NC
_3
32
VD
D3
3V
D[1
0]
34
VD
[9]
35
VD
[8]
36
VD
[7]
37VD[6]38VD[5]39VD[4]40VD[3]41VD[2]42VSS_243NC_444VD[1]45VD[0]/SIAD046VSSE_247XTI48XTO
+3.3
V
47uF
16V
C101
0
SDA
_Par
t0.01uF C1001
27M
Hz
X10
00
0.1uF C1008
100
R100
3
100
R100
2
0.1u
FC1
004
0.1u
FC1
002
0.1u
FC1
003
SW_R
ESET
+3.3
V
4.7K
R100
1RE
ADY
100
R100
4
4.7K
R100
6
51R1
009
10pF
C101
3
RE
AD
Y
120O
HM
UBW
2012
-121
FL1
000
0
R1007
20pF
C1014
RE
AD
Y
0.1u
FC1
015
22pF C1005
22pF C1007
DE
C_
65
6[3
]
DE
C_
65
6[4
]
DE
C_
65
6[5
]
DE
C_
65
6[2
]
DE
C_
65
6[7
]
DE
C_
65
6[1
]
DE
C_
65
6[6
]
DEC_656[0-7]
DE
C_
65
6[0
]
MS
TA
R
TW
99
09
10
1
1
TW
9910
MAX
1A
EA
X40043809
MS
TA
R L
P81A
20
08
/01
/08
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
MA
DR
[4]
0.1
uF
C9
03
MA
DR
[1]
MA
DR
[11]
MA
DR
[9]
SB
A0
MA
DR
[2]
15
0R
EA
DY
R9
03
LD
QM
CK
E
MA
DR
[2]
MA
DR
[3]
MD
AT
A[0
-15
]
MA
DR
[9]
MC
LK
MA
DR
[7]
MA
DR
[5]
10
00
pF
C9
07
MA
DR
[6]
0.1
uF
C9
04
+2.
5V_V
DD
M_M
ST
0.1
uF
C9
06
0.1
uF
C9
09
WE
Z
+2.5
V_V
DD
M_M
ST
UD
QM
0.1
uF
C9
05
MA
DR
[0]
CA
SZ
DQ
S1
1KR9
06
MA
DR
[3]
MA
DR
[0-1
1]
MA
DR
[4]
MA
DR
[8]
15
0R
90
5
MA
DR
[0]
MA
DR
[1]
1KR9
09
MC
LK
Z
0.1
uF
C9
01
SB
A1
MA
DR
[8]
MA
DR
[6]
DQ
S0
RA
SZ
0.1
uF
C9
08
MA
DR
[11]
MA
DR
[10]
MA
DR
[7]
0.1
uF
C9
02
MA
DR
[5]
MA
DR
[10]
0.1
uF
C9
00
1/1
6W
56
AR
903
1/1
6W
56
AR
902
1/1
6W
56
AR
901
1/1
6W
56
AR
900
HY
B25D
C256163C
E-4
IC9
00
26
BA
0
27
BA
1
28
A1
0/A
P
29
A0
30
A1
31
A2
32
A3
33
VD
D_3
34
VS
S_1
35
A4
36
A5
37
A6
38
A7
39
A8
40
A9
41
A11
42
A1
2/N
C_
5
43
NC
_6
44
CK
E
45
CK
46
CK
47
UD
M
48
VS
S_2
49
VR
EF
50
NC
_7
17
A1
3/N
C_
2
3V
DD
Q_1
6V
SS
Q_1
16
LD
QS
15
VD
DQ
_3
14
NC
_1
13
DQ
7
12
VS
SQ
_2
11
DQ
6
10
DQ
5
9V
DD
Q_2
8D
Q4
7D
Q3
4D
Q1
5D
Q2
25
NC
_4
24
CS
23
RA
S
2D
Q0
22
CA
S
21
WE
1V
DD
_1
20
LD
M
19
NC
_3
18
VD
D_2
51
UD
QS
52
VS
SQ
_3
53
NC
_8
54
DQ
8
55
VD
DQ
_4
56
DQ
9
57
DQ
10
58
VS
SQ
_4
59
DQ
11
60
DQ
12
61
VD
DQ
_5
62
DQ
13
63
DQ
14
64
VS
SQ
_5
65
DQ
15
66
VS
S_3
MD
AT
A[1
2]
MA
DR
[4]
MA
DR
[4]
MD
AT
A[1
1]
MA
DR
[0-1
1]
MA
DR
[9]
MA
DR
[8]
MA
DR
[11]
MA
DR
[11]
MA
DR
[2]
MDATA[0-15]
MD
AT
A[0
-15
]
MD
AT
A[1
]
MD
AT
A[2
]
MD
AT
A[1
4]
MD
AT
A[0
]
MA
DR
[5]
MA
DR
[0]
MA
DR
[6]
MA
DR
[0]
MA
DR
[8]
MA
DR
[10]
MA
DR
[7]
MA
DR
[7]
MA
DR
[10]
MA
DR
[9]
MA
DR
[3]
MD
AT
A[1
5]
MD
AT
A[5
]
MD
AT
A[7
]
MD
AT
A[1
0]
MA
DR
[1]
MA
DR
[6]
MD
AT
A[9
]M
DA
TA
[6]
MA
DR
[5]
MA
DR
[1]
MA
DR
[2]
MA
DR
[3]
MD
AT
A[3
]
MD
AT
A[4
]
MD
AT
A[8
]
MD
AT
A[1
3]
#9.D
DR
MST
AR
DD
R9
11
** M
UL
TI
ITE
M
SUB
- H
YN
IX :
EA
N31
7292
02M
AIN
- Q
IMO
ND
A :
EA
N41
7885
01
EA
X40
0438
09M
STA
R L
P81A
2008
/01/
08
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
LE
D_R
_PW
M_B
ig
PWM
3
PC_AUD_L
4.7
uF
C8
34
1N
4148W
10
0V
D8
00
READY
+3.3
V_M
ST
MC
LK
Z
PC
_V
S
2.2uF C849
+2.
5V_V
DD
M_M
ST
MA
IN_S
IF+
3.3
V_M
UL
TI_
MS
T
HWRESET
CVBS_RIN
SW
_RE
SE
T
RE
AD
YR
81
09
+5V
_S
T
SP
I_D
I
SID
E_Y
COMP2_L
1KR8
10
5
RE
AD
YR
81
06
SID
E_C
+3.3
V_M
ST
2.2uF C845
SP
I_C
LK
CO
MP
1_P
b
PC
_H
S
PIP
_V
OU
T
20pF C841
PWM
2
MN
T_V
OU
T_T
1uF C837
SW_L
+3.3
V_M
UL
TI_
MS
T
PC_AUD_R
UD
QM
MC
LK
+3.3
V_M
ST
DE
C_
65
6[0
-7]
MD
AT
A[0
-15
]
MA
DR
[0-1
1]
KE
Y2
SP
I_C
Z
SPI_
DI
CV
BS
_VIN
SID
E_V
2.2uF C847
2.2uF C842
AT
24C
64A
N-1
0S
U-2
.7IC
80
2
3A
2
2A
1
4G
ND
1A
0
5SD
A
6S
CL
7W
P
8V
CC
10
uF
16V
C8
75
+3.3
V_M
UL
TI_
MS
T
SC
L_
Pa
rt
+3.3V_MULTI_MST
IR
CO
MP
2_P
r
PWM
1
2.2uF C846
+2.
5V_V
DD
M_M
ST
+3.3
V_M
UL
TI_
MS
T
SW_R
PWM
0
DQ
S1
RE
AD
YR
81
07
RE
AD
YR
81
12
+3.3
V_M
ST
SP
I_C
Z
+3.3
V_M
UL
TI_
MS
T
CO
MP
1_P
r
+1.2
V_V
DD
C_M
ST
PC
_G
2.2uF C843
0R8
17
5
SB
A0
LD
QM
E_D
IMM
ING
RA
SZ
PC
_R
SP
I_D
O
CO
MP2_
Y
COMP2_R
+3.3
V_M
UL
TI_
MS
T
MNT_R_AMP
2.2uF C839
2.2uF C848
PWM
1
CE
C_C
MNT_L_AMP
DIS
P_E
N
PC
_B
CVBS_LIN
CA
SZ
0R8
17
6
2.2uF C840
CO
MP
2_P
b
CK
E
CO
MP1_
Y
LE
D_G
1MR8
06
4
SB
A1
SD
A_
Part
PWM
0
+3.3
V_M
ST
20pF C838
+3.3
V_M
UL
TI_
MS
T
14.31818MHzX800
SD
A_L
ED
SP
I_D
O
10
uF
16V
C8
79
0.1
uF
C8
04
RE
AD
Y
KE
Y1
SPI_
CL
K
WE
Z
DQ
S0
TV
_MA
IN
AM_AUDIO
10
uF
16V
C8
33
DE
C_656_C
LK
TX
CE
0+
,TX
CE
0-,
TX
CE
1+
,TX
CE
1-,
TX
CE
2+
,TX
CE
2-,
TX
CE
3+
,TX
CE
3-,
TX
CE
4+
,TX
CE
4-,
TX
CL
KE
+,T
XC
LK
E-
TX
CL
KO
+,T
XC
LK
O-,
TX
CO
0+
,TX
CO
0-,
TX
CO
1+
,TX
CO
1-,
TX
CO
2+
,TX
CO
2-,
TX
CO
3+
,TX
CO
3-,
TX
CO
4+
,TX
CO
4-
PWM
2
KD
S181
D8
02
10
0R
80
18
10
0R
80
19
4.7
uF
10V
C8
00
33K
R8
01
6
0.1
uF
50V
C8
24
KD
S181
D8
01
AC
_RST
HW
RE
SET
+5V
ST
_MS
T0R
80
08
RE
SE
T_+
5V
ST
_M
ST
I2S_MCLK
I2S_WS
I2S_SCK
I2S_SDO
I2S_WS_IN
I2S_CLK_IN
I2S_DIN
I_D
IMM
ING
0R
80
27
RE
AD
Y
0R
80
22
RE
AD
Y
0R
80
28
RE
AD
Y0
R8
02
3R
EA
DY
0R
80
24
RE
AD
Y
0R
80
29
RE
AD
Y
0R
80
26
RE
AD
Y
22
R8
05
3RE
AD
Y
22
R8
05
2
RE
AD
Y
22
R8
05
5
22
R8
05
6
100 R8078READY
100 R8075READY
10
0R
81
39
RE
AD
Y
100 R8077100 R8074
100 R8085
100 R8082
100 R8087
100 R8089
100 R8095
100 R8092RS232C
100 R8094RS232C
0.0
47
uF
C8
13
0.0
47
uF
C8
17
0.0
47
uF
C8
16
0.0
47
uF
C8
14
0.0
47
uF
C8
19
0.0
47
uF
C8
12
0.0
47
uF
C8
15
0.0
47
uF
C8
18
0.0
47
uF
C8
10
0.0
47
uF
C8
20
0.0
47
uF
C8
23
0.0
47
uF
C8
22
0.0
47
uF
C8
29
0.0
47
uF
C8
27
0.0
47
uF
C8
30
0.0
47
uF
C8
28
0.0
47
uF
C8
25
0.0
47
uF
C8
26
0.0
47
uF
C8
31
0.1
uF
C8
32
0.1
uF
C8
35
0.1uF C836
0.1uF C844
10
00
pF
C8
11
10
00
pF
C8
21
DSU
B_S
CL
SC
L_
Pa
rt
SD
A_
Part
DSU
B_S
DA
PANEL_ON
SDA_TUNER
TX
_MPE
G
RXD
TXD
RX
_MPE
G
HPD_MST_3
HPD_MST_2
PWM
3
10
0A
R800
10
0A
R801
10
0A
R802
10
0R
81
52
10
0R
81
50
10
0R
81
45
10
0R
81
46
10
0R
81
44
10
0R
81
53
10
0R
81
54
10
0R
81
47
10
0R
81
51
10
0R
81
43
HD
MI_
0+
HD
MI_
0-
HD
MI_
C-
HD
MI_
C+
HD
MI_
SC
L
HD
MI_
2-
HD
MI_
SD
A
HD
MI_
2+
HD
MI_
1-
HD
MI_
1+
HP
D_M
ST
_1
47
R8
03
1
47
R8
01
2 47
R8
04
3
47
R8
03
6
47
R8
03
7
47
R8
04
7
47
R8
03
2
47
R8
01
3 47
R8
04
6
47
R8
03
4
47
R8
04
1
47
R8
03
3
47
R8
03
8
47
R8
03
5
47
R8
04
4
47
R8
03
0
47
R8
04
5
47
R8
04
9T
W9
91
0 b
loc
k47
R8
01
7
47
R8
01
1
47
R8
03
9
47
R8
04
2
0.1
uF
C8
09
0.1
uF
C8
07
0.1
uF
C8
06
0.1
uF
C8
08
0R
80
25
RE
AD
Y
2.2K R8071
READY
0.1
uF
C8
64
0.1
uF
C8
61
0.1
uF
C8
60
0.1
uF
C8
63
0.1
uF
C8
67
0.1
uF
C8
73
0.1
uF
C8
76
10
00
pF
C8
78
0.1
uF
C8
71
0.1
uF
C8
72
0.1
uF
C8
70
10
0R
81
34
10
0R
81
31
10
0R
81
35
0R
81
21
0R
81
20
0R
81
23
0R
81
22
10
0R
81
27
10
0R
81
15
10
0R
81
16
10
0R
81
18
10
0R
81
17
0.1
uF
C8
68
0.1
uF
C8
69
10
0R
81
71
10
0R
81
79
10
0R
81
72
10
0R
81
78
0.1uF C859
0.1uF C852
0.1uF C850
10
0R
81
68
10
0R
80
03
AU
DIO
_SW
47
R8
04
8
22K R8084READY
22K R8088READY
0.1
uF
C8
05
10K R8076
39
0R
80
54
0.1uF C866
0.1uF C865
0.1uF C862
0.1
uF
C8
77
HDMI_SEL2
HDMI_SEL1100 R8015
MU
TE
_LIN
E
10
0R
81
40 R
EA
DY
100 R8065
100 R8066
LE
D_R
/PW
M
SC
L_L
ED
SCL_TUNER
HDMI2_5V_DET
HDMI3_5V_DET
HDMI1_5V_DET
10
0R
81
69
MPE
G_R
ESE
T
10K R8102
READY
1KR8
16
7
1KR
81
63
MX
25L
1605A
M2C
-15G
IC8
03
3W
P#
2SO
4G
ND
1C
S#
5S
I
6SC
LK
7H
OL
D#
8V
CC
+3.3
V_M
ST
10K
R8
09
9
RL
_ON
MB
W3216-5
01T
FL
50
9
3.3
KR
81
11
4.7
KR
81
81
0R8
00
0
40
2R
80
20
40
21%R
80
04
PIP
_V
OU
TP
IP_
V
40
2R
86
81
60
86
8R
80
07
47
0R
80
06
75
R8
01
4
40
2R
87
0
47
0R
80
50
DC
DC
_7
.22
V_
PIP
MN
T_V
OU
T_T
MN
T_V
OU
T
16
08
68
R8
05
1
+3.3
V_M
ST
4.7
KR
81
74
4.7
KR
EA
DY
R8
17
3
+3.3
V_M
ST
4.7
KR
80
62
10
BIT
4.7
KR
86
7FH
D
4.7
KR
86
5H
D
+3.3
V_M
ST
4.7
KR
80
63
8B
IT
TM
UE
312G
AB
SW
800
RE
AD
Y
1
24 3
5
PA
NE
L_S
TA
TU
S
AC
_DE
T
0.1uF C882
0.1uF C881
2S
A1
53
0A
-T1
12
-1R
Q8
01
E
B
C2
SA
15
30
A-T
11
2-1
RQ
80
4
TW
99
10
blo
ck
E
B
C
RT
1C
39
04
-T1
12
Q8
02
E
B
C
RT
1C
39
04
-T1
12
Q8
05
E
B
C
0.1
uF
16V
C8
80
LG
E6991D
D
IC
80
1
FH
D
1R
XB
1N
2R
XB
1P
3G
ND
_3
4R
XB
2N
5R
XB
2P
6H
PLU
GB
7D
DC
DB
_DA
8D
DC
DB
_CK
9R
XA
CK
N
10
RX
AC
KP
11
GN
D_1
1
12
RX
A0N
13
RX
A0P
14
AV
DD
_33_14
15
RX
A1N
16
RX
A1P
17
GN
D_1
7
18
RX
A2N
19
RX
A2P
20
HPL
UG
A
21
RE
XT
22
DD
CD
A_D
A
23
DD
CD
A_C
K
24
HSY
NC
1
25
VSY
NC
1
26
VC
LA
MP
27
RE
FP
28
RE
FM
29
BIN
1P
30
SO
GIN
1
31
GIN
1P
32
RIN
1P
33
VC
OM
3
34
BIN
0P
35
VC
OM
2
36
GIN
0P
37
SO
GIN
0
38
RIN
0P
39
AV
DD
_33_39
40
GN
D_4
0
41
HSY
NC
0
42
VSY
NC
0
43
VSY
NC
2
44
BIN
2P
45
SO
GIN
2
46
GIN
2P
47
RIN
2P
48
C1
49
Y1
50
C0
51
Y0
52
CV
BS3
53
CV
BS2
54
CV
BS1
55
VC
OM
1
56
CV
BS0
57
VC
OM
0
58
AV
DD
_33_58
59
CV
BSO
UT
1
60
CV
BSO
UT
0
61
GN
D_6
1
62
SIP
0P
63
AV
DD
_S
IF
64
SIF
1P
65 SIFM
66 GND_66
67 AUVRADN
68 AUVRADP
69 AUVREF
70 AVDD_AU
71 AUL0
72 AUR0
73 AUL1
74 AUR1
75 AUCOM
76 AUL2
77 AUR2
78 AUL3
79 AUR3
80 AUMONO
81 AUOUTL3
82 AUOUTR3
83 AUOUTL2
84 AUOUTR2
85 AUOUTL1
86 AUOUTR1
87 AUOUTL0
88 AUOUTR0
89 GPIOF[0]
90 GPIOF[1]
91 GPIOF[2]
92 GPIOF[3]
93 GPIOF[4]
94 GPIOF[5]
95 GPIOF[6]
96 GPIOF[7]
97 GPIOF[8]
98 GPIOF[9]
99 VDDP_99
100 GND_100
101 VDDC_101
102 DQS[1]
103 MDATA[15]
104 MDATA[14]
105 GND_105
106 MDATA[13]
107 MDATA[12]
108 VDDM_108
109 MDATA[11]
110 MDATA[10]
111 MDATA[9]
112 MDATA[8]
113 GND_113
114 VDDM_114
115 MDATA[7]
116 MDATA[6]
117 MDATA[5]
118 MDATA[4]
119 VDDM_119
120 MDATA[3]
121 MDATA[2]
122 MDATA[1]
123 MDATA[0]
124 DQS[0]
125 LDQM
126 UDQM
127 MVREF
128 MCLKE
12
9M
CL
KZ
13
0M
CL
K1
31
BA
DR
[1]
13
2B
AD
R[0
]1
33
RA
SZ
13
4G
ND
_134
13
5V
DD
M_1
351
36
AV
DD
_ME
MPL
L1
37
CA
SZ
13
8W
EZ
13
9M
AD
R[0
]1
40
MA
DR
[1]
14
1M
AD
R[2
]1
42
MA
DR
[3]
14
3M
AD
R[4
]1
44
MA
DR
[5]
14
5M
AD
R[6
]1
46
MA
DR
[7]
14
7V
DD
M_1
471
48
GN
D_148
14
9V
DD
C_149
15
0M
AD
R[8
]1
51
MA
DR
[9]
15
2M
AD
R[1
0]
15
3M
AD
R[1
1]
15
4A
D[0
]1
55
AD
[1]
15
6A
D[2
]1
57
AD
[3]
15
8A
D[4
]1
59
AD
[5]
16
0A
D[6
]1
61
AD
[7]
16
2W
RZ
16
3R
DZ
16
4A
LE
16
5V
DD
P_165
16
6G
ND
_166
16
7SC
K1
68
SD
I1
69
CS
Z1
70
SDO
17
1S
AR
01
72
SA
R1
17
3S
AR
21
74
SA
R3
17
5PW
M0
17
6PW
M1
17
7D
DC
R_D
A1
78
DD
CR
_CK
17
9D
DC
A_D
A1
80
DD
CA
_CK
18
1IN
T1
82
IRIN
18
3V
DD
P_183
18
4G
ND
_184
18
5V
DD
C_185
18
6G
PIO
B[4
]1
87
GP
IOB
[5]
18
8G
PIO
B[6
]1
89
NC
_189
19
0N
C_190
19
1PW
M2
19
2PW
M3
193VDDC_193194VDDP_194195NC_195196NC_196197LVA3P198LVA3M199LVACKP200LVACKM201LVA2P202LVA2M203LVA1P204LVA1M205LVA0P206LVA0M207VDDP_207208GND_208209NC_209210NC_210211LVB3P212LVB3M213LVBCKP214LVBCKM215LVB2P216LVB2M217LVB1P218LVB1M219LVB0P220LVB0M221VDDP_221222GND_222223GPIOE[3]224GPIOE[2]225GPIOE[1]226GPIOE[0]227ICLK228IDE229IHSYNC230IVSYNC231DI[0]232DI[1]233DI[2]234DI[3]235VDDP_235236DI[4]237DI[5]238DI[6]239DI[7]240VDDC_240241GND_241242DI[8]243DI[9]244DI[10]245DI[11]246DI[12]247DI[13]248HWRESET249XOUT250XIN251AVDD_MPLL252RXBCKN253RXBCKP254AVDD_33_254255RXB0N256RXB0P
LG
E6891D
DIC
80
1-*
1
HD
1R
XB
1N
2R
XB
1P
3G
ND
_3
4R
XB
2N
5R
XB
2P
6H
PLU
GB
7D
DC
DB
_DA
8D
DC
DB
_CK
9R
XA
CK
N
10
RX
AC
KP
11
GN
D_1
1
12
RX
A0N
13
RX
A0P
14
AV
DD
_33_14
15
RX
A1N
16
RX
A1P
17
GN
D_1
7
18
RX
A2N
19
RX
A2P
20
HPL
UG
A
21
RE
XT
22
DD
CD
A_D
A
23
DD
CD
A_C
K
24
HSY
NC
1
25
VSY
NC
1
26
VC
LA
MP
27
RE
FP
28
REFM
29
BIN
1P
30
SO
GIN
1
31
GIN
1P
32
RIN
1P
33
VC
OM
3
34
BIN
0P
35
VC
OM
2
36
GIN
0P
37
SO
GIN
0
38
RIN
0P
39
AV
DD
_33_39
40
GN
D_4
0
41
HSY
NC
0
42
VSY
NC
0
43
VSY
NC
2
44
BIN
2P
45
SO
GIN
2
46
GIN
2P
47
RIN
2P
48
C1
49
Y1
50
C0
51
Y0
52
CV
BS3
53
CV
BS2
54
CV
BS1
55
VC
OM
1
56
CV
BS0
57
VC
OM
0
58
AV
DD
_33_58
59
CV
BSO
UT
1
60
CV
BSO
UT
0
61
GN
D_6
1
62
SIP
0P
63
AV
DD
_S
IF
64
SIF
1P
65 SIFM
66 GND_66
67 AUVRADN
68 AUVRADP
69 AUVREF
70 AVDD_AU
71 AUL0
72 AUR0
73 AUL1
74 AUR1
75 AUCOM
76 AUL2
77 AUR2
78 AUL3
79 AUR3
80 AUMONO
81 AUOUTL3
82 AUOUTR3
83 AUOUTL2
84 AUOUTR2
85 AUOUTL1
86 AUOUTR1
87 AUOUTL0
88 AUOUTR0
89 GPIOF[0]
90 GPIOF[1]
91 GPIOF[2]
92 GPIOF[3]
93 GPIOF[4]
94 GPIOF[5]
95 GPIOF[6]
96 GPIOF[7]
97 GPIOF[8]
98 GPIOF[9]
99 VDDP_99
100 GND_100
101 VDDC_101
102 DQS[1]
103 MDATA[15]
104 MDATA[14]
105 GND_105
106 MDATA[13]
107 MDATA[12]
108 VDDM_108
109 MDATA[11]
110 MDATA[10]
111 MDATA[9]
112 MDATA[8]
113 GND_113
114 VDDM_114
115 MDATA[7]
116 MDATA[6]
117 MDATA[5]
118 MDATA[4]
119 VDDM_119
120 MDATA[3]
121 MDATA[2]
122 MDATA[1]
123 MDATA[0]
124 DQS[0]
125 LDQM
126 UDQM
127 MVREF
128 MCLKE
12
9M
CLK
Z1
30
MC
LK1
31
BA
DR
[1]
13
2B
AD
R[0
]1
33
RA
SZ
13
4G
ND
_134
13
5V
DD
M_1
351
36
AV
DD
_MEM
PLL
13
7C
ASZ
13
8W
EZ1
39
MA
DR
[0]
14
0M
AD
R[1
]1
41
MA
DR
[2]
14
2M
AD
R[3
]1
43
MA
DR
[4]
14
4M
AD
R[5
]1
45
MA
DR
[6]
14
6M
AD
R[7
]1
47
VD
DM
_147
14
8G
ND
_148
14
9V
DD
C_149
15
0M
AD
R[8
]1
51
MA
DR
[9]
15
2M
AD
R[1
0]
15
3M
AD
R[1
1]
15
4A
D[0
]1
55
AD
[1]
15
6A
D[2
]1
57
AD
[3]
15
8A
D[4
]1
59
AD
[5]
16
0A
D[6
]1
61
AD
[7]
16
2W
RZ
16
3R
DZ
16
4A
LE
16
5V
DD
P_165
16
6G
ND
_166
16
7SC
K1
68
SD
I1
69
CS
Z1
70
SDO
17
1S
AR
01
72
SA
R1
17
3S
AR
21
74
SA
R3
17
5PW
M0
17
6PW
M1
17
7D
DC
R_D
A1
78
DD
CR
_CK
17
9D
DC
A_D
A1
80
DD
CA
_CK
18
1IN
T1
82
IRIN
18
3V
DD
P_183
18
4G
ND
_184
18
5V
DD
C_185
18
6G
PIO
B[4
]1
87
GP
IOB
[5]
18
8G
PIO
B[6
]1
89
NC
_189
19
0N
C_190
19
1PW
M2
19
2PW
M3
193VDDC_193194VDDP_194195NC_195196NC_196197LVA3P198LVA3M199LVACKP200LVACKM201LVA2P202LVA2M203LVA1P204LVA1M205LVA0P206LVA0M207VDDP_207208GND_208209NC_209210NC_210211LVB3P212LVB3M213LVBCKP214LVBCKM215LVB2P216LVB2M217LVB1P218LVB1M219LVB0P220LVB0M221VDDP_221222GND_222223GPIOE[3]224GPIOE[2]225GPIOE[1]226GPIOE[0]227ICLK228IDE229IHSYNC230IVSYNC231DI[0]232DI[1]233DI[2]234DI[3]235VDDP_235236DI[4]237DI[5]238DI[6]239DI[7]240VDDC_240241GND_241242DI[8]243DI[9]244DI[10]245DI[11]246DI[12]247DI[13]248HWRESET249XOUT250XIN251AVDD_MPLL252RXBCKN253RXBCKP254AVDD_33_254255RXB0N256RXB0P
1KR
81
42
+3.3
V_M
ST
+5V
_S
T_S
W
SPK-N2.2K R8183
0
TW
99
10
blo
ck
R8
08
1
10
0R
81
26
NO
T L
G60
1KR
81
32
LPL
_CM
O
10
0R
80
10
DC
DC
_7
.22
V_
PIP
+3.3
V_M
ST
10K
R8
18
7
0
LG
60
R8
18
2
2.2
KR
81
85
US
E L
G5
0_
60
_7
0
2.2
KR
81
84
US
E L
G5
0_
60
_7
0
3.3
K
NO
T L
G60
R8
18
8
EY
EQ
_RE
SE
T
FLASH_WP
RT
1C
39
04
-T1
12
Q8
03
E
B
C
FL
ASH
_WP
0 R8080
0 R8079
FL
ASH
_WP_Z
OR
AN
4.7
KR
80
70
10
0R
80
05
0
RE
AD
Y
R8
00
1
0
RE
AD
Y
R8
02
1
0READY
R80570 R8058
0R8
06
1
RE
AD
Y
HP
D_M
ST
_2
10
0R
86
6L
G60
S_VIDEO_DET
10
0R
81
37
10K
R8
06
7
1000pF C851
10
0R
80
60
+3.3
V_M
ST
4.7
KR
80
91
4.7
KR
EA
DY
R8
09
0
39
R8
14
8
39
R8
14
9
3.3K R81583.3K R8157
0R
80
86
US
E L
G5
0_
60
_7
00.1uF C801
0.1uFC802
0.1uF
C803
0.1
uF
C8
55
2.2
uF
25V
C8
83
5.1K R8073
5.1K R8072
1KR8
10
81KR
81
10
470pF C853
470pF C854
+3.3
V_M
ST
0 R8
00
2R
ES
ET
_+
3.3
V_M
ST
MDATA[0]
MDATA[1]
MDATA[2]
MDATA[3]
MDATA[4]
MDATA[5]
MA
DR
[0]
DEC_656[0]
MDATA[6]
MA
DR
[1]
DEC_656[1]
MDATA[7]
MA
DR
[2]
DEC_656[2]
MDATA[8]
MA
DR
[3]
DEC_656[3]
MDATA[9]
MA
DR
[4]
DEC_656[4]
MDATA[10]
MA
DR
[5]
DEC_656[5]
MDATA[11]
MA
DR
[6]
DEC_656[6]
MDATA[12]
MA
DR
[7]
MDATA[13]
DEC_656[7]
MA
DR
[8]
MDATA[14]
MA
DR
[9]
MDATA[15]
MA
DR
[10]
MA
DR
[11]
MADR[0-11]
TXCE1-
TXCO2+
TXCE0+
TXCE3+
TXCO3-
TXCO1-
TXCO3+
TXCO1+
TXCE2+
TXCLKO-
TXCE0-
TXCO0-
TXCO0+
TXCE1+
TXCO2-
TXCLKO+
TXCLKE-
TXCLKE+
TXCE2-
TXCE3-
TXCE4-
TXCE4+
TXCO4-
TXCO4+
NO
N_E
U O
PT
ION
#8. M
ST
AR
DDR SDRAM
<M
od
e S
ele
cti
on
>
8 1
1
MS
TA
R N
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MS
TA
R
MPE
G U
AR
T
CV
BS_V
SW
_L
/R:
CO
MP
2_L
/R o
r S
IDE
_L
/R
RS232C
DO
N’T
US
E(1
56
,15
7)
MS
TA
R R
ecom
man
d
: o
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r 8
V
GA
IN X
4G
AIN
X 4
H/W
OP
TIO
N #
3
H/W
OP
TIO
N #
1
H/W
OP
TIO
N #
2
Inse
rt a
ll ex
cept
LG
60:R
8188
EA
X40043809
MS
TA
R L
P81A
12
0H
Z:
HN
orm
al:
L
2008
/01/
08
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
+3.3
VDDA
RAMRAS
RAM
CS
I2S_
DIN
RAM
DQM
JP
70
3
RAMBA[0]
0.1u
F50V
C750
4.7K
R716
150
R728
IPCL
K
MX2
5L16
05AM
2C-1
5GIC
703
IC703_U
SB
3W
P#
2SO
4GN
D
1CS
#
5SI
6SC
LK
7HO
LD#
8VC
C
JP
70
2
+1.8
VD
DC
RAM
AD
D[0
-3]
DUPR
D0
SFD
I
+3.3
VD
DP
0 R722
+1.8
VDDA
RAMWE
0 R723
0.1u
F50V
C732
+1.8
VD
DC
MBW
3216
-501
TF
L715
+3.3
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DP
27R700
100u
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C722
SFCL
K
SFDO
0.1
uF
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17
RAMADD[10]
0.1
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C7
13
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AD
Y
DEC
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[0]
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DN
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DA
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RAM
BA[0
]
JP
70
1
220K
R732
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DP
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DA
USB_
DP
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D0
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C731
0 R719
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VD
DP
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SFD
I
75R7
34
RAM
CAS
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25
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36
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RAM
ADD[
11]
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C747
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RE
AD
Y
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AD
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AD
Y
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DA
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15]
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DA
T[0-
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JP
70
0
DEC
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[0-7
]
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5%
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DA
T[0-
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5%
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16V
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22uF
16V
C711
22uF
16V
C715
ZR36966PQCG-XD
IC707
USB1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
10
3
10
4
10
5
10
6
10
7
10
8
10
9
11
0
11
1
11
2
11
3
11
4
11
5
11
6
11
7
11
8
11
9
12
0
12
1
12
2
12
3
12
4
12
5
12
6
12
7
12
8
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27VDD3
28VSS1
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36NC1
37CKE
38CLK
39UDQM
40NC2
41VSS2
42DQ8
43VDDQ3
44DQ9
45DQ10
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48DQ12
49VDDQ4
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USB DOWN STREAM
KJA-UB-4-0004
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B 1 2 3 4 5
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DP
4.7K
READ
YR7
42
OPT
L7
16
RE
AD
Y
4.7K
READ
Y
R743
+5V_
MUL
TI
12
50
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00
JK7
00
1 2 3 4
5
6.19
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15
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EN
22 R744
OCP_
EN
FL
ASH
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AN
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DP 10K
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nF
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20
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2012
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UBW
2012
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L712
120O
HM
UBW
2012
-121
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L713
120O
HM
UBW
2012
-121
F
L714
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HM
UBW
2012
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AD
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120O
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UBW
2012
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0
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AD
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12
75R7
11
75R7
14
75R7
13
RAM
ADD[
6]
DEC_656[5]
RAM
ADD[
1]
RAMADD[8]
RAM
DAT[
7]
RAM
ADD[
2]
DEC_656[3]
RAMDAT[6]
RAM
ADD[
3]
RAM
DAT[
0]
RAMADD[9]
RAM
DAT[
12]
RAMDAT[5]
RAM
ADD[
8]
DEC_656[2]
RAM
DAT[
10]
RAMDAT[2]
RAM
DAT[
4]
RAM
ADD[
9]
RAMDAT[11]
RAM
DAT[
14]
DEC_656[6]
RAMDAT[7]
DEC_656[4]
RAMDAT[14]
RAM
DAT[
1]
RAMDAT[0]
RAM
ADD[
11]
RAMDAT[13]
RAM
DAT[
13]
RAMDAT[4]
RAM
DAT[
8]
RAMDAT[10]
RAM
DAT[
3]
RAMDAT[12]
RAMADD[2]RAMADD[6]
DEC_656[0]
RAM
ADD[
0]
RAM
ADD[
5]
RAMADD[3]
RAMDAT[8]
RAM
DAT[
15]
RAM
ADD[
7]
RAM
ADD[
4]
RAMADD[4]
RAMADD[5]
RAM
DAT[
9]
DEC_656[1]
RAMADD[1]
RAMADD[0]RAMADD[7]
RAM
DAT[
5]
RAMDAT[15]
RAMDAT[9]
RAM
DAT[
2]
RAMDAT[1]
RAM
ADD[
10]
RAM
DAT[
6]
RAM
DAT[
11]
DEC_656[7]
RAMDAT[3]
7 1
1
MS
TA
R N
-EU
US
B/M
PE
G D
EC
**
1
A D
es
ign
* R
73
2 V
ide
o O
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l R
efe
re
nc
e
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luti
on
pla
ce
d a
s c
los
e t
o C
on
ne
cto
r a
s p
os
sib
le.
Ex
tern
al
F/W
Do
wn
loa
d
Ca
pa
cit
ors
on
VB
US
A s
ho
uld
be
Fo
r I
nitia
l D
ow
nlo
ad
DE
C_
65
6[0
] :
DU
PT
D0
* A
na
log
Vid
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tio
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RA
N I
2C
str
ob
e r
ea
dy
DU
PT
D0
* R
71
5 R
ec
om
me
nd
ati
on
is 6
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k 1
%
Ori
gin
all
y 3
92
oh
m 1
%
DE
BU
G T
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T O
PT
ION
* R
732
Vid
eo O
utpu
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el R
efer
ence
to m
ee
t U
SB
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HS
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rt
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N S
RA
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oard
F/W
Do
wn
load
It’
s p
os
sib
el
to 2
7~
47
oh
m
Co
nn
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t to
Ma
in I
C(C
CIR
65
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nte
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ce
)
TO
P S
IDE
!
EA
X40043809
MS
TA
R L
P81A
20
08
/0
1/0
8
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
JP
60
0
0.1u
FC6
41
+5V_
MUL
TI+
12V
+12V
SW_R
0.1u
FC6
3368
0KR6
37
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MUL
TI
SPK
_R-
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MUL
TI
2.2u
FC6
62
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MUL
TI
680K
R640
4.7K
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4.7K
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KR
64
9
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MNT
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SP
K_R
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OT
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15 DVSS
16 DVDD
17 SDATA
18 WCK
19 BCK
20 SDA
21 SCL
22 PWM_3B/PWM_HP2
23 PWM_3A/PWM_HP1
24 PROTECT
25 FAULT
26 VDR2B
27 BST2B
28 PGND2B_1
29PG
ND2B
_2
30OU
T2B_
1
31OU
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2
32PV
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35PV
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2
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43VDR1B
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45PGND1B_1
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47OUT1B_1
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49PVDD1B_1
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51PVDD1A_1
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2012
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2012
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2012
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2012
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2012
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2012
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33
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4.7
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L_O
PT
1N4148W
100V
D604READY1N4148W
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D605READY
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D606READY
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D607READY
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X40043809
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TA
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P81A
20
08
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1/0
8
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
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SED
FO
RTH
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COM
PON
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HE
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MBO
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OF
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IC.
100
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20
08
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/08
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
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WH
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IS
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AL
THA
T O
NLY
MA
NU
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PA
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SED
FO
RTH
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AL
COM
PON
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IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
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IC.
EAM
3876
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L402
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3876
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12
13
14
16
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19
14
9
4
18
13
8
3 17
12
7
2
16
11
6
1
20
15
10
5 21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
SM
W200-2
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P4
03
HD
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AL
19
14
9
4
18
13
8
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12
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2
16
11
6
1
20
15
10
5 21
22
23
24
25
26
3.3
KR
41
3
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FC4
00
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38
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OPT
RE
AD
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C402
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R443
IR-O
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R4
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IR-O
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47K
R4
39
IR-O
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22
R4
42
IR-O
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USE LG50_60_70
5.6BZD402
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3
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G5
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0
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42
2U
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LG
50
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P4
03
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TN
19
14
9
4
18
13
8
3 17
12
7
2
16
11
6
1
20
15
10
5 21
22
23
24
25
26
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11
3.3K
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12
TXCE
3+
TXCO
2+
TXCE
1-
TXCL
KE-
TXCE
2-T
XC
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1+
TXCO
0+
TX
CE
0+
TXCE
2+
TX
CE
1+
TXCO
1+
TXCO
3+TXCL
KE+
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CE
3+
TX
CO
4+
TXCO
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TXCO
0-
TXCO
3-
TX
CL
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TXCE
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X40043809
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R402
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BIT
8B
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LG
60
LG
30
R404
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BE
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BE
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BE
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BE
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9.1
K
R411
32
sh
arp
XX XX
XX
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
TMDS
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2-
TMDS
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C-
HPD
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TMDS2_RXC-
1KR319
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I_2
HDM
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L1
TMDS
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HDMI_C-
HDMI_SCL
HDMI_0-
10K
R351
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TMDS
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E_H
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0.01
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1-
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4.7K
R375
READ
Y
0R373
TMDS
2_RX
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TMDS
1_RX
0-
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4.7K R361
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HDMI_1+
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0-
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TMDS
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4.7K
R374
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S
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D30
0
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C
A1
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R329
TMDS
2_RX
1-
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0.01uF C312
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TMDS
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1-
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L2
TMDS
1_RX
2+
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10K
R352
TMDS
3_RX
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0.01
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10K
R301
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2-
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TMDS
1_RX
0-
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TMDS
1_RX
1+
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0R3
68
RE
AD
Y
10K
R325
0R347
CEC
HDMI_SDADDC_SCL2
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HPD
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0+
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READY
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C
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47K
R330
47K
R331 47
KR3
2647
KR3
27
47K
R354
47K
R353
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ADYR3
65
0R
EA
DY
R376
MMBD301LT1G
30V
D304
A
C
DDC_
SDA2
DDC_
SCL2
DDC_
SDA1
DDC_
SCL1
DDC_
SDA3
DDC_
SCL3
TMDS
351P
AGR
IC30
2
1S
DA
3
2S
CL
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31
5A
31
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CC
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32
8A
32
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10
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3
11
A33
12
VC
C_2
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B3
4
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26 Y1
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29 SCL_SINK
30 SDA_SINK
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32 S1
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8
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
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THIS
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8
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
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OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
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Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only