LG 26LK310 (Chassis LP91J) Manual de Servicio LCD

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Transcript of LG 26LK310 (Chassis LP91J) Manual de Servicio LCD

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    LCD TVSERVICE MANUAL

    CAUTION

    BEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

    CHASSIS : LP91J

    MODEL : 26LK310/310Y 26LK310/310Y-TAMODEL : 26LK311 26LK311-TB

    North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

    Internal Use Only

    Printed in KoreaP/NO : MFL62461531 (1104-REV01)

    Proporcionado por: Carlos Alexis Ortz Colmenares (Tcnico en Electrnica) San Salvador, El Salvador.

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    LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    - 2 -

    CONTENTS

    CONTENTS .............................................................................................. 2

    PRODUCT SAFETY ..................................................................................3

    SPECIFICATION ........................................................................................6

    ADJUSTMENT INSTRUCTION .................................................................9

    TROUBLE SHOOTING............................................................................14

    BLOCK DIAGRAM...................................................................................17

    EXPLODED VIEW .................................................................................. 18

    SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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    LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    - 3 -

    SAFETY PRECAUTIONS

    Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.

    General Guidance

    An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.

    It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.

    If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.

    When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.

    Keep wires away from high voltage or high temperature parts.

    Before returning the receiver to the customer,

    always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.

    Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phone

    jacks, etc.If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1M and 5.2M.When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.

    Leakage Current Hot Check (See below Figure)Plug the AC cord directly into the AC outlet.

    Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeter

    with 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.

    Leakage Current Hot Check circuit

    1.5 Kohm/10W

    To Instrument'sexposedMETALLIC PARTS

    Good Earth Groundsuch as WATER PIPE,CONDUIT etc.

    AC Volt-meter

    When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard

    IMPORTANT SAFETY NOTICE

    0.15uF

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    LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

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    CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.

    General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power

    source before;a. Removing or reinstalling any component, circuit board

    module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or

    other electrical connection.c. Connecting a test substitute in parallel with an electrolytic

    capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.

    2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".

    3. Do not spray chemicals on or near this receiver or any of itsassemblies.

    4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.

    Unless specified otherwise in this service manual, lubrication ofcontacts in not required.5. Do not defeat any plug/socket B+ voltage interlocks with which

    receivers covered by this service manual might be equipped.6. Do not apply AC power to this instrument and/or any of its

    electrical assemblies unless all solid-state device heat sinks arecorrectly installed.

    7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.

    8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.

    Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or

    semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed to

    prevent potential shock reasons prior to applying power to the

    unit under test.2. After removing an electrical assembly equipped with ES

    devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.

    3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.

    4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.

    5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.

    6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).

    7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.

    8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)

    General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate

    tip size and shape that will maintain tip temperature within therange or 500 F to 600 F.

    2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

    bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.

    5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.

    (500 F to 600 F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-

    type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

    6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature

    (500 F to 600 F)b. First, hold the soldering iron tip and solder the strand against

    the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the

    component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

    d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.

    SERVICING PRECAUTIONS

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    LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    - 5 -

    IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.

    Removal1. Desolder and straighten each IC lead in one operation by gently

    prying up on the lead with the soldering iron tip as the soldermelts.

    2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.

    Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and

    solder it.3. Clean the soldered areas with a small wire-bristle brush.

    (It is not necessary to reapply acrylic coating to the areas).

    "Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as

    possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining

    on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding

    leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.

    Power Output, Transistor Device

    Removal/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit

    board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

    Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as

    possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit

    board.3. Observing diode polarity, wrap each lead of the new diode

    around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of

    the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.

    Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow

    stake.2. Securely crimp the leads of replacement component around

    notch at stake top.3. Solder the connections.

    CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.

    Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.

    At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).

    1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).

    2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.

    3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.

    4. Route the jumper wire along the path of the out-away copper

    pattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.

    At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.

    1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.

    2. Trace along the copper pattern from both sides of the pattern

    break and locate the nearest component that is directlyconnected to the affected copper pattern.3. Connect insulated 20-gauge jumper wire from the lead of the

    nearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.

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    LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    - 6 -

    SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement .

    4. Electrical specification4.1. Model Specification

    1. Application rangeThis spec sheet is applied to LCD TV used LP91J chassis.

    2. SpecificationEach part is tested as below without special appointment.

    1) Temperature : 255C (779F), CST : 405C2) Relative Humidity : 6510%3) Power Voltage: Standard input voltage(100-240 V~, 50/60 Hz)

    * Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed

    each drawing and specification by part number inaccordance with BOM.

    5) The receiver must be operated for about 5 minutes prior tothe adjustment.

    3. Test method1) Performance: LGE TV test method followed2) Demanded other specification

    - Safety: CE, IEC specification- EMC : CE, IEC

    No Item Specification Remark

    1. Market NON EU

    2. Broadcasting system PAL/SECAM B/G/D/K,

    PAL I/II, NTSC-M

    3. Available Channel BAND PAL NTSC China(DK) Australia(BG)

    VHF/UHF E2-C69 2~78 C1~C62 C1~C75

    CATV S21~S47 1~71 S1~S41 S2~S44

    4. Receiving system Upper Heterodyne

    5. Video Input PAL, SECAM, NTSC 22LK310/311 : Rear 1EA,

    26/32LK310/311 : Rear 1EA, Side 1EA

    6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear

    7. RGB Input RGB-PC, S/W Upgrade Rear

    8. HDMI Input HDMI-DTV, Only PCM MODE 26/32LK310/311 Rear 2EA

    22LK310/311 Rear 1EA

    9. Audio Input (4EA) PC Audio, Component, AV (2EA) L/R Input (22LK310/311: AV Audio Input 1EA)

    10. RS-232C Remote control, Commercial control Rear

    11. USB Input (1EA) Divx, MP3, JPEG Only Side

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    - 7 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    5. Component Video Input (Y, P B, P R)

    NoSpecification

    RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

    1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

    2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

    3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz

    4 720* 480 31.47 59.94 27.000 SDTV 480P

    5 720* 480 31.50 60.00 27.027 SDTV 480P

    6 720* 576 31.25 50.00 27.000 SDTV 576P 50 Hz

    7 1280* 720 44.96 59.94 74.176 HDTV 720P

    8 1280* 720 45.00 60.00 74.250 HDTV 720P

    9 1280* 720 37.50 50.00 74.25 HDTV 720P 50 Hz

    10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50 Hz

    11 1920* 1080 33.72 59.94 74.176 HDTV 1080I

    12 1920* 1080 33.75 60.00 74.25 HDTV 1080I

    13 1920* 1080 56.25 50 148.5 HDTV 1080P14 1920* 1080 67.432 59.94 148.350 HDTV 1080P

    15 1920* 1080 67.5 60.00 148.5 HDTV 1080P

    NoSpecification

    Proposed RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

    1 640* 350 31.468 70.09 25.17 EGA

    2 720* 400 31.469 70.09 28.32 DOS

    3 640* 480 31.469 59.94 25.17 VESA( VGA)

    4 800* 600 37.879 60.317 40 VESA( SVGA)

    5 1024* 768 48.363 60.004 65 VESA( XGA)

    6 1280* 768 47.776 59.87 79.5 VESA( WXGA)

    7 1360* 768 47.72 59.799 84.75 VESA( WXGA)

    6. RGB(Analog PC, RGB-DTV - NOT SUPPORT)

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    - 8 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    7. HDMI input - PC(Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)

    No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks

    1 640 x 480 31.469 59.94 25.17 VESA( VGA)

    2 800 x 600 37.879 60.317 40.00 VESA( SVGA)

    3 1024 x 768 48.363 60.004 65.00 VESA( XGA)

    4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)

    5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)

    6 1366 x 768 47.7 60.00 84.62 WXGA

    7 1280 x 1024 63.595 60.00 108.875 SXGA

    8 1920 x 1080 66.647 59.988 138.625 WUXGA

    8. HDMI input (DTV)

    No

    Specification

    Proposed RemarksResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

    1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out

    2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.

    3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz

    4 720 x 480 31.47 59.94 27 SDTV 480P

    5 720 x 480 31.5 60.00 27.027 SDTV 480P

    6 720 x 576 31.25 50.00 27 SDTV 576P

    7 1 280 x 720 44.96 59.94 74.176 HDTV 720P

    8 1280 x 720 45 60.00 74.25 HDTV 720P

    9 1280 x 720 37.5 50.00 74.25 HDTV 720P

    10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I

    12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I

    13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P

    14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P

    15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P

    16 1920 x 1080 27 24.00 74.25 HDTV 1080P

    17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P

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    LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    - 9 -

    ADJUSTMENT INSTRUCTION1. Application Range

    This specification sheet is applied to all of the LCD TV, LP91Jchassis.

    2. Specification1) Because this is not a hot chassis, it is not necessary to use

    an isolation transformer. However, the use of isolationtransformer will help protect test instrument.

    2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of

    25 C 5 C of temperature and 65 % 10 % of relativehumidity if there is no specific designation.

    4) The input voltage of the receiver must keep 100-220 V,50/60 Hz.

    5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.

    3. Adjustment items3.1. PCB assembly adjustment items

    (1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig2) Using USB Memory Stick.

    (2) Input Tool-Option/Area option.(3) Download the EDID

    - EDID datas are automatically download when adjustingthe Tool Option2

    (4) ADC Calibration - RGB / Component(4) Check SW Version.

    3.2. SET assembly adjustment items(1) Input Area option(2) Adjustment of White Balance : Auto & Manual(3) Input Tool-Option/Area option(4) Intelligent Sensor Inspection Guide(5) Preset CH information(6) Factoring Option Data input

    4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig

    (1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack

    (2) Download steps1) Execute ISP Tool program, the main window(Mstar ISP

    utility Vx.x.x) will be opened.2) Click the Connect button and confirm Dialog Box.

    3) Click the Config. button and Change speed I2C Speed

    setting : 350 Khz ~ 400 Khz.

    4) Read and write bin file.Click (1)Read tab, and then load download file(XXXX.bin) by clicking Read.

    1

    Fi

    1

    Filexxx.binilexxx bin

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    5) Click (2)Auto tab and set as below.6) Click (3)Run.7) After downloading, you can see the (4)Pass message.

    4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the USB port.2) Automatically detect the SW Version.

    -> S/W download process is executed automatically.

    3) Show the message Copy the file from the Memory

    4) After Finished the Download, Automatically DC Off -> On

    5) If the TV is turn on, check the updated SW Version and tooloption.

    4.2. Input tool optionAdjust tool option refer to the BOM.- Tool Option Input : PCBA Check Process- Area Option Input : Set Assembly Process

    After Input Tool Option and AC offBefore PCBA check, you have to change the Tool option andhave to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)

    (1) Profile : Must be changed the option value because beingdifferent with some setting value depend on modulemaker, inch and market.

    (2) Equipment : adjustment remote control.

    (3). Adjustment method- The input methods are same as other chassis.(Use IN-

    START key on the Adjust remote control.)(If not changed the option, the input menu can differ themodel spec.)

    Refer to Job Expression of each main chassis assembly(EBTxxxxxxxx) for Option valueCaution : Dont Press IN-STOP key after completing thefunction inspection.

    4.3. EDID Download methodRecommend that dont connect HDMI and RGB(D-SUB) cablewhen downloading the EDID. If not possible, recommend thatconnect the MSPG equipment.There are two methods of downloading the EDID data.

    4.3.1. 1st MethodEDID datas are automatically downloaded when adjusting theTool Option2.Automatically downloaded when pushing the enter key afteradjusting the tool option2.It takes about 2 seconds.

    4.3.2. 2nd Method* Caution :

    Must be checked that the tool option is right or not.If tool option is wrong, HDMI EDID data could not bedownloaded well.

    1) Press the ADJ key2) Move to the EDID D/L and Press the right direction key( G )3) Press the right direction key( G ) at Start.4) After about a few seconds, appear OK, then complete.

    4.3.3. RS-232C command Method(1) Command : AE 00 10

    * CautionDont connect HDMI and RGB(D-SUB) cable whendownloading the EDID.If the cables are connected, Downloading of EDID could befailed.

    - 10 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    Filexxx bin

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    4.3.4. EDID data(1) Analog(RGB): 128bytes>

    (2) HDMI 1 : 256Bytes

    (3) HDMI 2 : 256Bytes

    4.4. ADC Calibration4.4.1. ADC Calibration - Component (Using External pattern)

    (1) Required Equipments- Remote control for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

    (2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60 Hz 100 % Color Bar

    YPbPr signal into Component1 or 2.(MSPG-925F Model: 209 / Pattern: 65 )

    3) Press ADJ key on Remote control for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : Component by using D / E

    (CH +/-) and press ENTER( A ).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear.

    4.4.2. ADC Calibration - RGB4.4.2.1. Method of Using External pattern

    (1) Required Equipments- Remote control for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

    (2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60 Hz Horizontal Color Bar

    signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )

    3) Press ADJ key on remote control for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : RGB by using D / E (CH +/-)

    and press ENTER( A ).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear.

    - 11 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    OK

    OK

    0 1 2 3 4 5 6 7 8 9 A B C D E F

    0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

    10 01 15 01 03 08 46 27 78 0A D9 B0 A3 57 49 9C 25

    20 11 49 4B A1 08 00 45 40 01 01 61 40 01 01 01 01

    30 01 01 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88

    40 35 00 BC 88 21 00 00 1C 0E 1F 00 80 51 00 1E 30

    50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 4C

    60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD

    70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 00 55

    0 1 2 3 4 5 6 7 8 9 A B C D E F

    0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

    10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25

    20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01

    30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28

    40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30

    50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C

    60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD

    70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C280 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05

    90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00

    A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35

    B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10

    C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16

    D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71

    E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00

    F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A

    0 1 2 3 4 5 6 7 8 9 A B C D E F

    0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

    10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25

    20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01

    30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28

    40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30

    50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C

    60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD

    70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2

    80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05

    90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00

    A0 20 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35

    B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10

    C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16

    D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71

    E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00

    F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 1A

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    4.4.2.1. Method of Using Internal pattern(1) Apply model : 22/26/32LK310/311(2) Process

    1) Change the Input to RGB mode..2) Press ADJ key on remote control for adjustment.3) Enter Password number. Password is 0 0 0 0.4) Select 0. ADC calibration : RGB by using D / E (CH +/-)

    and press ENTER( A ).5) ADC adjustment is executed automatically .6) When ADC adjustment is finished, this OSD appear.

    * Caution : No need to connect external input cable.* Caution : Adjustment result is applied after SET Off/On.

    4.5. Check SW Version(1) Method

    1) Push In-star key on Adjust remote-control.2) SW Version check

    Check SW VER : V3.xx

    5. PCB assembly adjustment method5.1. Input Area-Option

    (1) Profile : Must be changed the Area option value becausebeing different of each Countrys Language andsignal Condition.

    (2) Equipment : Adjustment remote control.(3) Adjustment method

    - The input methods are same as other chassis.(Use IN-START Key on the Adjust Remote control.)

    Refer to Job Expression of each main chassis assembly(EBTxxxxxxxx) for Option value.

    5.2. Adjustment of White Balance(For Automatic Adjustment)- Purpose : Adjust the color temperature to reduce the

    deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,

    Fix the one of R/G/B gain to 192 (default data)and decrease the others.

    - Adjustment mode : Three modes - Cool / Medium / Warm- Required Equipment

    1) Remote control for adjustment2) Color Analyzer : CA100+ or CA-210 or same product -

    LCD TV(ch : 9)(should be used in the calibrated ch by CS-1000)

    3) Auto W/B adjustment instrument(only for Auto adjustment)

    5.2.1 Adjustment of White Balance (For automatic adjustment)

    * LP91J Support RS-232C & I2C Interface For ADC/DDCAdjustment.

    (1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-

    run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition

    of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)

    (2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on

    in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off

    command(WB 00 FF) from adjustment equipment.- Need to transmit the aging off command to TV set after

    finishing the adjustment.- Check DDC adjust mode release by exit key and release

    DDC adjust mode)(3) Enter the adjust mode of white balance)

    - Enter the white balance adjustment mode with agingcommand (F3, 00, 00)

    (4) Release the adjust mode of white balance- Enter the white balance adjustment mode with agingcommand(F3, 00, FF)

    * Luminance min value is 150cd in the Cool/Medium/Warmmode(For LCD)

    - 12 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    OK

    MODEL : 32LK310SW VER : V3.04Mode : Home Use UTT 6

    ADC CAL. RGB : NGRGB: OK HDMI1 : NGCompo nent SD : OK HDMI2 : NGComponent HD : OK

    Tool Option 1 816Tool Option 2 4181Area Option 40Option 1 0Option 2 0System ControlSystem Control 2Power Off HistoryDavinci/Auto Test

    Area Option ETCLang. Group NTSC-ALL

    MODEL : 32LK310SW VER : V3.04Mode : Home Use UTT 6

    ADC CAL. RGB : NGRGB: OK HDMI1 : NGCompo nent SD : OK HDMI2 : NGComponent HD : OK

    Tool Option 1 816Tool Option 2 4181Area Option 40Option 1 0Option 2 0System ControlSystem Control 2Power Off HistoryDavinci/Auto Test

    Area Option ETCLang. Group NTSC-ALL

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    5.2.2. Adjustment of White Balance (for Manual adjustment)(1) Color analyzer(CA100+, CA210) should be used in the

    calibrated ch by CS-1000(2) Operate the zero-calibration of the CA100+ or CA-210,

    then stick sensor to the module when adjusting.(3) For manual adjustment, it is also possible by the following

    sequence.1) Select white pattern of heat-run by pressing POWER

    ON key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)

    2) Push Exit key.3) Change to the AV mode by remote control.4) Input external pattern (85% white pattern)5) Push the ADJ key -> Enter 0000 (Password)6) Select 3. W/B ADJUST7) Enter the W/B ADJUST Mode8) Stick the sensor to the center of the screen and select

    each items (Red/Green/Blue Gain and Offset) usingD / E (CH +/-) key on Adjustment remote control.

    9) Adjust R/G/B Gain using F / G (VOL +/-) key on

    Adjustment remote control.10) Adjust three modes all (Cool/ Medium/ Warm) : Fix theone of R/G/B gain and change the others

    11) When adjustment is completed, Enter COPY ALL.12) Exit adjustment mode using EXIT key on Adjustment

    remote control.

    * CASEFirst adjust the coordinate far away from the target value(x, y).1. x, y > target

    i) Decrease the R, G.2. x, y < target

    i) First decrease the B gain,ii) Decrease the one of the others.

    3. x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R

    4. x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G

    (4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment

    - 22LK310/311(Small size inchs color coordinate is differentfrom others, so use below table.)

    - To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : Select Vivid and change Dynamic Contrast :Off, Dynamic Colour : Off -> Picture Mode change ->Vivid(User)(If you miss the upper condition, the coordinates of W/B canbe lower than the spec.

    - 13 - LGE Internal Use OnlyCopyright 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes

    CoordinateMode x y Temp uv

    Cool 0.269 0.002 0.273 0.002 13,000 K 0.000

    Medium 0.285 0.002 0.293 0.002 9,300 K 0.000

    Warm 0.313 0.002 0.329 0.002 6,500 K 0.003

    CoordinateMode x y Temp uv

    Cool 0.285 0.002 0.293 0.002 9,300 K 0.000

    Medium 0.295 0.002 0.305 0.002 8,000 K 0.000

    Warm 0.313 0.002 0.329 0.002 6,500 K 0.003

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    LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes

    - 14 -

    TROUBLESHOOTING

    No power(LED indicator off)

    Check 24V, 12V, 3.5Vof Power B/D

    Check short of Main B/Dor Change Power B/D

    Pass

    Check Output ofIC1001, IC1003, IC1007

    Check P400 Connector

    Change LED Assembly

    : [A] PROCESS

    Fail

    Fail

    Pass

    Pass

    Check LED Assembly

    Change IC1002, IC1008, Q1003

    Pass

    Check short of IC1001,IC1003, IC1007

    Fail

    Re-soldering or Change defectpart of IC1001, IC1003, IC1007

    Fail

    No Raster [B]: Process

    Check LED statusOn Display Unit Repeat A PROCESS

    Pass

    Fail

    Check Output of IC802 Change IC802Fail

    Change Inverter ConnectorOr InverterFail

    Pass

    Fail

    Pass

    Change ModuleFail

    Check LVDS Cable

    Pass

    Check Panel Link CableOr Module

    Change Panel Link CableOr Module

    Check Inverter ConnectorOr Inverter

    Pass

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    LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes

    - 15 -

    No Raster on PC Signal

    Check Input source CableAnd Jack

    Pass

    Re-soldering orChange the defect part

    Pass

    Check the Input/OutputOf IC201 Fail

    Re-soldering orChange the defect part,Check RGB EDID Data

    Repeat [A], & [B] Process

    Pass

    Check the Input/OutputOf J202 Fail

    Pass

    Check the Input/OutputOf IC800 Fail

    Re-soldering orChange the defect part

    Pass

    No Raster on COMMPONENT Signal

    Check Input sourceCable And Jack

    Pass

    Re-soldering orChange the defect part

    Check the Input/OutputOf IC800 Fail

    Pass

    Re-soldering orChange the defect part

    Repeat [A], & [B] Process

    Check The Input/OutputOf JK101 Fail

    Pass

    No Raster on HDMI Signal

    Check Input sourceCable And Jack

    Pass

    Check the Input/Outputof JK301, JK302 Fail

    Re-soldering orChange the defect part

    Pass

    Pass

    Check the Input/Outputof IC300, IC301 Fail

    Re-soldering orChange the defect partCheck HDMI EDID Data

    Re-download HDCP

    Pass

    Pass

    Check the Input/Outputof IC800 Fail

    Re-soldering orChange the defect part

    Repeat [A], & [B] Process

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    LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes

    - 16 -

    No Sound

    Check The Input Sourse

    Check The Input/OutputOf IC600

    Re-soldering orChange the defect partFail

    Pass

    Pass

    Check The Speaker Change SpeakerFail

    Check The Speaker Wire

    Pass

    Change The Source InputFail

    No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal

    Check Input source

    Cable And Jack

    Pass

    Check Input sourceCable And Jack

    Pass

    Check The Input/Outputof JK102

    Re-soldering orChange the defect part

    Pass

    Fail

    Pass

    Repeat [A], & [B] Process

    Pass

    Check the Input/Outputof IC800 Fail

    Re-soldering orChange the defect part

    Pass

    Check The Input/OutputOf TU500

    Re-soldering orChange the defect part

    Pass

    Fail

    Pass

    Check the Input/Outputof IC800 Fail

    Re-soldering orChange the defect part

    Repeat [A], & [B] Process

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    LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved.Only for training and service purposes

    - 17 -

    BLOCK DIAGRAM

    R G B - P C ( J K 2 0 2 )

    T U N E R ( T U 5 0 0 )

    C O M P O N E N T / A V 1 A u d i o o u t ( J K 1 0 2 )

    A V 2

    ( J K 2 0 1 )

    A V

    _ L I N / R I N :

    5 0 0 m V r m s

    S P K

    _ L

    S P K

    _ R

    C O M P O N E N T

    _ L / R :

    5 0 0 m V r m s

    A V

    _ V I N :

    1 V p p

    N T P 3 2 0 0 L

    C

    O M P

    _ Y / P b / P r

    I R & L E D ( P 2 0 1 )

    H D M I_ D A T A 0

    T

    U_ M

    A I N

    C O M P O N E N T

    _ Y / P b / P r :

    1 / 0 . 7

    V p p

    A

    V_ V

    I N

    C

    O M P

    _ L I N / R I N

    L_ C

    H

    R_ C

    H

    A

    V_ L

    I N / R I N

    P C - S O U N D ( J K 2 0 3 )

    I 2 S

    _ M C L K

    I 2 S

    _ S D O

    I 2 S

    _ W S

    I 2 S

    _ S C K

    T M D S

    L I P S

    R L

    _ O N / I D I S P

    _ E N

    P A N E L

    _ S T A T U S

    E - D

    I M

    O P C

    _ O U T

    E E P R O M

    ( 2 4 L C 2 5 6 )

    S e r

    i a l F l a s h

    ( M X 2 5 L 6 4 )

    E E P R O M

    H D C P

    ( 2 4 W C 0 8 )

    E E P

    _ S C L / S D A

    E E P

    _ S C L / S D A

    T X C E 2

    T X C E 3

    T X C L K E

    T X C E 1

    T X C E 0

    T X C O 1

    T X C O 3

    T X C O 2

    T X C O 0

    T X C L K O

    M_ S C L / S D A

    M A I N S C L A E R

    M a t r i x

    ( L G E 4 7 6 7 A )

    ( I C 8 0 0 )

    E E P R O M

    2 4 C 0 2

    I C 3 0 2

    T U 5 0 0

    I C 8 0 2

    I C 8 0 3

    I C 8 0 1

    I C 6 0 0

    P 4 0 2

    P 4 0 3

    M_ S

    C L / S D A

    S

    I D E

    R E A R

    H D M I 3

    ( J K 3 0 3 )

    U S B

    ( J K 2 0 4 )

    R S - 2 3 2 C ( J K 2 0 0 )

    U S B ( S V C ) ( J K 2 0 5 )

    H D M I 1 ( J K 3 0 1 )

    H D M I 2 ( J K 3 0 2 )

    E E P R O M

    2 4 C 0 2

    I C 3 0 1

    E E P R O M

    2 4 C 0 2

    I C 3 0 0

    E E P R O M

    2 4 C 0 2

    I C 3 0 0

    D D C

    _ S C L 1 / S D A 1

    D D C

    _ S C L 2 / S D A 2

    D D C

    _ S C L 3 / S D A 3

    C o n

    t r o

    l l e r

    S T 3 2 3 2 C D R

    I C 2 0 0

    R X D / T X D

    E E P R O M

    2 4 C 0 2

    I C 2 0 1

    D S U B

    _ S C L / S D A

    P 4 0 1

    S P

    I_ C Z / D O

    S P I_ C L K / D I

    H D M I_ D A T A 1

    H D M I_ D A T A 2

    U S B D N / D P

    P C

    _ R / G / B

    P C

    _ V S / H S

    T X D / R X D

    P C

    _ A U D

    _ L / R

    T X C O 4

    T X C E 4

    F H D L V D S c o n n e c t o r

    H D L V D S c o n n e c t o r

    D D R 2 S D R A M

    ( 5 1 2 M B y t e )

    I C 9 0 0

    D D R 2_ C K E

    D D R 2_ W E Z

    D D R 2_ D Q S 0

    D D R 2_ M C L K

    D D R 2_ B A 0 / 1

    D D R 2_ D Q S 1

    D D R 2_ O D T

    D D R 2_ D Q M 0 / 1

    S I D E

    _ V I N

    S I D E

    _ L I N / R I N

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    - 18 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.Only for training and service purposes

    L V 1

    8 0 0

    1 2 0

    1 2 2

    5 0 0

    3 0 0

    5 1 0

    A 2

    A 2 1

    A 5

    A

    1 0

    5 4 0

    5 2 1

    5 3 0

    4 0 0

    8 1 0

    9 1 0

    5 5 0

    9 0 0

    2 0 0

    EXPLODED VIEW

    Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW.It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.

    IMPORTANT SAFETY NOTICE

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    THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

    CVBS_LIN

    ZD100SD05

    ZD103SD05

    ZD105SD05

    CVBS_VIN

    CVBS_RIN

    ZD104SD05

    ZD101SD05

    ZD102SD05

    D10130V

    D10030V

    D10430V

    D10530V

    COMP2_Y

    COMP2_PB

    COMP2_PR

    COMP2_L

    COMP2_R

    R10975

    R10875

    R10775

    R104220K

    R11812K

    R11712K

    R11912K

    R12012K

    R113

    10K

    R115

    10K

    R116

    10K

    R100220K

    R111220K

    R112220K

    R11075

    R114

    10K

    R121

    75

    JP102

    C1045600pF50V

    ZD10630V

    ZD10730V

    C101 10uF16V

    Q105RT1C3904-T112

    EBC

    MUT

    R124

    1K

    C1035600pF50V

    R1220

    R123

    1K

    Q103RT1C3904-T112

    EBC

    Q106RT1C3904-T112

    EBC

    Q104RT1C3904-T112

    EBC

    C102 10uF16V

    R1250

    MUT

    JK101

    PPJ238-01

    NON_AUDIO_OUT

    5D [GN2]O-SPRING

    6D [GN2]E-LUG

    4D [GN2]CONTACT

    7E [BL2]E-LUG-S

    5E [BL2]O-SPRING

    7F [RD2]E-LUG-S

    5F [RD2]O-SPRING_1

    5G [WH2]O-SPRING

    4H [RD2]CONTACT

    5H [RD2]O-SPRING_2

    6H [RD2]E-LUG

    6A [YL1]E-LUG

    5A [YL1]O-SPRING

    4A [YL1]CONTACT

    5B [WH1]O-SPRING

    4C [RD1]CONTACT

    5C [RD1]O-SPRING

    6C [RD1]E-LUG

    JK102

    PPJ239-03

    AUDIO_OUT

    5J [GN2]O-SPRING

    6J [GN2]E-LUG

    4J [GN2]CONTACT

    7K [BL2]E-LUG-S

    5K [BL2]O-SPRING

    7L [RD2]E-LUG-S

    5L [RD2]O-SPRING_1

    5M [WH2]O-SPRING

    4N [RD2]CONTACT

    5N [RD2]O-SPRING_2

    6N [RD2]E-LUG

    6D [WH1]E-LUG

    5D [WH1]O-SPRING

    7E [RD1]E-LUG-S

    5E [RD1]O-SPRING_1

    7F [YL1]E-LUG-S

    5F [YL1]O-SPRING_1

    4F [YL1]CONTACT_1

    5G [WH1]O-SPRING_2

    4H [RD1]CONTACT_2

    5H [RD1]O-SPRING_2

    6H [RD1]E-LUG

    COMPONENT / AV IN / AV AUDIO OUT

    POP NOISE

    POP NOISE

    AUDIO_OUT O

    LP91J

    EAX64045802

    p y r g

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    U S

    B D

    OWN

    STREAM

    THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

    SIDE_LIN

    SIDE_RIN

    ZD2035.6BSIDE_AV

    SIDE_VZD2025.6B

    SIDE_AV

    IR_OUT+3.5V_MST

    TXD

    R2044.7K

    IC200ST3232CDR

    3C1-

    2V+

    4C2+

    1C1+

    6V-

    5C2-

    7T2OUT

    8R2IN

    9 R2OUT

    10 T2IN

    11 T1IN

    12 R1OUT

    13 R1IN

    14 T1OUT

    15 GND

    16 VCC

    R2054.7K

    RXD

    +3.5V_MST

    IC201CAT24C02WI-GT3

    RGB_EEPROM_CATAL

    3A2

    2A1

    4VSS

    1A0

    5SDA

    6SCL

    7WP

    8VCC

    D20030V

    D20130V

    D20630VSIDE_AV

    D20530VSIDE_AV

    C2030.1uF16V

    C2000.1uF16V

    C2010.1uF16V

    C2020.1uF16V

    R202

    100

    R203

    100

    R22775

    SIDE_AV

    R223220K

    READY

    R222220K

    READY

    R22612K

    SIDE_AV

    R22812K

    SIDE_AV R216100

    R217100

    R218100

    C2080.1uF50V

    OCP_READYC20910uF16V

    OCP_READY

    L200

    120OHM

    OCP_READY

    +5V_USB

    R2091K

    OCP_READY R2104.7K

    OCP_READY

    R237

    0

    Non_OCP

    C21010uF6.3V

    L201

    500C212220uF16V

    C214100uF16V

    D213OCP_READY

    AAC

    C

    R238510

    OCP_READY

    R224

    10K

    SIDE_AV

    R22510K

    SIDE_AV

    JK200SPG09-DB-009

    1

    2

    3

    4

    5

    6

    7

    8

    9

    10

    JK201PPJ235-01

    SIDE_AV

    4A [YL]O-SPRING

    5A [YL]E-LUG

    3A [YL]CONTACT

    4B [WH]O-SPRING

    3C [RD]CONTACT

    4C [RD]O-SPRING

    5C [RD]E-LUG

    JK202

    SPG09-DB-0106630TGA004Q

    RED

    1

    GREEN

    2

    BLUE

    3

    GND_1

    4

    DDC_GND

    5

    RED_GND6

    GREEN_GND7

    BLUE_GND8

    NC9

    SYNC_GND10

    GND_2

    11

    DDC_DATA12

    H_SYNC13

    V_SYNC14

    DDC_CLOCK15

    SHILED16

    JK203PEJ027-01

    6B T_TERMINA

    7B B_TERMINA

    5 T_SPRING

    4 R_SPRING

    7A B_TERMINA

    6A T_TERMINA

    3 E_SPRING

    D20730V

    USB_DN

    USB_DP

    ZD20430V

    READYZD20530V

    READY

    JK205KJA-UB-0-0037

    REAR_USB

    1

    2

    3

    4

    5

    R229

    0

    REAR_USB

    USB_DL_P

    R230

    0REAR_USB

    USB_DL_N

    USB_DL_P

    USB_DL_N

    IC202AP2191SG-13

    OCP_READY

    3IN_2

    2IN_1

    4EN

    1GND

    5FLG

    6OUT_1

    7OUT_2

    8NC

    +3.5V_MULTI

    JK204KJA-UB-4-0004

    SIDE_USB

    1

    2

    3

    4

    5

    IC201-*1R1EX24002ASAS0A

    RGB_EEPROM_RENESAS

    3A2

    2A1

    4VSS

    1A0

    5SDA

    6SCL

    7WP

    8VCC

    USB Its possibel to 27~47ohm

    ** 1A Design

    SIDE AV

    RS-232C

    PC EDID

    PC SOUND

    Close to SIDE_USB

    PC

    LP91J

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    THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

    +5V_HDMI_2

    HPD_MST_2

    TMDS2_RX2-

    CECTMDS2_RXC-

    TMDS2_RXC+ TMDS1_RXC-

    TMDS2_RX0+

    +5V_HDMI_2

    HPD_MST_1

    CEC

    TMDS1_RX2+

    TMDS2_RX1+

    +5V_MULTI

    +5V_HDMI_1

    TMDS2_RX0-

    TMDS1_RX1-

    TMDS2_RX1-

    TMDS1_RX2-

    TMDS1_RX0-

    TMDS1_RX1+

    TMDS1_RX0+

    TMDS2_RX2+

    TMDS1_RXC+

    DDC_SDA2DDC_SCL2

    JP301

    JP300

    Q3012SC3875S

    RT1C3904-T112

    E

    B

    C

    Q300

    2SC3875SRT1C3904-T112

    E

    B

    C

    D301KDS184S

    A 1

    C

    A 2

    IC301CAT24C02WI-GT3

    HDMI2_EEPROM_CATAL

    3A2

    2A1

    4VSS

    1A0

    5SDA

    6SCL

    7WP

    8VCC

    IC300CAT24C02WI-GT3

    HDMI1_EEPROM_CATAL

    3A2

    2A1

    4VSS

    1A0

    5SDA

    6SCL

    7WP

    8VCC

    DDC_WP

    R30110K

    R303

    1K

    R30010K

    R3021K

    R305 1 0 0

    R304 1 0 0

    C3010.01uF

    R327 100

    R30910K

    R31110K

    JK302YKF45-7058V

    14 NC

    13 CEC

    5 DATA1_SHIELD

    20

    SHIELD

    12 CLK-

    11 CLK_SHIELD

    2 DATA2_SHIELD

    19 HPD

    18 +5V_POWER

    10 CLK+

    4 DATA1+

    1 DATA2+

    17 DDC/CEC_GND

    9 DATA0-

    8 DATA0_SHIELD

    3 DATA2-

    16 SDA

    7 DATA0+

    6 DATA1-

    15 SCL

    JK301YKF45-7058V

    14 NC

    13 CEC

    5 DATA1_SHIELD

    20

    SHIELD

    12 CLK-

    11 CLK_SHIELD

    2 DATA2_SHIELD

    19 HPD

    18 +5V_POWER

    10 CLK+

    4 DATA1+

    1DATA2+

    17 DDC/CEC_GND

    9 DATA0-

    8 DATA0_SHIELD

    3 DATA2-

    16 SDA

    7 DATA0+

    6DATA1-

    15 SCL

    R31910K

    +5V_HDMI_3

    +5V_MULTI

    TMDS3_RX1-

    DDC_SCL3

    HPD_MST_3 Q3022SC3875SRT1C3904-T112

    E

    B

    C

    TMDS3_RX0+

    +5V_HDMI_3

    R312

    10K

    DDC_WP

    R318 100

    TMDS3_RXC+

    JK303KJA-ET-0-0032

    14 NC

    13 CEC

    5 DATA1_SHIELD

    20

    JACK_GND

    12 CLK-

    11 CLK_SHIELD

    2 DATA2_SHIELD

    19 HPD

    18 +5V_POWER

    10 CLK+

    4 DATA1+

    1 DATA2+

    17 DDC/CEC_GND

    9 DATA0-

    8 DATA0_SHIELD

    3 DATA2-

    16 SDA

    7 DATA0+

    6 DATA1-

    15 SCL JP305

    TMDS3_RXC-

    DDC_SDA3

    R32010K

    R314

    1K

    TMDS3_RX1+

    CEC

    TMDS3_RX2+

    R 3 17 1 00

    JP304

    C3000.01uF25V

    TMDS3_RX2-

    R 3 29 1 00

    IC302CAT24C02WI-GT3

    HDMI3_EEPROM_CATAL

    3A2

    2A1

    4VSS

    1A0

    5 SDA

    6 SCL

    7 WP

    8 VCC

    D302KDS184S

    A 1

    C

    A 2

    TMDS3_RX0-

    IC301-*1R1EX24002ASAS0A

    HDMI2_EEPROM_RENESAS

    3A2

    2A1

    4VSS

    1A0

    5SDA

    6SCL

    7WP

    8VCC

    IC3R1EX2

    HDMI1_E

    3A2

    2A1

    4VSS

    1A0

    IC302-*1R1EX24002ASAS0A

    HDMI3_EEPROM_RENESAS

    3A2

    2A1

    4VSS

    1A0

    5SDA

    6SCL

    7WP

    8VCC

    LP91J

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    THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

    MAIN_SIF

    0.01uFC501

    50V

    M_SDA

    C50227pF50V

    +5V_TUNER

    TV_MAIN

    M_SCL

    +5V_TUNER

    C50450V

    READY

    C50027pF50V

    L502READY

    10uH

    C50782pF50V

    READY

    C50810uF16V

    L500

    120-ohm

    READY

    Q502ISA1530AC1

    E

    BC

    R5024.7K

    R506220

    R507220

    C505100uF16V

    READY

    C506100uF16V

    READY

    R505

    47

    R504

    47

    C5030.1uF50V

    R500

    0

    R5010

    TU500TAFJ-Z001D

    PAL_TUNER

    5 MOPLL_AS

    11 VIDEO

    2 NC_2

    10 NC_4

    4 RF_AGC

    1 NC_1

    9 SIF

    8 NC_3

    3 +B[5V]

    7 SDA

    6 SCL

    12 GND

    13

    SHIELD

    TU500-*1

    TAFJ-H001F

    5MOPL

    11VIDEO

    2NC_2

    10NC_4

    4RF_AG

    1NC_1

    9SIF

    8NC_3

    3+B[5V

    7SDA

    6SCL

    12GND

    13

    SHIELD

    Near the pin

    LP91J

    EAX64045802

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    THERMAL

    THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

    C6440.1uF

    C6370.1uF

    M_

    S D A

    C6061000pF

    C61622000pF

    C623 22000pF+1.8V_DVDD

    C6511000pF50V

    C6320.47uF

    MULTI_PW_SW

    C6050.1uF

    +1.8V_DVDD

    C6150.1uF50V

    C6290.1uF

    +3.3V_MULTI_MST

    C6430.1uF

    C6170.1uF50V

    C6020.1uF

    C6470.01uF

    SPK_R+

    M_

    S C L

    C6100.1uF

    C611 2200 0pF

    SPK_L+

    +1.8V_AVDD

    SPK_L-

    C6690.1uF

    +16V_NTP

    +16V_NTP

    SPK_R-

    C601100pF

    C62522000pF

    +1.8V_AVDD

    C6720.01uF

    C6480.01uF

    C6031000pF

    SW_RESET

    C6730.47uF

    C6710.01uF

    C6260.1uF

    C6130.01uF50V

    +1.8V_DVDD

    +1.8V_AVDD

    +1.8V

    I2S_MCLK

    I 2 S

    _ S D O

    I 2 S

    _ W S

    I 2 S

    _ S C K

    C619390pF

    C621390pF

    C630390pF

    C634390pF

    C6081uF

    C6181uF

    C6241uF

    C6141uF

    C6070.1uF50V

    C64210uF35V

    C60010uF16V

    C60410uF16V

    C60910uF 16V

    R6043.3

    R60812

    R61112

    R61012

    R63812

    R6634.7K

    R6234.7K

    R6263.3

    R625

    3.3

    R601 100

    R6003.3K

    R 6 7 6

    1 0 0

    R 6 7 7

    1 0 0

    R 6 7 8

    1 0 0

    R602100

    R603100

    R65812

    R65312

    R62112

    R65412

    R6284.7K

    R6674.7K

    R6713.3

    R6353.3

    L605

    MLB-201209-0120P-N20LCML00003B

    120-ohm

    L606

    MLB-201209-0120P-N2

    0LCML00003B

    120-ohm

    C63833pF

    50VREADY

    C63933pF

    50VREADY

    +3.3V_MST

    R63010K

    Q603RT1C3904-T112E

    BC

    R 6 29 1 0 K

    MULTI_PW_SW R627

    0

    READY

    R624

    0

    READY

    L608MLB-201209-0120P-N2

    L609

    MLB-201209-0120P-N2

    L610MLB-201209-0120P-N2

    L611

    MLB-201209-0120P-N2

    C61268uF35V

    C64068uF35V

    L607AD-9060

    EAP61008401

    2S

    1S 1F

    2F

    L603AD-9060

    EAP61008401

    2S

    1S 1F

    2F

    R63147K

    READY

    R673 0

    IC600NTP-3200L

    1BST1A

    2VDR1A

    3RESET

    4AD

    5DVSS_1

    6VSS_IO

    7CLK_I

    8VDD_IO

    9DGND_PLL

    10AGND_PLL

    11LF

    12AVDD_PLL

    13DVDD_PLL

    14TEST0/GND

    1 5

    D V S S

    _ 2

    1 6

    D V D D

    1 7

    S D A T A

    1 8

    W C K

    1 9

    B C K

    2 0

    S D A

    2 1

    S C L

    2 2

    M O N I T O R

    _ 0

    2 3

    M O N I T O R

    _ 1

    2 4

    M O N I T O R

    _ 2

    2 5

    F A U L T

    2 6

    V D R 2 B

    2 7

    B S T 2 B

    2 8

    P G N D 2 B

    _ 1

    29 PGND2B_2

    30 OUT2B_1

    31 OUT2B_2

    32 PVDD2B_1

    33 PVDD2B_2

    34 PVDD2A_1

    35 PVDD2A_2

    36 OUT2A_1

    37 OUT2A_2

    38 PGND2A_1

    39 PGND2A_2

    40 BST2A

    41 VDR2A

    42 NC

    4 3

    V D R 1 B

    4 4

    B S T 1 B

    4 5

    P G N D 1 B

    _ 1

    4 6

    P G N D 1 B

    _ 2

    4 7

    O U T 1 B

    _ 1

    4 8

    O U T 1 B

    _ 2

    4 9

    P V D D 1 B

    _ 1

    5 0

    P V D D 1 B

    _ 2

    5 1

    P V D D 1 A

    _ 1

    5 2

    P V D D 1 A

    _ 2

    5 3

    O U T 1 A

    _ 1

    5 4

    O U T 1 A

    _ 2

    5 5

    P G N D 1 A

    _ 1

    5 6

    P G N D 1 A

    _ 2

    57

    [ E P ] G N D

    R6054.7K

    MNT_LOUT

    +12V_AUDIO

    R6164.7K

    C65

    Q601RT1C3904-T112

    EBC

    C65

    MNT_ROUT

    MNT_L_

    C6310.1uF16V

    C6200.1uF16V

    Q602RT1C3904-T112

    EBC

    MNT_R_

    +12V_AUDIO

    Main AMP

    AMP :G

    LP91J

    EAX64045802

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    THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

    DDR2_A[0]

    DDR2_A[12]

    DDR2_A[11]

    DDR2_A[1]

    DDR2_A[2]

    DDR2_A[3]

    DDR2_A[4]

    DDR2_A[5]

    DDR2_A[6]

    DDR2_A[7]

    DDR2_A[8]

    DDR2_A[9]

    DDR2_A[10]

    DDR2_D[0-15]

    DDR2_D[0]

    DDR2_D[1]

    DDR2_D[2]

    DDR2_D[3]

    DDR2_D[4]

    DDR2_D[5]

    DDR2_D[6]

    DDR2_D[7]

    DDR2_D[8]

    DDR2_D[9]

    DDR2_D[10]

    DDR2_D[11]

    DDR2_D[12]

    DDR2_D[13]

    DDR2_D[14]

    DDR2_D[15]

    +1.8V_DDR

    DDR2_A[0-12]

    DDR2_BA0DDR2_BA1

    DDR2_MCLKDDR2_MCLKZDDR2_CKE

    DDR2_ODT

    DDR2_RASZDDR2_CASZDDR2_WEZ

    DDR2_DQS0PDDR2_DQS1P

    DDR2_DQM0DDR2_DQM1

    DDR2_DQS0MDDR2_DQS1M

    +1.8V_DDR

    +1.8V_DDR

    DDR2_D[0-15]

    V_REF

    R900

    56R901

    56

    R902

    56R90356

    R904

    56R90556

    +1.8V_DDR

    R906150

    READY

    V_REF

    C91910uF10V

    R 9 0 7 1

    K

    R 9 0 8 1

    K C9051000pF

    C9180.1uF

    C9202.2uF16V

    C9040.01uF

    C9080.01uF

    C9070.01uF

    C9060.01uF

    C9030.01uF

    C9020.01uF

    C9100.01uF

    C9010.01uF

    C9090.01uF

    C9000.01uF50V

    IC900

    K4T51163QI-HCF7

    J2VREF

    J8CK

    H2 VSSQ_2

    B7UDQS

    N8A4

    P8A8

    L1NC_4

    L2BA0

    R8NC_3

    K7RAS

    F8 VSSQ_3

    F3LDM

    P3A9

    M3A1

    N3A5

    K8CK

    R3NC_5

    L3BA1

    J7VSSDL

    L7CAS

    F2 VSSQ_4

    B3UDM

    M2A10/AP

    K2CKE

    R7NC_6

    M7A2

    N7A6

    M8A0

    J1VDDL

    K3WE

    E8LDQS

    P7A11

    K9ODT

    A2NC_1

    N2A3

    P2A7

    H8 VSSQ_1

    F7LDQS

    A8UDQS

    R2A12

    L8CS

    E2NC_2

    E7 VSSQ_5D8 VSSQ_6D2 VSSQ_7A7 VSSQ_8B8 VSSQ_9B2 VSSQ_10

    P9 VSS_1N1 VSS_2J3 VSS_3E3 VSS_4A3 VSS_5

    G9 VDDQ_1G7 VDDQ_2G3 VDDQ_3G1 VDDQ_4E9 VDDQ_5C9 VDDQ_6C7 VDDQ_7C3 VDDQ_8C1 VDDQ_9A9 VDDQ_10

    R1 VDD_1M9 VDD_2J9 VDD_3E1 VDD_4A1 VDD_5

    B9 DQ15B1 DQ14D9 DQ13D1 DQ12D3 DQ11D7 DQ10C2 DQ9C8 DQ8F9 DQ7F1 DQ6H9 DQ5H1 DQ4H3 DQ3H7 DQ2G2 DQ1G8 DQ0

    DDR2

    DDR2 MEMORY

    Close to DDR2 IC

    Close to DDR2 IC

    LP91J

    EAX64045802

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