Fatigue Crack Growth Behaviour in Semi-liquid Die-cast Al-7%Si-0.4%Mg
Materials Declaration Form - st.com · Die Other inorganic materials 14.809 mg supplier die Silicon...
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IPC 1752 Form Type * Distribute Sectionals * Material Info Subsectionals * Manufacturing Info Company Name * STMicroelectronics Response Date * Contact Name * Refer to " Supplier Comment" section Contact Title Contact Phone * Refer to " Supplier Comment" section Contact Email * Authorized Representative * Floriana SAN BIAGIO Representative Title Representative Phone * Refer to " Supplier Comment" section Representative Email * Supplier Comment Uncertainty Statement Supplier Acceptance * true Legal Declaration * Legal Statement Materials Declaration Form Version 2 A-D * : Required Field Supplier Information AMS MD Champions Refer to " Supplier Comment" section 2019-04-02 Refer to " Supplier Comment" section Refer to " Supplier Comment" section Legal Statement Standard Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier’s liability and the Company’s remedies for issues that arise regarding information the Supplier provides in this form. Online Technical Support - STMicroelectronics : http://www.st.com/internet/com/support/online_tech_support.jsp While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Transcript of Materials Declaration Form - st.com · Die Other inorganic materials 14.809 mg supplier die Silicon...
IPC 1752
Form Type * Distribute
Sectionals * Material Info Subsectionals * Manufacturing Info
Company Name * STMicroelectronics Response Date *
Contact Name * Refer to " Supplier Comment" section Contact Title
Contact Phone * Refer to " Supplier Comment" section Contact Email *
Authorized Representative * Floriana SAN BIAGIO Representative Title
Representative Phone * Refer to " Supplier Comment" section Representative Email *
Supplier Comment
Uncertainty Statement
Supplier Acceptance * true Legal Declaration *
Legal Statement
Materials Declaration Form
Version 2
A-D
* : Required Field
Supplier Information
AMS MD Champions
Refer to " Supplier Comment" section
2019-04-02
Refer to " Supplier Comment" section
Refer to " Supplier Comment" section
Legal Statement
Standard
Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge
and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in
determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in
completing this form, and that Supplier may not have independently verified such information. However, in situations where
Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have
provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the
certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified
part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that
agreement, will be the sole and exclusive source of the Supplier’s liability and the Company’s remedies for issues that arise regarding
information the Supplier provides in this form.
Online Technical Support - STMicroelectronics : http://www.st.com/internet/com/support/online_tech_support.jsp
While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as
available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of
completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss
or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Mfr Item Number Mfr Item Name Version Mfr Site Date
AMZ7*VN86X3B B MU1A 2019-04-02
Amount UoM Unit type ST ECOPACK Grade
534.52 mg Each ECOPACK® 1
J-STD-020 MSL Rating Classification Temp Nbr of Reflow Cycles
3 250 3
bulk Solder Termination Terminal Plating Terminal Base Alloy Comment
Not Applicable ; if coating is used or other bulk termaination : add in commentsTin (Sn), matte, annealed Copper Alloy
Package Designator Size Nbr of instances Shape
DSO 12.8X7.5X2.5 20 gull wing
Comment
Product
Manufacturing information
SO 20 .30 TO JEDEC MS-013; MDF valid for VNQ860-E and VNQ860TR-E
RoHS Directive 2011/65/EU-July 2011 – Annex II amended by Directive 2015/863-April 2015
Response
false
false
truefalse
Exemption Id.
7a
Response
false
CategoryLevel_Name CategoryLevel_Threshold amount in product (mg) Application ppm in product
Lead 1000 ppm 9.119 Die attach 17060
Product(s) does not meet EU RoHS requirements and is not under exemptions
Description
Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead)
Query
Product(s) meets EU RoHS requirement without any exemptions
Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may
apply)
Product(s) meets EU RoHS requirements by application of the selected exemption(s)
QueryList :REACH-15th January 2019
Query
The product does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH
Mfr Item Name 536.159 5999998 999997
Homogeneous Material Material Group Mass UoM Level Substance Category Substance CAS Exempt Mass UoM Concentration in
homogeneous
material (ppm)
Concentration in
product (ppm)
Die Other inorganic materials 14.809 mg supplier die Silicon (Si) 7440-21-3 14.42 mg 973732 26895
Die supplier metallization Aluminium (Al) 7429-90-5 0.089 mg 6010 166
Die supplier passivation Silicon Nitride (SiN) 68034-42-4 0.081 mg 5470 151
Die supplier passivation Silicon Oxide(SiO2) 7631-86-9 0.125 mg 8441 233
Die supplier back side metallization Titanium (Ti) 7440-32-6 0.005 mg 338 9
Die supplier back side metallization Gold (Au) 7440-57-5 0.016 mg 1080 30
Die supplier back side metallization Nickel (Ni) 7440-02-0 0.073 mg 4929 136
Leadframe Copper & its alloys 150.338 mg supplier alloy Copper (Cu) 7440-50-8 149.907 mg 997133 279594
Leadframe supplier alloy Iron (Fe) 7439-89-6 0.069 mg 459 129
Leadframe supplier alloy Iron Phosphide (FeP) 26508-33-8 0.126 mg 838 235
Leadframe supplier metallization Silver (Ag) 7440-22-4 0.236 mg 1570 440
Soft solder Other Organic Materials 9.353 mg JIG R solder Lead (Pb) 7439-92-1 7a-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead)9.119 mg 974981 17008
Soft solder supplier solder Silver (Ag) 7440-22-4 0.14 mg 14968 261
Soft solder supplier solder Tin (Sn) 7440-31-5 0.094 mg 10050 175
Bonding wire Precious metals 0.578 mg supplier wire Gold (Au) 7440-57-5 0.578 mg 1000000 1078
encapsulation Other Organic Materials 360.052 mg supplier mold compound Silica, vitreous 60676-86-0 285.522 mg 793002 532531
encapsulation supplier mold compound Epoxy Resin Proprietary 34.205 mg 95000 63796
encapsulation supplier mold compound Phenol Novolac 9003-35-4 18.003 mg 50001 33578
encapsulation supplier mold compound Antimony Trioxide 1309-64-4 7.201 mg 20000 13431
encapsulation supplier mold compound Bismuth Trioxide 1304-76-3 2.52 mg 6999 4700
encapsulation supplier mold compound Bismuth nitrate 10361-44-1 2.52 mg 6999 4700
encapsulation supplier mold compound Brominated epoxy resin 40039-93-8 8.281 mg 22999 15445
encapsulation supplier mold compound Carbon black 1333-86-4 1.8 mg 4999 3357
connections coating Solder 1.029 mg supplier solder alloy Tin (Sn) 7440-31-5 1.029 mg 1000000 1919
Material Composition Declaration AMZ7*VN86X3B
