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Founded in 1979Privately OwnedHealthy Balance Sheet42,000 Sq. Ft.160 EmployeesISO 9001:2008ITAR CertifiedAS9100 In Progress

Annual Sales ($ Millions)

Marcel Electronics International

Engineering Partnership

Benefits of Proactive Design Reviews: High Speed Signal Integrity Military and Aerospace Applications Thermal Considerations High Speed Antenna Applications Cost Reduction

Parameters Standard Advanced R&D Comments

IL line and space 0.5 oz. copper 4/4 3/3 2/2

OL line and space 0.375 oz. copper 4/4 3/3 2/2.5

OL line and space 0.5 oz. base copper 5/5 4/4 3/3

Smallest drilled thru via - .062” brd. thickness .008” .006” .005”Smallest drilled thru via - .093” brd. thickness .010” .008” .006”

Smallest drilled thru via - .115” brd. thickness .012 .010” .006”

Smallest drilled thru via - .250” brd. thickness .020” .016” .014”

.001” annular ring – Class 2 .010” .008” See Eng.

.002” annular ring – Class 3 .012” .010” See Eng.Antipad over drill size .024” .016” .012”Microvia laser drill size .006” .004” .003”Pad over microvia drill size .006” .005” .004”Stacked/Staggered Micro Vias Yes Yes YesMaximum layers of Micro Via per side Unlimited Unlimited ALAV Any Layer Any Via

Maximum aspect ratio – w/ .010” drilled hole 12:1 18:1 24:1

Maximum aspect ratio - microvias 0.8:1 0.8:1 See Eng. Not recommended to go higher than1:1

Technology Roadmap

MEI is proud to announce our submittal to PCQR² and listings as CAT Code “G16”, “F27”, “H34”, “I20”, “I45”, “J20”, “K37” (Oct 2010)

Parameters Standard Advanced R&D Comments

Press fit hole tolerance +/- .002” +/- .002” +/- .002”SMD soldermask web width - mils .004” .0035” .003SMD soldermask clearance – mils (over pad) .005” .004” See Eng.Soldermask registration tolerance .003” .002” See Eng.Impedance control – single ended +/- % +/- 7% +/- 5% See Eng.

Impedance control – edge coupled diff. +/- % +/- 10% +/- 7% See Eng.

Impedance control – broad side differential +/- % +/ 10% +/- 7% See Eng.

Board thickness – Min./Max. .020” / .240” .016” / .300” .010” / .300”

Maximum layer count 28 50 50+Layer count is only

limited by total thickness

Average layer count 16Maximum panel size 21”X 24” 20”X 26” See Eng.Maximum bow and twist - % (balanced construction) <0.75% <0.75% <0.5%

Minimum copper to edge clearance .015” .012” .010”Min. positional tol. – feature to feature +/- .005” +/- .003” +/- .003”Layer to layer registration tolerance +/- .005” +/- .004 +/- .004”Minimum core thickness .002” .001” .001”

Technology Roadmap

Parameters Standard Advanced R&D CommentsSurface finishes offered Immersion Silver In House ENIG (Electroless NI / Immersion Au) In House ENEPIG (Electroless Nickel / Electroless Palladium / Immersion Gold

Outside

OSP – Entek Plus HT In House

HASL (Tin / Lead) & Tin Lead Reflow Outside

Full body & Selective Electrolytic Ni / Au In House Gold edge connector In House

Other Capabilities Sequential lamination 3 Sublams 5 Sublams See Eng. Ormet Conductive Pastes Yes Copper Filled Vias Yes

Epoxy filled vias Yes MEI recommends Non Conductive

Embedded Capacitance & Resistance Yes ZBC200, HK 04, Ticer

Mixed dielectric construction Yes Cavity & Heat Sink Designs Yes See Eng Back-Drilling Tolerances +/- .015 .010 See Eng

Technology Roadmap

Parameters Standard Advanced R&D Comments

Other Capabilities Pigmented Soldermask (Red, Blue, Black, Purple, Clear)

Yes

Photo Imageable Legend Yes

Jump Scoring Yes

Edge Milling Yes Counter Bores / Slot Milling Yes Edge Plating Yes

Valor ODB++ Yes

Industry Certifications

UL 94V-0 Yes

ISO 9001:2008 Yes

IPC-6012C Class 2, 3, 3/A, -6016, -6018 Yes

IPC-9151 / PCQR² Benchmark Data CAT CODE F27, G16, H34, I20, I45, J20, K37 ITAR Registered Yes Cert # M20467

JCP Registered Yes Cert # 47424 AS9100 In Process RoHS Compliant Yes

Technology Roadmap

Preferred data formats: Gerber (274 or 274X) or Valor ODB++, drill files should be in ASCII format, fabrication drawings asGerber, HPGL, HPGL2 or AutoCAD DXF / DWG files. An IPC D-356 netlist is highly recommended for crosscheck against Gerber files and for electrical testing.

Data files and drawings should be compressed together into either ZIP (WinZip) or TGZ (UNIX) files to reduce file size and speed up the file transfer process Alternative data types or compression schemes may be acceptable by agreement.

EMAILAttach your files to an email and send to data@mei4pcbs.com . Attached flies should be no larger than 15 MB (15,000 KB) although we have the capacity to accept up to 50 MB files. Please keep in mind that your own email server may be a limiting factor in your ability to send large file attachments.

FTPUsing FTP client software (such as WS-FTP) you can send files via FTP with no file size limits.

FTP hostname: ftp.mei4pcbs.com IP address is 65.170.125.60

username: mei/marcel <------all lower case exactly as shown, using forward slash ( / )

password: mei4qta <-------all lower case exactly as shown

Upload your files to INCOMING directory (directory name is not case sensitive). Also, be sure to use PASSIVE modefor compatibility with our firewall. If using WS-FTP this setting is found on the “Properties” page under “Advanced” tab.

Please contact our Customer Service Department by phone (714) 974-8590 if you prefer to have your own FTP username, password and directory or if you experience any problems with the transfer..

File Transfer Instructions

Thank You!

130 W. Bristol LaneOrange, California 92865Tel. 714-974-8590www.mei4pcbs.com