Managing Challenges Associated with Large Area Array C4 ......and video game consoles continues to...
Transcript of Managing Challenges Associated with Large Area Array C4 ......and video game consoles continues to...
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Managing Challenges Associated with Large Area Array C4 Bump/Cu
Pillar SOC Applications using Advanced MEMS Technology
Mike Chrastecky – CEO/President BucklingBeam
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Motivation/Issue• As the market appetite for advanced processing power in automotive, mobile, tablet, flat panel, and video game consoles continues to grow:– Complex wafer testing with higher pin counts, large area array, increased parallelism and smaller form factors are required
– Probe cards requiring 20k, 30k, and > probes resulting in high mechanical force, higher frequency of cleaning, higher probe burn incidence, challenges servicing, and reduced probe lifetime are increasing Cost of Test
• The market needs a better solution!2Author
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Execution
• In this paper we will discuss the advantages of a new probe style and housing methodology to meet metrics associated with minimizing COO and maximizing ROI as validated through collaboration with a major FAB/Test House.
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1st Phase ObjectiveIdentify End User Wish List
• Low and consistent Cres performance leading to maximum yields
• High current probe material that resists probe burning thereby maximizing tester uptime
• Extended probe lifetime to maximize the number of dies tested before probe replacement
• Easy and safe repair • Means to Lower Cost of Test
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2nd Phase ObjectiveComplete Design Meeting Phase 1
• Must be a MEMS probe– Ability to control shape/spring rate/material composition (high current)
• Mechanical support to allow easy mfg, assembly, and service – Simple and safe probe replacement– Minimal training to perform
• Extended probe lifetime – Providing means to Lower Cost of Test!
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2nd Phase ObjectiveComplete Design Meeting Phase 1
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• Design modeling suggested adding a Patented 2ndLGP to improve probe position and stability lending to placement accuracy and reduced LGP friction
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2nd Phase ObjectiveComplete Design Meeting Phase 1
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• Added a Patented sacrificial 3rd LGP increasing total probe length while maintaining identical probe position and stability.
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2nd Phase ObjectiveComplete Design Meeting Phase 1
• When probe EOL occurs, simply removing the sacrificial 3rd LGP exposes more probe, thus 2X’s lifetime!
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2nd Phase ObjectiveComplete Design Meeting Phase 1
• Patented sacrificial 3rd LGP removed exposing 2X’s lifetime!
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• Technology Name ‐ Motus III R – Latin term meaning ‘movement’
3nd Phase ObjectiveManufacture
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3nd Phase ObjectiveManufacture – Motus III R
• Patented sacrificial 3rd LGP shown in photo– Simple 4 screw end user removal
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• Video this slide
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4th Phase ObjectiveBump Deformation by 3rd Party – Motus III R
• < 75% bump damage Pb‐Free Solder Bump
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4th Phase ObjectiveBump Deformation by 3rd Party – Motus III R
• < 75% bump damage on 40um Cu‐Pillar
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‐ Last contact @ 20 µm Overdrive + 50um OD = 70um Total OD‐ 2.8 grams at OD, CCC= 1,200mA (probe spec, test did not confirm)
4th Phase ObjectiveCres Testing by 3rd Party – Motus III R
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4th Phase ObjectiveCres Testing by 3rd Party – Motus III R
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• Cres data test was positive and aligned with a buckling beam Paliney7 Cres, but with much improved probe position, stability and higher lifetime.
• Redesign/manufacturing resulted in changing the Probe‐to‐ST contact, thereby reducing Cres as witnessed on actual production device. However, insufficient time to re‐perform test meeting SWTC deadline.
4th Phase ObjectiveCres Testing by 3rd Party – Motus III R
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5th Phase ObjectiveEasy & Safe Probe Replacement – Motus III R
• Ability for end‐user to service PH maximizes uptime and eliminate or reduces need for backup hardware
• Maximum uptime provides Means to Lower Cost of Test
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• Video this slide
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• Video this slide
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Conclusion
• Motus IIIR addresses the market requirement for: – High mechanical performance reliability– Consistent Cres supporting high yield– Extended lifetime without tradeoffs– Higher current probe that resists burning– Safe and Easy end user repair– Means to Lower Cost of Test
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Next Steps• MAC (maximum allowable current) characterization on Motus IIIs to meet new industry standard testing methodology
• Motus IIIs Alpha test vehicle being delivered June/July to GlobalFoundries with validation target by end of Q3
• Expect Motus IIIs availability in Q4 in limited quantity with high volume availability starting in in Q1 2017
• Need to identify Alpha 60um test vehicle for Lancaster in Q1 2017 as well as 40um
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Future Work
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Available Now Available Now Q3 2016 Q1 2017 Q3 2017Product/Dev.
Code Motus II Motus III Motus IIIs Lancaster PiperTechnology
TypeMEMS Offset
ProbeMEMS Offset
ProbeMEMS Offset
Probe Advanced Vertical
TBAAdvanced Vertical
TBASOC
Application Al Pad Micro Bump - CuP Micro Bump - CuP Micro Bump - CuP Micro Bump - CuPMarket 1st Gen TSV SOC SOC SOC SOC
Pitch ums 140um + 100/110 80-90 60-70 40-50
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Recognitions • Jens Kober ‐ GlobalFoundries, Dresden• Alexander Wittig – GlobalFoundries, Dresden• Thomas Auxel – GlobalFoundries, Dresden
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